JP2007180339A - Light emitting device and its process for fabrication - Google Patents

Light emitting device and its process for fabrication Download PDF

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JP2007180339A
JP2007180339A JP2005378199A JP2005378199A JP2007180339A JP 2007180339 A JP2007180339 A JP 2007180339A JP 2005378199 A JP2005378199 A JP 2005378199A JP 2005378199 A JP2005378199 A JP 2005378199A JP 2007180339 A JP2007180339 A JP 2007180339A
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light emitting
light
emitting element
base
emitting device
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JP5176273B2 (en
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Osamu Taruki
統 多留木
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Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device which can irradiate uniform light in an irradiation surface. <P>SOLUTION: The light emitting device contains a base mount having a recess with a bottom and side faces, a light emitting element laid in the bottom of the recess of the base mount, a first member covering the light emitting element and arranged in the recess of the base mount, and a second member which covers the first member, is arranged in the recess of the base mount and the light from the light emitting element, contains an optical diffusion member which diffuses the light from the emitting element, and contains many optical diffusion members in this volume rather than the near side of the base mount in the upper part of the light emitting element adjacent to the light emitting element. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、発光装置に関し、特に、発光素子を有する発光装置に関する。   The present invention relates to a light emitting device, and particularly to a light emitting device having a light emitting element.

発光素子を用いた発光装置は、小型で電力効率が良く鮮やかな色の発光をする。また、該発光素子は半導体素子であるため球切れなどの心配がない。さらに初期駆動特性が優れ、振動やオン・オフ点灯の繰り返しに強いという特徴を有する。このような優れた特性を有するため、発光ダイオード(LED)、レーザーダイオード(LD)などの発光素子を用いる発光装置は、各種の光源として利用されている。
従来の半導体発光装置として以下の構成を有するものがある。図12は、従来の発光装置を示す概略断面図である。図13は、従来の発光装置を発光させた際の照射面の像を示す概略図である。従来の発光装置は、発光素子201と、発光素子201が載置されるリード202と、発光素子201上に設けられるコーティング樹脂203と、コーティング樹脂203を保護するモールド部材206と、を有する。発光素子201には、窒化ガリウム系化合物半導体からなる発光層を備えた青色発光が可能な発光素子が使用されている。発光素子201はリード202の凹部内の底面に配置されている。発光素子3の上部及びその周囲は例えば、セリウムにより付活されたイットリウム・アルミニウム酸化物系(以下、YAGという)蛍光体207の粒子を含む透明なエポキシ樹脂からなるコーティング樹脂203で覆われている。コーティング樹脂203には、発光素子201からの青色光の少なくとも一部を吸収し波長変換して蛍光を発する黄色のフォトルミネッセンス蛍光体207が含まれている。発光装置は、発光素子201からの青色光と蛍光体207の黄色光とが混合して白色光を得ている。
しかしながら、この発光装置から放射される光は、光照射面でドーナツ状のイエローリングが生じている。つまり、発光素子201の上面からは青色光が強く出射され、ドーナツ状の中央にやや青色味がかった白色光211が形成される。一方、発光素子201の側面から出射された光は、蛍光体207に強く照射され、また、凹部の側面にも照射され、ドーナツ状にやや黄色味がかった白色光212が形成される。これは発光素子201からの光を反射するリード202の凹部が影響しているものと考えられる。
A light-emitting device using a light-emitting element emits light with a small color, high power efficiency, and vivid colors. In addition, since the light-emitting element is a semiconductor element, there is no fear of a broken ball. Further, it has excellent initial driving characteristics and is strong against vibration and repeated on / off lighting. Because of such excellent characteristics, light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) and laser diodes (LDs) are used as various light sources.
Some conventional semiconductor light emitting devices have the following configuration. FIG. 12 is a schematic cross-sectional view showing a conventional light emitting device. FIG. 13 is a schematic view showing an image of an irradiation surface when a conventional light emitting device emits light. A conventional light emitting device includes a light emitting element 201, a lead 202 on which the light emitting element 201 is placed, a coating resin 203 provided on the light emitting element 201, and a mold member 206 that protects the coating resin 203. As the light emitting element 201, a light emitting element capable of emitting blue light having a light emitting layer made of a gallium nitride compound semiconductor is used. The light emitting element 201 is disposed on the bottom surface in the recess of the lead 202. The upper part of the light emitting element 3 and the periphery thereof are covered with a coating resin 203 made of a transparent epoxy resin containing particles of yttrium / aluminum oxide (hereinafter referred to as YAG) phosphor 207 activated by cerium, for example. . The coating resin 203 includes a yellow photoluminescence phosphor 207 that absorbs at least part of blue light from the light emitting element 201 and converts the wavelength to emit fluorescence. In the light emitting device, white light is obtained by mixing blue light from the light emitting element 201 and yellow light of the phosphor 207.
However, the light emitted from the light emitting device has a donut-shaped yellow ring on the light irradiation surface. That is, blue light is strongly emitted from the upper surface of the light emitting element 201, and white light 211 having a slightly blue tint is formed in the center of the donut shape. On the other hand, the light emitted from the side surface of the light emitting element 201 is strongly irradiated on the phosphor 207 and is also irradiated on the side surface of the concave portion, and white light 212 having a slightly yellowish shape is formed in a donut shape. This is considered to be due to the concave portion of the lead 202 that reflects the light from the light emitting element 201.

また、モールド部材を乳白色にする拡散材が含まれる発光装置がある(例えば、特許文献1参照)。しかし、この発光装置はモールド部材全体に均一に拡散材が含有されているため、本来は光を集光させるために設けられるモールド部材の作用が不十分になる。   Moreover, there exists a light-emitting device containing the diffusion material which makes a mold member milky white (for example, refer patent document 1). However, in this light emitting device, since the diffusing material is uniformly contained in the entire mold member, the function of the mold member originally provided for condensing light becomes insufficient.

さらに、拡散樹脂224の上部に蛍光材227を配置する発光装置が知られている(例えば、特許文献2参照)。図14は、従来の発光装置を示す概略断面図である。
この発光装置は、一方のリードフレーム222の凹部内に発光素子221を配置し、他方のリードフレームと発光素子221をボンディングワイヤで接続する。発光素子221の凹部内で発光層よりも下の部分の周囲を透明樹脂または拡散樹脂224を用いて封止し、発光層よりも上面のみに蛍光材227を塗布する。拡散樹脂224中には拡散部材225が含まれている。蛍光材227は樹脂223中に含まれている。樹脂223はモールド部材226で被覆されている。これにより、発光素子221からの光が蛍光材227を通過する距離を経路によらず略同一とし、混色性を向上させる旨記載されている。
しかし、発光素子221を配置するリードフレーム222には、凹部が形成されているため、発光素子201からの光の透過経路を略同一とすることが難しい。つまり、発光素子221から出射された光が凹部の側面に照射され、照射面におけるドーナツ状のイエローリングを形成する。一方、発光素子221の上面から出射された光は、照射面におけるドーナツ状の中央部を形成する。よって、イエローリングの発生を抑止するまで到っていない。また、光の経路を略同一とすることができたとしても、蛍光材227を樹脂223内に均一に分散させる必要があり、蛍光材227を完全に制御することは困難である。そのため、蛍光体227が含まれる量が少ない部分においては、十分な励起発光が得られないために青みがかった光が放出されてしまい、均一な混色光を得るのには不十分である。
Furthermore, a light emitting device is known in which a fluorescent material 227 is disposed on the upper part of the diffusion resin 224 (see, for example, Patent Document 2). FIG. 14 is a schematic cross-sectional view showing a conventional light emitting device.
In this light emitting device, a light emitting element 221 is disposed in a recess of one lead frame 222, and the other lead frame and the light emitting element 221 are connected by a bonding wire. The periphery of the portion below the light emitting layer in the concave portion of the light emitting element 221 is sealed with a transparent resin or a diffusion resin 224, and the fluorescent material 227 is applied only on the upper surface of the light emitting layer. A diffusion member 225 is included in the diffusion resin 224. The fluorescent material 227 is contained in the resin 223. The resin 223 is covered with a mold member 226. Accordingly, it is described that the distance that the light from the light emitting element 221 passes through the fluorescent material 227 is substantially the same regardless of the route, and the color mixing property is improved.
However, since a recess is formed in the lead frame 222 in which the light emitting element 221 is arranged, it is difficult to make light transmission paths from the light emitting element 201 substantially the same. That is, the light emitted from the light emitting element 221 is irradiated onto the side surface of the concave portion to form a donut-shaped yellow ring on the irradiated surface. On the other hand, light emitted from the upper surface of the light emitting element 221 forms a donut-shaped central portion on the irradiation surface. Therefore, it has not yet reached the suppression of the occurrence of yellow rings. Even if the light paths can be made substantially the same, the fluorescent material 227 needs to be uniformly dispersed in the resin 223, and it is difficult to completely control the fluorescent material 227. Therefore, in a portion where the amount of the phosphor 227 is small, sufficient excitation light emission cannot be obtained, and thus bluish light is emitted, which is insufficient to obtain uniform mixed light.

特開2000−208815号公報JP 2000-208815 A 特開2002−222996号公報JP 2002-222996 A

そこで、本発明は、照射面において均一な光が照射可能な発光装置を提供することを目的とする。   Accordingly, an object of the present invention is to provide a light emitting device capable of irradiating uniform light on an irradiation surface.

本発明によれば、前記課題は次の手段により解決される。   According to the present invention, the above problem is solved by the following means.

本発明は、底面と側面とを持つ凹部を有する基台と、前記基台の凹部の底面に載置される発光素子と、前記発光素子を被覆し、前記基台の凹部内に配置される第1の部材と、前記第1の部材を被覆し、前記基台の凹部内に配置され、かつ、前記発光素子からの光を拡散させる光拡散部材が含有されており、前記基台の側面付近よりも前記発光素子の上方付近の方が同体積中で前記光拡散部材を多く含有する第2の部材と、を有する発光装置に関する。これにより照射面において均一な光が照射可能な発光装置を提供することができる。   The present invention provides a base having a concave portion having a bottom surface and a side surface, a light emitting element placed on the bottom surface of the concave portion of the base, and covers the light emitting element, and is disposed in the concave portion of the base. A first member; a light diffusing member that covers the first member, is disposed in the recess of the base, and diffuses light from the light emitting element; and includes a side surface of the base The present invention relates to a light emitting device having a second member in the vicinity of the upper part of the light emitting element rather than the vicinity thereof and containing a large amount of the light diffusing member in the same volume. Accordingly, a light emitting device that can irradiate uniform light on the irradiation surface can be provided.

本発明は、底面と側面とを持つ凹部を有する基台と、前記基台の凹部の底面に載置される発光素子と、前記発光素子を被覆し、前記基台の凹部内に配置される第1の部材と、前記第1の部材を被覆し、前記基台の凹部内に配置され、かつ、前記発光素子からの光を拡散させる光拡散部材が含有されており、前記基台の側面付近の厚さよりも前記発光素子の上方付近の厚さの方が厚い第2の部材と、を有する発光装置である。これにより照射面において均一な光が照射可能な発光装置を提供することができる。   The present invention provides a base having a concave portion having a bottom surface and a side surface, a light emitting element placed on the bottom surface of the concave portion of the base, and covers the light emitting element, and is disposed in the concave portion of the base. A first member; a light diffusing member that covers the first member, is disposed in the recess of the base, and diffuses light from the light emitting element; and includes a side surface of the base And a second member having a thickness near the upper portion of the light emitting element that is thicker than a thickness near the light emitting device. Accordingly, a light emitting device that can irradiate uniform light on the irradiation surface can be provided.

