JP2007180305A - Manufacturing method for semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To protect the terminals formed on the side opposite to the surface of a substrate, on which a semiconductor chip is mounted in the packaging process. <P>SOLUTION: The surfaces with the terminals formed thereon opposite to the sides of the individually dividable multi-boards 12a, with the semiconductor chips 11 being mounted thereon are removably bonded together with adhesive tape 21. Die bonding, wire bonding, and molding are carried out for the individually dividable multi-boards 12a, in a state where the individually dividable multi-boards 12a are bonded together. In some cases, the individually dividable multi-boards 12a may be bonded together with a rigid reinforcing material 22, such as a metal plate 22a for reinforcing the rigidity of the multi-boards 12a that is interposed between them. Thereafter, when they are divided individually, the bonded state thereof is released. <P>COPYRIGHT: (C)2007,JPO&amp;INPIT

Description

  The present invention relates to a manufacturing technique of a semiconductor device, and is particularly effective when applied to terminal protection of a semiconductor chip mounted on a multi-piece substrate until individualization after a molding process.

  The technology described below has been studied by the present inventors in completing the present invention, and the outline thereof is as follows.

  2. Description of the Related Art A semiconductor device has a structure in which a semiconductor chip is mounted on one surface of a substrate, the mounted semiconductor chip and the substrate are connected by wire bonding, and this configuration is resin-sealed with a single-sided mold. In the semiconductor device having such a configuration, the terminal connected to the outside is exposed on the side opposite to the surface on which the semiconductor chip is mounted.

  In the semiconductor device having such a configuration, the exposed terminal surface is easily damaged, and the plating film provided on the terminal surface may be peeled off. Peeling of the plating film causes poor solder connection during mounting. In addition, foreign matter may adhere to the terminal surface. Such adhesion of foreign matter naturally leads to poor conduction during mounting.

  Actually, substrate products having terminals, such as card external products such as SD cards, MMC guards, mini cards, etc., scratches on the terminal portions mainly on the back surface of LGA, BGA, etc., and the occurrence of foreign matter are problematic. .

  As a method for preventing such scratches on the exposed terminal surface or adhesion of foreign substances, for example, a method of applying a protective tape to the entire back surface including the terminals on the back side of the multi-chip substrate on which the terminals are formed is performed. ing. Thereby, the damage | wound to the terminal surface in the die-bonding process of a semiconductor chip to a multi-piece board | substrate, the wire bonding process, foreign material adhesion, etc. can be avoided.

  On the other hand, a carrier jig may be used for conveyance. In such a case, the back side of the multi-piece substrate is attached to the carrier jig. Therefore, as a result, an effect of preventing scratches and foreign matter adhesion to the terminal surface in the die bonding process and the wire bonding process of the semiconductor chip to the multi-piece substrate can be obtained.

  Further, in Patent Document 1, in a BGA (Ball Grid Array) type package, a protruding portion higher than that of a resin-sealed package is formed at the time of molding, and even if it is stacked until it is separated into individual pieces, scratches and foreign matter are left on the terminal portion. The structure which prevents the contact with the resin part used as adhesion is disclosed.

Patent Document 2 describes that in a lead frame type package, a resin is used to form a contact prevention body during resin sealing. It is described that with such a contact preventer, the terminal surface does not come into contact with the resin portion even if the package is subsequently stacked, and it is possible to prevent damage to the terminal surface and adhesion of foreign matter.
JP-A-10-270603 JP 2002-151625 A

  However, the present inventor has found that the conventional techniques related to the terminal protection have the following problems.

  In a configuration in which a protective tape is applied to the back side of the substrate on the terminal forming side of the multi-piece substrate and terminal protection is performed in the die bonding process and the wire bonding process, the protective tape is removed after the wire bonding process. Such a terminal protection configuration does not correspond to the process after the wire bonding process, which is most likely to cause terminal scratches and foreign matter adhesion, and lacks the point of performing terminal protection in the process after the molding process. Yes.

