JP2007150111A5 - - Google Patents

Claims (3)

A wiring board including a core part in which a cylindrical through-hole conductor and a filler filling the inside thereof are formed in a through-hole penetrating in the plate thickness direction,
The filler is composed of a resin material containing an inorganic filler. When the average particle size of the inorganic filler is X (μm), the maximum value of X is 5 μm, as defined in JIS-B-0601 on the end face of the filler. The ten-point average roughness (Rz) satisfies Rz ≦ X / 2, and the end face of the filler is covered with a lid-like conductor connected to the through-hole conductor ,
Two or more resin insulation layers are formed on the main surface of the core part via a conductor layer,
A via conductor embedded in the resin insulation layer and connected to the lid-like conductor;
A wiring board, wherein the via conductors are connected in the thickness direction to form a stacked via, and the stacked via is located on the lid-like conductor .   The wiring board according to claim 1, wherein a ten-point average roughness (Rz) of an end face of the filler is X / 3 ≦ Rz. The circuit board according to claim 1 or 2, wherein the via conductor is located at the center area on the through hole.