JP2007149722A - Pressurization processing equipment, pressurization processing method and pressurization processing mold - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide pressurization processing equipment which can perform pressurization processing by measuring the distance between a mold and a work with high precision without relying upon the wavelength of light, and to provide pressurization processing method and pressurization processing mold. <P>SOLUTION: The pressurization processing equipment for transferring a pattern formed on the processing surface of a mold to the surface of a work by pressing the side of at least either of the mold and the work is constituted as follows. A mechanism for measuring the distance between the mold and the work observes distance measurement structures provided, respectively, on the processing surface side of the mold and the surface side of the work. Based on the observation results, the distance between the mold and the work can be measured. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a pressure processing apparatus, a pressure processing method, and a pressure processing mold that pressurize one side of a mold (mold) or a work (workpiece) and transfer the shape of the mold to the work.

In recent years, as introduced in Non-Patent Document 1, for example, a microfabrication technology that pressurizes and transfers a fine structure formed by a concavo-convex pattern on a mold to a workpiece such as a semiconductor, glass, resin, metal, etc. has been developed and attracted attention. ing.
This technique is called nanoimprint or nanoembossing because it has a resolution of several nanometers.
This technology makes it possible to collectively process a three-dimensional structure at the wafer level in addition to semiconductor manufacturing.
Therefore, optical elements such as photonic crystals, μ-TAS (Micro Total
Analysis System) and biochip manufacturing technology are expected to be applied to a wide range of fields.
In such a pressure processing technique using nanoimprinting, for example, when used in a semiconductor manufacturing technique or the like, the microstructure on the mold is transferred to the workpiece as follows.
First, a photo-curing resin layer is formed on a substrate (for example, a semiconductor wafer) that is a workpiece to constitute a workpiece.
Next, a mold in which a fine structure having a desired uneven pattern is formed on the resin layer is pressed and pressed, and the resin is cured by irradiating ultraviolet rays. Thereby, the fine structure on the mold is transferred to the resin layer.
By performing etching or the like using this resin layer as a mask, the microstructure of the mold is formed on the substrate.

In the above imprint technique, when transferring the fine structure by the uneven pattern on the mold, the distance (gap) between the mold and the substrate as the workpiece is increased in order to increase the transfer accuracy and perform high-definition fine processing. Measurement is required.
For this reason, for example, Patent Document 1 proposes to control the distance between the mold and the workpiece by measuring the distance between the mold and the workpiece using light interference when transferring the fine structure on the mold.
US Pat. No. 6,696,220 Stephan Y. Chou et. al. , Appl. Phys. Lett, Vol. 67, Issue 21, pp. 3114-3116 (1995)

  By the way, with the recent increase in demand for high-definition microfabrication, further improvement in transfer accuracy is demanded even in the pressurization by imprint. However, in the above-described conventional example of Patent Document 1, since interference of light is used to measure the distance between the mold and the workpiece, it is difficult to accurately perform measurement below the wavelength, and the transfer accuracy can be improved. Satisfaction was not necessarily obtained in planning.

In view of the above problems, the present invention provides a pressure processing apparatus, a pressure processing method, and a pressure processing apparatus capable of measuring and pressing with high accuracy the distance between a mold and a workpiece without depending on the wavelength of light. The object is to provide a mold for pressure processing.

