JP2007121291A - 物体を検査する方法および装置 - Google Patents

物体を検査する方法および装置 Download PDF

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Publication number
JP2007121291A
JP2007121291A JP2006287188A JP2006287188A JP2007121291A JP 2007121291 A JP2007121291 A JP 2007121291A JP 2006287188 A JP2006287188 A JP 2006287188A JP 2006287188 A JP2006287188 A JP 2006287188A JP 2007121291 A JP2007121291 A JP 2007121291A
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JP
Japan
Prior art keywords
light
light source
structured light
imaging sensor
wavelength
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JP2006287188A
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English (en)
Japanese (ja)
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JP2007121291A5 (enExample
Inventor
Kevin George Harding
ケビン・ジョージ・ハーディング
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General Electric Co
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General Electric Co
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Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JP2007121291A publication Critical patent/JP2007121291A/ja
Publication of JP2007121291A5 publication Critical patent/JP2007121291A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2509—Color coding

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  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
JP2006287188A 2005-10-24 2006-10-23 物体を検査する方法および装置 Pending JP2007121291A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/256,886 US7285767B2 (en) 2005-10-24 2005-10-24 Methods and apparatus for inspecting an object

Publications (2)

Publication Number Publication Date
JP2007121291A true JP2007121291A (ja) 2007-05-17
JP2007121291A5 JP2007121291A5 (enExample) 2009-12-03

Family

ID=37576558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006287188A Pending JP2007121291A (ja) 2005-10-24 2006-10-23 物体を検査する方法および装置

Country Status (5)

Country Link
US (1) US7285767B2 (enExample)
EP (1) EP1777489B1 (enExample)
JP (1) JP2007121291A (enExample)
CN (1) CN1963381B (enExample)
DE (1) DE602006004529D1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105841618A (zh) * 2016-06-08 2016-08-10 杭州汉振科技有限公司 二维三维复合式测量仪及其数据融合标定方法

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US20070193012A1 (en) * 2006-02-22 2007-08-23 Robert Bergman Metal forming process
JP2011002305A (ja) * 2009-06-17 2011-01-06 Topcon Corp 回路パターンの欠陥検出装置、回路パターンの欠陥検出方法およびプログラム
CN102645159A (zh) * 2011-02-22 2012-08-22 贺明志 一种影像测量装置
CN102278943B (zh) * 2011-05-06 2012-10-10 华东师范大学 非接触式数字微镜器件微镜片一致性检测仪
EP2631730B1 (en) * 2012-02-24 2014-09-24 Samsung Electronics Co., Ltd Sensor assembly and robot cleaner having the same
CN103777206B (zh) * 2014-01-26 2016-04-06 上海交通大学 一种基于偏振关联成像的单像素成像系统
JP6065875B2 (ja) * 2014-06-02 2017-01-25 横河電機株式会社 偏光検査装置
JP6363903B2 (ja) * 2014-07-31 2018-07-25 株式会社キーエンス 光学的情報読取装置
CN104345318A (zh) * 2014-11-18 2015-02-11 上海交通大学 基于计算关联成像的可绕过墙角的成像系统及成像方法
CN105066906B (zh) * 2015-07-24 2018-06-12 南京理工大学 一种快速高动态范围三维测量方法
TWI571649B (zh) * 2015-12-03 2017-02-21 財團法人金屬工業研究發展中心 A scanning device and method for establishing an outline image of an object
CN105572138A (zh) * 2016-02-24 2016-05-11 唐山英莱科技有限公司 基于偏振态检测的高反光对接焊缝检测方法及检测装置
CN105866129A (zh) * 2016-05-16 2016-08-17 天津工业大学 一种基于数字投影的产品表面质量在线检测方法
CN106813574A (zh) * 2016-11-02 2017-06-09 北京信息科技大学 一种基于偏振光的关节臂测头光学系统
US11204508B2 (en) * 2017-01-19 2021-12-21 Lockheed Martin Corporation Multiple band multiple polarizer optical device
CN110044927B (zh) * 2019-04-23 2020-02-21 华中科技大学 一种空间编码光场对曲面玻璃表面缺陷的检测方法
CN110275098B (zh) * 2019-06-28 2021-07-09 杭州赫太克科技有限公司 紫外成像仪
JP2023509867A (ja) * 2019-12-27 2023-03-10 ソニーグループ株式会社 偏光撮像システムおよび偏光撮像方法
JP7413293B2 (ja) * 2020-01-27 2024-01-15 コグネックス・コーポレイション 複数タイプの光を用いるビジョン検査のためのシステム及び方法

