JP2007116121A - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device in which reliability and directivity are enhanced. <P>SOLUTION: The light emitting device comprises: a tubular frame 40 surrounding an LED chip 10 on the mounting surface side of a mounting substrate 20; an elastic sealing portion 50 formed by filling the inside of the frame 40 with silicon resin and sealing the LED chip 10 and bonding wires 14 and 14 connected with the LED chip 10; a lens 60 arranged on the sealing portion 50; and a domelike color transformation member 70 formed of a yellow phosphor excited by blue light radiated from the LED chip 10 and of a translucent material and arranged on the mounting surface side of the mounting substrate 20 to surround the lens 60 and the frame 40 thus forming an air layer 80 on the inside. The lens 60 is constituted of a biconvex lens. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light emitting device using an LED chip (light emitting diode chip).

Conventionally, an LED chip, a mounting board on which the LED chip is mounted, and an epoxy resin sealing the LED chip and the bonding wire connected to the LED chip on the mounting surface side of the LED chip on the mounting board There has been proposed a light emitting device that has a directivity of light emitted by forming a part of the sealing portion into a convex lens shape (for example, Patent Document 1). In Patent Document 1, an LED chip that emits blue light or ultraviolet light and a phosphor that emits light of a color different from the emission color of the LED chip when excited by the light emitted from the LED chip. A technique for obtaining mixed color light having a hue different from the emission color of the LED chip including white is disclosed.
JP 2003-243724 A

  However, in the case where an epoxy resin is used as the material of the sealing portion as in the light emitting device described in Patent Document 1, the weather resistance of the sealing portion is low, and the blue LED chip emits blue light. In this case, there is a problem that the sealing portion is easily deteriorated by blue light.

  The present invention has been made in view of the above-described reasons, and an object thereof is to provide a light-emitting device capable of improving reliability and directivity.

  The invention of claim 1 seals an LED chip, a mounting substrate on which the LED chip is mounted, and a bonding wire electrically connected to the LED chip on the mounting surface side of the LED chip on the mounting substrate. The transparent sealing resin is made of an elastic sealing portion, the lens is placed on the sealing portion, and is excited by the light emitted from the LED chip to emit light of a color different from the emission color of the LED chip. A dome-shaped color conversion member that is formed of a phosphor and a light-transmitting material and surrounds the lens and the sealing portion on the mounting surface side of the mounting substrate, and an air layer is inside the color conversion member The lens is formed of a biconvex lens.

  According to this invention, since the sealing part is formed of a transparent resin having elasticity, the reliability of the sealing part can be increased as compared with the case where the sealing part is formed of an epoxy resin, In addition, since the lens is provided so as to overlap the sealing portion, and the lens is a biconvex lens, directivity can be increased. Moreover, since the mounting surface side of the LED chip on the mounting substrate is provided with a dome-shaped color conversion member surrounding the lens and the sealing portion, and an air layer is formed inside the color conversion member, the LED chip emits the air layer. Not only can the light be mixed with the light emitted from the phosphor of the color conversion member, but also the lens and the sealing part can be protected, and color conversion is performed when an external force acts on the color conversion member. The stress generated in the member can be suppressed from being transmitted to the LED chip and the bonding wire through the lens and the sealing portion, and the variation in the light emitting characteristics of the LED chip and the disconnection of the bonding wire due to the external force can be suppressed, so the reliability Can be further enhanced. In addition, since the air layer is formed inside the color conversion member, heat generated in the phosphor of the color conversion member can be prevented from being transferred to the LED chip.

  According to a second aspect of the present invention, in the first aspect of the invention, the lens is configured such that the light emitting surface receives light incident from the light incident surface on the sealing portion side at a boundary between the light emitting surface and the air layer. It is formed in a convex curved surface shape that does not totally reflect.

  According to the present invention, the light emitted from the LED chip can easily reach the color conversion member without being totally reflected at the boundary between the light emitting surface and the air layer, and the total luminous flux can be increased. .

  The invention of claim 3 is the invention of claim 1 or claim 2, further comprising a frame body that encloses a sealing portion on the mounting surface side of the LED chip in the mounting substrate, and the frame body and the sealing portion. It is formed by the same kind of transparent resin.

  According to this invention, since the frame body that encloses the sealing portion on the mounting surface side of the LED chip on the mounting substrate is provided, the shape of the sealing portion can be defined by the frame body. The sealing part can be formed without using a mold or the like, and the frame is formed of the same transparent resin as the sealing part, so the difference in linear expansion coefficient between the frame and the sealing part It is possible to prevent a decrease in reliability due to the above.