In order to solve the above problems, the present invention provides a pressure processing apparatus, a pressure processing method, and a pressure processing mold configured as follows.
The present invention provides a pressure processing apparatus that pressurizes at least one side of a mold or a member to be processed and transfers a pattern formed on the processing surface of the mold to the surface of the member to be processed as follows. It is characterized by the construction.
That is, it has a distance measuring mechanism for measuring the distance between the mold and the workpiece, and the distance measuring mechanism is provided on the processing surface side of the mold and the surface side of the processing member, respectively. Observe the distance measurement structure.
And based on the said observation result, it comprised so that the distance between the said mold and the said to-be-processed member could be measured.
The pressure processing apparatus of the present invention is characterized in that the distance measuring mechanism includes an optical system having an optical axis inclined with respect to the normal line of the processing surface of the mold.
The pressure processing apparatus of the present invention is characterized in that the distance measuring mechanism is configured to measure a three-dimensional six-axis positional relationship with respect to the mold and the workpiece.
Further, the present invention provides a pressure processing method in which at least one side of a mold or a workpiece is pressed and a pattern formed on the processing surface of the mold is transferred to the surface of the workpiece. It is characterized by being configured as described above.
That is, the distance measurement structures provided on the processing surface side of the mold and the surface side of the workpiece are observed, and the distance between the mold and the workpiece is measured based on the observation result. And a distance measuring step.
Further, in the pressure processing method of the present invention, the distance measuring step includes a step of measuring the distance measuring structure by optical observation from a tilted optical axis direction with respect to a normal line of the processing surface of the mold. It is a feature.
In the pressurizing method according to the present invention, the distance measuring step includes a step of measuring a three-dimensional six-axis positional relationship with respect to the mold and the workpiece.
Moreover, the mold for pressure processing of the present invention is the mold for pressure processing used in the pressure processing apparatus described in any of the above or the pressure processing method described in any of the above as follows. It is characterized by the construction.
That is, the distance measuring structure provided corresponding to the distance measuring structure provided in the surface side of the said to-be-processed member is provided in the process surface side of the said mold. The pressure processing mold of the present invention is characterized in that the distance measuring structure has a strip-shaped structure.
In the pressure processing mold according to the present invention, the distance measurement structure has a periodic structure.
Moreover, the mold for pressure processing of the present invention is characterized in that the distance measurement structure has a periodic structure having a different period from a periodic structure constituting the distance measurement structure provided on the surface side of the workpiece. Yes.
Further, the mold for pressure processing according to the present invention has a periodic structure that generates moire fringes when the distance measuring structure overlaps with a periodic structure constituting the distance measuring structure provided on the surface side of the workpiece. It is characterized by having.
Further, the pressure processing apparatus of the present invention includes a pressure processing apparatus for transferring the pattern of the mold having the concavo-convex pattern to a member on the substrate, the following holding parts (1) to (2), (3) It has the structure provided with the optical observation part.
(1) A first holding unit for holding the mold.
(2) A second holding unit for holding the second surface of the substrate so as to be parallel to the first surface on which the uneven pattern of the mold is formed.
(3) An optical observation unit for observing alignment marks each having an optical axis inclined with respect to the normal direction of the first surface and formed on the mold and the substrate.
And using the information from the said optical observation part, the distance between the said mold and the said board | substrate is replaced with the plane information parallel to the said 1st surface of the said mold.

  According to the present invention, the pressure processing apparatus, the pressure processing method, and the pressure processing that enable high-precision measurement and pressure processing without depending on the wavelength of the light between the mold and the workpiece. Mold can be realized.

With the above configuration, the distance between the mold and the workpiece can be measured with high accuracy without depending on the wavelength of light. This is based on the following knowledge of the present inventors.
As a result of intensive studies, the present inventors have found a measurement technique that enables measurement by replacing the distance between the mold and the workpiece with information on a plane parallel to the processed surface of the mold.
Hereinafter, in order to clarify these measurement methods, the principle of measuring the distance between the mold and the workpiece will be described.
In FIG. 1, the conceptual diagram explaining the principle of the distance measurement between the mold in this Embodiment and a workpiece | work is shown.
In the coordinates, the workpiece side when the mold and the workpiece are in contact at a desired position is the origin of the entire system, and at this position, the origin of the mold is coincident with the origin of the entire system.
The xy plane is parallel to the workpiece surface, and the z-axis is the normal direction of the workpiece.
Here, the in-plane alignment is alignment on the xy plane, and the distance measurement is the distance between the mold and the workpiece on the z-axis.
The mold is provided with a mold distance measuring structure 101, and the workpiece is provided with a workpiece distance measuring structure 102.
In this distance measurement structure of the mold, a strip-shaped structure is in the positive direction of the y-axis with the x-axis as a boundary, and is periodically arranged in the x-direction.
In addition, the work has a strip-shaped structure in the negative direction of the y-axis with respect to the x-axis, and it exists alone. Therefore, when the distance measurement structure between the mold and the workpiece is observed from the axis on the zx plane, the structures do not overlap.

