JP2007108537A - Display module and relay board and driving circuit mounting board used for the module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a display module in which a driving circuit mounting board connecting a plurality of driving ICs and/or chip electronic parts is made compact without decreasing the yield nor increasing the cost. <P>SOLUTION: The display module is equipped with a plurality of semiconductor devices generating panel driving signals on the basis of external signals, a driving circuit mounting board where at least one of the above semiconductor devices is flip-chip connected, and a display panel where the panel driving signals generated by the semiconductor devices are input. The driving circuit mounting board includes an electrode connected to the semiconductor device, first wiring connected to the above electrode and at least partially formed inside a first region opposing to the semiconductor device, a second region opposing to the first region across the driving circuit mounting board, second wiring at least partially formed inside the second region, and inner wiring connecting the first wiring and the second wiring. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a display module that achieves a reduction in size and weight and a reduction in thickness, and a relay substrate used therefor.

  Display modules mounted on electronic devices such as mobile phones, PDAs (personal digital assistants), notebook personal computers, and televisions that are required to be smaller and lighter and thinner are flexible substrates (hereinafter referred to as FPCs) that connect display panels and semiconductor chips. It has. As one method for connecting the semiconductor chip and the FPC, a chip-on-film (hereinafter referred to as COF) is used.

  In COF, flip chip mounting is performed in which bumps formed on a circuit forming surface of a semiconductor chip and electrodes on a wiring pattern formed on an FPC are electrically connected to face each other. It is continuously connected to the FPC.

FIG. 11 is a schematic plan view showing the display module disclosed in Patent Document 1. As shown in FIG. The configuration of the display module 80 will be described with reference to FIG. 11. The liquid crystal module 80 is formed of a liquid crystal panel 82, a chip mounting substrate 89, and an external substrate 85. The chip mounting substrate 89 is
A driving IC 81, a chip electronic component 87, and a circuit board 84 are provided.

  The liquid crystal panel 82 includes a drive substrate (not shown) and a counter substrate (not shown). The drive substrate includes a display region G in which switching elements (not shown) for switching pixels are arranged, and a peripheral region S that is a region other than the display region G. In the peripheral region S, connection terminals for connecting the terminals of the circuit board 84 are arranged.

  The driving IC 81 is an IC that inputs a signal output from the external substrate 85 and outputs a signal for driving the switching element of the liquid crystal panel 82. Bumps are formed in end regions on the circuit formation surface of the driving IC 81, and electrodes are formed on the circuit board 84 so as to correspond to the bumps of the driving IC 81. The circuit forming surface of the driving IC 81 and the electrode forming surface of the circuit substrate 84 are opposed to each other, and an anisotropic conductive film (hereinafter referred to as ACF) 83 made of conductive particles and a filler is sandwiched between them, and heating and pressure bonding are performed. To do. As a result, the bump of the driving IC 81 and the electrode of the circuit board 84 become conductive, and the driving IC 81 and the circuit board 84 are electrically connected.

  The circuit board 84 is formed with an input terminal for inputting a signal supplied from the external board 85, an input wiring (not shown) connected to the input terminal, and an output wiring (not shown) for outputting a signal to the liquid crystal panel 82. The input wiring and the output wiring are electrically connected to the bumps of the driving IC 81. An opening is formed in an end region on the output wiring forming side of the circuit board 84, and the output wiring is connected to an output terminal formed on the back surface of the circuit board 84 through the opening.

  The input terminal of the circuit board 84 is electrically connected to a signal cable 93 connected to the external board 85 by ACF. The output terminal of the circuit board 84 is electrically connected to a connection terminal formed in the peripheral region S of the liquid crystal panel 82 by ACF.

  A signal output from the external substrate 85 is input to the driving IC 82 connected to the circuit substrate 84 via the signal cable 93, and a driving signal for the liquid crystal panel 82 is generated from the driving IC 82 and the chip electronic component 87. The drive signal is supplied to the liquid crystal panel 82 via the circuit board 84. The pixels are driven by the input drive signal, and a predetermined image is displayed on the liquid crystal panel 82.