  On the other hand, when using a carrier jig, the meaning of reinforcing the rigidity of a multi-piece substrate with insufficient rigidity is strong, but when using such a carrier jig, the terminal forming surface side is adhesive tape on the inside of the carrier jig. As a result, the terminal surface side is protected. However, even in such a configuration, only the wire bonding process can be handled in terms of using the carrier jig. Therefore, it is difficult to deal with after the molding process, and as described above, it is impossible to cope with the occurrence of such troubles in the process after the molding process, which has the highest possibility of terminal scratches and terminal foreign matter adhesion.

  As described above, in the conventional terminal protection technique, only the terminal protection up to the die bonding process or the wire bonding process can be performed, and the terminal protection in the process after the molding process cannot be performed.

  In addition, from the viewpoint of terminal protection after the molding process, there are techniques disclosed in Patent Documents 1 and 2, but although the disclosed invention is certainly an excellent technique, it is an addition other than resin sealing such as protrusions. Since there is a configuration, it is necessary to remove the additional configuration when singulating. In terms of production efficiency, there are things that are not easily recognized.

  An object of the present invention is to provide a technique for protecting a terminal formed on the opposite side of a semiconductor chip mounting surface at least after the molding step.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  In other words, a large number of substrates on which semiconductor chips are mounted are detachably bonded to each other with their terminal forming surfaces facing each other, and in this state, the molding process is completed, so that scratches on the terminal surface and foreign matter can be removed. Suppresses adhesion.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  In the present invention, the multi-chip substrate on which the semiconductor chip is mounted is detachably bonded with the terminal forming surface side facing, so that the molding process can be completed in that state, It is possible to cope with the occurrence of terminal scratches after the molding process with a high possibility of foreign matter adhesion.

  In the present invention, the multi-chip substrate on which the semiconductor chip is mounted is detachably bonded with the terminal formation surface side facing each other, and the molding process can be completed in that state. The number of product acquisitions per process performed in the state increases, and the process efficiency can be improved.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof may be omitted.

(Embodiment 1)
FIG. 1 is a cross-sectional view schematically showing an overall configuration of an embodiment of a semiconductor device manufactured by the method for manufacturing a semiconductor device of the present invention. FIG. 2 is a process flow diagram of an embodiment of a method for manufacturing a semiconductor device of the present invention. FIG. 3A is a plan view schematically showing a multi-piece substrate according to an embodiment of the present invention, FIG. 3B is a cross-sectional view showing a configuration of bonding, and FIG. It is sectional drawing which shows typically the structure bonded together through the material. 4A is a plan view schematically showing a state in which a semiconductor chip is mounted on a multi-piece substrate according to an embodiment of the present invention, FIG. 4B is a sectional view thereof, and FIG. It is sectional drawing at the time of using the board | substrate bonded together through the rigid reinforcement material. Fig.5 (a) is explanatory drawing which shows typically a mode that it molds in the bonding state of one embodiment of this invention, (b) is a top view which shows a mode that it molded.

  As shown in FIG. 1, in the semiconductor device 10, a semiconductor chip 11 is mounted on a substrate 12 by die bonding, and is electrically connected to the substrate 12 by a wire 13 such as a gold wire by wire bonding. The substrate 12 is provided with a terminal 14 for external connection on its back surface, and is electrically connected to the surface on the chip mounting surface side through a through hole or the like. Such a configuration is sealed with the resin 15 to form the semiconductor device 10.

  The semiconductor device 10 is configured in a card outer shape product 10a such as an SD card, an MMC card, or a mini card, for example. The card outer shape product 10a is manufactured by dividing a multi-piece substrate 12a (see FIG. 3A) into pieces by an on-pack method (punching method).

  Such an on-pack manufacturing method is performed through steps as shown in FIG. That is, in step S100, the semiconductor chip 11 to be mounted is prepared. The semiconductor chip 11 is manufactured through a predetermined process on a semiconductor wafer according to, for example, the card outer shape product 10a. When the semiconductor chip 11 is mounted on the multi-piece substrate 12a, the semiconductor chip 11 that has passed the electrical characteristic test is singulated for each chip and placed in a tray or the like.