FIGS. 1A, 1C, and 1E are views showing a state in which a mold and a work are cut along a zx plane.
The microscope 103 is on the zx plane, and the optical axes of the microscope intersect at the origin and are the angle of the z axis and θ. 1 (b), (d) and (f) show the structure of the mold in the positive region of the y-axis and the workpiece in the negative region when the structure is observed from the optical axis of the microscope. It is a figure which shows the state by which the structure was observed.
Here, a description will be given using the strip-shaped structures A, B, and C of the mold and the strip-shaped structure W of the workpiece.
First, these are set at a position where the origin of the mold coincides with the origin of the entire system.
When these are observed with a microscope at this position, A of the mold and W of the workpiece coincide.
Next, it is assumed that the mold is moved in the z direction from the position where A and W of the workpiece coincide with each other to reach the position shown in FIG. At that time, in the microscope 103 whose optical axis has an angle of θ with respect to the z-axis, the B of the mold and the W of the workpiece are observed to coincide with each other as shown in FIG.
Here, it is assumed that the position of the mold is moved in the positive direction of z from FIG. 1A to become FIG. 1C. In this case, in the microscope, as shown in FIG. 1D, the mold C and the workpiece W are observed to coincide with each other.
However, even if the height is the same as in FIG. 1C, in the case of FIG. 1E in which the positional relationship between the mold and the workpiece is shifted in the x direction, as shown in FIG. The mold B and the workpiece W are observed to coincide with each other.

As is clear from the above, the length L from the mold A to the workpiece W when observed with a microscope includes two pieces of information, that is, the mold height and the movement distance in the x direction.
That is, when the mold A is at the position (x, y, z), L observed with a microscope can be expressed by the following equation.

However, by adding the optical axis to be observed from the z direction, the position information of x can be separated, and the distance between the mold and the workpiece can be measured.
By applying such a principle, the distance between the mold and the workpiece can be measured by replacing it with information on a plane parallel to the mold.
This makes it possible to detect all regions linearly without depending on the wavelength of light.
The distance measurement structure may be the reverse of the structure of the present embodiment described above, with the periodic structure and the single structure being a mold and a workpiece.
Furthermore, both may have a periodic structure or a single structure.
When both are arranged periodically, the period may be the same or different.
Further, the positional relationship may be a position where they do not overlap or may overlap. Thus, by using a periodic structure for the distance measurement structure, it is possible to measure the distance between the mold and the workpiece with higher accuracy.
In particular, when different pitches are overlapped, moire fringes are generated, and by using this phenomenon, it is possible to measure the distance between the mold and the workpiece with high accuracy.
Further, the distance measurement structure does not have to be a strip structure as described above, and may be a circle, a cross, a box, or the like.
Furthermore, the accuracy of transferring the mold structure can be improved by applying the above-described principle and using a method of calculating the three-dimensional six-axis posture of the mold and the workpiece.
In addition, by using such a distance measurement structure for pressure processing with a mold and a workpiece, it is possible to improve accuracy particularly when transferring a fine structure.
Moreover, the above technique can be used as a semiconductor manufacturing technique, a manufacturing technique of an optical element such as a photonic crystal, or a biochip such as μ-TAS.

Examples of the present invention will be described below.
[Example 1]
In Example 1, a method for measuring a distance between a mold and a workpiece to which the present invention is applied will be described.
FIG. 2 is a diagram for explaining them.
2A to 2D are observation examples using the distance measuring optical system when the mold and the workpiece are in contact with each other and the origins of the entire system are coincident with each other.
The dotted line 201 is the imaging range, the xy axis is at the center of the imaging range, and the z axis is facing from the back to the paper surface.
The positive direction of the y-axis with respect to the x-axis is the mold structure, and the negative direction is the work structure.
FIG. 2A is a configuration example in which the distance measurement structure is a strip-shaped structure.
That is, the strip-shaped structure 202 on the mold side and the strip-shaped structure 203 on the workpiece side are provided so as to have a positional relationship that does not overlap when observed with a microscope.
The configuration example of FIG. 2A will be described. First, the mold and workpiece distance measurement structure at the origin where the mold and the workpiece are in contact is measured and stored in advance.
Next, at a predetermined position where the mold is moved in the z direction, the mold strip structure 202 and the workpiece strip structure 203 are respectively measured by a distance measuring optical system in which the optical axis has an angle of θ with respect to the z axis. Measure the long side of.
Each position is detected by comparing the structure of the measurement result with the structure stored in advance.
Based on these, the length L between the position in the distance measurement structure of the mold (A of the mold described above) and the position of the distance measurement structure of the workpiece (work W described above) can be obtained.
By applying the above-described principle of measuring the distance between the mold and the workpiece based on the length L, the distance between the mold and the workpiece can be measured.