  FIG. 12 is a schematic plan view showing the display module 80 shown in Patent Document 2. As shown in FIG. The COF 86 includes a driving IC 81, a chip electronic component 87, and an FPC 92. The driving IC 81 and the FPC 92 are electrically connected by an Sn—Au alloy with the Au bumps arranged on the circuit forming surface of the driving IC 81 facing the electrodes formed on the wiring 90 arranged on the FPC 92. . As shown in the partial schematic sectional view of FIG. 12B, the wiring 90 electrically connected to the driving IC 81 is formed from the inside of the facing area 91 facing the driving IC 81 to the outside of the area. The connection between the liquid crystal panel 82 and the FPC 92 is performed by electrically connecting an electrode formed in the peripheral region S of the liquid crystal panel 82 and an output terminal formed in the FPC 92 via the ACF.

  FIG. 13 is a schematic side view showing the display module disclosed in Patent Document 3. As shown in FIG. The COF 86 includes a driving IC 81 and an FPC 92. The driving IC 81 and the FPC 92 are configured such that the bump electrode disposed on the circuit forming surface of the driving IC 81 and the electrode disposed on the FPC 92 are opposed to each other, an anisotropic conductive film is sandwiched therebetween, and heating and pressure bonding are performed. Are electrically connected.

  The output terminal of the COF 86 is electrically connected to the electrode formed in the peripheral region S via the ACF. Further, the back surface of the driving IC 81 connected on the FPC 92 is bonded to the back surface side of the peripheral region S.

A wiring (not shown) formed on the FPC 92 that is electrically connected to the driving IC 81 is formed outside the area from the facing area 91 facing the driving IC 81. The connection between the liquid crystal panel 82 and the FPC 92 is such that an electrode formed in the peripheral region S of the liquid crystal panel 82 and an output terminal formed in the FPC 92 are electrically connected via an anisotropic conductive film. Is done.
Japanese Patent Laid-Open No. 11-340285 JP 2001-127216 A JP 2001-308256 A

  The above driving IC includes, for example, a scanning line driving circuit (hereinafter referred to as a gate driver), a signal line driving circuit (hereinafter referred to as a source driver), a power supply circuit, a level shifter circuit, a counter circuit, a DC-DC converter circuit, One or a plurality of serial interface circuits and image processing circuits are formed. These circuits are formed as drive ICs that are separately or combined with a plurality of circuits. Which circuit is mounted is selected according to a signal required by the liquid crystal panel and a signal input to the driving IC.

  That is, for example, when the gate driver and the source driver are monolithically formed on the liquid crystal panel, the gate driver and the source driver are not arranged in the driving IC, and for example, a counter signal is input to the driving IC. If there is a counter signal (that is, if it is not necessary to create a new counter signal), the counter circuit is not arranged in the driving IC.

  In Patent Document 1, Patent Document 2, and Patent Document 3, electrodes connected to the bumps of the driving IC are formed on the surface of the FPC to which the bumps of the driving IC are connected. The wiring formed in the FPC does not cross the inside of the peripheral area of the driving IC for the FPC, and is formed from the facing area facing the driving IC toward the outside of the area. For this reason, an area where only the wiring is formed is formed around the opposing area facing the driving IC.

  Therefore, the distance between the driving IC and the other driving IC and the distance between the driving IC and the chip electronic component are widened, which makes it difficult to miniaturize the FPC that connects a plurality of chip electronic components. It was.

  Accordingly, an object of the present invention is to provide a display module in which a drive circuit mounting substrate to which a plurality of drive ICs and / or chip electronic components are connected is reduced without causing a decrease in yield or an increase in cost. .

  The present invention has been made in order to achieve the above-described object. For this reason, a plurality of semiconductor devices that generate a panel drive signal based on an external signal, and at least one semiconductor device among the plurality of semiconductor devices. Is a display module comprising a flip-chip connected drive circuit mounting substrate and a display panel to which a panel drive signal generated by the semiconductor device is input, wherein the drive circuit mounting substrate is connected to the semiconductor device. An electrode, a first wiring that is connected to the electrode and that is at least partially formed inside a first region that is opposed to the semiconductor device, and sandwiches the first region and the drive circuit mounting substrate A display module comprising: an opposing second area; a second wiring formed at least in part inside the second area; and an internal wiring connecting the first wiring and the second wiring. It is referred to as the means Yuru.

  According to this configuration, since at least a part of the wiring in the first region connected to the semiconductor device is arranged inside the first region, it is possible to reduce the wiring region outside the first region. .