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JPH085569A (ja) * 1994-06-15 1996-01-12 Matsushita Electron Corp パーティクル測定装置およびパーティクル検査方法
JP2001242091A (ja) * 2000-01-07 2001-09-07 Thermo Radiometrie Oy 表面検査のための方法及び装置
JP2002039960A (ja) * 2000-07-27 2002-02-06 Hitachi Ltd パターン欠陥検査方法及びその装置
JP2002318109A (ja) * 2001-04-20 2002-10-31 Teruaki Yogo ３次元形状測定方法
JP2003035613A (ja) * 2001-07-23 2003-02-07 Omron Corp 光透過性物質の残留応力検査装置
US20030223083A1 (en) * 2000-01-28 2003-12-04 Geng Z Jason Method and apparatus for generating structural pattern illumination
JP2004061371A (ja) * 2002-07-30 2004-02-26 Nikon Corp 欠陥検査装置および欠陥検査方法

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US4864123A (en) * 1987-05-08 1989-09-05 Nikon Corporation Apparatus for detecting the level of an object surface
DE4130237A1 (de) * 1991-09-11 1993-03-18 Zeiss Carl Fa Verfahren und vorrichtung zur dreidimensionalen optischen vermessung von objektoberflaechen
JPH05142141A (ja) * 1991-11-19 1993-06-08 Katsuya Masao 薄膜測定装置
US6028671A (en) * 1996-01-31 2000-02-22 General Scanning, Inc. Method and system for suppressing unwanted reflections in an optical system
US6064759A (en) * 1996-11-08 2000-05-16 Buckley; B. Shawn Computer aided inspection machine
US6956963B2 (en) * 1998-07-08 2005-10-18 Ismeca Europe Semiconductor Sa Imaging for a machine-vision system
AU4975499A (en) * 1998-07-08 2000-02-01 Bryan Maret Identifying and handling device tilt in a three-dimensional machine-vision image
US6639685B1 (en) * 2000-02-25 2003-10-28 General Motors Corporation Image processing method using phase-shifted fringe patterns and curve fitting
US6831742B1 (en) * 2000-10-23 2004-12-14 Applied Materials, Inc Monitoring substrate processing using reflected radiation
JP4358982B2 (ja) * 2000-10-25 2009-11-04 株式会社堀場製作所 分光エリプソメータ
US6678057B2 (en) * 2001-12-19 2004-01-13 General Electric Company Method and device for reduction in noise in images from shiny parts
JP3878023B2 (ja) * 2002-02-01 2007-02-07 シーケーディ株式会社 三次元計測装置
US20040026622A1 (en) * 2002-08-06 2004-02-12 Dimarzio Don System and method for imaging of coated substrates

Patent Citations (7)

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Publication number Priority date Publication date Assignee Title
JPH085569A (ja) * 1994-06-15 1996-01-12 Matsushita Electron Corp パーティクル測定装置およびパーティクル検査方法
JP2001242091A (ja) * 2000-01-07 2001-09-07 Thermo Radiometrie Oy 表面検査のための方法及び装置
US20030223083A1 (en) * 2000-01-28 2003-12-04 Geng Z Jason Method and apparatus for generating structural pattern illumination
JP2002039960A (ja) * 2000-07-27 2002-02-06 Hitachi Ltd パターン欠陥検査方法及びその装置
JP2002318109A (ja) * 2001-04-20 2002-10-31 Teruaki Yogo ３次元形状測定方法
JP2003035613A (ja) * 2001-07-23 2003-02-07 Omron Corp 光透過性物質の残留応力検査装置
JP2004061371A (ja) * 2002-07-30 2004-02-26 Nikon Corp 欠陥検査装置および欠陥検査方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105841618A (zh) * 2016-06-08 2016-08-10 杭州汉振科技有限公司 二维三维复合式测量仪及其数据融合标定方法

Also Published As

Publication number Publication date
CN1963381B (zh) 2012-07-04
CN1963381A (zh) 2007-05-16
US20070090280A1 (en) 2007-04-26
DE602006004529D1 (de) 2009-02-12
EP1777489A1 (en) 2007-04-25
EP1777489B1 (en) 2008-12-31
US7285767B2 (en) 2007-10-23

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