JP2010000754A - Method of molding article to be molded, and apparatus for molding - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of molding an article to be molded capable of molding the article to be molded by a simple process, and easy to alter a thickness of the article W to be molded. <P>SOLUTION: In the method of molding the article W to be molded uses a first member P1 having a first plane P1A, and a second member P2 having a second plane P2A and able to relatively transfer and position in a direction approaching or leaving from the first member P1, the article W to be molded before molding is put on the first plane P1A when the first plane P1A stays away from the second plane P2A by a first distance, the second member P2 is relatively transferred and positioned so that a distance between the first plane P1A and the second plane P2A becomes a second distance, and then the article W to be molded is cured. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a molding method and a molding apparatus for a product to be molded, and particularly to a product in which a product to be molded is sandwiched and molded between surfaces facing each other.

  FIG. 11 is a diagram showing an outline of a conventional molding method for the molded product W, and FIG. 11A shows a box-shaped mold 100 used in the conventional molding method for the molded product W. FIG. 11B is a side view of the box-shaped mold 100 and the molded product W used in the conventional molding method of the molded product W. FIG.

  When a rectangular plate-shaped workpiece W is molded by a conventional molding method, a box-shaped mold (case) 100 that is made of a transparent member and can be disassembled and assembled is used. First, the mold 100 is assembled, and the liquid ultraviolet curable resin W <b> 1 is put into the mold 100. Thereafter, the mold 100 is irradiated with ultraviolet rays to cure the resin W1.

  Subsequently, the mold 100 is disassembled (disassembled), the cured resin W1 is taken out, and the peripheral portion of the taken out resin W1 is cut by laser processing or the like along the broken line L1 to form a rectangular plate-shaped article to be molded. W is gained.

  In addition to the ultraviolet curable resin, a thermosetting resin or a thermoplastic resin may be used. Further, the obtained molded product W is transparent, for example, and has a thickness t of about 0.1 mm to 0.3 mm, and is used as a front panel of the image display device.

For example, Patent Document 1 and Patent Document 2 can be listed as documents related to the conventional technology.
JP 2006-295010 A JP 2000-289010 A

  By the way, in the conventional molding method described above, each time the molded product W is molded, the mold 100 must be disassembled and assembled, and the molding process of the molded product W is complicated. That is, since the mold 100 is assembled from a large number of members using bolts, jigs, etc., it takes a lot of time to disassemble and assemble the mold 100. Furthermore, when it is desired to change the thickness of the molded product W, there is a problem that it takes time and effort because the form of the mold 100 must be changed.

  The present invention has been made in view of the above-described problems, and it is possible to mold a molded product with a simple process, and it is also possible to easily change the thickness of the molded product W. It is an object of the present invention to provide a method and a molding apparatus for a molded article.

  The invention according to claim 1 is provided with a first member having a first surface and a second surface facing the first surface, in a direction approaching / separating from the first member. In a molding method of a molded product using a second member that is relatively movable and positionable, when the first surface and the second surface are separated from each other by a first distance, A distance between the first surface and the second surface after the molded product is installed in the first surface and the molded product is installed in the molded product installation step. The member movement positioning step of moving and positioning the second member relative to the first member so that the second distance is smaller than the first distance, and the member movement positioning step A molding method for a molded product, comprising: a molded product curing step for curing the molded product after moving and positioning A.

  According to a second aspect of the present invention, in the molding method for a molded product according to the first aspect, at least one of a concave portion and a convex portion is provided on at least one of the first surface and the second surface. This is a molding method of a molded product that is formed.