  In the invention of claim 1, there is an effect that reliability and directivity can be improved.

(Embodiment 1)
Hereinafter, the light-emitting device of this embodiment will be described with reference to FIGS.

  The light emitting device 1 of the present embodiment includes an LED chip 10, a mounting substrate 20 on which the LED chip 10 is mounted, a frame body 40 that surrounds the LED chip 10 on the mounting surface side of the LED chip 10 on the mounting substrate 20, and a frame body. A sealing portion 50 formed by filling a transparent resin material inside 40 and sealing the LED chip 10 and bonding wires 14 and 14 electrically connected to the LED chip 10 and having elasticity; and sealing A lens 60 arranged to overlap the unit 50, and a phosphor and a translucent material (transparent material) that are excited by the light emitted from the LED chip 10 and emit light of a color different from the emission color of the LED chip 10. The lens 60 and the frame body 40 are surrounded by the mounting surface side of the LED chip 10 on the mounting substrate 20, and the light emitting surface 60 b and the frame body of the lens 60 are formed. And a color conversion member 70 domed disposed in the form of an air layer 80 is formed between the outer surface of the 0.

  In addition, the light-emitting device 1 of this embodiment is used as a light source of a lighting fixture such as a spotlight, for example. For example, an instrument body 100 made of metal (for example, a metal having high thermal conductivity such as Al or Cu) is formed on an insulating layer 90 formed of an organic green sheet such as an epoxy resin sheet highly filled with fused silica. By joining, the thermal resistance from the LED chip 10 to the instrument body 100 can be reduced, heat dissipation can be improved, and the temperature rise of the junction temperature of the LED chip 10 can be suppressed. High output can be achieved. Here, when used as a light source of a lighting fixture, a plurality of light emitting devices 1 are mounted on the fixture main body 100 so that a desired light output is obtained, and the plurality of light emitting devices 1 are connected in series or in parallel. You can do it.

  The mounting substrate 20 is made of a heat conductive material and has a rectangular plate-like heat transfer plate 21 on which the LED chip 10 is mounted, and a rectangular plate-like shape fixed to one surface side (the upper surface side in FIG. 1) of the heat transfer plate 21. A rectangular window hole 24 that exposes the mounting surface (a part of the one surface) of the LED chip 10 in the heat transfer plate 21 is formed at the center of the wiring substrate 22. 10 is mounted on the heat transfer plate 21 via a submount member 30 disposed inside the window hole 24. Therefore, the heat generated in the LED chip 10 is transferred to the heat transfer plate 21 via the submount member 30 without passing through the wiring substrate 22. In this embodiment, Cu, which is a metal having high thermal conductivity, is adopted as the heat conductive material of the heat transfer plate 21 (that is, a metal plate is adopted as the heat transfer plate 21). The conductive material is not limited to Cu, and for example, other metals having high thermal conductivity such as Al or nonmetals having high thermal conductivity like these metals may be adopted.

  The above-mentioned wiring board 22 has a pair of power supply lead patterns 23 electrically connected to each electrode (not shown) of the LED chip 10 on one surface side of an insulating base material 22a made of a glass epoxy board. 23 is provided. Each lead pattern 23, 23 is composed of a laminated film of a Cu film, a Ni film, and an Au film, and the portion inside the frame body 40 in the plan view constitutes the inner lead portions 23a, 23a, and color conversion is performed. Sites outside the member 70 constitute the outer lead portions 23b and 23b. The heat transfer plate 21 and the wiring board 22 are fixed via a fixing sheet 25 made of an insulating sheet-like adhesive film. In addition, the material of the insulating base material 22a is not limited to a glass epoxy resin such as FR4, and may be, for example, a polyimide resin or a phenol resin.