前記第2の部材における前記発光素子の上方の厚さが、前記第1の部材における前記発光素子の上方の厚さよりも厚いことが好ましい。発光素子の上方から出射される光を拡散させるためである。また、基台の凹部の側面に反射された光を拡散させるためである。
前記第1の部材は、前記凹部の上端よりも低い位置まで充填されていることが好ましい。第2の部材を配置し易くするためである。
前記凹部は、側面に段差が設けられており、下段部分に前記第1の部材が配置されているものも使用することができる。第1の部材を配置しやすくすると共に、第2の部材も配置しやすくするためである。また、第2の部材を一定量確保し、より光の拡散を促進させるためである。
前記第1の部材と前記第2の部材とは、界面がなく固着されているものも使用することができる。これにより屈折率差による光取り出し効率の低下を抑制することができる。ただし、第1の部材を半硬化した状態で第2の部材を配置したときに界面が生じたとしても、本明細書における界面ではないものとする。本明細書における界面は、第1の部材を本硬化した状態で第2の部材を配置したときに生じるものをいう。
前記第1の部材は、前記発光素子からの光を吸収して、前記発光素子からの光と異なる波長の光を放出する蛍光物質を含有することもできる。これにより、発光素子からの光と第1の部材で波長変換された光とが、第2の部材を通過して外部に取り出される際に、混色性の高い光を取り出すことができる。
前記第1の部材は凹状に形成されていることが好ましい。第1の部材の凹状部分に第2の部材を配置できるため、光の拡散を向上させることができる。
前記第2の部材は、前記基台の凹部から突出する凸状に形成されていることが好ましい。第2の部材に光拡散部材が含まれているため、凸状となる厚みが厚い部分は厚みの薄い部分よりも光拡散作用が大きいため、容易に光の拡散を向上させることができる。
前記発光装置は、第2の部材上に、さらに第3の部材を設けることもできる。これにより第2の部材を保護することができる。また、第2の部材より屈折率の低い第3の部材を用いることにより、光の取り出し効率を向上させることができる。第3の部材は、光を集光する作用を高めるために、光拡散部材を含有する量が少ない又は含有しないほうが好ましい。
The thickness of the second member above the light emitting element is preferably thicker than the thickness of the first member above the light emitting element. This is for diffusing light emitted from above the light emitting element. Moreover, it is for diffusing the light reflected by the side surface of the recessed part of a base.
It is preferable that the first member is filled to a position lower than the upper end of the recess. This is because it is easy to arrange the second member.
As the concave portion, a step having a step on the side surface and the first member disposed on the lower portion can be used. This is because it is easy to arrange the first member, and it is also easy to arrange the second member. In addition, a certain amount of the second member is secured to further promote light diffusion.
As the first member and the second member, those fixed without any interface can be used. Thereby, the fall of the light extraction efficiency by a refractive index difference can be suppressed. However, even if an interface is generated when the second member is disposed in a state where the first member is semi-cured, it is not an interface in the present specification. The interface in this specification refers to what occurs when the second member is disposed in a state where the first member is fully cured.
The first member may include a fluorescent material that absorbs light from the light emitting element and emits light having a wavelength different from that of the light from the light emitting element. Thereby, when the light from the light emitting element and the light wavelength-converted by the first member pass through the second member and are extracted to the outside, light with high color mixing property can be extracted.
The first member is preferably formed in a concave shape. Since the second member can be disposed in the concave portion of the first member, light diffusion can be improved.
The second member is preferably formed in a convex shape protruding from the concave portion of the base. Since the light diffusing member is included in the second member, the light-diffusing action is easily improved in the portion having a thick convex shape than in the portion having a small thickness.
The light emitting device may further include a third member on the second member. Thereby, the second member can be protected. Moreover, the light extraction efficiency can be improved by using a third member having a lower refractive index than the second member. The third member preferably has a small or no amount of the light diffusing member in order to enhance the effect of condensing light.

本発明は、底面と側面とを持つ凹部を有する基台と、前記基台の凹部の底面に載置される発光素子と、前記発光素子を被覆する第1の部材と、光拡散部材が含有された、前記第1の部材を被覆する第2の部材と、を有する発光装置の製造方法であって、前記基台の前記底面に発光素子を載置する第1の工程と、前記凹部内に第1の部材を配置する第2の工程と、前記基台の側面付近の厚さよりも前記発光素子の上方付近の厚さの方が厚くなるように第2の部材を第1の部材上に配置する第3の工程と、を有する。これにより光拡散効果の高い発光装置を容易に製造することができる。第3の工程は、粘度の高い樹脂を用いる場合や、撥水性の高い部材を所定の位置に設けるなどの方法により製造することができる。   The present invention includes a base having a recess having a bottom surface and side surfaces, a light emitting element placed on the bottom surface of the recess of the base, a first member covering the light emitting element, and a light diffusion member And a second member that covers the first member, the first step of placing the light emitting element on the bottom surface of the base, and the inside of the recess And a second step of disposing the first member on the first member such that the thickness near the upper side of the light emitting element is thicker than the thickness near the side surface of the base. And a third step of disposing the substrate. Thereby, a light emitting device having a high light diffusion effect can be easily manufactured. The third step can be manufactured by using a resin having a high viscosity or by providing a member having high water repellency at a predetermined position.

前記第2の工程は、第1の部材を硬化して、凹状となるように配置することが好ましい。これにより第2の部材の厚みを容易に変えることができる。   In the second step, it is preferable that the first member is hardened and arranged to be concave. Thereby, the thickness of the second member can be easily changed.

前記第3の工程は、第1の部材が本硬化する前に第2の部材を配置することが好ましい。これにより第1の部材と第2の部材との界面をなくすことができ、界面における光の反射に伴う光の取り出し効率の低下を抑制することができる。また、第1の部材と第2の部材との密着性を高めることができる。   In the third step, the second member is preferably disposed before the first member is fully cured. As a result, the interface between the first member and the second member can be eliminated, and a decrease in light extraction efficiency associated with light reflection at the interface can be suppressed. Moreover, the adhesiveness of the 1st member and the 2nd member can be improved.

前記第3の工程は、前記発光素子の上方から第2の部材を滴下して、前記凹部から突出する凸状を形成することが好ましい。これにより所定の位置に厚みを持たせた第2の部材を容易に形成することができる。   In the third step, it is preferable that a second member is dropped from above the light emitting element to form a convex shape protruding from the concave portion. Thereby, the second member having a predetermined thickness can be easily formed.

本発明によれば、光の拡散作用を高め、照射面における均一な光が照射可能な発光装置を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the light-diffusion effect | action can be improved and the light-emitting device which can irradiate the uniform light in an irradiation surface can be provided.

以下に、本発明に係る発光装置及びその製造方法を、実施の形態及び実施例を用いて説明する。ただし、本発明は、この実施の形態及び実施例に限定されない。   Hereinafter, a light-emitting device and a manufacturing method thereof according to the present invention will be described with reference to embodiments and examples. However, the present invention is not limited to this embodiment and examples.

<第1の実施の形態>
第1の実施の形態に係る発光装置は、以下の構成を採る。図1は、第1の実施の形態に係る発光装置を示す概略断面図である。図2は、第1の実施の形態に係る発光装置を発光させた際の照射面の像を示す概略図である。
第1の実施の形態に係る発光装置は、発光素子1、基台2、第1の部材3及び第2の部材4を備える、いわゆる砲弾型発光装置である。発光素子1を載置する側の基台2は、底面2bと側面2cとを持つ凹部2aを有する。発光素子1は基台2の凹部2aの底面2bに載置する。第1の部材3は、基台2の凹部2a内に配置して、発光素子1を被覆する。第1の部材3は中央部が凹んでいる。中央部を凹ますことにより第2の部材4を基台2の凹部2a内に配置することができる。第2の部材4は光拡散部材5を含有する。第2の部材4は、凹部2a内、若しくは、凹部2a付近に配置され、第1の部材3を被覆する。第2の部材4は中央部が凸状に形成されている。つまり、基台2の側面2c付近の厚さよりも発光素子1の上方付近の厚さの方が厚くなっている。第2の部材4中に光拡散部材5がほぼ均一に含有されていた場合、基台2の側面2c付近における光拡散部材5の全体量よりも、発光素子1の上方部分における光拡散部材5の全体量が多いため、光拡散作用が大きい。第2の部材4は、さらに第3の部材6で被覆されている。第3の部材6は基台2を固定している。
(作用)
発光素子1の上方から出射される光は、第2の部材4中に含まれる光拡散部材5に照射されて反射され、光が拡散する。基台2の側面2c付近における光拡散部材5の全体量よりも、発光素子1の上方部分における光拡散部材5の全体量が多いため、光拡散作用が大きい。また、発光素子1の側面等から出射される光は、基台2の凹部2aの側面2cで反射され、発光素子1の上方部分を通過する。このときも基台2の側面2c付近における光拡散部材5の全体量よりも、発光素子1の上方部分における光拡散部材5の全体量が多いため、光拡散作用が大きい。発光素子1の上方から出射され、光拡散部材5により光拡散された第1光101と、発光素子1の側面等から出射され、光拡散部材5により光拡散された第2光102と、が混合する。これにより光の透過量が多い部分について、光拡散部材5を多く配置して光を拡散することができるため、照射面において従来よりも均一な発光色を写しだすことができる。また、光が拡散される部分を限定しているため、発光出力の低下を抑えることもできる。
<First Embodiment>
The light emitting device according to the first embodiment has the following configuration. FIG. 1 is a schematic cross-sectional view showing the light emitting device according to the first embodiment. FIG. 2 is a schematic diagram illustrating an image of an irradiation surface when the light emitting device according to the first embodiment emits light.
The light emitting device according to the first embodiment is a so-called bullet-type light emitting device including the light emitting element 1, the base 2, the first member 3, and the second member 4. The base 2 on the side on which the light emitting element 1 is placed has a recess 2a having a bottom surface 2b and a side surface 2c. The light emitting element 1 is placed on the bottom surface 2 b of the recess 2 a of the base 2. The first member 3 is disposed in the recess 2 a of the base 2 and covers the light emitting element 1. The center of the first member 3 is recessed. The second member 4 can be disposed in the recess 2 a of the base 2 by denting the central portion. The second member 4 contains a light diffusing member 5. The second member 4 is disposed in the recess 2 a or in the vicinity of the recess 2 a and covers the first member 3. The center part of the second member 4 is formed in a convex shape. That is, the thickness near the upper side of the light emitting element 1 is thicker than the thickness near the side surface 2 c of the base 2. When the light diffusing member 5 is contained almost uniformly in the second member 4, the light diffusing member 5 in the upper part of the light emitting element 1 is larger than the total amount of the light diffusing member 5 in the vicinity of the side surface 2 c of the base 2. Since the total amount of is large, the light diffusion effect is large. The second member 4 is further covered with a third member 6. The third member 6 fixes the base 2.
(Function)
The light emitted from above the light emitting element 1 is irradiated and reflected on the light diffusion member 5 included in the second member 4, and the light is diffused. Since the total amount of the light diffusing member 5 in the upper part of the light emitting element 1 is larger than the total amount of the light diffusing member 5 in the vicinity of the side surface 2c of the base 2, the light diffusing action is large. The light emitted from the side surface of the light emitting element 1 is reflected by the side surface 2 c of the recess 2 a of the base 2 and passes through the upper part of the light emitting element 1. Also at this time, since the total amount of the light diffusing member 5 in the upper part of the light emitting element 1 is larger than the total amount of the light diffusing member 5 in the vicinity of the side surface 2c of the base 2, the light diffusing action is large. The first light 101 emitted from above the light emitting element 1 and diffused by the light diffusing member 5 and the second light 102 emitted from the side surface of the light emitting element 1 and diffused by the light diffusing member 5 Mix. As a result, light can be diffused by arranging a large number of light diffusing members 5 in a portion where the amount of light transmitted is large, so that a light emission color that is more uniform than the conventional one can be copied on the irradiated surface. In addition, since the portion where the light is diffused is limited, it is possible to suppress a decrease in light emission output.