  In step S200, a multi-piece substrate 12a on which the semiconductor chip 11 configured as described above is mounted is prepared. In the multi-piece substrate 12a, as shown in FIG. 3A, each substrate 12 on which the semiconductor chip 11 is mounted is formed in a suspended structure in a frame. In the illustration, the suspension structure is omitted for easy understanding of the drawing. As shown in FIG. 3A, terminals 14 are formed on the opposite surface of the multi-chip substrate 12 a on which the semiconductor chip 11 is mounted, that is, the back surface of the substrate 12.

  As shown in FIG. 3B, the multi-piece substrate 12a having such a configuration is prepared by bonding the back side thereof with an adhesive tape 21 to which the opposite substrate 12a can be attached and detached. By bonding the back side, the surface of the terminal 14 configured on the back side is protected. That is, the surface of the terminal 14 on the back surface is covered with the adhesive tape 21, and the surface of the terminal 14 is protected from scratches or adhesion of foreign matter until the adhesive tape 21 is removed.

  In step S300, the semiconductor chip 11 is mounted on the multi-piece substrate 12a in which the back side is bonded in step S200. The semiconductor chip 11 is die-bonded by a die bonder and mounted on the individual substrates 12 of the multi-piece substrate 12a. When the semiconductor chip 11 is mounted, a die bonder that has been used so far is used if the semiconductor chip 11 is mounted on one surface of the bonded multi-chip substrate 12a and then turned over and mounted on the other surface. be able to. Of course, a die bonder on which the semiconductor chip 11 is simultaneously mounted on both sides may be developed and used.

  In this way, the semiconductor chips 11 mounted on the individual substrates 12 of the multiple substrates 12a are wire-bonded to the substrate 12 using the wires 13 in step S310. This state is shown in FIGS. 4 (a) and 4 (b).

  After the wire bonding in step S310, resin sealing is performed in the molding process in step S320. That is, as shown in FIG. 5 (a), in step S320, in the cavity 31 of the mold 30, a semiconductor chip 11 is mounted and wire-bonded on the multiple substrate 12a bonded together, Resin 15 (resin) is poured into the cavity 31 from the gate to perform resin sealing. The molded state is shown in FIG.

  After resin sealing in step S320, in step S400, it is cut into individual pieces by punching. As shown in FIG. 6A, the punching may be performed, for example, in a shape outside the card. After such singulation, the bonded substrates 12 are peeled off from the adhesive tape 21 in step S410 as shown in FIG. 6B, and the peeled semiconductor device 10 may be stored in a tray.

  In such a configuration, the side on which the terminals 14 of the substrate 12 are formed is bonded by the double-sided adhesive tape 21 until just before packing into the tray even after being singulated, so the terminals 14 in the process until just before packing the tray. It is possible to prevent damage to the surface or adhesion of foreign matter to the surface of the terminal 14.

  Such a configuration provides a much greater protection effect than conventional terminal protection up to wire bonding. The configuration shown in FIG. 7A shows the back side of the substrate in the configuration so far in which the semiconductor chip 11 is mounted on each substrate 12 of the multi-piece substrate 12a and then wire bonding is performed. It is a thing.

  Up to now, in order to protect the terminal 14 on the back side of the substrate, as shown in FIG. 7B, a single-sided adhesive tape 21a is pasted on the back side of the substrate so that the terminal 14 is hidden. However, the protection with the single-sided adhesive tape 21a is before the molding process, and in the molding process, the single-sided adhesive tape 21a is peeled off and the process is performed. For this reason, the terminal cannot be protected after the molding process in which there is a high possibility of scratches on the surface of the terminal 14 or adhesion of foreign matter.

  Further, in the configuration so far, as shown in FIG. 8A, a large number of substrates 12a are mounted on a metal carrier jig 32, resulting in terminal protection in the die bonding and wire bonding processes. It was also planned. In such a configuration, since the rigidity of the multi-piece substrate 12a is originally weak, it is often made for the purpose of reinforcing the rigidity so as not to be bent during conveyance and various bondings.