  The LED chip 10 is a GaN-based blue LED chip that emits blue light, and is a conductive substrate made of an n-type SiC substrate that has a lattice constant and a crystal structure close to GaN as a crystal growth substrate and has conductivity compared to a sapphire substrate. The light-emitting portion 12 is formed of a GaN-based compound semiconductor material on the main surface side of the conductive substrate 11 and has a laminated structure portion having, for example, a double hetero structure. ), A cathode electrode (n electrode) which is a cathode side electrode (not shown) is formed on the back surface of the conductive substrate 11, and is shown on the surface of the light emitting unit 12 (the outermost surface on the main surface side of the conductive substrate 11). An anode electrode (p electrode) which is an electrode on the anode side that is not to be formed is formed. In short, the LED chip 10 has an anode electrode formed on one surface side and a cathode electrode formed on the other surface side. The cathode electrode and the anode electrode are composed of a laminated film of a Ni film and an Au film, but the material of the cathode electrode and the anode electrode is not particularly limited, and a material capable of obtaining good ohmic characteristics For example, Al or the like may be employed. In this embodiment, the LED chip 10 is mounted on the heat transfer plate 21 such that the light emitting portion 12 of the LED chip 10 is on the side farther from the heat transfer plate 21 than the conductive substrate 11. The light emitting unit 12 may be mounted on the heat transfer plate 21 so as to be closer to the heat transfer plate 21 than the conductive substrate 11. In consideration of the light extraction efficiency, it is desirable to arrange the light emitting part 12 of the LED chip 10 on the side away from the heat transfer plate 21, but in this embodiment, the conductive substrate 11 and the light emitting part 12 are of the same level. Therefore, even if the light emitting unit 12 is arranged on the side close to the heat transfer plate 21, the light extraction loss does not become too large.

  The LED chip 10 is formed on the above-described heat transfer plate 21 in a rectangular plate shape larger than the chip size of the LED chip 10, and is caused by a difference in linear expansion coefficient between the LED chip 10 and the heat transfer plate 21. The LED chip 10 is mounted via a submount member 30 that relieves stress. The submount member 30 has not only a function of relieving the stress but also a heat conduction function of transferring heat generated in the LED chip 10 to a range wider than the chip size of the LED chip 10 in the heat transfer plate 21. Yes. In the present embodiment, AlN having a relatively high thermal conductivity and insulation is used as the material of the submount member 30, and the LED chip 10 has the cathode electrode on the LED chip 10 side of the submount member 30. Electrically connected to one lead pattern 23 via a bonding wire 14 provided on the surface and connected to the cathode electrode (see FIG. 4) and a fine metal wire (for example, a gold fine wire, an aluminum fine wire, etc.) The anode electrode is electrically connected to the other lead pattern 23 via the bonding wire 14. The LED chip 10 and the submount member 30 may be bonded using, for example, solder such as SnPb, AuSn, SnAgCu, or silver paste, but may be bonded using lead-free solder such as AuSn, SnAgCu. It is preferable. In the submount member 30, a reflective film 32 (see FIG. 4) that reflects light emitted from the LED chip 10 is formed around the conductor pattern 31. Note that the reflection film 32 may be formed of a laminated film of a Ni film and an Ag film, for example.

  The material of the submount member 30 is not limited to AlN, and any material may be used as long as the linear expansion coefficient is relatively close to 6H—SiC that is the material of the conductive substrate 11 and the heat conductivity is relatively high. Si or the like may be employed.

  Incidentally, in the light emitting device 1 of the present embodiment, the outer peripheral shape of each of the LED chip 10 and the submount member 30 in a plan view is a square shape, and the outer peripheral line of the LED chip 10 in the plan view is more than the outer peripheral line of the submant member 30. The LED chip 10 is joined to the conductor pattern 31 at the center portion of the submount member 30 so as to be located on the inner side and the outer peripheral lines are not parallel, and the diagonal line of the LED chip 10 and the diagonal line of the submount member 30 are not parallel. It has become. More specifically, the LED chip 10 is bonded to the conductor pattern 31 at the center of the sub-mant member 30 so that the angle formed by the diagonal line of the LED chip 10 and the diagonal line of the sub-mount member 30 is approximately 45 degrees. In the present embodiment, the window hole 24 is also square in plan view.

  The bonding wire 14 electrically connected to the anode electrode is connected to the anode electrode near the center of one surface of the LED chip 10, and the bonding wire 14 electrically connected to the cathode electrode is connected to the LED chip. 10 is connected to the conductor pattern 31 of the submount member 30 in the vicinity of one corner. Here, in this embodiment, since each bonding wire 14 and 14 is extended in the direction along one diagonal of LED chip 10, the fall of the light extraction efficiency resulting from bonding wire 14 and 14 is suppressed. be able to. Further, one diagonal line of the LED chip 10 can be obtained without reducing the planar size of the submount member 30 as compared with the case where the LED chip 10 and the submount member 30 are in a positional relationship such that the outer peripheral lines of the LED chip 10 and the submount member 30 are parallel to each other. The linear distance between the both ends of the bonding wire 14 extended in the direction along the direction can be shortened, and the frame body 40 and the light emitting device 1 as a whole can be reduced in size. In short, it is possible to suppress a decrease in light extraction efficiency due to the bonding wire 14 without reducing the heat conduction function of the submount member 30 and to reduce the size of the frame body 40 and the light emitting device 1 as a whole. it can.