<第2の実施の形態>
第2の実施の形態について、図面を用いて説明する。図3は、第2の実施の形態に係る発光装置を示す概略断面図である。
第2の実施の形態は、第1の部材13に蛍光物質17を含有させた以外は、第1の実施の形態とほぼ同様の構成を採る。ほぼ同様の構成を採る部分については説明を省略する部分もある。第2の実施の形態に係る発光装置は、発光素子11、基台12、第1の部材13及び第2の部材14を備える、いわゆる砲弾型発光装置である。第1の部材13中には蛍光物質17が含有されており、基台12の凹部内に沈降している。第1の部材13は、基台12の凹部内に配置して、発光素子11を被覆する。蛍光物質17は発光素子11の上面や側面に配置される。第1の部材13は中央部が凹んでいる。第2の部材14は光拡散部材15を含有する。第2の部材14は、凹部内、若しくは、凹部付近に配置され、第1の部材13を被覆する。第2の部材14は中央部が凸状に形成されている。つまり、基台12の側面付近の厚さよりも発光素子11の上方付近の厚さの方が厚くなっている。第2の部材14中に光拡散部材15がほぼ均一に含有されていた場合、基台12の側面付近における光拡散部材15の全体量よりも、発光素子11の上方部分における光拡散部材15の全体量が多いため、光拡散作用が大きい。第2の部材14は、さらに第3の部材16で被覆されている。第3の部材16は、基台12を固定している。
(作用)
発光素子11から出射される光の少なくとも一部は蛍光物質17に照射され、発光素子11からの光と異なる波長の光を放出する。発光素子11の上方から出射される光(発光素子11からの光と蛍光物質17からの光)は、第2の部材14中に含まれる光拡散部材15に照射されて反射され、光が拡散する。基台12の側面付近における光拡散部材15の全体量よりも、発光素子11の上方部分における光拡散部材15の全体量が多いため、光拡散作用が大きい。また、発光素子11の側面等から出射される光(発光素子11からの光と蛍光物質17からの光)は、基台12の凹部の側面で反射され、発光素子11の上方部分を通過する。このときも基台12の側面付近における光拡散部材15の全体量よりも、発光素子11の上方部分における光拡散部材15の全体量が多いため、光拡散作用が大きい。これにより光の透過量が多い部分について、光拡散部材15を多く配置して光を拡散することができるため、従来よりも均一な発光色を出射することができる。かつ、光が拡散される部分を限定しているため、発光出力の低下を抑えることもできる。例えば、発光素子11に青色に発光する窒化ガリウム系化合物半導体を用い、蛍光物質17に黄色に発光するイットリウム・アルミニウム・酸化物系蛍光体を用いる。第1の部材13において、発光素子11の上方から出射される光は青色光であり、基台12の側面付近から出射される光は黄色光が主である場合、上述のように第2の部材14で光が拡散されるため、照射面においては均一な白色光が写し出される。これにより、ドーナツ状のイエローリングの発生を抑制することができる。
<Second Embodiment>
A second embodiment will be described with reference to the drawings. FIG. 3 is a schematic cross-sectional view showing a light emitting device according to the second embodiment.
The second embodiment employs substantially the same configuration as that of the first embodiment except that the fluorescent material 17 is contained in the first member 13. There is also a part which omits description about the part which takes about the same composition. The light emitting device according to the second embodiment is a so-called bullet-type light emitting device including the light emitting element 11, the base 12, the first member 13, and the second member 14. The first member 13 contains a fluorescent material 17 and settles in the recess of the base 12. The first member 13 is disposed in the recess of the base 12 and covers the light emitting element 11. The fluorescent material 17 is disposed on the upper surface or side surface of the light emitting element 11. The center part of the first member 13 is recessed. The second member 14 contains a light diffusing member 15. The second member 14 is disposed in the recess or in the vicinity of the recess and covers the first member 13. The center part of the second member 14 is formed in a convex shape. That is, the thickness near the upper side of the light emitting element 11 is thicker than the thickness near the side surface of the base 12. When the light diffusing member 15 is contained almost uniformly in the second member 14, the light diffusing member 15 in the upper part of the light emitting element 11 is larger than the total amount of the light diffusing member 15 in the vicinity of the side surface of the base 12. Since the total amount is large, the light diffusion effect is large. The second member 14 is further covered with a third member 16. The third member 16 fixes the base 12.
(Function)
At least a part of the light emitted from the light emitting element 11 is irradiated to the fluorescent material 17 and emits light having a wavelength different from that of the light from the light emitting element 11. The light emitted from above the light emitting element 11 (the light from the light emitting element 11 and the light from the fluorescent material 17) is irradiated and reflected on the light diffusion member 15 included in the second member 14, and the light is diffused. To do. Since the total amount of the light diffusing member 15 in the upper part of the light emitting element 11 is larger than the total amount of the light diffusing member 15 in the vicinity of the side surface of the base 12, the light diffusing action is large. In addition, light emitted from the side surface of the light emitting element 11 (light from the light emitting element 11 and light from the fluorescent material 17) is reflected by the side surface of the recess of the base 12 and passes through the upper part of the light emitting element 11. . Also at this time, since the total amount of the light diffusing member 15 in the upper part of the light emitting element 11 is larger than the total amount of the light diffusing member 15 in the vicinity of the side surface of the base 12, the light diffusing action is large. Accordingly, since the light diffusion member 15 can be arranged in a large amount to diffuse the light in the portion where the amount of light transmission is large, it is possible to emit a light emission color that is more uniform than in the past. And since the part to which light is diffused is limited, the fall of light emission output can also be suppressed. For example, a gallium nitride compound semiconductor that emits blue light is used for the light emitting element 11, and an yttrium, aluminum, and oxide phosphor that emits yellow light is used for the fluorescent material 17. In the first member 13, when the light emitted from above the light emitting element 11 is blue light, and the light emitted from the vicinity of the side surface of the base 12 is mainly yellow light, the second light as described above. Since light is diffused by the member 14, uniform white light is projected on the irradiated surface. Thereby, generation | occurrence | production of donut-shaped yellow ring can be suppressed.

<第3の実施の形態>
第3の実施の形態について、図面を用いて説明する。図4は、第3の実施の形態に係る発光装置を示す概略断面図である。図5は、第3の実施の形態に係る発光装置を発光させた際の照射面の像を示す概略図である。
第3の実施の形態は、第1の部材23に蛍光物質27を含有させたこと、及び、第2の部材24に含有される光拡散部材25の濃度を変えたこと以外は、第1の実施の形態とほぼ同様の構成を採る。ほぼ同様の構成を採る部分については説明を省略する部分もある。第3の実施の形態に係る発光装置は、発光素子21、基台22、第1の部材23及び第2の部材24を備える、いわゆる砲弾型発光装置である。第1の部材23中には蛍光物質27が含有されており、基台22の凹部内に沈降している。第1の部材23は、基台22の凹部内に配置して、発光素子21を被覆する。蛍光物質27は発光素子21の上面や側面に配置される。第1の部材23は中央部が凹んでいる。第2の部材24は光拡散部材25を含有する。第2の部材24は、凹部内、若しくは、凹部付近に配置され、第1の部材23を被覆する。基台22の側面付近よりも発光素子21の上方付近の方が同体積中で光拡散部材25が多く含有されている。これにより発光素子21の上方付近の方が基台22の側面付近よりも光拡散作用が大きい。基台22の側面付近よりも発光素子21の上方付近の方が同体積中で光拡散部材25が多く含有されていれば、第2の部材24は平板状でも、中央部が凸状でもよい。ここでは第2の部材24の中央部が凸状に形成されている。第2の部材24は、さらに第3の部材26で被覆されている。第3の部材26は、基台22を固定している。
発光素子21の上方から出射され、光拡散部材25により光拡散された第1光111と、発光素子21の側面等から出射され、光拡散部材25により光拡散された第2光112と、が混合する。これによっても、第2の部材24で光が拡散されるため、照射面においては均一な白色光が写し出される。また、ドーナツ状のイエローリングの発生を抑制することができる。
<Third Embodiment>
A third embodiment will be described with reference to the drawings. FIG. 4 is a schematic cross-sectional view showing a light emitting device according to the third embodiment. FIG. 5 is a schematic diagram showing an image of an irradiation surface when the light emitting device according to the third embodiment is caused to emit light.
The third embodiment is different from the first embodiment except that the first member 23 contains the fluorescent material 27 and the concentration of the light diffusion member 25 contained in the second member 24 is changed. The configuration is almost the same as that of the embodiment. There is also a part which omits description about the part which takes about the same composition. The light emitting device according to the third embodiment is a so-called bullet-type light emitting device including the light emitting element 21, the base 22, the first member 23, and the second member 24. The first member 23 contains a fluorescent material 27 and settles in the recess of the base 22. The first member 23 is disposed in the recess of the base 22 and covers the light emitting element 21. The fluorescent material 27 is disposed on the upper surface or side surface of the light emitting element 21. The central portion of the first member 23 is recessed. The second member 24 contains a light diffusing member 25. The second member 24 is disposed in the recess or in the vicinity of the recess and covers the first member 23. More light diffusion members 25 are contained in the same volume in the vicinity of the upper side of the light emitting element 21 than in the vicinity of the side surface of the base 22. As a result, the light diffusing action is greater near the upper side of the light emitting element 21 than near the side surface of the base 22. As long as the light diffusion member 25 is contained in the same volume in the vicinity of the upper side of the light emitting element 21 than in the vicinity of the side surface of the base 22, the second member 24 may have a flat plate shape or a central portion may have a convex shape. . Here, the central portion of the second member 24 is formed in a convex shape. The second member 24 is further covered with a third member 26. The third member 26 fixes the base 22.
The first light 111 emitted from above the light emitting element 21 and diffused by the light diffusing member 25 and the second light 112 emitted from the side surface of the light emitting element 21 and diffused by the light diffusing member 25 Mix. Also by this, since light is diffused by the second member 24, uniform white light is projected on the irradiated surface. In addition, the occurrence of a donut-shaped yellow ring can be suppressed.