  In such a configuration, the back surface side of the multi-piece substrate 12a on which the terminals 14 are formed is adhered to the carrier jig 32 with an adhesive tape 21 that can be bonded on both sides, as shown in FIG. In this state, die bonding and wire bonding are performed. Even in such a configuration, the adhesive tape 21 is peeled off in the molding process as in the case described with reference to FIG. 7A. Therefore, in the processes after the molding process where the surface of the terminal 14 is highly likely to be scratched and adhered to foreign matter. The terminal cannot be protected.

  However, in the configuration of the present invention, since the back side of the multi-piece substrate 12a is bonded at least until the molding process, the occurrence of such a defect in the molding process in which there is a high risk of scratches on the surface of the terminal 14 and adhesion of foreign substances. Prevention can be achieved.

  In addition, by performing die bonding, wire bonding, and molding process in a state where such a large number of substrates 12a are bonded together, the number of simultaneous processes per process becomes two substrates, and the number of product acquisition is doubled. Production efficiency is doubled.

  Furthermore, as the multi-piece substrate 12a is made thinner, the rigidity of the multi-piece substrate 12 can be secured by bonding the two multi-piece substrates 12 together. Therefore, troubles caused by insufficient rigidity of the multi-piece substrate 12a can also be prevented in advance during conveyance in the die bonding process, wire bonding process, molding process, and the like. In addition, it is possible to eliminate quality troubles due to insufficient rigidity related to the multi-piece substrate 12a.

  Such an effect can be similarly obtained in the embodiments described below.

(Embodiment 2)
In the present embodiment, when providing the multi-piece substrate 12a described in the first embodiment, if the rigidity of the multi-piece substrate 12a is insufficient, as shown in FIG. Alternatively, the adhesive tape 21 may be provided on both sides with the rigid reinforcing member 22 such as the metal plate 22a interposed therebetween, and the back side of the multi-piece substrate 12a may be bonded to each other through the adhesive tape 21.

  If such a configuration is adopted, as shown in FIGS. 4C and 5C, the rigid reinforcing material 22 such as a thin metal plate 22a can prevent the substrate 12a from being bent, for example, and the semiconductor chip 11 can be prevented. Die bonding, wire bonding, and subsequent molding can be performed smoothly.

  The rigid reinforcing member 22 such as the metal plate 22a may be formed as a single sheet and sandwiched between the adhesive tapes 21. Alternatively, it is formed in a punched shape in consideration of the wear of the punching die, and corresponds to the substrate 12. You can pinch it.

(Embodiment 3)
Further, in the above description, the case where the semiconductor device 10 is manufactured by separating the bonded multi-substrates 12a in step S400 and peeling the bonded substrates 12 after separation in step S410 has been described. However, the method of separating into pieces after peeling off the bonding may be used. That is, after molding in step S320, the bonded multi-piece substrate 12a is peeled off as in step S500, and the peeled multi-piece substrate 12a is punched by a normal method in step S510. It may be divided into 12 pieces.

  In such a case, since it is peeled off before singulation, there is an increased risk of scratches on the surface of the terminal 14 or adhesion of foreign matter compared to the case where the detachment is not done until singulation. 14 It is possible to prevent scratches on the surface and adhesion of foreign matter.

  In particular, if such a method is employed, when the rigid reinforcing material 22 such as the metal plate 22a is sandwiched between them in order to separate them into pieces after being peeled, they are adjusted to the substrate 12 in consideration of the wear of the punching die at the time of punching. It is not necessary to prepare the shape metal plate 22a. A rigid reinforcement 22 such as a fairly thick metal plate 22a can also be used in a single piece configuration.

(Embodiment 4)
In the present embodiment, unlike the first embodiment, the semiconductor device 10 having a configuration of LGA, BGA or the like in which the terminals 14 are arranged on the back surface is separated into a plurality of substrates 12b by the MAP method. The case where it manufactures by is demonstrated.