  Although the silicone resin is used as the transparent resin material of the sealing portion 50 described above, not only the silicone resin but also an acrylic resin may be used.

  On the other hand, the frame 40 has a cylindrical shape and is formed of a transparent resin (configured by a molded product of the transparent resin), and a silicone resin is used as the transparent resin. ing. In short, in this embodiment, the frame body 40 is formed of the same type of transparent resin (translucent material) having a linear expansion coefficient equivalent to that of the transparent resin that is the material of the sealing portion 50. Here, in this embodiment, after the frame body 40 is fixed to the mounting substrate 20, the transparent resin of the sealing portion 50 is filled (potted) inside the frame body 40 and thermally cured to thereby seal the sealing portion 50. It is formed. In addition, when using acrylic resin instead of silicone resin as transparent resin of the sealing part 50, it is desirable to form the frame 40 with acrylic resin.

  The lens 60 is composed of a biconvex lens in which each of the light incident surface 60a and the light emitting surface 60b on the sealing portion 50 side is formed in a convex curved surface shape. Here, the lens 60 is made of silicone (made of a silicone molded product) and has the same refractive index as that of the sealing portion 50. However, the lens 60 is not limited to silicone, For example, you may form with an acrylic resin.

  By the way, the lens 60 has a light emitting surface 60b formed in a convex curved surface shape that does not totally reflect the light incident from the light incident surface 60a at the boundary between the light emitting surface 60b and the air layer 80 described above. Therefore, the light emitted from the LED chip 10 can easily reach the color conversion member 70 without being totally reflected at the boundary between the light emitting surface 60b and the air layer 80, and the total luminous flux can be increased. Here, the lens 60 is disposed so that the optical axis of the lens 60 is positioned on the center line of the light emitting unit 12 along the thickness direction of the LED chip 10. The light emitted from the side surface of the LED chip 10 propagates through the sealing portion 50 and the air layer 80 to reach the color conversion member 70 and does not excite the phosphor of the color conversion member 70 or collide with the phosphor. Or the color conversion member 70 is transmitted.

  The color conversion member 70 is a mixture of a translucent material (transparent material) such as silicone and a particulate yellow phosphor that emits broad yellow light when excited by the blue light emitted from the LED chip 10. It is comprised by the molded article of the mixed mixture. Therefore, in the light emitting device 1 of the present embodiment, the blue light emitted from the LED chip 10 and the light emitted from the yellow phosphor are emitted through the outer surface 70b of the color conversion member 70, and white light is obtained. Can do. Note that the translucent material used as the material of the color conversion member 70 is not limited to silicone, for example, an acrylic resin, an epoxy resin, glass, an organic / inorganic component mixed and bonded at the nm level or molecular level, and organic / An inorganic hybrid material or the like may be employed. Further, the phosphor mixed with the translucent material used as the material of the color conversion member 70 is not limited to the yellow phosphor. For example, white light can be obtained by mixing a red phosphor and a green phosphor.

  Here, the color conversion member 70 has an inner surface 70 a formed in a shape along the light emitting surface 60 b of the lens 60. Therefore, the distance between the light emitting surface 60b and the inner surface 70a of the color conversion member 70 in the normal direction is a substantially constant value regardless of the position of the light emitting surface 60b of the lens 60. In addition, the color conversion member 70 is shape | molded so that the thickness along a normal line direction may become uniform irrespective of a position. The color conversion member 70 may be bonded to the mounting substrate 20 using, for example, an adhesive (for example, a silicone resin, an epoxy resin, or the like) on the periphery of the opening.

  In manufacturing the light emitting device 1 of the present embodiment, for example, after the LED chip 10 is mounted on the heat transfer plate 21 of the mounting substrate 20 via the submount member 30, each electrode of the LED chip 10 and the mounting substrate are mounted. Wire bonding for electrically connecting the lead patterns 23 and 23 of the wiring board 22 in 20 is performed, and then the frame body 40 is fixed to the mounting surface side of the LED chip 10 in the mounting board 20, and then the sealing portion 50. A transparent resin, which is a material of the above, is filled in a space surrounded by the mounting substrate 20 and the frame body 40, and then the lens 60 is placed on the frame body 40, and then the transparent resin is thermoset to seal the resin. The sealing part 50 and the lens 60 may be fixed simultaneously with the formation of the stop part 50, and finally the color conversion member 70 may be fixed to the mounting substrate 20 using an adhesive or the like.