  According to a third aspect of the present invention, there is provided a first molding plate holder capable of holding the first molding plate, and a first molding plate held by the first molding plate holder. The second molding plate can be held so that the molding surface of the second molding plate faces the molding surface, and is close to the first molding plate holder. A second molding plate movable in a separating direction, a holder, a plate holder driving positioning means for moving and positioning the second molding plate holder, and the first molding plate Measuring means for measuring the position of the second molding plate holder with respect to the holder, molded article curing means for curing the molded article installed between the molding plates, and curing the molded article Formation when cured by means The molded product thickness input means for inputting the thickness of the product, and the thickness of the molded product is input by the molded product thickness input means and is held by the first molding plate holder. A first installation molding surface which is a molding surface of one molding plate and a second molding surface which is a second molding plate held by the second molding plate holder. The second molding plate holder is held in the first molding plate until the installation molding surfaces are brought into surface contact with each other by the plate holder driving positioning means from a state where the installation molding surface is separated from each other. The position of the second molding plate holder when the installation molding surfaces are brought into surface contact with each other is measured by the measuring means, and the measured value is used as an origin. After this measurement, the plate By holding body drive positioning means, The molding plate holder 2 is moved away from the first molding plate holder so that the distance between the first installation molding surface and the second installation molding surface is the first distance. After the molding product before curing is placed between the molding plates, the first installation molding surface and the second installation molding surface are used by the plate holder drive positioning means using the origin as a reference. Is a second distance that is smaller than the first distance and is a second distance corresponding to the thickness of the molded product input by the molded product thickness input means. The second molding plate holder is moved and positioned, and after the moving positioning, the molded product is cured by the molded product curing means, and after the curing, the plate holder drive positioning means performs the second The molding plate holder of the first component. It is a molding apparatus for a molding product having control means for controlling the mold plate holder so as to be separated from the mold plate holder.

  According to the present invention, it is possible to mold a molded product through a simple process, and it is possible to easily change the thickness of the molded product W.

  FIG. 1 is a diagram illustrating a schematic configuration of a molding apparatus 1 for a molded product W according to an embodiment of the present invention, and FIGS. 2 to 4 are diagrams illustrating an operation of the molding apparatus 1.

  FIG. 5 is a view showing the form of the molded product W, FIG. 5 (a) is a perspective view of the molded product W, and FIG. 5 (b) is a plan view of the molded product W. FIG. 5C is a side view of the product W.

  FIG. 6 is a flowchart showing the operation of the molding apparatus 1.

  For convenience of explanation, one horizontal direction is the X-axis direction, another horizontal direction that is perpendicular to the X-axis direction is the Y-axis direction, and the vertical direction (vertical direction) is the Z-axis direction. The direction.

  A molding apparatus (hereinafter referred to as a “molding apparatus”) 1 for a molded article W is an apparatus used when a plate-shaped molded article (for example, an ultraviolet curable resin W1) W is sandwiched and molded. One molding plate holder (lower molding plate holder) 3 and a second molding plate are provided with a holder (upper molding plate holder) 5.

  The lower molding plate holder 3 is formed by, for example, using a first molding plate (lower molding plate; first member) P1 formed in a rectangular flat plate shape as the first molding plate P1. One surface (lower surface) in the thickness direction is brought into contact with each other and can be held using holding means (not shown) such as vacuum suction or bolts.

  Similarly to the lower molding plate holder 3, the upper molding plate holder 5 is a second molding plate (upper molding plate; formed in the same shape as the first molding plate P1). The second member) P2 can be held freely. In other words, the upper molding plate holder 5 is configured such that the second molding plate P2 is brought into contact with one surface (upper surface) in the thickness direction of the second molding plate P2, and vacuum suction, bolts, or the like are used. The holding means (not shown) is configured to be freely held. The upper molding plate P2 is made of a transparent body such as quartz glass that can transmit ultraviolet rays.

  In a state where the respective molding plate holders 3 and 5 hold the respective molding plates P1 and P2, a molding surface (upper surface; when molding the product W to be molded) is sandwiched between the first molding plates P1. The surface for contact with the product W) P1A is substantially parallel to the molding surface of the second molding plate P2 (lower surface; the surface with which the product W contacts when the product W is sandwiched) P2A. Facing each other.

  The upper molding plate holder 5 is movable in a direction (Z-axis direction) that approaches and separates from the lower molding plate holder 3. That is, the upper molding plate holder 5 is provided above the lower molding plate holder 3 and is integrally supported by the movable body 10. The movable body 10 is supported by the base frame 9 via a linear guide bearing (not shown). Thus, the upper molding plate holder 5 is movable in the Z-axis direction. The lower molding plate holder 3 is supported by the base frame 9 via a gimbal mechanism 7 described later in detail.

  As already understood, the upper molding plate holder 5 is movable in the thickness direction (Z-axis direction) of the molding plate P2 held by the upper molding plate holder 5. When viewed from the thickness direction (Z-axis direction) of the respective molding plates P1 and P2 installed, the respective molding plates P1 and P2 that are installed overlap each other.