  In addition, by arranging all the wirings that have conventionally been outside the first region in the first region or the second region, it is possible to eliminate the need for a wiring region connected to another semiconductor device around the first region. Therefore, the interval between the semiconductor device and another semiconductor device can be reduced. Therefore, the drive circuit mounting substrate can be further downsized.

  Preferably, in addition to the configuration according to the above means, a relay board that is electrically connected to the driving circuit mounting board and supplies an external signal supplied from the outside to the driving circuit mounting board is provided, and the driving circuit mounting The substrate is connected to the relay substrate and is disposed to face a peripheral region that is a region other than the display region of the display panel.

  According to this configuration, in addition to being able to reduce the size, a combination of a plurality of semiconductor devices according to the specifications of the display panel is realized on the drive circuit mounting substrate, and if it is connected to the relay substrate, the specification of the display panel is achieved. Since it can respond, it becomes easy to respond to specification changes. Further, by disposing the drive circuit mounting substrate in the peripheral region of the display panel, it is possible to reduce the thickness and size of the display module.

  Preferably, in addition to the configuration according to the above means, a relay board that is electrically connected to the driving circuit mounting board and supplies an external signal supplied from the outside to the driving circuit mounting board is provided, and the driving circuit mounting Both the board and the relay board are arranged to face a peripheral area that is an area other than the display area of the display panel.

  According to this configuration, in addition to being able to be miniaturized, a combination of a plurality of semiconductor devices according to the specifications of the display panel is realized on the drive circuit mounting board, and if it is connected to a relay board, the display panel specifications are achieved. Since it is possible to cope with the change in the specification, the relay substrate is not disposed between the drive circuit mounting substrate and the display panel, so that a thin display module can be realized.

Preferably, in addition to the configuration according to the above means, a relay board that is electrically connected to the driving circuit mounting board and supplies an external signal supplied from the outside to the driving circuit mounting board is provided, and the driving circuit mounting The substrate is connected to the display panel, and the relay substrate is connected to the drive circuit mounting substrate on the peripheral region.
According to this configuration, in addition to being able to reduce the size, a combination of a plurality of semiconductor devices according to the specifications of the display panel is realized on the drive circuit mounting substrate, and if it is connected to the relay substrate, the specification of the display panel is achieved. Since it can respond, it becomes easy to respond to specification changes. In addition, since the relay substrate is not disposed between the drive circuit mounting substrate and the display panel, the display module can be thinned.

  Preferably, in addition to the configuration according to the above means, the relay board is formed in a U shape in plan view, and an output portion is provided at one end of the U shape, and an input portion is provided at the other end. The drive circuit mounting board placement portion is provided between one end and the other end, and the drive circuit mounting board is electrically connected to a terminal provided in the drive circuit mounting board placement portion, and the output portion is It is assumed that the drive circuit mounting substrate is disposed on a surface opposite to the surface on which the peripheral region of the display panel is disposed, connected to the peripheral region.

  According to this configuration, the drive circuit mounting substrate can be disposed on the surface facing the peripheral region with the liquid crystal panel interposed therebetween, so that more space can be used effectively and the display module can be formed in a small size. Become.

  Preferably, in addition to the configuration according to the above means, the drive circuit mounting substrate is disposed on the same surface as the output portion forming surface of the relay substrate.

  According to this configuration, according to this configuration, the drive circuit mounting substrate can be disposed on a surface facing the peripheral region with the liquid crystal panel interposed therebetween, so that more space can be used more effectively and the display module can be reduced in size. It becomes possible to form.

  Further, the relay board is formed in a U shape in plan view using a material having flexibility, an output portion at one end of the U shape, an input portion at the other end, and the one end and the above It is characterized by having a region having a terminal for arranging a driving circuit mounting substrate for generating a panel driving signal for driving the display panel between the other ends.

According to this configuration, since the drive circuit mounting substrate can be disposed between one end and the other end, it is not necessary to secure a region for disposing the drive circuit mounting substrate in the peripheral region of the liquid crystal panel. The display module can be made small.
The drive circuit mounting board is a drive circuit mounting board to which at least one semiconductor device among a plurality of semiconductor devices generating a panel drive signal based on an external signal is flip-chip connected, and is connected to the semiconductor device. An electrode to be connected, a first wiring that is connected to the electrode and that is at least partially formed inside a first region that is opposed to the semiconductor device, and sandwiches the first region and the drive circuit mounting substrate A second region opposed to the second region, a second wire formed at least partially inside the second region, and an internal wire connecting the first wire and the second wire. It is said.