<第4の実施の形態>
第4の実施の形態について、図面を用いて説明する。図6は、第4の実施の形態に係る発光装置を示す概略断面図である。
第4の実施の形態は、第1の部材33に蛍光物質37を含有させたこと、及び、第2の部材34の表面が凹部の上端と略同じであること、以外は第1の実施の形態とほぼ同様の構成を採る。ほぼ同様の構成を採る部分については説明を省略する部分もある。第4の実施の形態に係る発光装置は、発光素子31、基台32、第1の部材33及び第2の部材34を備える、いわゆる砲弾型発光装置である。第1の部材33中には蛍光物質37が含有されており、基台32の凹部内に沈降している。第1の部材33は、基台32の凹部内に配置され、発光素子31を被覆する。蛍光物質37は発光素子31の上面や側面に配置される。第1の部材33は中央部が凹んでいる。第2の部材34は光拡散部材35を含有する。第2の部材34は、凹部内、若しくは、凹部付近に配置され、第1の部材33を被覆する。第2の部材34の表面は、平坦に形成されている。第2の部材34の厚さは、基台32の側面付近の厚さよりも発光素子31の上方付近の厚さの方が厚くなっている。第2の部材34中に光拡散部材35がほぼ均一に含有されていた場合、基台32の側面付近における光拡散部材35の全体量よりも、発光素子31の上方部分における光拡散部材35の全体量が多いため、光拡散作用が大きい。第2の部材34は、さらに第3の部材36で被覆されている。第3の部材36は、基台12を固定している。
これにより、図には示さないが、発光素子31の上方から出射され、光拡散部材35により光拡散された光と、発光素子31の側面等から出射され、光拡散部材35により光拡散された光と、が混合し、従来よりも均一な発光色を出射することができる。これによっても、第2の部材34で光が拡散されるため、照射面においては均一な白色光が写し出される。また、ドーナツ状のイエローリングの発生も抑制することができる。さらに、第2の部材34の平坦な表面は、光が拡散される部分を限定しているため、発光出力の低下をさらに抑えることができる。かつ、第2の部材34の表面を凸状にするよりも製造が容易であり、ワイヤへの負担も減らすことも可能となる。
<Fourth embodiment>
A fourth embodiment will be described with reference to the drawings. FIG. 6 is a schematic cross-sectional view showing a light emitting device according to the fourth embodiment.
The fourth embodiment is the same as that of the first embodiment except that the first member 33 contains the fluorescent material 37 and that the surface of the second member 34 is substantially the same as the upper end of the recess. The configuration is almost the same as the form. There is also a part which omits description about the part which takes about the same composition. The light emitting device according to the fourth embodiment is a so-called bullet-type light emitting device including a light emitting element 31, a base 32, a first member 33, and a second member 34. The first member 33 contains a fluorescent material 37 and settles in the recess of the base 32. The first member 33 is disposed in the recess of the base 32 and covers the light emitting element 31. The fluorescent material 37 is disposed on the upper surface or side surface of the light emitting element 31. The central portion of the first member 33 is recessed. The second member 34 includes a light diffusing member 35. The second member 34 is disposed in the recess or in the vicinity of the recess and covers the first member 33. The surface of the second member 34 is formed flat. As for the thickness of the second member 34, the thickness near the upper side of the light emitting element 31 is thicker than the thickness near the side surface of the base 32. When the light diffusing member 35 is contained almost uniformly in the second member 34, the light diffusing member 35 in the upper part of the light emitting element 31 is larger than the total amount of the light diffusing member 35 in the vicinity of the side surface of the base 32. Since the total amount is large, the light diffusion effect is large. The second member 34 is further covered with a third member 36. The third member 36 fixes the base 12.
Thus, although not shown in the drawing, the light emitted from above the light emitting element 31 and diffused by the light diffusing member 35, the light emitted from the side surface of the light emitting element 31, etc., and diffused by the light diffusing member 35. Light can be mixed, and a more uniform emission color than before can be emitted. Also by this, since light is diffused by the second member 34, uniform white light is projected on the irradiated surface. Also, the occurrence of a donut-shaped yellow ring can be suppressed. Furthermore, since the flat surface of the second member 34 limits the portion where the light is diffused, it is possible to further suppress the decrease in the light emission output. In addition, manufacturing is easier than making the surface of the second member 34 convex, and the burden on the wire can also be reduced.

<第5の実施の形態>
第5の実施の形態について、図面を用いて説明する。図7は、第5の実施の形態に係る発光装置を示す概略断面図である。
第5の実施の形態は、蛍光物質47が第1の部材43の中に略均一に分散していること、第1の部材43の表面が平坦であること、第2の部材44の表面が凸状であること、以外は第1の実施の形態とほぼ同様の構成を採る。ほぼ同様の構成を採る部分については説明を省略する部分もある。第5の実施の形態に係る発光装置は、発光素子41、基台42、第1の部材43及び第2の部材44を備える、いわゆる砲弾型発光装置である。第1の部材43中には蛍光物質47が含有されており、基台42の凹部内に略均一に分散している。第1の部材43は、基台42の凹部内に配置して、発光素子41を被覆する。第1の部材43は表面が平坦である。第2の部材44は光拡散部材45を含有する。第2の部材44は、凹部よりも上部、若しくは、凹部付近に配置され、第1の部材43を被覆する。第2の部材44の表面は、凸状に形成されている。第2の部材44の厚さは、基台42の側面付近の厚さよりも発光素子41の上方付近の厚さの方が厚くなっている。第2の部材44中に光拡散部材45がほぼ均一に含有されていた場合、基台42の側面付近における光拡散部材45の全体量よりも、発光素子41の上方部分における光拡散部材45の全体量が多いため、光拡散作用が大きい。第2の部材44は、さらに第3の部材46で被覆されている。第3の部材46は、基台42を固定している。
これにより、図には示さないが、発光素子41の上方から出射され、光拡散部材45により光拡散された光と、発光素子31の側面等から出射され光拡散部材45により光拡散された光と、が混合し、第2の実施の形態と同様に従来よりも均一な発光色を出射することができる。また、第1の部材43中に蛍光物質47を略均一に分散させることにより、発光素子41からの光と、蛍光物質47に波長変換された光と、が混合し易くなり、さらに均一な発光色を出射することが可能となる。
これによっても、第2の部材34で光が拡散されるため、照射面においてはさらに均一な白色光が写し出される。また、ドーナツ状のイエローリングの発生も抑制することができる。
<Fifth embodiment>
A fifth embodiment will be described with reference to the drawings. FIG. 7 is a schematic cross-sectional view showing a light emitting device according to a fifth embodiment.
In the fifth embodiment, the fluorescent material 47 is dispersed substantially uniformly in the first member 43, the surface of the first member 43 is flat, and the surface of the second member 44 is The configuration is almost the same as that of the first embodiment except that it is convex. There is also a part which omits description about the part which takes about the same composition. The light emitting device according to the fifth embodiment is a so-called bullet-type light emitting device including a light emitting element 41, a base 42, a first member 43 and a second member 44. The first member 43 contains a fluorescent material 47 and is distributed substantially uniformly in the recesses of the base 42. The first member 43 is disposed in the recess of the base 42 and covers the light emitting element 41. The first member 43 has a flat surface. The second member 44 includes a light diffusing member 45. The second member 44 is disposed above or near the recess than the recess, and covers the first member 43. The surface of the second member 44 is formed in a convex shape. The thickness of the second member 44 is thicker in the vicinity of the upper side of the light emitting element 41 than in the vicinity of the side surface of the base 42. When the light diffusing member 45 is contained substantially uniformly in the second member 44, the light diffusing member 45 in the upper part of the light emitting element 41 is larger than the total amount of the light diffusing member 45 in the vicinity of the side surface of the base 42. Since the total amount is large, the light diffusion effect is large. The second member 44 is further covered with a third member 46. The third member 46 fixes the base 42.
Thereby, although not shown in the drawing, the light emitted from above the light emitting element 41 and diffused by the light diffusion member 45 and the light emitted from the side surface of the light emitting element 31 and the like and diffused by the light diffusion member 45 And can emit a light emission color that is more uniform than in the prior art as in the second embodiment. Further, by dispersing the fluorescent material 47 substantially uniformly in the first member 43, the light from the light emitting element 41 and the light converted into the wavelength of the fluorescent material 47 can be easily mixed, and more uniform light emission. A color can be emitted.
Also by this, since light is diffused by the second member 34, more uniform white light is projected on the irradiated surface. Also, the occurrence of a donut-shaped yellow ring can be suppressed.

<第6の実施の形態>
第6の実施の形態について、図面を用いて説明する。図8は、第6の実施の形態に係る発光装置を示す概略断面図である。
第6の実施の形態は、第1の部材53に蛍光物質57が含有されており、第1の部材53の表面および第2の部材54の表面は凸状である。また、基台52の凹部の上端には樹脂を弾く部材が塗布されており、ワイヤをうつ部分には塗布されていない。それ以外は、第1の実施の形態とほぼ同様の構成を採る。ほぼ同様の構成を採る部分については説明を省略する部分もある。第6の実施の形態に係る発光装置は、発光素子51、基台52、第1の部材53及び第2の部材54を備える、いわゆる砲弾型発光装置である。第1の部材53中には蛍光物質57が含有されており、基台52の凹部内に沈降している。第1の部材53は、基台52の凹部内に配置して、発光素子51を被覆する。蛍光物質57は発光素子51の上面や側面に配置される。第1の部材53の表面は凸状をしている。第2の部材54は光拡散部材55を含有する。第2の部材54は、凹部より上部、若しくは、凹部付近に配置され、第1の部材53を被覆する。第2の部材54は、凹部の上端に塗布された樹脂を弾く部材により、ワイヤをボンディングする部分に流れるのを防ぐ。それによって、第2の部材54の表面は、凸状に形成することができる。第2の部材54の厚さは、基台52の側面付近の厚さよりも発光素子51の上方付近の厚さの方が厚くなっている。第2の部材54中に光拡散部材55がほぼ均一に含有されていた場合、基台52の側面付近における光拡散部材55の全体量よりも、発光素子51の上方部分における光拡散部材55の全体量が多いため、光拡散作用が大きい。第2の部材54は、さらに第3の部材56で被覆されている。第3の部材56は、基台52を固定している。
これにより、図には示さないが、発光素子51の上方から出射され、光拡散部材55により光拡散された光と、発光素子51の側面等から出射され、光拡散部材55により光拡散された光と、が混合し、従来よりも均一な発光色を出射することができる。さらに、第1及び2の部材の凸状の表面は、光が拡散される部分を限定しているため、発光出力の低下をさらに抑えることができ、特に、凹部の端部付近から出射される光の出力低下を抑えることができる。
これによっても、第2の部材54で光が拡散されるため、照射面においては均一な白色光が写し出される。また、ドーナツ状のイエローリングの発生も抑制することができる。
<Sixth Embodiment>
A sixth embodiment will be described with reference to the drawings. FIG. 8 is a schematic cross-sectional view showing a light emitting device according to a sixth embodiment.
In the sixth embodiment, a fluorescent material 57 is contained in the first member 53, and the surface of the first member 53 and the surface of the second member 54 are convex. In addition, a member that repels resin is applied to the upper end of the concave portion of the base 52, and the wire is not applied to the depressed portion. Other than that, the configuration is almost the same as that of the first embodiment. There is also a part which omits description about the part which takes about the same composition. The light emitting device according to the sixth embodiment is a so-called bullet-type light emitting device including a light emitting element 51, a base 52, a first member 53, and a second member 54. The first member 53 contains a fluorescent material 57 and has settled in the recess of the base 52. The first member 53 is disposed in the recess of the base 52 and covers the light emitting element 51. The fluorescent material 57 is disposed on the upper surface or side surface of the light emitting element 51. The surface of the first member 53 has a convex shape. The second member 54 includes a light diffusing member 55. The second member 54 is disposed above or near the recess, and covers the first member 53. The second member 54 prevents the resin from flowing to the portion where the wire is bonded by the member that repels the resin applied to the upper end of the recess. Thereby, the surface of the second member 54 can be formed in a convex shape. The thickness of the second member 54 is thicker in the vicinity of the upper part of the light emitting element 51 than in the vicinity of the side surface of the base 52. When the light diffusing member 55 is contained almost uniformly in the second member 54, the light diffusing member 55 in the upper part of the light emitting element 51 is larger than the total amount of the light diffusing member 55 in the vicinity of the side surface of the base 52. Since the total amount is large, the light diffusion effect is large. The second member 54 is further covered with a third member 56. The third member 56 fixes the base 52.
As a result, although not shown in the drawing, the light emitted from above the light emitting element 51 and diffused by the light diffusing member 55, the light emitted from the side surface of the light emitting element 51, etc., and diffused by the light diffusing member 55. Light can be mixed, and a more uniform emission color than before can be emitted. Furthermore, since the convex surfaces of the first and second members limit the portion where light is diffused, it is possible to further suppress a decrease in light emission output, and in particular, the light is emitted from the vicinity of the end of the concave portion. A decrease in light output can be suppressed.
Also by this, since light is diffused by the second member 54, uniform white light is projected on the irradiated surface. Also, the occurrence of a donut-shaped yellow ring can be suppressed.

