JP2007180077A5 - - Google Patents
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- Publication number
- JP2007180077A5 JP2007180077A5 JP2005373734A JP2005373734A JP2007180077A5 JP 2007180077 A5 JP2007180077 A5 JP 2007180077A5 JP 2005373734 A JP2005373734 A JP 2005373734A JP 2005373734 A JP2005373734 A JP 2005373734A JP 2007180077 A5 JP2007180077 A5 JP 2007180077A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- tab
- leads
- lead
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 14
- 238000007789 sealing Methods 0.000 claims 8
- 239000000725 suspension Substances 0.000 claims 8
- 230000002093 peripheral Effects 0.000 claims 3
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005373734A JP2007180077A (ja) | 2005-12-27 | 2005-12-27 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005373734A JP2007180077A (ja) | 2005-12-27 | 2005-12-27 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007180077A JP2007180077A (ja) | 2007-07-12 |
JP2007180077A5 true JP2007180077A5 (zh) | 2009-02-12 |
Family
ID=38305004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005373734A Pending JP2007180077A (ja) | 2005-12-27 | 2005-12-27 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2007180077A (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5155644B2 (ja) * | 2007-07-19 | 2013-03-06 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5130566B2 (ja) * | 2008-07-01 | 2013-01-30 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5404083B2 (ja) * | 2009-02-10 | 2014-01-29 | 株式会社東芝 | 半導体装置 |
JP5237900B2 (ja) * | 2009-08-11 | 2013-07-17 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP6164895B2 (ja) * | 2013-04-02 | 2017-07-19 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3154579B2 (ja) * | 1993-02-23 | 2001-04-09 | 三菱電機株式会社 | 半導体素子搭載用のリードフレーム |
JP4357344B2 (ja) * | 2004-04-16 | 2009-11-04 | 株式会社ルネサステクノロジ | 半導体装置 |
-
2005
- 2005-12-27 JP JP2005373734A patent/JP2007180077A/ja active Pending
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