  Further, the molding apparatus 1 is provided with plate holder drive positioning means 11 for driving and positioning the upper molding plate holder 5 (movable body 10) in the Z-axis direction. The plate holder drive positioning means 11 is configured to move and position the upper molding plate holder 5 via an actuator (not shown) such as a servo motor and a ball screw, for example.

  In the molding apparatus 1, the upper molding plate is configured to move and position the holding body 5. However, the lower molding plate holding body 3 is replaced with or in addition to the upper molding plate. It may be configured to move and position in the Z-axis direction. That is, the upper molding plate may be relatively moved and positioned with respect to the lower molding plate holder 3.

  The gimbal mechanism 7 adjusts the posture (the rotation angle about the X axis and the rotation angle about the Y axis) of the lower molding plate holder 3 with respect to the upper molding plate holder 5, and can be held after this adjustment. It is a mechanism. The gimbal mechanism 7 is provided with a clamp mechanism (not shown). When this clamp mechanism is operated, the lower molding plate holder 3 is integrally supported with respect to the base frame 9, and the upper molding plate is supported. The posture of the lower molding plate holder 3 with respect to the holder 5 is maintained. When the clamp mechanism is not in operation, the lower molding plate holder 3 rotates with respect to the base frame 9.

  More specifically, since the lower molding plate holder 3 is supported by the base frame 9 via the spherical bearing 13, the posture can be adjusted. Further, for example, air pressure is supplied between the convex surface and the concave surface of the spherical bearing 13, or the convex surface and the concave surface of the spherical bearing 13 can be vacuum-sucked. When the air is supplied, the lower molding plate holder 3 rotates, and when the vacuum is sucked, the lower molding plate holder 3 is integrally supported by the base frame 9. Yes. The gimbal mechanism 7 may be provided on the upper molding plate holder 5 side instead of the lower molding plate holder 3.

  Further, the molding apparatus 1 includes a measuring means 15 for measuring the position of the upper molding plate holder 5 with respect to the lower molding plate holder 3 and a molded product installed between the molding plates P1 and P2. Molded product curing means 17 for curing W is provided.

  The measuring means 15 is configured to measure the position of the upper molding plate holder 5 with respect to the base frame 9 using, for example, a linear encoder. The molded product curing means 17 irradiates the molded product W made of the ultraviolet curable resin W1 with ultraviolet rays using, for example, the ultraviolet ray generator 19, and cures the molded product W (ultraviolet curable resin W1). It is configured as follows. The ultraviolet rays emitted from the ultraviolet ray generator 19 are transmitted through a through hole (not shown) provided in the movable body 10 or the upper molding plate holder 5 and the upper molding plate P2 made of a transparent body. The molded product W is irradiated through the through-hole.

  In addition, the molding apparatus 1 is configured such that when the molding product W is sandwiched between the molding plates P1 and P2 held by the molding plate holders 3 and 5, A vacuum molding chamber forming means 21 is provided for bringing the molded product W and its peripheral portion into a vacuum state or a reduced pressure state. The vacuum forming chamber forming means 21 includes a cover member 23 and a vacuum pump 25. When the molding target W is sandwiched between the molding plates P1 and P2, the cover member 23 and the movable body 10 are arranged. The base frame 9 forms a closed space SP1 into which the respective molding plate holders 3 and 5, the respective molding plates P1 and P2, and the molded product W are contained (see FIG. 3). And it is comprised so that the air in the closed space SP1 may be attracted | sucked with the vacuum pump 25, and it may pressure-reduce to a pressure lower than atmospheric pressure.

  Further, the molding apparatus 1 includes a molded product thickness input means 28 for inputting the thickness of the molded product W when cured by the molded product curing means 17, and a control device (for controlling the operation of the molding apparatus 1). Control means) 29.

  The molded product thickness input means 28 includes, for example, an input means 27 configured with a touch panel or a keyboard. The control device 29 controls the plate holder drive positioning unit 11, the measuring unit 15, the vacuum molding chamber forming unit 21, the molded product curing unit 17, and the like based on an operation program stored in the memory 31 in advance. It has become.