  According to this configuration, since at least a part of the wiring in the first region connected to the semiconductor device is arranged inside the first region, it is possible to reduce the wiring region outside the first region. .

In addition, by arranging all the wirings that have conventionally been outside the first region in the first region or the second region, it is possible to eliminate the need for a wiring region connected to another semiconductor device around the first region. Therefore, the interval between the semiconductor device and another semiconductor device can be reduced. Therefore, the drive circuit mounting substrate can be further downsized.
In addition, an electronic apparatus includes any one of the display modules described above. Preferably, the drive circuit mounting substrate is composed of two or more resin substrates,
The resin substrate facing the semiconductor device includes an electrode connected to the semiconductor device, and a first wiring at least partially formed inside a first region that is connected to the electrode and faces the semiconductor device The other resin substrate includes an internal wiring that connects the wiring formed in the region facing the first region and the wiring formed in the region facing the first region. It is characterized by providing.

  According to this configuration, since at least a part of the wiring in the first region connected to the semiconductor device is arranged inside the first region, it is possible to reduce the wiring region outside the first region. .

  Further, by arranging all the wirings that have conventionally been outside the first region in the first region or in the region facing the first region, there is no need for a wiring region connected to another semiconductor device around the first region. Therefore, the interval between the semiconductor device and another semiconductor device can be reduced. Therefore, the drive circuit mounting substrate can be further downsized.

  According to the present invention, the wiring of the driving circuit mounting substrate connected to the semiconductor device is also arranged inside the region where the terminals connecting to the semiconductor device are arranged, so that the wiring arranged between the adjacent semiconductor devices is arranged. Can be reduced. Thereby, the space | interval between semiconductor devices becomes narrow, a drive circuit mounting board | substrate can be reduced further, and, thereby, size reduction of a display module is attained.

  Hereinafter, examples in which a liquid crystal panel is used as an example of a display module as the best mode for carrying out the present invention will be described in each embodiment, and the present invention will be described in detail with reference to the drawings. The present invention is not limited to this, but can be applied to all flat display modules including EL display panels and plasma display panels. Furthermore, PDA, personal computers, mobile phones, electronic dictionaries, instrument panels, multimedia players, etc. The present invention can be applied to electronic devices that employ a flat display module.

(First embodiment)
FIG. 1A is a schematic plan view schematically showing the configuration of the display module 1 according to the first embodiment. As shown in FIG. 1A, the display module 1 includes a liquid crystal panel 2, an FPC (flexible wiring board) 3, and a drive circuit mounting board 4.

  The liquid crystal panel 2 includes an element substrate 2a, a counter substrate 2b disposed to face the element substrate 2a, and a liquid crystal layer 2c interposed between the two substrates. The liquid crystal panel 2 is divided into a display area 21 for displaying an image and a peripheral area 22 for arranging the FPC 3. In the element substrate 2a, a plurality of gate wirings provided so as to extend in parallel with each other, a source wiring provided so as to extend in parallel with a direction orthogonal to the gate wiring, and each intersection of the gate wiring and the source wiring The switching element provided in the part and the pixel electrode provided corresponding to each switching element are formed. In the counter substrate 2b, a common electrode and a color filter layer are formed on almost the entire surface of the display region 21. The liquid crystal layer 2c interposed between the two substrates is made of a nematic liquid crystal material having electro-optical characteristics.

  Each pixel electrode is configured with one pixel. In each pixel, when the switching element is turned on by a gate signal sent to the gate wiring, a charge is written to the pixel electrode according to the source signal sent to the source wiring, and the liquid crystal configured between the pixel electrode and the common electrode The voltage applied to the capacitor is controlled. By this control, the alignment state of the liquid crystal molecules in the liquid crystal layer is changed to adjust the light transmittance and display an image.

