JP2007129229A - コネクタ付き低esr電気化学コンデンサ - Google Patents
コネクタ付き低esr電気化学コンデンサ Download PDFInfo
- Publication number
- JP2007129229A JP2007129229A JP2006297897A JP2006297897A JP2007129229A JP 2007129229 A JP2007129229 A JP 2007129229A JP 2006297897 A JP2006297897 A JP 2006297897A JP 2006297897 A JP2006297897 A JP 2006297897A JP 2007129229 A JP2007129229 A JP 2007129229A
- Authority
- JP
- Japan
- Prior art keywords
- dlc
- pcb
- connector element
- connector
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 59
- 238000005476 soldering Methods 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 20
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000007456 delayed laparoscopic cholecystectomy Methods 0.000 claims 28
- 230000013011 mating Effects 0.000 abstract description 2
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- ZMHWQAHZKUPENF-UHFFFAOYSA-N 1,2-dichloro-3-(4-chlorophenyl)benzene Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC(Cl)=C1Cl ZMHWQAHZKUPENF-UHFFFAOYSA-N 0.000 description 12
- 239000003792 electrolyte Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 238000010618 wire wrap Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- -1 clips Chemical compound 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000135 prohibitive effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/74—Terminals, e.g. extensions of current collectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/78—Cases; Housings; Encapsulations; Mountings
- H01G11/82—Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations
-
- H01G9/155—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10462—Flat component oriented parallel to the PCB surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
【解決手段】 PCB上に装着するように電気化学二重層コンデンサ(DLC)が構成される。第1のコネクタ要素がDLCコンデンサの各個別端子リードに配置される。第2のコネクタ要素が、PCB上に実装され、かつDLCリードとの電気的結合接触のためにいくつかの並列コネクタ素子を実装場所に含む。このコネクタ構成は、PCB上に装着されたときのコンデンサのESRの最少の増加をもたらす。
【選択図】 図1
Description
DLCリードの寸法、ならびに第2のコネクタ要素の並列個別コネクタ素子の数およびタイプを変えることによって、各リードにおける総抵抗は精密に制御することができる。DLCリードおよび個別のコネクタ素子の数、寸法、および形状は、DLC端子リードにおける平均ESR増加が、5ミリΩ未満になるように、より好ましくは3ミリΩ未満になるように選択される。
Claims (20)
- PCB上に装着するように構成されたDLCコンデンサであって、前記DLCコンデンサの各個別端子リードに配置され、半田付けを用いずにPCB上の第2のコネクタ要素に電気的に結合するための形状および構造を有する、第1のコネクタ要素を含むことを特徴とするDLCコンデンサ。
- 前記PCBの前記第2のコネクタ要素が複数の個別並列コネクタ素子を有し、前記DLCの前記それぞれの端子リードが、複数の前記並列コネクタ素子と係合するような幅を有することを特徴とする請求項1に記載のDLCコンデンサ。
- 前記DLCコンデンサがケースを含み、前記ケースおよび第1のコネクタ要素が、前記第1のコネクタ要素を前記PCBの前記第2のコネクタ要素と結合させると前記ケースが前記PCBに密着するように構成されることを特徴とする請求項2に記載のDLCコンデンサ。
- 追加の取付けデバイスを前記ケースと前記PCBの間にさらに含むことを特徴とする請求項3に記載のDLCコンデンサ。
- 前記追加の取付けデバイスが粘着物を含むことを特徴とする請求項4に記載のDLCコンデンサ。
- 前記第1のコネクタ要素と前記PCBの前記第2のコネクタ要素との間の接続による前記コンデンサのESR増加が約5ミリΩ未満であることを特徴とする請求項1に記載のDLCコンデンサ。
- 前記第1のコネクタ要素と前記PCBの前記第2のコネクタ要素との間の接続による前記コンデンサのESR増加が約3ミリΩ未満であることを特徴とする請求項1に記載のDLCコンデンサ。
- PCB上に配置されるDLCコンデンサの結合であって、第1のコネクタ要素がDLCコンデンサの各個別端子リードに配置されたDLCコンデンサと、前記PCB上に配置され、前記DLCのそれぞれの前記端子リードに割り当てられた少なくとも1つのコネクタ素子を含む第2のコネクタ要素とを含み、前記DLCリードが、半田付けを用いずに前記第2のコネクタ要素と電気的に係合されることを特徴とする結合。
- 前記PCBの前記第2のコネクタ要素が複数の個別並列コネクタ素子を有し、前記DLCの前記それぞれの端子リードが、複数の前記並列コネクタ素子と係合するような幅を有することを特徴とする請求項8に記載の結合。
- 前記第2のコネクタ要素が、前記PCB上に実装されるカードエッジコネクタを含むことを特徴とする請求項9に記載の結合。
- 前記DLCコンデンサがケースを含み、前記ケースおよび第1のコネクタ要素が、前記第1のコネクタ要素を前記PCBの前記第2のコネクタ要素と結合させると前記ケースが前記PCBに密着するように構成されることを特徴とする請求項8に記載の結合。
- 前記第2のコネクタ要素が、前記PCB上に実装されるカードエッジコネクタを含み、前記ケースが前記カードエッジコネクタの厚さと概して整合する厚さを有し、その結果前記DLCが前記カードエッジコネクタと前記PCB上でじかに接触して装着するようになることを特徴とする請求項11に記載の結合。
- 追加の取付けデバイスを前記ケースと前記PCBの間にさらに含むことを特徴とする請求項12に記載の結合。