  That is, the molding apparatus 1 inputs the thickness of the molded product W by the molded product thickness input means 28 under the control of the control device 29. Subsequently, the posture of the lower molding plate holder 3 (lower molding plate P1) is adjusted from a predetermined state by the gimbal mechanism 7, and the upper molding plate holder 5 (upper molding plate P2) is adjusted. The origin is set.

  The predetermined state is a state in which the posture of the lower molding plate holder 3 relative to the upper molding plate holder 5 can be changed by the fact that the clamp mechanism of the gimbal mechanism 7 is not operated. A first installation molding surface P1A that is a molding surface of the lower molding plate P1 held by the side molding plate holder 3 and an upper molding plate that is held by the upper molding plate holder 5 This is a state where the second installation molding surface P2A, which is the molding surface of P2, is separated, and further, the molding product W is not installed on each of the molding plates P1, P2.

  Here, the adjustment of the posture of the lower molding plate holder 3 and the origin of the upper molding plate holder 5 in the gimbal mechanism 7 will be described in detail. First, the upper molding plate holder 5 is brought close to the lower molding plate holder 3 until the respective installation molding surfaces P1A and P2A come into surface contact with each other by the plate holder driving positioning means 11, and each gimbal mechanism 7 Adjust the posture of the lower molding plate holder 3 so that the lower molding plate holder 3 follows the upper molding plate holder 5 so that the installation molding surfaces P1A and P2A are parallel to each other. After the adjustment, the posture of the lower molding plate holder 3 is held by the clamp mechanism of the gimbal mechanism 7. Further, the position of the upper molding plate holder 5 when the installation molding surfaces P1A and P2A are in surface contact with each other is measured by the measuring means 15, and this measured value is used as the origin.

  After the origin is determined, the upper molding plate holder 5 is moved in the direction away from the lower molding plate holder 3 (upward) by the plate holder driving positioning means 11, and the installation molding surface P1A and the installation molding are moved. The distance from the surface P2A is set to a first predetermined distance D1 (see FIG. 2).

  Subsequently, after the product to be molded W (ultraviolet curable resin W1) before curing is placed between the respective molding plates P1 and P2 (on the installation molding surface P1A), the vacuum molding chamber forming means 21 performs the vacuum molding chamber. The SP1 is formed and the origin is used as a reference, and the distance between the first installation molding surface P1A and the second installation molding surface P2A by the plate holder drive positioning unit 11 is greater than the first distance D1. Is a second distance D2 that is smaller than the second distance D2 (for example, the input thickness of the molded product W and the thickness of the molded product W input by the molded product thickness input means 28). The upper molding plate holder 5 is moved and positioned so as to be the same distance) (see FIG. 3).

  After this movement positioning, the molded product W (ultraviolet curable resin W1) is cured by the molded product curing means 17 (irradiating ultraviolet rays), and after this curing, the vacuum molding formed by the vacuum molding chamber forming means 21 is performed. The chamber SP1 is released, and the upper molding plate holder 5 is separated from the lower molding plate holder 3 by the plate holder driving positioning means 11 (see FIG. 4).

  Here, the operation of the molding apparatus 1 will be described.

  As an initial state, it is assumed that the molding plate holders 3 and 5 hold the molding plates P1 and P2, and the distances between the installation molding surfaces P1A and P2A are separated by a predetermined distance (FIG. 1). reference).

  In the initial state, the surfaces P1A and P2A of the molding plates P1 and P2 are substantially parallel to each other, and the surfaces P1A and P2A overlap each other when viewed from the Z-axis direction.

  In the initial state, the posture of the lower molding plate holder 3 is adjusted (S1). That is, the molding plate holders 3 and 5 are brought close to each other to bring the surfaces P1A and P2A into surface contact with each other, and the posture of the molding plate P2 relative to the molding plate P1 is relatively adjusted (for example, the plane P2A The rotation angle about the X axis and Y axis in the lower molding plate holder 3 is adjusted so that the plane P1A is parallel to the plane P1A), and this adjusted state is maintained using the clamp mechanism, The lower molding plate holder 3 is moved in a direction (upward) away from the upper molding plate holder 5 until the distance between the molding plates P1 and P2 reaches a predetermined first distance D2. When adjusting the posture, the origin is also set as described above.