  As shown in FIG. 9A, the semiconductor device 10 is configured as an LGA (Land Grid Array) 10b, for example. In the LGA 10 b, the semiconductor chip 11 is mounted on the substrate 12, and the substrate 12 and the semiconductor chip 11 are connected to each other by a wire 13 by a wire 13. A terminal 14 as a land is formed on the back surface of the substrate 12 as shown in FIG. Such a configuration is sealed with the resin 15 to form the LGA 10b.

  The manufacturing method of the LGA 10b having such a configuration is performed, for example, through a process as shown in FIG. That is, in step S100, the semiconductor chip 11 to be mounted is prepared. The semiconductor chip 11 is manufactured through, for example, a predetermined process on a semiconductor wafer. When the semiconductor chip 11 is mounted on a multi-piece substrate 12b, a chip that passes an electrical characteristic test or the like is separated into individual chips. It is prepared and put in a tray or the like.

  In step S200, a multi-piece substrate 12b on which the semiconductor chip 11 configured as described above is mounted is prepared. Landed terminals 14 are formed on the back surface of the multi-chip substrate 12b opposite to the surface on which the semiconductor chip 11 is mounted.

  As shown in FIG. 3B, the multi-piece substrate 12b having such a configuration is prepared by attaching the back side thereof with a removable adhesive tape 21. By bonding the back side, the surface of the terminal 14 configured on the back side is protected. That is, the surface of the terminal 14 on the back surface is covered with the adhesive tape 21, and the surface of the terminal 14 is protected until the adhesive tape 21 is removed. This prevents scratches on the surface of the terminal or adhesion of foreign matter.

  In step S300, the semiconductor chip 11 is mounted on the multi-piece substrate 12b whose back side is bonded in step S200. The semiconductor chip 11 is die-bonded by a die bonder and mounted on a substrate 12 that is separated into pieces by dicing a multi-piece substrate 12b. In FIG. 10A, a region of the substrate 12 that is separated by dicing is illustrated by a broken line.

  When the semiconductor chip 11 is mounted, a die bonder that has been used so far is used if the semiconductor chip 11 is mounted on one surface of the bonded multi-substrate 12b and then turned over and mounted on the other surface. be able to. Of course, a die bonder in which the semiconductor chip 11 is simultaneously mounted on both sides may be developed and used.

  In this way, the semiconductor chips 11 mounted on the individual substrates 12 of the multiple substrates 12b are wire-bonded to the substrate 12 by the wires 13 in step S310. Such a state is shown in FIG.

  After the wire bonding in step S310, resin sealing is performed in the molding process in step S320. That is, as shown in FIG. 11 (a), in step S320, in the cavity 31 of the mold 30, a semiconductor chip 11 is mounted and wire-bonded on the multi-piece substrate 12b bonded together, Resin 15 (resin) is poured into the cavity from the gate to perform resin sealing. FIG. 11B shows a resin-sealed state.

  After resin sealing in step S320, in step S400, the wafer is diced by a dicer and separated into individual pieces. As shown in FIG. 12 (a), dicing may be performed by cutting into pieces by a dicer along a dicing line indicated by a broken line. After such singulation, the substrates 12 bonded in step S410 may be peeled off from the adhesive tape 21 as shown in FIG. 12B, and the semiconductor devices 10 may be stored in the respective trays. In this way, as shown in FIG. 12C, the terminals 14 arranged in an array formed on the back surface of the substrate 12 can be protected. In the description, the case where the part surrounded by a circle in FIG.

  In such a configuration, the side on which the terminals 14 of the substrate 12 are formed is bonded by the adhesive tape 21 until just before packing in the tray, so that the scratches on the surface of the terminals 14 in the process immediately before packing in the tray, or the surface of the terminals 14 It is possible to prevent foreign matter from adhering to the surface.