<第7の実施の形態>
第7の実施の形態について、図面を用いて説明する。図9は、第7の実施の形態に係る発光装置を示す概略断面図である。
第7の実施の形態は、第2の部材64がやや薄いこと、及び、第2の部材64に含有される光拡散部材65の濃度を変えたこと以外は第5の実施の形態とほぼ同様の構成を採る。ほぼ同様の構成を採る部分については説明を省略する部分もある。第7の実施の形態に係る発光装置は、発光素子61、基台62、第1の部材63及び第2の部材64を備える、いわゆる砲弾型発光装置である。第1の部材63中には蛍光物質67が含有されており、基台62の凹部内に略均一に分散している。第1の部材63は、基台62の凹部内に配置して、発光素子61を被覆する。第1の部材63は表面が平坦である。第2の部材64は光拡散部材65を含有し、凹部よりも上部、若しくは、凹部付近に配置され、第1の部材63を被覆する。また、第2の部材64は、基台62の側面付近よりも発光素子61の上方付近の方が同体積中で光拡散部材65が多く含有されている。そのため、発光素子61の上方付近の方が基台62の側面付近よりも光拡散作用が大きい。ゆえに、第2の部材64の厚さは比較的薄くても、光を十分均一に拡散することができる。第2の部材64は、中央部が凸状に形成されており、さらに第3の部材66で被覆されている。第3の部材66は、基台62を固定している。
これにより、図には示さないが第5の実施の形態と同様に、発光素子61の上方から出射され、光拡散部材65により光拡散された第1光と、発光素子61の側面等から出射され、光拡散部材25により光拡散された第2光と、が混合する。また、第1の部材43中に蛍光物質47を略均一に分散させることにより、発光素子41からの光と、蛍光物質47に波長変換された光と、が混合し易くなり、さらに均一な発光色を出射することが可能となる。さらに、第2の部材64の厚さを薄くすることは、光が拡散される部分を限定しているため、発光出力の低下をさらに抑えることができ、ワイヤへの負担も減らすことが可能となる。
これによっても、第2の部材64で光が拡散されるため、照射面においては均一な白色光が写し出される。また、ドーナツ状のイエローリングの発生を抑制することができる。
<Seventh embodiment>
A seventh embodiment will be described with reference to the drawings. FIG. 9 is a schematic cross-sectional view showing a light emitting device according to a seventh embodiment.
The seventh embodiment is substantially the same as the fifth embodiment except that the second member 64 is slightly thin and the concentration of the light diffusing member 65 contained in the second member 64 is changed. The configuration of There is also a part which omits description about the part which takes about the same composition. The light emitting device according to the seventh embodiment is a so-called bullet-type light emitting device including a light emitting element 61, a base 62, a first member 63, and a second member 64. The first member 63 contains a fluorescent material 67 and is dispersed substantially uniformly in the recesses of the base 62. The first member 63 is disposed in the recess of the base 62 and covers the light emitting element 61. The first member 63 has a flat surface. The second member 64 includes a light diffusing member 65 and is disposed above or near the recess than the recess and covers the first member 63. In addition, the second member 64 contains more light diffusing members 65 in the same volume near the upper side of the light emitting element 61 than near the side surface of the base 62. Therefore, the light diffusion action is greater near the upper side of the light emitting element 61 than near the side surface of the base 62. Therefore, even if the thickness of the second member 64 is relatively thin, light can be diffused sufficiently uniformly. The second member 64 has a convex central portion and is covered with a third member 66. The third member 66 fixes the base 62.
Thereby, although not shown in the drawing, the first light emitted from above the light emitting element 61 and diffused by the light diffusing member 65 and the side surface of the light emitting element 61 are emitted as in the fifth embodiment. Then, the second light diffused by the light diffusion member 25 is mixed. Further, by dispersing the fluorescent material 47 substantially uniformly in the first member 43, the light from the light emitting element 41 and the light converted into the wavelength of the fluorescent material 47 can be easily mixed, and more uniform light emission. A color can be emitted. Furthermore, reducing the thickness of the second member 64 limits the portion where the light is diffused, so that a decrease in light emission output can be further suppressed, and the burden on the wire can be reduced. Become.
Also by this, since the light is diffused by the second member 64, uniform white light is projected on the irradiated surface. In addition, the occurrence of a donut-shaped yellow ring can be suppressed.

<第8の実施の形態>
第8の実施の形態について、図面を用いて説明する。図10は、第8の実施の形態に係る発光装置を示す概略断面図である。
第8の実施の形態は、基台72の凹部内に段差を設け、下段部には第1の部材73を配置し、上段部には第2の部材74を配置すること以外は、第2の実施の形態とほぼ同様の構成を採る。ほぼ同様の構成を採る部分については説明を省略する部分もある。第8の実施の形態に係る発光装置は、発光素子71、基台72、第1の部材73及び第2の部材74を備える、いわゆる砲弾型発光装置である。第1の部材73中には蛍光物質77が含有されており、基台72の下段部に沈降している。第1の部材73は、基台72の下段部に配置され、発光素子71を被覆する。蛍光物質77は発光素子71の上面や側面に配置される。第1の部材73は中央部が凹んでいる。第2の部材74は光拡散部材75を含有する。第2の部材74は、凹部の上段部、若しくは、凹部の上段部付近に配置され、第1の部材73を被覆する。第2の部材74は中央部が凸状に形成されている。つまり、基台72の側面付近の厚さよりも発光素子71の上方付近の厚さの方が厚くなっている。第2の部材74中に光拡散部材75がほぼ均一に含有されていた場合、基台72の側面付近における光拡散部材75の全体量よりも、発光素子71の上方部分における光拡散部材75の全体量が多いため、光拡散作用が大きい。第2の部材74は、さらに第3の部材76で被覆されている。第3の部材76は、基台72を固定している。
これにより、図には示さないが第2の実施の形態と同様に、発光素子71の上方から出射され、光拡散部材75により光拡散された第1光と、発光素子71の側面等から出射され、光拡散部材75により光拡散された第2光と、が均一に混合する。これによっても、第2の部材74で光が拡散されるため、照射面においては均一な白色光が写し出され、ドーナツ状のイエローリングの発生も抑制することができる。
また、第8の実施の形態は、第2の部材74に粘度の低い部材を用いたとしても、基台72に設けられた段差によって、第2の部材74を凹部内に確実に配置することができる。基台72に設けられた段差は、第1及び2の部材を流し込む製造工程において、段差部分を目安に配置すれば良いため製造が容易になる。また、第1の部材73を半硬化した状態で、第2の部材74を流し込み界面ができないようにすることができる。基台72の段差は、第2の部材74の劣化を抑制するために半導体素子からの光が、第2の部材74と基台72との接する部分に当たることを抑える。さらに、基台72の段差は、第2の部材74と基台72とが接する部分の表面積を増加させる。これによって、第2の部材74が基台72から剥離することも抑制できる。
<Eighth Embodiment>
The eighth embodiment will be described with reference to the drawings. FIG. 10 is a schematic cross-sectional view showing a light emitting device according to the eighth embodiment.
In the eighth embodiment, a second step is provided except that a step is provided in the recess of the base 72, the first member 73 is disposed in the lower step portion, and the second member 74 is disposed in the upper step portion. The configuration is almost the same as that of the embodiment. There is also a part which omits description about the part which takes about the same composition. The light emitting device according to the eighth embodiment is a so-called bullet type light emitting device including a light emitting element 71, a base 72, a first member 73, and a second member 74. A fluorescent material 77 is contained in the first member 73, and settles in the lower part of the base 72. The first member 73 is disposed on the lower stage portion of the base 72 and covers the light emitting element 71. The fluorescent material 77 is disposed on the upper surface or side surface of the light emitting element 71. The central portion of the first member 73 is recessed. The second member 74 contains a light diffusing member 75. The second member 74 is disposed in the upper step portion of the recess or in the vicinity of the upper step portion of the recess, and covers the first member 73. The center part of the second member 74 is formed in a convex shape. That is, the thickness near the upper side of the light emitting element 71 is thicker than the thickness near the side surface of the base 72. When the light diffusing member 75 is contained almost uniformly in the second member 74, the light diffusing member 75 in the upper part of the light emitting element 71 is larger than the total amount of the light diffusing member 75 in the vicinity of the side surface of the base 72. Since the total amount is large, the light diffusion effect is large. The second member 74 is further covered with a third member 76. The third member 76 fixes the base 72.
Thereby, although not shown in the drawing, the first light emitted from above the light emitting element 71 and diffused by the light diffusing member 75 and the side surface of the light emitting element 71 and the like, as in the second embodiment. Then, the second light diffused by the light diffusing member 75 is uniformly mixed. Also by this, since light is diffused by the second member 74, uniform white light is projected on the irradiated surface, and the occurrence of a donut-shaped yellow ring can also be suppressed.
Further, in the eighth embodiment, even when a low-viscosity member is used as the second member 74, the second member 74 is reliably disposed in the recess by the step provided on the base 72. Can do. The steps provided on the base 72 can be easily manufactured because the steps may be arranged using the step portions as a guideline in the manufacturing process in which the first and second members are poured. Further, the second member 74 can be poured into the first member 73 in a semi-cured state so that an interface is not formed. The level difference of the base 72 suppresses the light from the semiconductor element from hitting the contact portion between the second member 74 and the base 72 in order to suppress the deterioration of the second member 74. Further, the level difference of the base 72 increases the surface area of the portion where the second member 74 and the base 72 are in contact. As a result, the second member 74 can also be prevented from peeling from the base 72.