  After execution of the posture adjustment, when the surface P1A and the surface P2A are separated by a predetermined first distance D1, the product to be molded W before molding is placed on the surface P1A (S3; see FIG. 2). . In addition, since the ultraviolet curable resin W1 is employed as the article to be molded W, the article to be molded W before molding is the liquid ultraviolet curable resin W1, but the semi-cured (temporarily cured) ultraviolet ray is used. You may install cured resin as the to-be-molded product W before shaping | molding. Here, the semi-cured ultraviolet curable resin is an ultraviolet curable resin that has been crosslinked to some extent to form a viscous fluid.

  After the molding product W is installed, the molding product W is sandwiched between the planes P1A and P2A to mold the molding product W to a predetermined thickness, and the distance between the surfaces P1A and P2A is smaller than the first distance D1. 2 is moved and positioned close to the molding plate P2 so as to be a predetermined distance D2 of 2 (S5; see FIG. 3). In this way, even when positioned at the second predetermined distance D2, the periphery of each plane P1A, P2A (molded product W) communicates with the outside (outside air). That is, the product to be molded W does not exist in a sealed space, and is simply sandwiched between the two planes P1A and P2A of the respective molding plates P1 and P2.

  After securing the second predetermined distance D2, while maintaining the secured state (while maintaining the second predetermined distance D2), the molded product W is cured by irradiating with ultraviolet rays (S7).

  After the molded product W is cured, the molding plate P2 is moved away from the molding plate P1 (see FIG. 4), and the molded product W is removed from the molding plates P1 and P2 (S9), and after the removal. Then, the outer periphery of the molded product W is cut to make the molded product W into a predetermined shape (S11). By cutting the outer periphery, the molded product W becomes a shape such as a rectangular flat plate (desired shape; the shape of the molded product necessary for use as a product or a semi-finished product).

  More specifically, as shown in FIG. 5, the molded product W immediately after being removed from the molding plates P <b> 1 and P <b> 2 has a peripheral shape such as a barrel shape. By cutting this at a rectangular cutting line L2 as shown in FIG. 5B, a rectangular thin plate-shaped product (thickness of about 0.1 mm to 0.3 mm, for example) is obtained. Molded product) W can be obtained. The cutting is performed using, for example, a laser, a shear, a water jet, or the like.

  FIG. 5A is a perspective view showing the shape of the molded product W immediately after being removed from the molding plates P1 and P2, and FIG. FIG. 5C is a side view showing the shape of the molded product W immediately after being removed from the molding plates P1 and P2.

  In the molding method described above, a flat plate-shaped product (for example, a product to be used as a transparent cover on the front surface of a liquid crystal panel) W is molded. You may make it shape | mold the to-be-molded product of shapes, such as other shapes. For example, as in the case of molding a spectacle lens, each surface in the thickness direction of the molded product may be a non-planar surface having a large curvature. In this case, the thickness of the molded product is not constant but gradually changes.

  In order to prevent air bubbles from being mixed into the molded product W when molding the molded product W, the vacuum molding chamber forming means 21 is used for vacuum molding around the molded product W as described above. A chamber SP1 is formed. Then, immediately after the upper molding plate holder 5 starts moving downward, the vacuum molding chamber SP1 ends the curing of the product W and immediately after the upper molding plate holder 5 starts moving upward. It has come to be formed.

  By the way, at least one of a concave portion and a convex portion may be formed on at least one of the surface P1A of the lower molding plate P1 and the surface P2A of the upper molding plate P2. These concave portions and convex portions are used as a reference when, for example, the molded product W is cut into a desired shape after the molded product W is sandwiched between the surfaces P1A and P2A, cured and removed from the molding apparatus 1. The concave and convex portions are transferred to the molding target W.

  More specifically, as shown in FIG. 8 (a diagram showing a modification of the molding plate), a rectangular annular groove P1B may be provided around the surface P1A of the lower molding plate P1.

  The cross section of the groove P1B (the cross section taken along a plane perpendicular to the extending direction of the groove P1B) is formed in a small rectangular shape, for example. Similarly, a rectangular annular groove P2B is also provided around the surface P2A of the upper molding plate P2. When viewed from the direction orthogonal to the planes P1A and P2A, the grooves P1B and P2B substantially overlap each other. When the product W is placed and molded (when the distance between the planes P1A and P2A is set to the second predetermined distance D2), excess resin flows into the grooves P1B and P2B. The molded product W is formed in a cross-sectional shape as shown in FIG. 10 (a) or FIG. 10 (b). The molded product W formed in this way is cut at, for example, a two-dot chain line L3 away from the step with reference to the step (step formed by the grooves P1B and P2B). ing.