  Since the light emitting device 1 of the present embodiment described above includes the elastic sealing portion 50 made of a transparent resin in which the LED chip 10 and the bonding wires 14 and 14 are sealed inside the frame body 40, the sealing is performed. The weather resistance of the sealing part 50 can be improved as compared with the conventional case where an epoxy resin is used as the material of the part 50, and deterioration due to light emitted from the LED chip 10 is less likely to occur.

  By the way, it is also conceivable that a metal material such as aluminum is used as the material of the frame body 40 and the frame body 40 is used as a reflector that reflects light emitted from the LED chip 10 toward the lens 60 side. However, when aluminum is adopted as the material of the frame body 40, the linear expansion coefficient of the silicone resin that is the material of the sealing portion 50 is a value that is 10 times or more the linear expansion coefficient of aluminum that is the material of the frame body 40. Yes, when a heat cycle test (temperature cycle test) in which a low temperature period of −40 ° C. and a high temperature period of 80 ° C. are alternately repeated is performed, a sealing portion is formed at a low temperature of the heat cycle test due to a difference in linear expansion coefficient between the two. Voids are generated in 50.

  On the other hand, in the light emitting device 1 according to the present embodiment, since the frame body 40 is formed of a transparent resin, the frame body 40 and the sealing portion 50 are compared to the case where the frame body 40 is formed of a metal material. The linear expansion coefficient difference can be reduced, and the generation of voids in the sealing portion 50 at the low temperature of the heat cycle test can be suppressed, so that the reliability can be improved. In short, since the light emitting device 1 of the present embodiment includes the frame body 40 that surrounds the sealing portion 50 on the mounting surface side of the LED chip 10 on the mounting substrate 20, the shape of the sealing portion 50 is changed by the frame body 40. Since the sealing portion 50 can be formed without using a mold or the like, and since the frame body 40 is formed of the same transparent resin as the sealing portion 50, A decrease in reliability due to a difference in linear expansion coefficient with the sealing unit 50 can be prevented.

  Further, in the light emitting device 1 of the present embodiment, since the lens 60 made of a biconvex lens formed separately from the sealing portion 50 is fixed to the sealing portion 50 in an overlapping manner, the directivity of the emitted light is improved. In particular, it is suitable as a light source for a luminaire having a high directivity requirement such as a luminaire such as a spotlight.

  Further, in the light emitting device 1 of the present embodiment, the color conversion member 70 may be disposed in a form in which an air layer 80 is formed between the light emitting surface 60b of the lens 60 and the outer surface of the frame body 40 (that is, The color conversion member only needs to be disposed in such a manner that the air layer 80 is formed on the inner side), and the color conversion member 70 does not need to be in close contact with the lens 60 and the frame body 40. And a decrease in yield due to positioning accuracy can be suppressed. Further, in the light emitting device 1 of the present embodiment, since the assembly of the color conversion member 70 is the final process at the time of assembly, the color conversion member 70 in which the blending of the phosphor with respect to the transparent material is adjusted according to the emission wavelength of the LED chip 10. By using, color variations can be reduced.

  Further, in the light emitting device 1 of the present embodiment, since the air layer 80 is formed between the color conversion member 70 and the lens 60 as described above, the color conversion member when an external force acts on the color conversion member 70. The possibility that the lens 70 is deformed and abutted against the lens 60 is reduced, and the stress generated in the color conversion member 70 due to the external force is transmitted to the LED chip 10 and the bonding wires 14 and 14 through the lens 60 and the sealing portion 50. Therefore, there is an advantage that reliability is improved because fluctuations in the light emission characteristics of the LED chip 10 due to the external force and disconnection of the bonding wires 14 and 14 are less likely to occur. Further, since the air layer 80 is formed between the color conversion member 70 and the lens 60, the moisture in the external atmosphere hardly reaches the LED chip 10, and the phosphor of the color conversion member 70 There is an advantage that it is possible to suppress the heat generated in step 1 from being transferred to the LED chip 10.