  The display area 21 corresponds to a portion where the element substrate 2a, the counter substrate 2b arranged to face the element substrate 2a, and the liquid crystal layer 2c interposed between the two substrates are arranged. The peripheral region 22 is a part of the element substrate 2a. In the peripheral region 22, for example, a signal line connected to the gate wiring and the source wiring, and a connection terminal 5 for connecting to the FPC 3 (see FIG. 1B). ) And are formed.

  FIG. 1B is a cross-sectional view schematically showing a configuration in the vicinity of the peripheral region 22 of the display module 1 according to the first embodiment. The FPC 3 is a flexible film made of polyimide in which wirings made of copper foil are formed. As shown in FIG. 1B, an output terminal 3a for connecting to the connection terminal 5 is formed at one end of one surface of the FPC 3, and a PWB for outputting an input signal to the FPC 3 at the other end. An input terminal 3b for connection with (Printed Wiring Board: printed wiring board) is formed, and serves as a relay board for relaying signals. A signal supply terminal 3c and a signal output terminal 3d for connecting the drive circuit mounting substrate 4 are formed on the other surface. These signal supply terminal 3 c and signal output terminal 3 d are formed corresponding to the terminals of the drive circuit mounting substrate 4. As the wiring of the FPC 3, wiring for connecting the input terminal 3b and the signal supply terminal 3c and wiring for connecting the output terminal 3a and the signal output terminal 3d are formed.

  The connection terminal 5 of the liquid crystal panel 2 and the output terminal 3a of the FPC 3 are connected by an anisotropic conductive film (hereinafter referred to as ACF). The input terminal 3b of the FPC 3 is connected by PWB and ACF.

  A chip component 6 that generates a panel drive signal for driving the liquid crystal panel 2 is mounted on the drive circuit mounting substrate 4. A wiring board is used as the drive circuit mounting board 4. In addition, as a wiring board, FPC, a double-sided wiring board, a multilayer board | substrate, or a rigid flexible board | substrate is employable. The drive circuit mounting substrate 4 has a structure in which a plastic film is bonded to both surfaces of a core layer serving as a base, and metal wiring is formed on each plastic film. The metal wiring formed on both surfaces of the drive circuit mounting substrate 4 is electrically connected through a prepreg layer and a through hole and an electrode formed in the plastic film. As the core layer, prepreg, plastic, or LCP (Liquid Crystal Polymer) can be used.

  On one surface of the drive circuit mounting board 4, a drive circuit mounting board input terminal 4a connected to the signal supply terminal 3c of the FPC 3 and a drive circuit mounting board output terminal 4b connected to the signal output terminal 3d of the FPC 3 are formed. ing. An input terminal and an output terminal for connecting to the chip component are formed on the upper surface (referred to as the front surface) of the drive circuit mounting substrate 4.

  Further, the chip component 6 is located in a region 9a on the drive circuit mounting substrate 4 facing the chip component 6 and inside the region (first region) where input terminals and output terminals connected to the chip component are arranged (first region). Wiring 7 that is electrically connected to is formed.

  The surface on which the drive circuit mounting board output terminal 4b and the driving circuit mounting board input terminal 4a are formed (referred to as the back side) is a first area that is opposed to the driving circuit mounting board 4 across the first area. A wiring 8 is arranged in a region 9b inside the two regions.

  The wiring 8 is connected to the wiring 7 through an internal wiring provided in a through hole that penetrates the drive circuit mounting substrate 4. Further, the wiring 8 is formed on the back surface side according to its role, and is connected to the wiring on the back surface side of the driving circuit mounting substrate input terminal 3b, the driving circuit mounting substrate output terminal 3a, or other chip components.

  By forming the wiring in this way, the distance between the chip parts can be reduced. In particular, as shown in FIG. 1B, if no wiring is provided between the chip components on the front surface, the space between the chip components can be made narrower, so that the drive circuit mounting substrate can be made smaller. Further, based on this, the display module can be reduced in size.

  The chip component 6 connected to the drive circuit mounting substrate 4 is composed of a chip circuit component and / or a chip electronic component. The chip circuit component means an IC that applies some modulation to the potential or signal input from the PWB. For example, a gate driver 401, a source driver 402, a DCDC converter 403, a DAC 404, and an EEPROM 405 are mounted. Among these, the gate driver 401 is an IC having a function of supplying a gate signal to the gate wiring so that only the selected gate wiring is at a high potential and other gate wirings are kept at a low potential. The source driver 402 is an IC having a function of receiving image data, converting it into a voltage applied to a liquid crystal capacitor, and supplying it to a selected source wiring. On the other hand, the chip electronic component 406 is a component such as a resistor or a ceramic capacitor, and generates a predetermined potential, signal, or the like in cooperation with the chip circuit component 405.