- 前記追加の取付けデバイスが粘着物を含むことを特徴とする請求項13に記載の結合。
- 前記PCBの前記第2のコネクタ要素が複数の個別並列コネクタ素子を有し、前記DLCの前記それぞれの端子リードが、複数の前記並列コネクタ素子と係合するような幅を有し、前記第1のコネクタ要素と前記PCBの前記第2のコネクタ要素との間の接続による前記コンデンサのESR増加が約5ミリΩ未満であることを特徴とする請求項8に記載の結合。
- 前記PCBの前記第2のコネクタ要素が複数の個別並列コネクタ素子を有し、前記DLCの前記それぞれの端子リードが、複数の前記並列コネクタ素子と係合するような幅を有し、前記第1のコネクタ要素と前記PCBの前記第2のコネクタ要素との間の接続による前記コンデンサのESR増加値が約3ミリΩ未満であることを特徴とする請求項8に記載の結合。
- DLCコンデンサをPCBに装着する方法であって、
第1のコネクタ要素をDLCコンデンサのそれぞれの端子リードに設けるステップと、
前記DLCの各端子リードに対して複数の並列コネクタ素子を有する第2のコネクタ要素をPCB上に実装するステップと、
前記DLCリードが半田付けを用いずに前記第2のコネクタ要素の並列コネクタ素子と結合するように、前記DLCを前記PCB上に装着するステップとを含むことを特徴とする方法。 - 前記第1のコネクタ要素が、前記PCBの前記並列コネクタ素子を画定するコネクタスロット内にはめ込まれることを特徴とする請求項17に記載の方法。
- 追加の取付けデバイスを前記DLCのケースと前記PCBの間に設けるステップをさらに含むことを特徴とする請求項18に記載の方法。
- 粘着物を前記DLCのケースと前記PCBの間に設けるステップを含むことを特徴とする請求項19に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US73239305P | 2005-11-01 | 2005-11-01 | |
US11/582,148 US7599191B2 (en) | 2005-11-01 | 2006-10-17 | Electrochemical low ESR capacitor with connector |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013022571A Division JP2013102224A (ja) | 2005-11-01 | 2013-02-07 | コネクタ付き低esr電気化学コンデンサ |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007129229A true JP2007129229A (ja) | 2007-05-24 |
Family
ID=37950127
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006297897A Pending JP2007129229A (ja) | 2005-11-01 | 2006-11-01 | コネクタ付き低esr電気化学コンデンサ |
JP2013022571A Pending JP2013102224A (ja) | 2005-11-01 | 2013-02-07 | コネクタ付き低esr電気化学コンデンサ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013022571A Pending JP2013102224A (ja) | 2005-11-01 | 2013-02-07 | コネクタ付き低esr電気化学コンデンサ |
Country Status (5)
Country | Link |
---|---|
US (1) | US7599191B2 (ja) |
JP (2) | JP2007129229A (ja) |
CN (1) | CN101004979B (ja) |
DE (1) | DE102006051874A1 (ja) |
GB (1) | GB2432051B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6284252B1 (ja) * | 2017-04-27 | 2018-02-28 | セイコーインスツル株式会社 | 電気化学セル |
JP6284251B1 (ja) * | 2017-04-27 | 2018-02-28 | セイコーインスツル株式会社 | 電気化学セル |
JP2021180341A (ja) * | 2014-06-30 | 2021-11-18 | エイブイエックス コーポレイション | 電気化学エネルギー貯蔵装置 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8198547B2 (en) | 2009-07-23 | 2012-06-12 | Lexmark International, Inc. | Z-directed pass-through components for printed circuit boards |
US8735734B2 (en) | 2009-07-23 | 2014-05-27 | Lexmark International, Inc. | Z-directed delay line components for printed circuit boards |
US8790520B2 (en) | 2011-08-31 | 2014-07-29 | Lexmark International, Inc. | Die press process for manufacturing a Z-directed component for a printed circuit board |
US8752280B2 (en) | 2011-09-30 | 2014-06-17 | Lexmark International, Inc. | Extrusion process for manufacturing a Z-directed component for a printed circuit board |
US8658245B2 (en) | 2011-08-31 | 2014-02-25 | Lexmark International, Inc. | Spin coat process for manufacturing a Z-directed component for a printed circuit board |
US9009954B2 (en) | 2011-08-31 | 2015-04-21 | Lexmark International, Inc. | Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material |
US9078374B2 (en) | 2011-08-31 | 2015-07-07 | Lexmark International, Inc. | Screening process for manufacturing a Z-directed component for a printed circuit board |
US8943684B2 (en) * | 2011-08-31 | 2015-02-03 | Lexmark International, Inc. | Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board |
US8912452B2 (en) | 2012-03-29 | 2014-12-16 | Lexmark International, Inc. | Z-directed printed circuit board components having different dielectric regions |