FIG. 2B is a configuration example in which the distance measuring structure is formed by arranging strip-shaped structures in a cycle.
That is, the distance measuring structure 204 of the mold-side alignment structure of the strip-shaped with a period of P _1, distance measurement structure 205 of the workpiece-side structure of the strip-shaped is to be aligned with a period of P _2. However, the strip structure at the position where x = 0 is formed longer than the other structures so that it can be recognized.
Also in this configuration example, the length L can be obtained as in the configuration example of FIG.
That is, the distance measurement structure of the mold and the workpiece is stored in advance, and each position is detected by comparing with the observed structure (pattern recognition), and L is measured by subtracting them.
According to this method, since the periodic structure is used as compared with FIG. 2A, the number of measurement objects increases, and the accuracy can be improved.

FIG. 2C is a configuration example in which the distance measurement structure is arranged in a plurality of periods with a strip-shaped structure on the mold side and the workpiece side.
That is, those which strip structure on the distance measuring structure of the mold side are arranged at a period 207 of cycle 206 and P ₄ of the P ₃ are used.
Meanwhile, those strip structure on the distance measuring structure of the work side are arranged at a period 209 of cycle 208 and P ₆ of P ₅ is used.
The positions of P _{3 and} P ₄ are measured by pattern recognition, and the position of the mold is calculated.
Further, measured P _5, P _6, respectively, to calculate the position of the workpiece.
With this method, L described above can be measured even if the reference point is not within the imaging range of the distance measuring optical system.

とＰ₉の周期を持つ基準信号

を掛けることにより次式を得る。

右辺の周期に関係ない成分

をフィルターによって抽出することにより位相を検出することができる。
なお、以上の計測方法はお互いに組み合わせて使うことにより、互いの利点を利用することができる。 FIG. 2D is a configuration example in which moire fringes are generated.
In this configuration example, is a sequence of periodic moire fringes 210 and moire fringes 211 of the P _9, moiré fringes 210 are aligned strip-shaped structure of the mold in a cycle of P _7, a strip-shaped structure of the work in a period of P ₈ It occurs when they are in line and overlap.
On the other hand, the moire fringes 211 strip-shaped structure of the mold arrangement with a period of P _8, a strip-shaped structure of the workpiece is lined with a period of P _7, generated by that they overlap.
2A to 2C change the intensity of the rectangle, whereas FIG. 2D changes gently, so that it is possible to measure with a resolution smaller than the number of pixels.
First, only the periodic component of the P ₉ extracted by the filter from the image, obtained by normalizing the signal signal

Reference signal having a the period of P ₉

To obtain the following equation:

Components not related to the period of the right side

Can be detected by a filter to detect the phase.
Note that the above-described measurement methods can be used in combination with each other to take advantage of each other.

[Example 2]
(Device configuration)
In Example 1, a pressure processing apparatus having a distance measuring means between a mold and a workpiece to which the present invention is applied will be described.
In FIG. 3, the structure of the pressurization processing apparatus in a present Example is shown.
In FIG. 3, reference numeral 301 denotes a light source, and 302 denotes a distance measuring optical system.
Reference numeral 303 denotes a mold, 304 denotes a mold distance measuring structure, 305 denotes a work distance measuring structure, and 306 denotes a work.
Reference numeral 307 denotes a pressurizing mechanism, 308 denotes an in-plane moving mechanism, 309 denotes an image sensor, 310 denotes an image sensor, and 311 denotes an in-plane alignment optical system.
312 is an in-plane alignment structure on the mold side, and 313 is an in-plane alignment structure on the workpiece side.
314 is an exposure control system, 315 is a process control system, 316 is an attitude control system, and 317 is a distance measurement system. The surface of the workpiece 306 is the xy plane, and the normal of the workpiece is the z axis.
The mold 303 and the work are arranged at positions facing each other. There is a distance measurement structure 304 and an in-plane alignment structure 312 on the mold side, and a distance measurement structure 305 and an in-plane alignment structure 313 on the workpiece side.
The workpiece is connected to a pressurizing mechanism 307 and an in-plane moving mechanism 308 through members.
These mechanisms are controlled by the attitude control system 316. The pressurizing mechanism is adjusted so that the mold and the workpiece do not shift while moving in the height direction.
There is a light source 301 on the back side of the mold, which is controlled by an exposure control system 314.
Further, in order to measure the distance between the mold and the workpiece, there are a distance measurement optical system 302, an image sensor 309, an in-plane alignment optical system 311 and an image sensor 310.