  In addition, since the air layer 80 is formed between the color conversion member 70 and the lens 60, the color conversion member 70 is emitted from the LED chip 10 and enters the color conversion member 70 through the sealing portion 50 and the lens 60. Among the light scattered by the yellow phosphor particles in 70, there is an advantage that the amount of light scattered to the lens 60 side and transmitted through the lens 60 can be reduced, and the light extraction efficiency to the outside as the entire apparatus can be improved. is there.

  Here, as shown in FIGS. 5A and 5B, the optical axis of the color conversion member 70 and the optical axis of the LED chip 10 coincide with each other, and the central position of the color conversion member 70 in the optical axis direction. It is assumed that the blue light from the LED chip 10 is scattered in all directions by P, the total reflection angle at the interface between the color conversion member 70 and the air layer 80 is φa, and the color conversion member 70 and the outside of the color conversion member 70 are outside. The total reflection angle at the interface with air, which is the medium, is φb, and the light scattered at the position P is 2θa, the spread angle of the escape cone ECa on the inner surface 70a side of the color conversion member 70, and the color is scattered with respect to the light scattered at the position P. If the spread angle of the escape cone ECb on the outer surface 70b side of the conversion member 70 is 2θb, as shown in FIG. 5A, when the total reflection angles φa and φb are 40 °, 2θa = 60 ° and 2θb = 98 °. , The total reflection angle as shown in FIG. When φa and φb are 50 °, 2θa = 76 ° and 2θb = 134 °.

Here, the refractive index of the translucent material (transparent material) used for the color conversion member 70 is n, and the maximum emission efficiency of blue light scattered at the position P and emitted through the escape cone ECa on the inner surface 70a side is η. In this case, since η = (1/4 n ² ) × 100 [%], when silicone is used as the translucent material as described above, n = 1.4 and η≈13 %. Therefore, when the air layer 80 is not formed between the color conversion member 70 and the lens 60, 50% of the blue light scattered at the position P returns to the lens 60, whereas the air layer Since 80 is formed, only 13% of the blue light scattered at the position P returns to the lens 60, so that deterioration of the sealing portion 50 due to the blue light can be suppressed. In order to reduce the blue light emitted through the escape cone ECa, it is desirable to increase the thickness of the color conversion member 70.

  Further, in the light emitting device 1 according to the present embodiment, the thickness dimension of the submount member 30 is set so that the surface of the submount member 30 is further away from the heat transfer plate 21 than the surface of the wiring substrate 22. It is possible to prevent the light radiated laterally from 10 from being absorbed by the wiring substrate 22 through the inner peripheral surface of the window hole 24 of the wiring substrate 22 and the light radiated laterally from the LED chip 10. The light can be prevented from being emitted through the joint portion between the color conversion member 70 and the mounting substrate 20. In addition, as described above, the reflective film 32 that reflects the light emitted from the LED chip 10 is formed around the bonding portion of the LED chip 10 in the submount member 30, so that the LED chip 10 is laterally formed. It is possible to prevent the emitted light from being absorbed by the submount member 30 and to increase the light extraction efficiency to the outside.

(Embodiment 2)
Hereinafter, the light-emitting device of this embodiment will be described with reference to FIGS.

  The basic configuration of the light emitting device 1 of the present embodiment is substantially the same as that of the first embodiment, and the lens 60 and the frame 40 are integrally formed of the same translucent material (for example, silicone). Is different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  Further, in the wiring board 22 in the present embodiment, the lead patterns 23 and 23 and the lead patterns 23 and 23 are formed in the insulating base material 22a on the surface side opposite to the heat transfer plate 21 side in the insulating base material 22a. A resist layer 26 (see FIG. 6 and FIG. 8) made of a white resin covering a portion that is not present is laminated. Therefore, the light emitted from the side surface of the LED chip 10 and incident on the surface of the resist layer 26 is reflected by the surface of the resist layer 26, so that the light emitted from the LED chip 10 is connected to the heat transfer plate 21 side in the wiring substrate 22. Can be prevented from being absorbed through the opposite surface, and the light output can be improved by improving the light extraction efficiency to the outside.

  Here, the resist layer 26 is formed with circular opening windows 26 a that expose the inner lead portions 23 a and 23 a of the lead patterns 23 and 23 in the vicinity of the window holes 24 of the wiring substrate 22. Are formed with circular opening windows 26b and 26b for exposing the outer lead portions 23b and 23b of the conductor patterns 23 and 23, respectively.