<第9の実施の形態>
第9の実施の形態について、図面を用いて説明する。図11は、第9の実施の形態に係る発光装置を示す概略断面図である。
第9の実施の形態は、第1及び2の部材の表面が平坦であること、蛍光物質87が第1の部材83の中に略均一に分散していること、及び、第2の部材84に含有される光拡散部材85の濃度を変えたこと以外は、第8の実施の形態とほぼ同様の構成を採る。ほぼ同様の構成を採る部分については説明を省略する部分もある。第9の実施の形態に係る発光装置は、発光素子81、基台82、第1の部材83及び第2の部材84を備える、いわゆる砲弾型発光装置である。第1の部材83中には蛍光物質87が含有されており、基台82の下段部に沈降している。第1の部材83は、基台82の下段部に配置され、発光素子81を被覆する。第1の部材83の表面は、平坦である。第2の部材84は光拡散部材85を含有する。第2の部材84は、凹部の上段部、若しくは、凹部の上段部付近に配置され、第1の部材83を被覆する。また、第2の部材84は、基台82の側面付近よりも発光素子81の上方付近の方が同体積中で光拡散部材65が多く含有されている。そのため、発光素子81の上方付近の方が基台82の側面付近よりも光拡散作用が大きい。ゆえに、第2の部材84の厚さは比較的薄くても、光を十分均一に拡散することができる。第2の部材84は、中央部が凸状に形成されており、さらに第3の部材86で被覆されている。第3の部材86は、基台82を固定している。
これにより、図には示さないが第8の実施の形態と同様に、発光素子81の上方から出射され、光拡散部材85により光拡散された第1光と、発光素子81の側面等から出射され、光拡散部材85により光拡散された第2光と、が均一に混合する。また、第1及び2の部材84の表面を平坦にし厚さを薄くすることは、光が拡散される部分を限定しているため、発光出力の低下をさらに抑えることができ、ワイヤへの負担も減らすことが可能となる。これによっても、第2の部材84で光が拡散されるため、照射面においては均一な白色光が写し出され、ドーナツ状のイエローリングの発生も抑制することができる。
また、第9の実施の形態は、第2の部材84に粘度の低い部材を用いたとしても、基台82に設けられた段差によって、第2の部材84を凹部内に確実に配置することができる。基台82に設けられた段差は、第1及び2の部材を流し込む製造工程において、段差部分を目安に配置すれば良いため製造が容易になる。また、第1及び2の部材の表面を平坦にすることでさらに製造が容易になる。第1の部材83を半硬化した状態で、第2の部材84を流し込み界面ができないようにすることができる。基台72の段差は、第2の部材84の劣化を抑制するために半導体素子からの光が、第2の部材84と基台82との接する部分に当たることを抑える。さらに、基台82の段差は、第2の部材84と基台82とが接する部分の表面積を増加させる。これによって、第2の部材84が基台82から剥離することも抑制できる。
<Ninth embodiment>
A ninth embodiment will be described with reference to the drawings. FIG. 11 is a schematic cross-sectional view showing a light emitting device according to the ninth embodiment.
In the ninth embodiment, the surfaces of the first and second members are flat, the fluorescent material 87 is substantially uniformly dispersed in the first member 83, and the second member 84. Except that the concentration of the light diffusing member 85 contained in is changed, the configuration almost the same as that of the eighth embodiment is adopted. There is also a part which omits description about the part which takes about the same composition. The light emitting device according to the ninth embodiment is a so-called bullet-type light emitting device including a light emitting element 81, a base 82, a first member 83, and a second member 84. The first member 83 contains a fluorescent material 87 and settles in the lower part of the base 82. The first member 83 is disposed at the lower part of the base 82 and covers the light emitting element 81. The surface of the first member 83 is flat. The second member 84 includes a light diffusing member 85. The second member 84 is disposed in the upper step of the recess or in the vicinity of the upper step of the recess and covers the first member 83. In addition, the second member 84 has the same volume in the vicinity of the upper side of the light emitting element 81 than the vicinity of the side surface of the base 82, and contains more light diffusion members 65. Therefore, the light diffusion action is greater near the upper side of the light emitting element 81 than near the side surface of the base 82. Therefore, even if the thickness of the second member 84 is relatively thin, light can be diffused sufficiently uniformly. The second member 84 has a central portion formed in a convex shape, and is further covered with a third member 86. The third member 86 fixes the base 82.
As a result, although not shown in the drawing, as in the eighth embodiment, the first light emitted from above the light emitting element 81 and diffused by the light diffusing member 85 and the side surface of the light emitting element 81 are emitted. Then, the second light diffused by the light diffusing member 85 is uniformly mixed. Further, flattening the surface of the first and second members 84 and reducing the thickness limits the portion where the light is diffused, and thus can further suppress the decrease in the light emission output, and the burden on the wire. Can also be reduced. Also by this, since the light is diffused by the second member 84, uniform white light is projected on the irradiated surface, and the occurrence of a donut-shaped yellow ring can be suppressed.
In the ninth embodiment, even if a low-viscosity member is used as the second member 84, the second member 84 is reliably disposed in the recess by the step provided on the base 82. Can do. The steps provided on the base 82 can be easily manufactured because the steps may be arranged with reference to the steps in the manufacturing process in which the first and second members are poured. Further, the manufacturing of the first and second members is further facilitated by flattening the surfaces. The second member 84 can be poured into the first member 83 in a semi-cured state so that no interface can be formed. The level difference of the base 72 suppresses the light from the semiconductor element from hitting the contact portion between the second member 84 and the base 82 in order to suppress the deterioration of the second member 84. Further, the level difference of the base 82 increases the surface area of the portion where the second member 84 and the base 82 are in contact. As a result, the second member 84 can also be prevented from peeling off from the base 82.

以下、上記構成部材で使用されているものについて、より詳細に説明する。ただし、下記の部材は一実施例であって、これに限定されない。   Hereinafter, what is used by the said structural member is demonstrated in detail. However, the following member is an example, and the present invention is not limited to this.

(発光素子)
発光素子は、基板上にGaAlN、ZnS、ZnSe、SiC、GaP、GaAlAs、AlN、InN、AlInGaP、InGaN、GaN、AlInGaN等の半導体を発光層として形成させたものを用いることができる。半導体の構造としては、MIS接合、PIN接合やPN接合を有したホモ構造、ヘテロ構造あるいはダブルへテロ構成のものが挙げられる。半導体層の材料やその混晶度によって発光波長を紫外光から赤外光まで種々選択することができる。発光層は、量子効果が生ずる薄膜とした単一量子井戸構造や多重量子井戸構造としても良い。発光素子は同一面側に電極を有するものを使用しているが、上下面に電極を有するものも使用することができる。また、ワイヤを用いずに、基台に発光素子をフェイスダウン実装することもできる。
発光素子は、1個に限られず複数個用いることもできる。複数個の発光素子を組み合わせることによって白色表示における混色性を向上させることもできる。
発光素子は、紫外線から赤外光までの光を発するものを使用することができるが、可視光の光を発するものが好ましい。発光素子は、蛍光物質の吸収スペクトル、発光スペクトルや発光装置の発光色等によって適宜変更するが、発光ピーク波長が360nm乃至470nmにあることが好ましい。発光ピーク波長が300nm以下であると蛍光物質を保持する第1の部材や第2の部材が劣化してしまうからである。
(Light emitting element)
As the light-emitting element, a substrate in which a semiconductor such as GaAlN, ZnS, ZnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, or AlInGaN is formed as a light-emitting layer can be used. Examples of the semiconductor structure include a homo structure having a MIS junction, a PIN junction, and a PN junction, a hetero structure, and a double hetero structure. Various emission wavelengths can be selected from ultraviolet light to infrared light depending on the material of the semiconductor layer and the degree of mixed crystal. The light emitting layer may have a single quantum well structure or a multiple quantum well structure which is a thin film in which a quantum effect is generated. A light emitting element having an electrode on the same surface side is used, but a light emitting element having electrodes on the upper and lower surfaces can also be used. Further, the light emitting element can be mounted face-down on the base without using a wire.
The number of light emitting elements is not limited to one, and a plurality of light emitting elements can be used. By combining a plurality of light emitting elements, color mixing in white display can be improved.
A light emitting element that emits light from ultraviolet to infrared light can be used, but a light emitting element that emits visible light is preferable. The light-emitting element is appropriately changed depending on the absorption spectrum, emission spectrum, emission color of the light-emitting device, and the like, but the emission peak wavelength is preferably 360 nm to 470 nm. This is because when the emission peak wavelength is 300 nm or less, the first member and the second member that hold the fluorescent material are deteriorated.

(基台)
基台は凹部を有する。基台は、砲弾型の発光装置に用いるリードだけに限られず、樹脂やセラミックスを用いるパッケージにも応用することができる。リードは、電気伝導性性の良い部材を用いる。基台の凹部の底面には、発光素子を載置する。基台の凹部の側面は、発光素子からの光を反射して、上方に光を放射する。基台の凹部の側面で反射された光は発光素子の上方を通るように反射角を設ける。基台の凹部の深さは、発光素子が載置された上に第1の部材を被覆できる程度の深さを有している。基台の凹部の上端には、第1の部材や第2の部材を弾く部材を配置することもできる。
基台は1以上の段差を設けた凹部を形成することもできる。第1の部材と第2の部材とを凹部内に配置するためである。また、第1の凹部を半硬化させた状態で、第2の部材を配置することもできる。複数段の凹部は開口方向に拡がるように階段状に形成されていることが好ましい。
(第1の部材)
第1の部材は、基台の凹部内に形成され、発光素子を被覆している。第1の部材は蛍光物質を含有することもできる。第1の部材を構成する具体的材料としては、エポキシ樹脂、シリコーン樹脂、変成シリコーン樹脂、アクリル樹脂、イミド樹脂及びユリア樹脂などを用いることができる。このうち、エポキシ樹脂、シリコーン樹脂が好ましい。耐熱性、耐光性に優れているからである。第1の部材は、例えば、樹脂の粘度や揮発性、滴下条件等を調整することで、凹状、凸状、平ら状などの形状にすることができる。第1の部材は第2の部材よりも屈折率の高い方が好ましい。光の取り出し効率を高めることができるからである。
(Base)
The base has a recess. The base is not limited to a lead used in a bullet-type light emitting device, but can be applied to a package using resin or ceramics. For the lead, a member having good electrical conductivity is used. A light emitting element is placed on the bottom surface of the recess of the base. The side surface of the recess of the base reflects light from the light emitting element and emits light upward. A reflection angle is provided so that the light reflected by the side surface of the recess of the base passes above the light emitting element. The depth of the concave portion of the base has such a depth that the first member can be covered on the light emitting element. A member that repels the first member or the second member can be disposed at the upper end of the recess of the base.
The base can also form a recess having one or more steps. This is because the first member and the second member are disposed in the recess. In addition, the second member can be disposed in a state where the first recess is semi-cured. The plurality of recesses are preferably formed in a step shape so as to expand in the opening direction.
(First member)
The first member is formed in the recess of the base and covers the light emitting element. The first member can also contain a fluorescent material. As a specific material constituting the first member, an epoxy resin, a silicone resin, a modified silicone resin, an acrylic resin, an imide resin, a urea resin, or the like can be used. Among these, an epoxy resin and a silicone resin are preferable. It is because it is excellent in heat resistance and light resistance. The first member can be formed into a concave shape, a convex shape, a flat shape, or the like by adjusting, for example, the viscosity or volatility of the resin, dropping conditions, and the like. The first member preferably has a higher refractive index than the second member. This is because the light extraction efficiency can be increased.

(蛍光物質)
蛍光物質は、発光素子からの光を吸収し異なる波長の光に波長変換するものであればよい。例えば、Eu、Ce等のランタノイド系元素で主に賦活される窒化物系蛍光体・酸窒化物系蛍光体、Eu等のランタノイド系、Mn等の遷移金属系の元素により主に付活されるアルカリ土類ハロゲンアパタイト蛍光体、アルカリ土類金属ホウ酸ハロゲン蛍光体、アルカリ土類金属アルミン酸塩蛍光体、アルカリ土類ケイ酸塩、アルカリ土類硫化物、アルカリ土類チオガレート、アルカリ土類窒化ケイ素、ゲルマン酸塩、又は、Ce等のランタノイド系元素で主に付活される希土類アルミン酸塩、希土類ケイ酸塩又はEu等のランタノイド系元素で主に賦活される有機及び有機錯体等から選ばれる少なくともいずれか1以上であることが好ましい。このうちCeで付活されるイットリウム・アルミニウム酸化物を用いて説明するが、これに限定されない。
(Fluorescent substance)
The fluorescent substance may be any substance that absorbs light from the light emitting element and converts the wavelength into light of a different wavelength. For example, it is mainly activated by nitride-based phosphors / oxynitride-based phosphors mainly activated by lanthanoid elements such as Eu and Ce, lanthanoid-based phosphors such as Eu, and transition metal elements such as Mn. Alkaline earth halogen apatite phosphor, alkaline earth metal borate phosphor, alkaline earth metal aluminate phosphor, alkaline earth silicate, alkaline earth sulfide, alkaline earth thiogallate, alkaline earth nitriding Selected from silicon, germanate, or rare earth aluminate mainly activated by lanthanoid elements such as Ce, organic and organic complexes mainly activated by lanthanoid elements such as rare earth silicate or Eu It is preferable that it is at least any one or more. Of these, description will be made using yttrium aluminum oxide activated by Ce, but is not limited thereto.