(Embodiment 5)
In the present embodiment, a case where the rigidity of the multi-piece substrate 12b is insufficient when the semiconductor device 10 is manufactured by employing the MAP method described in the fourth embodiment will be described. In such a case, as shown in FIG. 13A, adhesive tapes 21 are provided on both sides with a rigid reinforcing member 22 such as a metal plate 22a in between, and the back surface of the multi-piece substrate 12a is interposed therebetween. The sides should be pasted together.

  If such a configuration is adopted, as shown in FIG. 13B, the rigid reinforcing material 22 such as a thin metal plate 22a can prevent the substrate 12b from being bent, for example, and die bonding of the semiconductor chip 11 or wire Bonding can be performed smoothly. The rigid reinforcing member 22 such as the metal plate 22 a is formed as a single piece and is sandwiched between the adhesive tapes 21.

(Embodiment 6)
In the fourth embodiment, the bonded multi-piece substrate 12b is separated in step S400, and the multi-piece substrate 12 bonded after the singulation is peeled off in step S410. The configuration for manufacturing the above has been described. However, the method of separating into pieces after peeling off the bonding may be used. That is, after the molding in step S320, the bonded multiple substrate 12b is peeled off in step S500, and the peeled multiple substrate 12b is diced by a normal method in step S510 to form the substrate 12. It does not matter if it is separated.

  In such a case, since it is peeled off before singulation, there is an increased risk of scratches on the surface of the terminal 14 or adhesion of foreign matter compared to the case where the detachment is not done until singulation. 14 It is possible to prevent scratches on the surface and adhesion of foreign matter.

  In particular, if this method is adopted, there is no need to worry about blade wear during dicing by a dicer when sandwiching a rigid reinforcing material 22 such as a metal plate 22a between them in order to separate them after peeling. The rigid reinforcing member 22 such as the thick metal plate 22a can be used as a single sheet.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  In the above description, the card outer shape product is taken as an example to describe the manufacturing method by the on-pack method. However, the present invention can also be applied to the manufacture of a semiconductor device in which terminals are formed on the back surface, such as LGA and BGA. Needless to say.

  Further, in the manufacturing method of the MAP method, the LGA has been described as an example. However, for example, the MAP method is applied to BGA and the like, and also to an LGA, or a card external product such as an SD card, an MMC card, and a mini card. Needless to say, the manufacturing method can be applied.

  In the description of the above embodiment, the case where the multi-chip substrate is provided from the beginning in a state where the back surface side is bonded in step S200 has been described. After mounting by bonding, or after die bonding and wire bonding are completed, a plurality of substrates may be bonded together, and the subsequent steps after the molding step may be performed.

  In the above-described embodiment, the case where a semiconductor chip having the same configuration is mounted on a multi-piece substrate to be bonded is shown. However, if the punching shape or the dicing line has the same configuration, a large number of substrates to be bonded are combined. Even if different types of semiconductor chips are mounted on both sides of the individual substrate, it does not matter.

  In the above-described embodiment, the configuration in which a multi-piece substrate is bonded is described as an example. However, the multi-chip substrate is not necessarily required.

  Further, in the above embodiment, the case where the terminal forming surface side of the multi-piece substrate is bonded is shown, but from the viewpoint of terminal protection, the terminal portion is bonded, and the adhesive tape is applied to the entire substrate. You don't have to stick.

  Further, in the above-described embodiment, the configuration in which the terminal formation surface side of the multi-piece substrate is bonded is shown, but the opposite surface on which the semiconductor chip is mounted is bonded even if it is not necessarily the terminal formation surface. Thus, the present invention can be applied for the purpose of increasing the number of products acquired and improving the production efficiency.

  The present invention can be effectively used in the field of manufacturing a semiconductor device in which terminals are formed on the back side of a semiconductor chip.