  Here, as described above, the lens 60 and the frame body 40 are integrally formed of the same translucent material (for example, silicone) (in other words, the lens 60 and the frame body 40 are integrally formed integrally. The refractive index and the linear expansion coefficient are the same as those of the sealing portion 50. The lens 60 and the frame body 40 may be formed of a translucent material that does not fall below the refractive index and elastic modulus of the transparent resin of the sealing portion 50. For example, when the sealing resin is an acrylic resin, The lens 60 and the frame body 40 may be integrally formed with an acrylic resin. Moreover, the translucent material employ | adopted as a material of the lens 60 and the frame 40 should just have a linear expansion coefficient equivalent to the linear expansion coefficient of the transparent resin of the sealing part 50. FIG.

  In the light emitting device of the present embodiment, the LED chip 10 is disposed at a position separated from the plane including the outermost surface (the surface of the resist layer 26) of the mounting substrate 20 in the normal direction of the plane. The space surrounded by the lens 60 and the frame body 40 in the lens block constituted by the frame body 40 constitutes a housing recess for housing the LED chip 10.

  As a manufacturing method of the light emitting device of this embodiment, as shown in FIG. 10, after the LED chip 10 and the bonding wires 14 and 14 are electrically connected, the space surrounded by the lens 60 and the frame body 40 is described above. A mounting substrate in which the frame 40 is interposed between the lens 60 and the mounting substrate 20 after injecting a liquid transparent resin material (for example, a sealing resin made of silicone resin) 50c to be the sealing portion 50 A manufacturing method is conceivable in which the sealing portion 50 is formed by placing the transparent resin material 50c opposite to the substrate 20 and curing the transparent resin material 50c. However, in such a manufacturing method, a void may occur in the sealing portion 50 during the manufacturing process.

  Therefore, in manufacturing the light emitting device 1 of the present embodiment, as shown in FIG. 9, after the LED chip 10 is mounted on the mounting substrate 20 and the LED chip 10 and the bonding wires 14 and 14 are electrically connected, The LED chip 10 and the bonding wires 14 and 14 are covered with a liquid first transparent resin material (for example, a sealing resin made of silicone resin) 50a that becomes a part of the sealing portion 50, and then the lens 60 and the frame body 40 are covered. A liquid second transparent resin material (for example, a sealing resin made of silicone resin) 50b made of the same material as the first transparent resin material 50a and serving as another part of the sealing portion 50 is injected into the space surrounded by Thereafter, the transparent resin materials 50a and 50b are cured by disposing the lens 60 opposite to the mounting substrate 20 with the frame body 40 interposed between the lens 60 and the mounting substrate 20. And so as to form the sealing portion 50. According to such a manufacturing method, it is difficult to generate a void in the sealing portion 50 during the manufacturing process, and it is possible to provide the light emitting device 1 with high reliability and high light output. Here, if the first transparent resin material 50a is cured before injecting the second transparent resin material 50b, the viscosity of the first transparent resin material 50a is lowered and trapped in the storage recess. There is an advantage that voids are easily removed. In the present embodiment, the inner diameter of the circular opening window 26a formed in the central portion of the resist layer 26 of the mounting substrate 20 is set to be slightly larger than the maximum outer diameter of the color conversion member 70. When the first transparent resin material 50a is potted, the first transparent resin material 50a that has flowed to the vicinity of the inner peripheral surface of the opening window 26a is used as an adhesive that joins the color conversion member 70 and the mounting substrate 20. .

  In the light emitting device 1 of the present embodiment described above, the lens 60 and the frame body 40 are integrally formed of the same translucent material, so that the lens 60 and the frame body 40 are separate members compared to the case where the lens 60 and the frame body 40 are separate members. It is possible to reduce the number of parts and to prevent a decrease in light output due to the deviation of the optical axis between the LED chip 10 and the lens 60.

(Embodiment 3)
Hereinafter, the light-emitting device 1 of this embodiment is demonstrated based on FIG.

  The basic configuration of the light emitting device 1 of the present embodiment is substantially the same as that of the second embodiment, and the inner diameter of the opening window 26a at the center of the resist layer 26 is set slightly smaller than the maximum inner diameter of the color conversion member 70. The difference is that the edge of the color conversion member 70 on the mounting substrate 20 side and the peripheral portion of the opening window 26a in the resist layer 26 are joined together by a joint portion 75 made of an adhesive over the entire circumference. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 2, and description is abbreviate | omitted.