  In addition, as shown in FIG. 9 (a diagram showing a modification of the molding plate), rectangular annular protrusions P1C and P2C are provided around the planes P1A and P2A in place of the rectangular annular grooves. It may be a configuration. In this case, in order to avoid interference between the convex portions P1C and P2C, the total height of the convex portions P1C and P2C is smaller than the thickness dimension of the molded product W to be molded. In addition, each of the rectangular annular convex portions P1C and P2C is formed in a comb shape in the longitudinal direction, and the convex portions of the first member and the convex portion of the second member do not interfere with each other. , The total dimension of the heights of the convex portions may be larger than the thickness dimension of the molded product to be molded. Furthermore, the structure which provided the groove | channel in one of each plate P1, P2 and provided the convex part in the other may be sufficient.

  According to the molding apparatus 1, since the conventional mold 100 is not used, the process of disassembling and assembling the mold 100 every time the molded product W is molded becomes unnecessary, and the molded product W can be assembled in a simple process. Can be molded. Moreover, the thickness of the to-be-molded product W can be easily changed by changing the distance between each molding plate P1, P2.

  Further, if the concave and convex portions of the respective molding plates P1 and P2 are transferred to the molding target W, the transferred concave and convex portions are cut when, for example, the peripheral portion of the molding target W is cut. Therefore, it is possible to accurately cut the workpiece W quickly.

  In the above description, the ultraviolet curable resin is taken as an example of the article to be molded, but instead of the ultraviolet curable resin, a material that is cured by receiving electromagnetic waves in a specific frequency band may be employed.

  Moreover, as the to-be-molded product W, a thermosetting resin or a thermoplastic resin may be employed, or a material other than the resin may be employed.

  When a thermosetting resin is used as the article to be molded W, the article to be molded before molding is a liquid thermosetting resin, but a semi-cured thermosetting resin is molded before molding. Good. Here, the semi-cured ultraviolet curable resin is a thermosetting resin that has been crosslinked to some extent to become a viscous fluid. Furthermore, when a thermosetting resin is employed, a heater may be provided as the molding product curing means 17, for example, in each of the molding plate holders 3 and 5.

  Further, when a thermoplastic resin is employed as the product to be molded W, the product to be molded before molding is a thermoplastic resin formed in a plate shape or a pellet shape. The thermoplastic resin placed in this way is molded, for example, in a state where it is once heated to a viscous fluid by a heater provided in each of the molding plate holders 3 and 5.

  Furthermore, a thermoplastic resin that has been preliminarily heated to become a viscous fluid may be employed as a molded product before molding. Furthermore, a thermoplastic resin dissolved in a solvent may be employed as a molded product before molding. Furthermore, a semi-cured thermoplastic resin may be employed as a molded product before molding. Here, the semi-cured thermoplastic resin is a thermoplastic resin in which a solvent disappears to some extent due to evaporation or the like and cross-linking proceeds to form a viscous fluid.

  When a thermoplastic resin is employed, a cooling device for cooling and curing the thermoplastic resin or a heater for removing the solvent is used as the molded article curing means 17, for example, each molding plate holder 3, 5 may be provided.

  Further, as shown in FIG. 7 (a diagram showing a case where a fine transfer pattern is provided on the molding plate), at least one of the surfaces P1A and P2A of the molding plates P1 and P2 has a micron size or a submicron size. The transfer pattern P2D formed by the fine irregularities may be formed, and the fine transfer pattern may be transferred to the molding target W when the molding target W is molded. The product W to which the fine pattern is transferred in this way is used as, for example, a light guide plate of a backlight of a liquid crystal display device.

  Moreover, although supply of the to-be-molded product W to the shaping | molding apparatus 1 and taking out of the to-be-molded article W from the shaping | molding apparatus 1 are performed by a person, the to-be-molded product installation means comprised with a robot etc. is provided, Under the control of the control device 29, the installation of the molded product W before molding and the removal of the molded product W after molding may be automated.

  At least one of the lower molding plate P1 (lower molding plate holder 3) and the upper molding plate P2 (upper molding plate holder 5), the cured product to be molded W is placed on each molding plate P1, P2. An ejector pin may be provided for pulling away from.