These are controlled by the distance measurement system 317. The in-plane alignment optical system detects the position in the xy plane, and the distance measurement optical system measures the distance between the mold and the workpiece in the z direction.
The in-plane alignment optical system has an optical axis parallel to the z normal, whereas the distance measurement optical system forms an angle θ.
The exposure control system, the position control system, and the distance measurement system are connected to the process control system 315, and the process control system performs overall control.
In the pressurizing process, an in-plane alignment optical system and an in-plane moving mechanism are arranged at a position where a work coated with a photo-curing resin and having a distance measurement structure faces the mold.
Pressure is applied while measuring the distance between the mold and the workpiece by the distance measuring method, and the film thickness of the photo-curing resin is controlled.
When the desired film thickness is reached, light is irradiated to cure the photocurable resin.
Thereafter, the mold and the workpiece are peeled off.

[Example 3]
In Example 3, a method for producing a distance measuring structure to the mold side and the workpiece side to which the present invention is applied will be described.
FIG. 4A is a process diagram for explaining the procedure of the method for producing the distance measuring structure to the mold side according to this embodiment.
At the time of creation on the mold side, a processing structure 404 for transfer is created, and then a distance measurement structure 406 is created by the following procedure.
(1) The quartz substrate 402 is coated with an EB resist 401.
(2) The processed structure is drawn and developed by the EB drawing apparatus.
(3) Etching is performed using an etching apparatus, and the resist is further removed.
(4) A resist 405 is applied to a quartz substrate having a processed structure by spin coating.
(5) The distance measurement structure 406 is transferred by aligning the position with the mask while referring to the alignment structure 403, and performing exposure and development.
(6) A desired mold can be obtained by performing etching using an etching apparatus and further stripping off the resist.
FIG. 4B is a process diagram for explaining the procedure of the method for manufacturing the structure for measuring the distance to the workpiece in this embodiment.
When creating on the workpiece side, the workpiece is prepared as follows.
(1) A silicon wafer is coated with a resist.
(2) Exposure is performed by a light exposure machine, and the distance measurement structure 409 is transferred and developed.
(3) A desired distance measurement structure 409 can be obtained by performing etching using an etching apparatus and further peeling the resist.
The mold may be a material that transmits light, such as Pyrex (registered trademark) or sapphire, and the processing method may be an optical exposure machine, an EB exposure machine, FIB, or an X-ray lithography apparatus. It is also possible to take a replica by Ni electroforming or the like.
Further, if the width and depth of the machining structure and the distance measurement structure are approximately the same, the order of the machining structure and the distance measurement structure may be made simultaneously. If the distance measurement structure is smaller than the machining structure, the distance measurement structure may be made first and the machining structure may be performed later.
Further, the work substrate may be a resin plate or a glass substrate.
In addition, the distance measurement structure may be formed not only with unevenness but also with films having optically different characteristics.

[Example 4]
In the fourth embodiment, a three-dimensional six-axis distance measuring method to which the present invention is applied will be described. FIG. 5 shows a two-dimensional distance measurement structure in a state where the mold and the work are in contact with each other and the origin of the mold and the system coincide with each other.
On the mold, strip-shaped structures are periodically arranged in a region in the positive direction of the y-axis with respect to the x-axis, and a strip-shaped structure is periodically arranged in the region in the positive direction of the x-axis with respect to the y-axis. There are 503 lined up.
A strip structure 502 and a strip structure 504 parallel to the x-axis exist in the negative direction region from the x-axis to the y-axis on the workpiece.
When the mold is at a position (x ₀ , y ₀ , z ₀ ) from the workpiece origin, the next distance can be measured by observing from the measurement optical axis 505 on the zx plane.
That is, the periodic structure 501 and the strip-shaped structure 502, the distance represented by _{f (x 0, z 0)} , it is possible to measure the y ₀ from the periodic structure 503 and the strip-shaped structure 504.