US8830692B2 (en) * | 2012-03-29 | 2014-09-09 | Lexmark International, Inc. | Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component |
US8822840B2 (en) | 2012-03-29 | 2014-09-02 | Lexmark International, Inc. | Z-directed printed circuit board components having conductive channels for controlling transmission line impedance |
US8822838B2 (en) | 2012-03-29 | 2014-09-02 | Lexmark International, Inc. | Z-directed printed circuit board components having conductive channels for reducing radiated emissions |
CN202758740U (zh) * | 2012-06-14 | 2013-02-27 | 施耐德东芝换流器欧洲公司 | 电气设备 |
CN114720733B (zh) * | 2022-06-08 | 2022-09-09 | 南通江海电容器股份有限公司 | 一种固液混合铝电解电容器寿命试验转接pcb板 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02165614A (ja) * | 1988-12-20 | 1990-06-26 | Murata Mfg Co Ltd | 扁平型電源素子 |
JPH05307312A (ja) * | 1992-04-30 | 1993-11-19 | Ricoh Co Ltd | 画像形成装置の高圧電源接続機構 |
JPH0590836U (ja) * | 1992-05-13 | 1993-12-10 | 矢崎総業株式会社 | コネクタ用端子 |
JPH06310243A (ja) * | 1993-04-22 | 1994-11-04 | Fujitsu Ltd | 電気的接続装置の製造方法 |
JP2000251868A (ja) * | 1999-02-25 | 2000-09-14 | Mitsubishi Electric Corp | 薄型電池 |
JP2002078061A (ja) * | 2000-08-30 | 2002-03-15 | Citizen Watch Co Ltd | カード型電子機器 |
JP2002280271A (ja) * | 2001-03-19 | 2002-09-27 | Nissan Diesel Motor Co Ltd | 電気二重層キャパシタおよびその製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4428633A (en) * | 1982-03-01 | 1984-01-31 | Amp Incorporated | Dual-in-line socket assembly |
JPH05114392A (ja) | 1991-10-23 | 1993-05-07 | Murata Mfg Co Ltd | 偏平型電源素子の回路基板への実装構造および実装方法 |
US5295843A (en) * | 1993-01-19 | 1994-03-22 | The Whitaker Corporation | Electrical connector for power and signal contacts |
US5666721A (en) * | 1994-01-18 | 1997-09-16 | Matsushita Electric Industrial Co., Ltd. | Method of soldering an electronic connector on a printed circuit board |
US6449139B1 (en) * | 1999-08-18 | 2002-09-10 | Maxwell Electronic Components Group, Inc. | Multi-electrode double layer capacitor having hermetic electrolyte seal |
DE19941690C2 (de) * | 1999-09-01 | 2001-12-06 | Siemens Ag | Steuergerät und Lötverfahren |
JP3125220B1 (ja) | 1999-09-30 | 2001-01-15 | 京セラエルコ株式会社 | 電子部品用コネクタ |
US6731512B2 (en) * | 2002-03-20 | 2004-05-04 | The Procter & Gamble Company | Active package for integrated circuit |
DE10234395A1 (de) | 2002-07-23 | 2004-02-05 | Hans-Joachim Horn | Schneidklemm-Verbinder für elektronische Bauelemente und Schaltungen |
US6830484B1 (en) * | 2003-05-27 | 2004-12-14 | Jae-Uk Lee | Cable connecting system and its application to partitions |
-
2006
- 2006-10-17 US US11/582,148 patent/US7599191B2/en not_active Expired - Fee Related
- 2006-10-31 DE DE102006051874A patent/DE102006051874A1/de not_active Withdrawn
- 2006-11-01 JP JP2006297897A patent/JP2007129229A/ja active Pending
- 2006-11-01 CN CN2006101728986A patent/CN101004979B/zh not_active Expired - Fee Related
- 2006-11-01 GB GB0621731A patent/GB2432051B/en not_active Expired - Fee Related
-
2013
- 2013-02-07 JP JP2013022571A patent/JP2013102224A/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02165614A (ja) * | 1988-12-20 | 1990-06-26 | Murata Mfg Co Ltd | 扁平型電源素子 |
JPH05307312A (ja) * | 1992-04-30 | 1993-11-19 | Ricoh Co Ltd | 画像形成装置の高圧電源接続機構 |
JPH0590836U (ja) * | 1992-05-13 | 1993-12-10 | 矢崎総業株式会社 | コネクタ用端子 |
JPH06310243A (ja) * | 1993-04-22 | 1994-11-04 | Fujitsu Ltd | 電気的接続装置の製造方法 |
JP2000251868A (ja) * | 1999-02-25 | 2000-09-14 | Mitsubishi Electric Corp | 薄型電池 |