(第2の部材)
第2の部材は、第1の部材を被覆している。第2の部材は、光拡散部材を含有している。第2の部材を構成する具体的材料としては、エポキシ樹脂、シリコーン樹脂、変成シリコーン樹脂、アクリル樹脂、イミド樹脂及びユリア樹脂などを用いることができるが、特にエポキシ樹脂、シリコーン樹脂を用いることが望ましい。また、第1の部材と第2の部材は同じ種類の部材を用いることが好ましい。同じ種類の部材を用いることにより、第1の部材と第2の部材の密着性を高めたり、界面をなくしたりすることもできる。第2の部材は、第2の部材の厚さや光拡散部材の含有量を調整することにより、光の拡散状態を変えることができる。また、第2の部材は、例えば樹脂の粘度や揮発性、滴下条件等を調整することで形状を変えることができる。また、第2の部材は、基台の凹部から突出する凸状に形成することもできる。第2の部材は、基台の凹部内に配置されていることが好ましいが、基台の凹部からはみ出していてもよい。第2の部材は、基台の凹部に滴下する前、均一に分散しておくことが好ましい。これにより第2の部材中に含有される光拡散部材の全体量を常に均一にすることができ、製品毎の色バラツキを低減することができるからである。そのほか、第2の部材は、濃度の異なる光拡散部材を含有するものを2以上用いることもできる。光拡散部材の濃度の高い樹脂を発光素子の上方に配置し、光拡散部材の濃度の低い樹脂を基台の凹部の側面に配置することにより、第2の部材の濃度が変えることができる。第2の部材の上に、さらに第3の部材を配置することもできる。さらに第3の部材を配置する場合は、第2の部材よりも屈折率が低い方が好ましい。光の取り出し効率を高めることができるからである。
(Second member)
The second member covers the first member. The second member contains a light diffusing member. As a specific material constituting the second member, an epoxy resin, a silicone resin, a modified silicone resin, an acrylic resin, an imide resin, a urea resin, or the like can be used, and it is particularly preferable to use an epoxy resin or a silicone resin. . Moreover, it is preferable to use the same kind of member for the first member and the second member. By using the same type of member, the adhesion between the first member and the second member can be improved, or the interface can be eliminated. The second member can change the light diffusion state by adjusting the thickness of the second member and the content of the light diffusion member. Further, the shape of the second member can be changed by adjusting, for example, the viscosity and volatility of the resin, dropping conditions, and the like. Further, the second member can also be formed in a convex shape protruding from the concave portion of the base. The second member is preferably disposed in the recess of the base, but may protrude from the recess of the base. It is preferable that the second member is uniformly dispersed before being dropped into the recess of the base. This is because the total amount of the light diffusing member contained in the second member can always be made uniform, and color variation for each product can be reduced. In addition, as the second member, two or more members containing light diffusing members having different concentrations can be used. The concentration of the second member can be changed by disposing a resin having a high concentration of the light diffusing member above the light emitting element and disposing a resin having a low concentration of the light diffusing member on the side surface of the recess of the base. A third member can be further disposed on the second member. Furthermore, when arrange | positioning a 3rd member, the one where a refractive index is lower than a 2nd member is preferable. This is because the light extraction efficiency can be increased.

(光拡散部材)
光拡散部材は、第2の部材に含有される。光拡散部材を構成する具体的材料としては、二酸化珪素、酸化チタン、酸化アルミニウム、炭酸カルシウム、酸化亜鉛、チタン酸バリウムなどの無機系拡散材が望ましい。エポキシ樹脂、フェノールホルマリン樹脂、ベンゾグアナミン樹脂、メラミン樹脂、アクリル樹脂、ポリカーボネート樹脂、ポリエチレン樹脂、ポリプロピレン樹脂、グアナミン樹脂などの有機系拡散材であってもよい。また、ガラスなども用いることができる。このうち、反射率の高い二酸化珪素、酸化チタンが好ましい。光拡散部材の含有量により光拡散効果を調整することができる。
(Light diffusion member)
The light diffusing member is contained in the second member. As specific materials constituting the light diffusing member, inorganic diffusing materials such as silicon dioxide, titanium oxide, aluminum oxide, calcium carbonate, zinc oxide, and barium titanate are desirable. Organic diffusion materials such as epoxy resin, phenol formalin resin, benzoguanamine resin, melamine resin, acrylic resin, polycarbonate resin, polyethylene resin, polypropylene resin, and guanamine resin may be used. Glass or the like can also be used. Of these, silicon dioxide and titanium oxide having high reflectivity are preferable. The light diffusion effect can be adjusted by the content of the light diffusion member.

(第3の部材)
第3の部材は、外部環境からの外力や水分などから第1の部材や発光素子などを保護する。よって、第2の部材よりも硬質であることが望ましい。また、発光素子からの光を効率よく集光し、外部に放出することも可能である。このような、第3の部材を構成する具体的材料としては、エポキシ樹脂、ユリア樹脂、シリコーン樹脂などの耐候性に優れた透明樹脂や、金属アルコキシドなどを出発原料としゾル・ゲル法により生成される透光性無機部材、ガラスなどが好適に用いられる。このうち、強度や成型のし易さからエポキシ樹脂が好ましい。また、所定の波長をカットする目的で有機や無機の着色染料や着色顔料を含有させることもできる。また、さらに光を拡散させるために、光拡散部材を含有させることもできる。
(Third member)
The third member protects the first member, the light emitting element, and the like from external force and moisture from the external environment. Therefore, it is desirable that it is harder than the second member. In addition, light from the light emitting element can be efficiently collected and emitted to the outside. Such a specific material constituting the third member is produced by a sol-gel method using a transparent resin having excellent weather resistance such as an epoxy resin, a urea resin, a silicone resin, or a metal alkoxide as a starting material. A translucent inorganic member, glass or the like is preferably used. Among these, an epoxy resin is preferable from the viewpoint of strength and ease of molding. Further, organic or inorganic coloring dyes or coloring pigments may be included for the purpose of cutting a predetermined wavelength. Moreover, in order to further diffuse light, a light diffusing member can be contained.

(発光装置の製造方法)
実施の形態に係る発光装置の製造方法について説明する。第2の実施の形態に係る発光装置について説明する。
第2の実施の形態に係る発光装置は、底面と側面とを持つ凹部を有する基台12と、基台12の凹部の底面に載置される発光素子11と、発光素子11を被覆する第1の部材13と、光拡散部材15が含有された、第1の部材13を被覆する第2の部材14と、を有する。
底面と側面を持つ凹部を有する基台12の底面に発光素子11を載置する(第1の工程)。発光素子11は、エポキシ樹脂や金属部材を介して固定される。その後、発光素子11と基台12とをワイヤを介して電気的に接続する。
次に、基台12の凹部内に第1の部材13を配置する(第2の工程)。第1の部材13内には予め均一に分散させた蛍光物質17を含有させておく。第1の部材13を基台12の凹部内に配置した後、載置すると蛍光物質17が沈降する。第1の部材13を半硬化、若しくは本硬化させた後に次の工程を行うことが好ましい。第1の部材13は、硬化に伴い、有機成分が揮発して、中央部が凹み、凹状を形成する。特に、揮発性の高い第1の部材13を用いることにより、凹状を形成し易くすることもできる。また、第1の部材13を少量、滴下することでも凹状に形成することができる。
次に、基台12の側面付近の厚さよりも発光素子11の上方付近の厚さの方が厚くなるように第2の部材14を第1の部材13上に配置する(第3の工程)。粘度の高い第2の部材14を用いることにより、容易に形成することができる。また、基台12の凹部の上端部に、樹脂を弾く部材を塗布しておくこともできる。第2の部材14は、発光素子11の上方から滴下することが好ましい。第2の部材14中には均一に分散された光拡散部材15が予め含有されている。
第1の部材13が本硬化する前に第2の部材14を配置することができる。これにより第1の部材13と第2の部材14との間に界面が形成せずに硬化でき、光の取り出し効率を上げることができる。また、第1の部材13を注入した後に、第2の部材14を滴下し、第1の部材13と第2の部材14とを同時に硬化することによっても、第1の部材13と第2の部材14との間に界面が形成せずに硬化することができる。一方、第1の部材13を本硬化させた後に、第2の部材14を硬化させることもできる。屈折率の異なる第1の部材13と第2の部材14とを用いたり、異なる材質の部材を用いることもできる。 さらに、第3の部材16を設ける。所定の開口部を有する治具に第3の部材16に係る樹脂を注入する。その後、第2の部材14が被覆されるように、基台12の一部を治具の開口部内に浸漬する。第3の部材16を仮硬化させた後、基台12を治部から取り出し、第3の部材16を本硬化する。
以上の工程を経ることにより発光装置を製造することができる。
(Method for manufacturing light emitting device)
A method for manufacturing the light emitting device according to the embodiment will be described. A light emitting device according to the second embodiment will be described.
The light emitting device according to the second embodiment includes a base 12 having a recess having a bottom surface and a side surface, a light emitting element 11 placed on the bottom surface of the recess of the base 12, and a first covering the light emitting element 11. 1 member 13 and a second member 14 containing the light diffusion member 15 and covering the first member 13.
The light emitting element 11 is placed on the bottom surface of the base 12 having a recess having a bottom surface and a side surface (first step). The light emitting element 11 is fixed via an epoxy resin or a metal member. Then, the light emitting element 11 and the base 12 are electrically connected through a wire.
Next, the 1st member 13 is arrange | positioned in the recessed part of the base 12 (2nd process). The first member 13 contains a fluorescent material 17 uniformly dispersed in advance. When the first member 13 is placed in the recess of the base 12 and then placed, the fluorescent material 17 settles. It is preferable to perform the next step after semi-curing or main-curing the first member 13. As the first member 13 is cured, the organic component is volatilized, the central portion is recessed, and a concave shape is formed. In particular, it is possible to easily form a concave shape by using the first member 13 having high volatility. Alternatively, the first member 13 can be formed in a concave shape by dropping a small amount.
Next, the second member 14 is disposed on the first member 13 so that the thickness near the upper side of the light emitting element 11 is thicker than the thickness near the side surface of the base 12 (third step). . By using the second member 14 having a high viscosity, it can be easily formed. Further, a resin repelling member can be applied to the upper end of the recess of the base 12. The second member 14 is preferably dropped from above the light emitting element 11. The second member 14 contains a light diffusing member 15 uniformly dispersed in advance.
The second member 14 can be disposed before the first member 13 is fully cured. Thereby, it can harden | cure without forming an interface between the 1st member 13 and the 2nd member 14, and it can raise the extraction efficiency of light. Moreover, after inject | pouring the 1st member 13, the 2nd member 14 is dripped and the 1st member 13 and the 2nd member 14 are also hardened by hardening the 1st member 13 and the 2nd member 14 simultaneously. It is possible to cure without forming an interface with the member 14. On the other hand, after the first member 13 is fully cured, the second member 14 can be cured. The first member 13 and the second member 14 having different refractive indexes can be used, or members of different materials can be used. Furthermore, a third member 16 is provided. The resin related to the third member 16 is injected into a jig having a predetermined opening. Thereafter, a part of the base 12 is immersed in the opening of the jig so that the second member 14 is covered. After the third member 16 is temporarily cured, the base 12 is taken out from the healing portion, and the third member 16 is fully cured.
A light emitting device can be manufactured through the above steps.