Next, a three-dimensional six-axis attitude control method for the mold and workpiece according to this embodiment will be described with reference to FIG. There are three measurement areas 601, 603, and 605, and the origin of the workpiece distance measurement structure at each position is represented by A (x ₁ , y ₁ , z ₁ ), B (x ₂ , y ₂ , z ₂ ) and C (x ₃ , y ₃ , z ₃ ).
When the mold moves and the origin of the distance measurement structure is A ′, B ′, C ′, the distance measurement structure represented in the coordinate system is expressed as follows.
That is, they are expressed as A ′ (x _1d , y _1d , z _1d ), B ′ (x _2d , y _2d , z _2d ), C ′ (x _3d , y _3d , z _3d ).
However, A ′ (x ₁ + x _1d , y ₁ + y _1d , z ₁ + z _1d ), B ′ (x ₂ + x _2d , y ₂ + y _2d , z ₂ + z _2d ), C ′ (x ₃ + x _3d , y ₃ + y _3d , z ₃ + z _3d ).
Each measurement region is observed by a measurement system 602 parallel to the zx plane, a measurement system 604 parallel to the xy plane, and a measurement system 606 parallel to the yz plane.
At that time, the distance measurement system 607 measures the following six physical quantities.

Since the mold is a rigid body, the distance between the vertices of the triangle ABC and the triangle A′B′C ′ of the distance measurement structure of the mold does not change. Thus, the following three equations can be obtained.

There are nine unknowns, six measured physical quantities, and three equations.
The posture calculation system 608 calculates the posture of the mold with respect to the workpiece in three dimensions by substituting the measured physical quantity into an equation.
As a result, the origin position and normal vector of the mold can be calculated, and the attitude is controlled by the attitude control system 609 so that the mold has a desired attitude.
However, the mechanism for controlling the posture is omitted here.
Note that, using the fact that the mold is substantially parallel to the workpiece, first, y _1d , y _2d , and x _3d are measured, and the stage is controlled to reduce them.
Next, L ₁ ≈z _1d tan (θ), L ₂ ≈z _2d tan (θ), and L ₃ ≈z _3d tan (θ) are measured, and the stage is controlled so that each becomes a desired value.
By repeating this operation, the mold and the workpiece may be in a desired posture.

The conceptual diagram explaining the principle of the distance measurement between the mold and workpiece | work in embodiment of this invention. (A), (c), (e) is a figure which shows the state which cut the mold and the workpiece | work in the zx plane. (B), (d), and (f) show the structure of the mold in the positive region of the y axis and the structure of the workpiece in the negative region when the distance measurement structure is observed from the optical axis of the microscope. The figure which shows the state made. The figure explaining the distance measuring method between the mold and the workpiece | work in Example 1 of this invention. (A) is a figure which shows the structural example which made the distance measurement structure the strip-shaped structure. (B) is a figure which shows the structural example which made the distance measurement structure the strip-shaped structure arranged in a period. (C) is a diagram showing a configuration example in which a distance measuring structure is arranged in a plurality of periods with a strip-shaped structure on the mold side and the workpiece side. FIG. 6D is a diagram illustrating a configuration example in which moire fringes are generated. The figure which shows the structure of the pressure processing apparatus in Example 2 of this invention. The figure explaining the production method of the mold in Example 3 of this invention, and a workpiece | work. (A) is a figure which shows the process drawing explaining the procedure of the production method of the distance measurement structure to the mold side. (B) is a figure which shows the process drawing explaining the procedure of the production method of the distance measurement structure to the workpiece | work side. The figure explaining the distance measurement structure of the two-dimensional structure of the state which the mold explaining the Example 4 of this invention and the origin of a system correspond. The figure explaining the attitude | position control of the three-dimensional 6 axis | shaft between the mold and the workpiece | work in Example 4 of this invention.