  For example, the ejector pin pushes a portion (for example, the groove portions P1B, P2B and the convex portions P1C, P2C) that are not finally used as a product among the portions of the cured product W to be molded. It is designed to be separated from the plates P1 and P2.

  Further, when ejector pins are provided on both of the molding plates P1 and P2, both ejector pins are not operated at the same time, but are operated while being shifted in time. Shall.

  Specifically, after the product to be molded W is cured, when the upward movement of the upper molding plate holder 5 is started, only the ejector pins provided on the upper molding plate P2 are operated. Thus, the cured product W is separated from the upper molding plate P2 and is in contact with the surface P1A of the lower molding plate P1. Thereafter, when the ejector pin provided on the lower molding plate P1 is operated, the cured product W is separated from the lower molding plate P1. As a result, the cured product W can be easily removed from the molding plates P1 and P2.

  Further, the shrinkage rate (deformation rate) when the molded product W is cured is input to the control device 29 via the input means 27 such as a touch panel or a keyboard, and this input value is set when the molded product W is cured. Based on the above, the plate holder drive positioning means 11 may be controlled to change the distance between the first installation molding surface P1A and the second installation molding surface P2A.

  For example, when a certain resin is completely cured from a semi-cured state, its length becomes 98% (shrinkage rate 98%), and a cured product having a thickness of 0.3 mm is molded. Shall. In such a case, after installing the semi-cured resin, the distance between the first installation molding surface P1A and the second installation molding surface P2A is set to 0.306 mm (0.3 mm ÷ 0.98). To do. Subsequently, when the irradiation of ultraviolet rays is started to completely cure the semi-cured resin, the movement (downward movement) of the upper molding plate holder 5 is started at a certain very low speed, and when the ultraviolet irradiation is finished, or Shortly before the end of the ultraviolet irradiation, the movement of the upper molding plate holder 5 is stopped. Then, the distance between the first installation molding surface P1A and the second installation molding surface P2A when stopped may be 0.3 mm.

  When the shrinkage rate exceeds 100%, the second molding plate holder 5 is moved away from the first molding plate holder 3 when the product W is cured. To do.

  Further, instead of storing the type of the molded product W and the shrinkage rate in advance in the memory 31 provided in the control device 29 and inputting the shrinkage rate with the input means 27, the molded product W is replaced. When the shrinkage rate corresponding to the input type of the molded product W is called from the memory 31 and the molded product W is cured, the same control as described above may be performed. Good.

  Furthermore, for example, a pressing force detecting means capable of detecting the pressure that presses the molding product W to mold the molding product W with the molding plate holding members 3 and 5 on the upper molding plate holder 5. (For example, a load cell) is provided, and when a high accuracy is required as the planar accuracy of the molded product W (planar accuracy of the upper surface and the lower surface of the molded product W in FIG. 5C), the molding plate P2 is pressed. The product W may be molded with the force kept constant under the control of the control device 29.

  Further, in the above case (when high accuracy is required as the planar accuracy of the molded product W), when a higher accuracy is required as the thickness accuracy of the molded product W, an appropriate predetermined pressing is performed. The molded product W is molded as a trial by force, and the thickness of the molded product W molded in this trial is separately measured (it may be automatically measured by a measuring device provided in the molding apparatus 1). Based on the obtained value, the amount of the resin W1 may be adjusted, or the pressing force may be adjusted, and the product W may be molded.

  That is, when the molded product W molded as a trial is thicker than the target value, at least one of increasing the pressing force or reducing the amount of the resin W1 is performed to perform the next molded product W. On the other hand, if the molded product W molded as a trial is thinner than the target value, at least one of reducing the pressing force and increasing the amount of the resin W1 is performed. The molded product W may be molded.

  In the molding apparatus 1, the molding plates P1 and P2 are held by the molding plate holders 3 and 5, but the lower molding plate holder 3 and the lower molding plate P1 are connected to each other. A configuration may be adopted in which the upper molding plate holder 5 and the upper molding plate P2 are integrated.

  In addition, the shaping | molding apparatus 1 is an example of the apparatus used in order to perform the molding method hung up next.