It is sectional drawing which shows typically the whole structure of the semiconductor device which is one embodiment of this invention. It is a flowchart which shows the process of the manufacturing method of the semiconductor device which is one embodiment of this invention. (A) is a top view which shows typically the board | substrate of the multi-piece of one embodiment of this invention, (b) is sectional drawing which shows the structure of bonding, (c) is a rigid reinforcement material. It is sectional drawing which shows typically the structure bonded together via. (A) is a top view which shows typically a mode that the semiconductor chip was mounted in the board | substrate of the multi-piece of one embodiment of this invention, (b) is the sectional drawing, (c) is rigidity reinforcement It is sectional drawing at the time of using the board | substrate bonded together through the material. (A) is explanatory drawing which shows a mode that it molds in the bonding state of one embodiment of this invention typically, (b), (c) is sectional drawing which shows a mode that it molded. (A) is a top view which shows typically a mode that it separated into pieces according to the card | curd external shape of one embodiment of this invention, (b) is a mode that peels the adhesive tape after individualization schematically It is explanatory drawing shown. (A) is a top view which shows typically the structure of the terminal protection of the board | substrate back surface side of the former structure, (b) is the sectional drawing. It is a top view which shows typically the case where the terminal protection of the board | substrate back surface side of a structure so far is performed using a carrier jig | tool, (b) is the sectional drawing. (A) is sectional drawing which shows typically the whole structure of the semiconductor device of one embodiment of this invention, (b) is a top view which shows typically the terminal condition of (a). (A) is a top view which shows typically a mode that the semiconductor chip was mounted in the board | substrate of the multi-piece of one embodiment of this invention, (b) is the sectional drawing. (A) is explanatory drawing which shows typically a mode that it molds in the bonding state of one embodiment of this invention, (b) is sectional drawing which shows a mode that it molded. (A) is a top view which shows the area | region which separates into multiple pieces the board | substrate of one embodiment of this invention by dicing, (b) separated the part enclosed with the circle of (a). It is explanatory drawing which shows a state typically, (c) is a top view which shows typically the terminal condition of the state separated into pieces. (A) is sectional drawing which shows typically the board | substrate of many pieces bonded together through the rigid reinforcement material, (b) is a mode that the semiconductor chip was mounted and resin-sealed in the state of (a). FIG.

Explanation of symbols

10 Semiconductor device 10a Card outline product 10b LGA
DESCRIPTION OF SYMBOLS 11 Semiconductor chip 12 Board | substrate 12a Board | substrate 13 Wire 14 Terminal 15 Resin 21 Adhesive tape 21a Single-sided adhesive tape 22 Rigid reinforcement 22a Metal plate 30 Mold

Claims (5)

A method of manufacturing a semiconductor device having a step of dividing into pieces after a molding step,
In the molding step, a substrate on which a plurality of semiconductor chips are mounted is molded in a state where the surfaces on which the semiconductor chips are not mounted are detachably bonded together. A method of manufacturing a semiconductor device having a structure in which a semiconductor chip is mounted on an individual substrate,
A multi-chip substrate is a semiconductor device characterized in that at least process steps up to a molding process are performed in a state where a surface opposite to the side on which the semiconductor chip is mounted is detachably bonded. Production method. A method of manufacturing a semiconductor device having a structure in which a semiconductor chip is mounted on an individual substrate,
The multi-chip substrate is a semiconductor in which at least process steps up to a molding process are performed in a state in which a terminal forming surface opposite to the side on which the semiconductor chip is mounted is detachably bonded. Device manufacturing method. A method of manufacturing a semiconductor device having a structure in which a semiconductor chip is mounted on an individual substrate,
The multi-chip substrate is characterized in that at least process steps up to a molding process are performed in a state where terminals formed on a side surface opposite to the side on which the semiconductor chip is mounted are detachably bonded. A method for manufacturing a semiconductor device. A method of manufacturing a semiconductor device having a structure in which a semiconductor chip is mounted on an individual substrate,
The multi-piece substrate has at least a molding step in which a terminal forming surface opposite to the side on which the semiconductor chip is mounted is detachably bonded via a rigid reinforcing material of the multi-piece substrate. The manufacturing method of the semiconductor device characterized by the above-mentioned process processing being performed.

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