Explanation of symbols

101: Mold distance measurement structure (cross section)
102: Workpiece distance measurement structure (cross section)
103: Microscope 104: Mold side distance measurement structure (top surface)
105: Distance measurement structure on the workpiece side (top surface)
201: imaging range 202: mold strip structures 203: a strip of the workpiece structure 204: the cycle of the mold of P ₁ Structure 205: workpiece P ₂ of the periodic structure 206: the mold P ₃ periodic structure 207: the mold P ₄ periodic structure 208: the periodic structure 209 P ₅ of the work: periodic structure 210 of the P ₆ of the workpiece: the periodic structure of the P ₇ of the mold, moire fringes due to the periodic structure of the P ₈ of the workpiece 211: period of mold P ₈ structure When moire fringes due to the periodic structure of the P ₇ of the work 301: light source 302: distance measuring optical system 303: mold 304: mold side distance measuring structure 305: workpiece-side distance measuring structure 306: work 307: pressing mechanism 308: In-plane moving mechanism 309: imaging device 310: imaging device 311: in-plane alignment optical system 312: mold in-plane alignment structure 313: workpiece surface Alignment structure 314: Exposure control system 315: Process control system 316: Attitude control system 317: Distance measurement system 401: EB resist 402: Quartz substrate 403: In-plane alignment structure 404: Processing structure 405: Resist 406: Mold Distance measurement structure 407: Silicon substrate 408: Resist 409: Work distance measurement structure 501: Periodic structure parallel to the y-axis on the mold 502: Strip structure 503 parallel to the y-axis on the work 503: On the x-axis on the mold Parallel periodic structure 504: strip structure parallel to the x-axis on the workpiece 505: measurement optical axis 601 on the zx plane: region 1
602: Measurement system parallel to the zx plane 603: Region 2
604: Measurement system parallel to zx plane 605: Region 3
606: Measurement system 607 parallel to yz plane: Distance measurement system 608: Attitude calculation system 609: Attitude control system

Claims (12)

A pressure processing apparatus that pressurizes at least one side of a mold or a workpiece, and transfers a pattern formed on the processing surface of the mold to the surface of the workpiece,
A distance measuring mechanism for measuring a distance between the mold and the workpiece;
The distance measuring mechanism observes a distance measuring structure provided on each of the processing surface side of the mold and the surface side of the workpiece,
A pressure processing apparatus configured to be able to measure a distance between the mold and the member to be processed based on the observation result.   The pressure processing apparatus according to claim 1, wherein the distance measuring mechanism includes an optical system having an optical axis inclined with respect to a normal line of a processing surface of the mold.   The pressure processing apparatus according to claim 1, wherein the distance measuring mechanism is configured to be able to measure a three-dimensional six-axis positional relationship with respect to the mold and the workpiece. A pressure processing method in which at least one side of a mold or a workpiece is pressed, and a pattern formed on the processing surface of the mold is transferred to the surface of the workpiece.
Observe the distance measurement structures provided on the processing surface side of the mold and the surface side of the workpiece,
A pressure processing method comprising a distance measuring step of measuring a distance between the mold and the workpiece based on the observation result.   5. The pressurization according to claim 4, wherein the distance measuring step includes a step of measuring the distance measuring structure by optical observation from an optical axis direction inclined with respect to a normal line of a processing surface of the mold. Processing method.   The pressure processing method according to claim 4, wherein the distance measuring step includes a step of measuring a three-dimensional six-axis positional relationship with respect to the mold and the workpiece. It is a mold for pressure processing used for the pressure processing apparatus of any one of Claims 1-3, or the pressure processing method of any one of Claims 4-6,
A pressure processing mold having a distance measurement structure provided on the processing surface side of the mold in correspondence with the distance measurement structure provided on the surface side of the workpiece.   The pressure processing mold according to claim 7, wherein the distance measuring structure has a strip-shaped structure.   The mold for pressure processing according to claim 7, wherein the distance measuring structure has a periodic structure.   The pressure processing mold according to claim 7, wherein the distance measurement structure has a periodic structure constituting a distance measurement structure provided on a surface side of the workpiece and a periodic structure having a different period. .   The said distance measurement structure has a periodic structure which produces | generates a moire fringe by overlapping with the periodic structure which comprises the distance measurement structure provided in the surface side of the said to-be-processed member. Mold for pressure processing. A pressure processing apparatus for transferring the pattern of a mold having a concavo-convex pattern to a member on a substrate,
A first holding unit for holding the mold;
A second holding part for holding the second surface of the substrate so as to be parallel to the first surface on which the uneven pattern of the mold is formed;
An optical observation unit for observing alignment marks formed on the mold and the substrate, respectively, having an optical axis inclined with respect to the normal direction of the first surface;
A pressure processing apparatus, wherein information from the optical observation unit is used to replace the distance between the mold and the substrate with plane information parallel to the first surface of the mold.

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