  That is, the molding apparatus 1 includes a first member having a first surface and a second surface opposite to the first surface, and is relative to the first member in a direction approaching / separating from the first member. In a molding method of a molded product using a second member that can be moved and positioned freely, when the first surface and the second surface are separated by a predetermined first distance, A distance between the first surface and the second surface after the molded product is installed in the first surface and the molded product is installed in the molded product installation step. A member movement positioning step of moving and positioning the second member relative to the first member so as to be a second predetermined distance smaller than the first distance; and the member movement positioning. A molded product having a molded product curing step for curing the molded product after moving and positioning in the process It is an example of a device used to perform the method of molding.

It is a figure which shows schematic structure of the shaping | molding apparatus of the to-be-molded product W which concerns on embodiment of this invention. It is a figure which shows operation | movement of a shaping | molding apparatus. It is a figure which shows operation | movement of a shaping | molding apparatus. It is a figure which shows operation | movement of a shaping | molding apparatus. It is a figure which shows the form of a to-be-molded product. It is a flowchart which shows operation | movement of a shaping | molding apparatus. It is a figure which shows the case where a fine transcription | transfer pattern is provided in the plate for shaping | molding. It is a figure which shows the modification of a plate for shaping | molding. It is a figure which shows the modification of a plate for shaping | molding. It is a figure which shows the cross-sectional shape of a to-be-molded product. It is a figure which shows the outline of the shaping | molding method of the to-be-molded product W performed conventionally.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Molding apparatus 3 Lower molding plate holder 5 Upper molding plate holder 11 Plate holder drive positioning means 15 Measuring means 17 Molded product curing means 27 Input means 29 Controller P1 Lower molding plate P1A Installation molding surface P2 Upper molding plate P2A Installation molding surface P1B, P2B Groove P1C, P2C Convex part W Molded product

Claims (3)

A second member that includes a first member having a first surface and a second surface that faces the first surface, and is relatively movable and positionable in a direction approaching and moving away from the first member. In the molding method of the molded article using the member of
A molded product installation step of installing a molded product before molding on the first surface when the first surface and the second surface are separated by a first distance;
After installing the molding product in the molding product installation process, the distance between the first surface and the second surface is a second distance smaller than the first distance, A member movement positioning step of moving and positioning the second member relative to the first member;
A molded product curing step for curing the molded product after the positioning in the member movement positioning step;
A method for molding a product to be molded. In the molding method of the molding product according to claim 1,
A molding method for a molding product, wherein at least one of a concave portion and a convex portion is formed on at least one of the first surface and the second surface. A first molding plate holder capable of holding the first molding plate;
The second molding is performed such that the molding surface of the second molding plate faces the molding surface of the first molding plate held by the first molding plate holder. A second molding plate that is capable of holding a working plate and is movable in a direction approaching and separating from the first molding plate holding body;
Plate holder driving positioning means for driving and positioning the second molding plate holder;
Measuring means for measuring the position of the second molding plate holder relative to the first molding plate holder;
Molding product curing means for curing the molding product installed between the molding plates;
Molded product thickness input means for inputting the thickness of the molded product when cured by the molded product curing means;
A first installation which is a molding surface of the first molding plate held by the first molding plate holder by inputting the thickness of the molding product by the molding product thickness input means. Driving the plate holder from a state in which the molding surface is separated from the second installation molding surface, which is the molding surface of the second molding plate held by the second molding plate holder The positioning molding means brings the second molding plate holder close to the first molding plate holder until the installation molding surfaces come into surface contact with each other, and the installation molding surfaces come into surface contact with each other. The position of the second molding plate holder is measured by the measuring means, and the measured value is used as the origin. After this measurement, the second molding plate holder is moved by the plate holder driving positioning means. For the first molding The distance between the first installation molding surface and the second installation molding surface is changed to the first distance by moving in a direction away from the rate holder, and the molded product before curing is between the molding plates. The distance between the first installation molding surface and the second installation molding surface is greater than the first distance by the plate holder driving positioning means using the origin as a reference. The second molding plate holder is moved and positioned so that the second distance is a second distance corresponding to the thickness of the molded product input by the molded product thickness input means. After the movement positioning, the molded product is cured by the molded product curing means, and after the curing, the second molding plate holder is moved to the first molding plate by the plate holder driving positioning means. Control to keep away from the holding body And means;
An apparatus for molding a product to be molded.

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