JP2002078061A (ja) * | 2000-08-30 | 2002-03-15 | Citizen Watch Co Ltd | カード型電子機器 |
JP2002280271A (ja) * | 2001-03-19 | 2002-09-27 | Nissan Diesel Motor Co Ltd | 電気二重層キャパシタおよびその製造方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021180341A (ja) * | 2014-06-30 | 2021-11-18 | エイブイエックス コーポレイション | 電気化学エネルギー貯蔵装置 |
JP6284252B1 (ja) * | 2017-04-27 | 2018-02-28 | セイコーインスツル株式会社 | 電気化学セル |
JP6284251B1 (ja) * | 2017-04-27 | 2018-02-28 | セイコーインスツル株式会社 | 電気化学セル |
JP2018186251A (ja) * | 2017-04-27 | 2018-11-22 | セイコーインスツル株式会社 | 電気化学セル |
JP2018186250A (ja) * | 2017-04-27 | 2018-11-22 | セイコーインスツル株式会社 | 電気化学セル |
Also Published As
Publication number | Publication date |
---|---|
GB0621731D0 (en) | 2006-12-13 |
US20070117422A1 (en) | 2007-05-24 |
CN101004979A (zh) | 2007-07-25 |
US7599191B2 (en) | 2009-10-06 |
DE102006051874A1 (de) | 2007-05-10 |
CN101004979B (zh) | 2012-06-20 |
GB2432051A (en) | 2007-05-09 |
JP2013102224A (ja) | 2013-05-23 |
GB2432051A8 (en) | 2007-06-12 |
GB2432051B (en) | 2011-05-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7599191B2 (en) | Electrochemical low ESR capacitor with connector | |
US5876241A (en) | Horizontal battery connector | |
US11063322B2 (en) | Circuit body and battery module | |
US7833033B2 (en) | Solar panel junction box and components thereof | |
US7957156B2 (en) | Busbar circuit board assembly | |
US11128018B2 (en) | Circuit body and battery module | |
US8852790B2 (en) | Secondary battery with protection circuit module | |
US20060128197A1 (en) | Board mounted power connector | |
US9184472B2 (en) | Battery pack and method of manufacturing battery pack with interconnected half contact pads | |
US4755145A (en) | Electrically connecting circuit board system | |
US20050168911A1 (en) | Capacitor module and capacitor battery comprising the same | |
CA2592475A1 (en) | Sensing board assembly for secondary battery module | |
JP2007087944A (ja) | バッテリーパック | |
JP2000251977A (ja) | 電源供給端子 | |
CN104170117A (zh) | 具有新颖结构的二次电池组 | |
US8043123B2 (en) | Power receptacle for portable electronic device | |
US20210135301A1 (en) | Sensing assembly and battery module comprising the same | |
CA1037611A (en) | Removable coulometric timer connector assembly for printed circuit boards | |
US6478586B1 (en) | Electrical connector having conductive terminals that are provided with a dielectric coating | |
EP2705575B1 (en) | High-voltage resistance for a connector attached to a circuit board | |
CA1207047A (en) | Electrically connecting | |
US20240072396A1 (en) | Battery module | |
KR102204858B1 (ko) | 배터리 모듈 | |
WO2023037889A1 (ja) | 配線モジュール | |
KR200355795Y1 (ko) | 전기 이중층 축전기 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20091028 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110128 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110201 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110420 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120203 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120418 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20121012 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130207 |
|
RD13 | Notification of appointment of power of sub attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7433 Effective date: 20130208 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20130208 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20130301 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20130607 |