  Therefore, in manufacturing the light emitting device 1 of the present embodiment, as in the second embodiment, as shown in FIG. 12, the LED chip 10 is mounted on the mounting substrate 20 and the LED chip 10 and the bonding wires 14 and 14 are electrically connected. After the connection, the LED chip 10 and the bonding wires 14 and 14 are covered with a liquid first transparent resin material (for example, a sealing resin made of silicone resin) 50a which becomes a part of the sealing portion 50, In a space surrounded by the lens 60 and the frame body 40, a liquid second transparent resin material (for example, a seal made of silicone resin) made of the same material as the first transparent resin material 50a and forming the other part of the sealing portion 50 is used. (Stopping resin) 50b is injected, and then the lens 60 is disposed opposite to the mounting substrate 20 with the frame body 40 interposed between them and the transparent resin materials 50a, 5 And so as to form a sealing portion 50 formed by curing the b. Here, in manufacturing the light emitting device 1 of the present embodiment, the resist layer 26 prevents the first transparent resin material 50a from flowing out to the joint portion of the color conversion member 70. Since the edge on the mounting substrate 20 side and the mounting substrate 20 are bonded with an adhesive, the thickness of the bonding portion 75 interposed between the color conversion member 70 and the mounting substrate 20 can be easily controlled, and the color The reliability of joining between the conversion member 70 and the mounting substrate 20 is improved. In addition, it is desirable to use the same material as the color conversion member 70 as the adhesive of the joint portion 75.

  By the way, in each of the above-described embodiments, a blue LED chip whose emission color is blue is adopted as the LED chip 10, and a SiC substrate is adopted as the conductive substrate 11, but a GaN substrate is used instead of the SiC substrate. If a SiC substrate or a GaN substrate is used, the crystal growth substrate has a higher thermal conductivity than the case where an insulator sapphire substrate is used as the crystal growth substrate. The thermal resistance can be reduced. Further, the light emission color of the LED chip 10 is not limited to blue, and may be, for example, red or green. That is, the material of the light-emitting portion 12 of the LED chip 10 is not limited to the GaN-based compound semiconductor material, and a GaAs-based compound semiconductor material, a GaP-based compound semiconductor material, or the like may be employed according to the emission color of the LED chip 10. Further, the conductive substrate 11 is not limited to the SiC substrate, and may be appropriately selected from, for example, a GaAs substrate and a GsP substrate according to the material of the light emitting unit 12.

1 is a schematic cross-sectional view of a light emitting device according to Embodiment 1. FIG. It is a general | schematic disassembled perspective view which showed the same and partially fractured | ruptured. It is a principal part schematic plan view which shows the same as the above. It is a schematic perspective view of the submount member in the same as the above. It is principal part explanatory drawing same as the above. 6 is a schematic cross-sectional view of a light emitting device according to Embodiment 2. FIG. It is a general | schematic disassembled perspective view in which the light emitting device same as the above was partially broken. It is a schematic plan view of the wiring board in the above light emitting device. It is explanatory drawing of the manufacturing method of a light-emitting device same as the above. It is explanatory drawing of the manufacturing method of a light-emitting device same as the above. 6 is a schematic cross-sectional view of a light emitting device according to Embodiment 3. FIG. It is explanatory drawing of the manufacturing method of a light-emitting device same as the above.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 LED chip 14 Bonding wire 20 Mounting board 40 Frame 50 Sealing part 60 Lens 60a Light incident surface 60b Light output surface 70 Color conversion member 80 Air layer

Claims (3)

  It is made up of an LED chip, a mounting substrate on which the LED chip is mounted, and a transparent resin that seals the LED chip and the bonding wire electrically connected to the LED chip on the mounting surface side of the LED chip on the mounting substrate. A sealing portion having a lens, a lens disposed on the sealing portion, and a phosphor and a translucent material that are excited by light emitted from the LED chip and emit light of a color different from the emission color of the LED chip A dome-shaped color conversion member that surrounds the lens and the sealing portion on the mounting surface side of the mounting substrate, an air layer is formed inside the color conversion member, and the lens is a biconvex lens A light-emitting device comprising:   In the lens, the light exit surface is formed in a convex curved surface shape that does not totally reflect the light incident from the light incident surface on the sealing portion side at the boundary between the light exit surface and the air layer. The light-emitting device according to claim 1.   2. A frame body that encloses a sealing portion on a mounting surface side of the LED chip on the mounting substrate, and the frame body is formed of the same kind of transparent resin as the sealing portion. The light emitting device according to claim 2.

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