(実施例1)
実施例1は、第2の実施の形態とほぼ同様の形態を採る。同様な構成を採る部分については説明を省略する部分もある。実施例1について、図3を用いて説明する。実施例1は、発光素子11、基台12、第1の部材13、第2の部材14、光拡散部材15、第3の部材16、蛍光物質17を備える。
発光素子11は、基台(リードフレーム)12の凹部(カップ部)内に載置される。発光素子11は窒化ガリウム系化合物半導体を用いる。基台12の凹部は、深さが約0.3mmである。
第1の部材13は基台12の凹部内に配置され、発光素子11を被覆する。第1の部材13は、基台12の凹部内の上端から発光素子11の上方付近にかけて凹状に形成される。第1の部材13は、基台12の凹部の上端よりも発光素子11の上方付近の方が約0.1mm低い。第1の部材13にはエポキシ樹脂を用い、蛍光物質17が含有される。
蛍光物質17は発光素子11の上面や側面に配置される。蛍光物質17は、YAG系蛍光体を用いる。
第2の部材14は第1の部材13を被覆しており、基台12の凹部内、若しくは、凹部付近に配置される。第2の部材14の表面は凸状に形成されており、基台12の凹の上端よりも発光素子11の上方付近の方が約0.2mm高い。そのため、第2の部材14は、発光素子11の上方付近の厚さが約0.3mmとなる。これによって、第2の部材14は、基台12の側面付近の厚さよりも発光素子11の上方付近の厚さの方が厚く形成される。また、第2の部材14はエポキシ樹脂を用い、光拡散部材15が略均一に含有される。
第3の部材16は、基台12を固定するよう第2の部材14を被覆する。第3の部材16にはエポキシ樹脂を用いる。市販の砲弾型発光装置の形状となるように、第3の部材16を形成する。
以上のようにして作製した発光装置は、均一な白色の発光が可能である。
Example 1
Example 1 takes substantially the same form as the second embodiment. There is also a part which abbreviate | omits description about the part which takes the same structure. Example 1 will be described with reference to FIG. Example 1 includes a light emitting element 11, a base 12, a first member 13, a second member 14, a light diffusing member 15, a third member 16, and a fluorescent material 17.
The light emitting element 11 is placed in a recess (cup part) of a base (lead frame) 12. The light emitting element 11 uses a gallium nitride compound semiconductor. The recess of the base 12 has a depth of about 0.3 mm.
The first member 13 is disposed in the recess of the base 12 and covers the light emitting element 11. The first member 13 is formed in a concave shape from the upper end in the concave portion of the base 12 to the vicinity of the upper side of the light emitting element 11. The first member 13 is approximately 0.1 mm lower in the vicinity of the upper side of the light emitting element 11 than the upper end of the concave portion of the base 12. The first member 13 is made of an epoxy resin and contains a fluorescent material 17.
The fluorescent material 17 is disposed on the upper surface or side surface of the light emitting element 11. The fluorescent substance 17 uses a YAG-based phosphor.
The second member 14 covers the first member 13 and is disposed in the recess of the base 12 or in the vicinity of the recess. The surface of the second member 14 is formed in a convex shape, and is about 0.2 mm higher in the vicinity of the upper side of the light emitting element 11 than the upper end of the concave portion of the base 12. Therefore, the thickness of the second member 14 near the upper side of the light emitting element 11 is about 0.3 mm. As a result, the thickness of the second member 14 near the upper side of the light emitting element 11 is thicker than the thickness near the side surface of the base 12. The second member 14 uses an epoxy resin, and the light diffusion member 15 is contained substantially uniformly.
The third member 16 covers the second member 14 so as to fix the base 12. An epoxy resin is used for the third member 16. The third member 16 is formed so as to have a shape of a commercially available bullet-type light emitting device.
The light emitting device manufactured as described above can emit uniform white light.

第1の実施の形態に係る発光装置を示す概略断面図である。It is a schematic sectional drawing which shows the light-emitting device which concerns on 1st Embodiment. 第1の実施の形態に係る発光装置を発光させた際の照射面の像を示す概略図である。It is the schematic which shows the image of the irradiation surface at the time of making the light-emitting device which concerns on 1st Embodiment light-emit. 第2の実施の形態に係る発光装置を示す概略断面図である。It is a schematic sectional drawing which shows the light-emitting device which concerns on 2nd Embodiment. 第3の実施の形態に係る発光装置を示す概略断面図である。It is a schematic sectional drawing which shows the light-emitting device which concerns on 3rd Embodiment. 第3の実施の形態に係る発光装置を発光させた際の照射面の像を示す概略図である。It is the schematic which shows the image of the irradiation surface at the time of making the light-emitting device which concerns on 3rd Embodiment light-emit. 第4の実施の形態に係る発光装置を示す概略断面図である。It is a schematic sectional drawing which shows the light-emitting device which concerns on 4th Embodiment. 第5の実施の形態に係る発光装置を示す概略断面図である。It is a schematic sectional drawing which shows the light-emitting device which concerns on 5th Embodiment. 第6の実施の形態に係る発光装置を示す概略断面図である。It is a schematic sectional drawing which shows the light-emitting device which concerns on 6th Embodiment. 第7の実施の形態に係る発光装置を示す概略断面図である。It is a schematic sectional drawing which shows the light-emitting device concerning 7th Embodiment. 第8の実施の形態に係る発光装置を示す概略断面図である。It is a schematic sectional drawing which shows the light-emitting device concerning 8th Embodiment. 第9の実施の形態に係る発光装置を示す概略断面図である。It is a schematic sectional drawing which shows the light-emitting device concerning 9th Embodiment. 従来の発光装置を示す概略断面図である。It is a schematic sectional drawing which shows the conventional light-emitting device. 従来の発光装置を発光させた際の照射面の像を示す概略図である。It is the schematic which shows the image of the irradiation surface at the time of making the conventional light-emitting device light-emit. 従来の発光装置を示す概略断面図である。It is a schematic sectional drawing which shows the conventional light-emitting device.

符号の説明Explanation of symbols

1、11、21、31、41、51、61、71、81 発光素子
2、12、22、32、42、52、62、72、82 基台
3、13、23、33、43、53、63、73、83 第1の部材
4、14、24、34、44、54、64、74、84 第2の部材
5、15、25、35、45、55、65、75、85 光拡散部材
6、16、26、36、46、56、66、76、86 第3の部材
17、27、37、47、57、67、77、87 蛍光物質
101、111 第1光
102、112 第2光
201、221 発光素子
202、222 リードフレーム
203 コーティング樹脂
206、226 モールド部材
207、227 蛍光体
211 青色味がかった白色光
212 黄色味がかった白色光
223 樹脂
224 拡散樹脂
225 拡散部材
1, 11, 21, 31, 41, 51, 61, 71, 81 Light-emitting element 2, 12, 22, 32, 42, 52, 62, 72, 82 Base 3, 13, 23, 33, 43, 53, 63, 73, 83 First member 4, 14, 24, 34, 44, 54, 64, 74, 84 Second member 5, 15, 25, 35, 45, 55, 65, 75, 85 Light diffusing member 6, 16, 26, 36, 46, 56, 66, 76, 86 Third member 17, 27, 37, 47, 57, 67, 77, 87 Fluorescent substance 101, 111 First light 102, 112 Second light 201, 221 Light emitting element 202, 222 Lead frame 203 Coating resin 206, 226 Mold member 207, 227 Phosphor 211 Blueish white light 212 Yellowish white light 223 Resin 224 Diffusion resin 2 5 diffusion member

Claims (14)

底面と側面とを持つ凹部を有する基台と、
前記基台の凹部の底面に載置される発光素子と、
前記発光素子を被覆し、前記基台の凹部内に配置される第1の部材と、
前記第1の部材を被覆し、前記基台の凹部内に配置され、かつ、前記発光素子からの光を拡散させる光拡散部材が含有されており、前記基台の側面付近よりも前記発光素子の上方付近の方が同体積中で前記光拡散部材を多く含有する第2の部材と、を有することを特徴とする発光装置。
A base having a recess having a bottom surface and a side surface;
A light emitting element placed on the bottom surface of the recess of the base;
A first member covering the light emitting element and disposed in a recess of the base;
A light diffusing member that covers the first member, is disposed in the recess of the base, and diffuses light from the light emitting element; And a second member containing a large amount of the light diffusing member in the same volume.
底面と側面とを持つ凹部を有する基台と、
前記基台の凹部の底面に載置される発光素子と、
前記発光素子を被覆し、前記基台の凹部内に配置される第1の部材と、
前記第1の部材を被覆し、前記基台の凹部内に配置され、かつ、前記発光素子からの光を拡散させる光拡散部材が含有されており、前記基台の側面付近の厚さよりも前記発光素子の上方付近の厚さの方が厚い第2の部材と、を有することを特徴とする発光装置。
A base having a recess having a bottom surface and a side surface;
A light emitting element placed on the bottom surface of the recess of the base;
A first member covering the light emitting element and disposed in a recess of the base;
A light diffusing member that covers the first member, is disposed in the recess of the base, and diffuses light from the light emitting element is contained, and the thickness is greater than the thickness near the side surface of the base. And a second member having a larger thickness in the vicinity of the upper portion of the light emitting element.
前記第2の部材における前記発光素子の上方の厚さが、前記第1の部材における前記発光素子の上方の厚さよりも厚いことを特徴とする請求項1又は請求項2に記載の発光装置。   3. The light emitting device according to claim 1, wherein a thickness of the second member above the light emitting element is thicker than a thickness of the first member above the light emitting element. 前記第1の部材は、前記凹部の上端よりも低い位置まで充填されていることを特徴とする請求項1又は請求項2に記載の発光装置。   The light emitting device according to claim 1, wherein the first member is filled up to a position lower than an upper end of the concave portion. 前記凹部は、側面に段差が設けられており、下段部分に前記第1の部材が配置されていることを特徴とする請求項1又は請求項2に記載の発光装置。   3. The light emitting device according to claim 1, wherein the concave portion has a step on a side surface, and the first member is disposed on a lower portion. 前記第1の部材と前記第2の部材とは、界面がなく固着されていることを特徴とする請求項1又は請求項2に記載の発光装置。   The light emitting device according to claim 1, wherein the first member and the second member are fixed without an interface. 前記第1の部材は、前記発光素子からの光を吸収して、前記発光素子からの光と異なる波長の光を放出する蛍光物質が含有されていることを特徴とする請求項1又は請求項2に記載の発光装置。   The said 1st member contains the fluorescent material which absorbs the light from the said light emitting element, and discharge | releases the light of a wavelength different from the light from the said light emitting element, The Claim 1 or Claim characterized by the above-mentioned. 2. The light emitting device according to 2. 前記第1の部材は、凹状に形成されていることを特徴とする請求項1又は請求項2に記載の発光装置。   The light emitting device according to claim 1, wherein the first member is formed in a concave shape. 前記第2の部材は、前記基台の凹部から突出する凸状に形成されていることを特徴する請求項1又は請求項2に記載の発光装置。   The light emitting device according to claim 1, wherein the second member is formed in a convex shape protruding from a concave portion of the base. 前記発光装置は、第2の部材上に、さらに第3の部材が設けられていることを特徴とする請求項1又は請求項2に記載の発光装置。   The light emitting device according to claim 1, wherein a third member is further provided on the second member. 底面と側面とを持つ凹部を有する基台と、前記基台の凹部の底面に載置される発光素子と、前記発光素子を被覆する第1の部材と、光拡散部材が含有された、前記第1の部材を被覆する第2の部材と、を有する発光装置の製造方法であって、
前記基台の前記底面に発光素子を載置する第1の工程と、
前記凹部内に第1の部材を配置する第2の工程と、
前記基台の側面付近の厚さよりも前記発光素子の上方付近の厚さの方が厚くなるように第2の部材を第1の部材上に配置する第3の工程と、を有することを特徴とする発光装置の製造方法。
A base including a concave portion having a bottom surface and a side surface; a light emitting element placed on the bottom surface of the concave portion of the base; a first member covering the light emitting element; and a light diffusing member, A second member that covers the first member, and a method for manufacturing the light emitting device,
A first step of placing a light emitting element on the bottom surface of the base;
A second step of disposing a first member in the recess;
And a third step of disposing the second member on the first member so that the thickness near the upper side of the light emitting element is thicker than the thickness near the side surface of the base. A method for manufacturing a light emitting device.
前記第2の工程は、第1の部材を硬化して、凹状となるように配置していることを特徴とする請求項11に記載の発光装置の製造方法。   The method of manufacturing a light emitting device according to claim 11, wherein the second step is arranged such that the first member is cured and has a concave shape. 前記第3の工程は、第1の部材が本硬化する前に第2の部材を配置することを特徴とする請求項11に記載の発光装置の製造方法。   The method of manufacturing a light emitting device according to claim 11, wherein in the third step, the second member is disposed before the first member is fully cured. 前記第3の工程は、前記発光素子の上方から第2の部材を滴下して、前記凹部から突出する凸状を形成することを特徴とする請求項11に記載の発光装置の製造方法。
The method of manufacturing a light emitting device according to claim 11, wherein the third step includes dropping a second member from above the light emitting element to form a convex shape protruding from the concave portion.
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