  Metal bumps are formed on the electrodes of the chip component, and the surface of the chip component on which the metal bumps are formed and the first region of the drive circuit mounting substrate 4 are opposed to each other by solid phase bonding or liquid layer bonding. The electrode of the chip component and the input terminal and output terminal of the drive circuit mounting substrate 4 are flip-chip connected. Further, in order to reinforce the connection between the chip component 6 and the drive circuit mounting substrate 4, an underfill resin is injected between the chip component 6 and the drive circuit mounting substrate 4 to perform sealing. In addition, as a metal used for the metal bump, solder, gold, or copper can be adopted.

  On the peripheral region 22 of the liquid crystal panel 2, the connection terminal 5 and the output terminal 3a are connected via the ACF, and the signal output terminal portion 3d of the FPC 3 and the drive circuit mounting board output terminal 4b are connected via the ACF. Is done.

  The liquid crystal panel module formed as described above is driven as follows. That is, a plurality of signals such as a synchronization signal, a clock signal, a video signal, a power supply voltage, and a GND output from the PWB are input to the input terminal 3b of the FPC 3, and the plurality of signals are driven from the input terminal 3b to the signal supply terminal unit 3c. The chip component 6 is supplied via the circuit mounting board input terminal 4a. The chip component 6 generates the panel drive signal for driving the liquid crystal panel 2.

  The generated signal is supplied from the drive circuit mounting board output terminal 4b to the output terminal 3a of the FPC 3 via the signal output terminal portion 3d of the FPC 3. A panel drive signal is input from the output terminal 3 a to the connection terminal 5 formed in the peripheral region 22 of the liquid crystal panel 2. The panel drive signal input to the connection terminal 5 drives the switching element to write electric charge to the pixel electrode, thereby performing a desired display.

  In the above description, all of the drive circuit mounting substrate 4 is disposed so as to face the peripheral region 22. However, if at least a part can be disposed to face the peripheral region, the facing portion is provided. About, it can have an effect of miniaturization.

  In addition, since multiple chip components are connected to the drive circuit mounting board by solid phase bonding or liquid layer bonding with metal used for metal bumps, chip component connection work is facilitated and bonding reliability is improved, improving yield. Thus, cost reduction can be realized.

  Furthermore, it becomes possible to arrange a plurality of chip parts on the liquid crystal panel 2 at a time via the drive circuit mounting substrate 4 and the FPC 3, and work efficiency can be improved.

(Second Embodiment)
FIG. 2 is a schematic plan view schematically showing the configuration of the display module 1b according to the second embodiment. The display module 1b according to the second embodiment will be described by taking a liquid crystal panel as an example. The difference from the first embodiment is that the source driver and the gate driver are monolithically formed in the liquid crystal panel, and therefore the source driver and the gate driver are not arranged on the drive circuit mounting substrate 41a.

  Hereinafter, the configuration will be described, but only differences from the first embodiment will be described, and the same components will be denoted by the same reference numerals and description thereof will be omitted.

  As shown in FIG. 2, the display module 1b includes a liquid crystal panel 2b, an FPC 3b, and a drive circuit mounting substrate 41a.

  The liquid crystal panel 2b is divided into a display area 21b for displaying an image and a peripheral area 22b formed on one side of the liquid crystal panel 2b on which the FPC 3b is arranged.

  The display region 21b includes an element substrate, a counter substrate disposed to face the element substrate, and a liquid crystal layer interposed between the two substrates. In the element substrate, a plurality of gate wirings provided so as to extend in parallel to each other, a source wiring provided so as to extend in a direction orthogonal to the gate wiring, and each intersection of the gate wiring and the source wiring And a pixel electrode provided corresponding to each switching element. Furthermore, a gate driver circuit for sending a gate signal to the gate wiring and a source driver circuit for sending a source signal to the source wiring are also formed. In the counter substrate, a common electrode and a color filter layer are formed on almost the entire display area 21. The liquid crystal layer interposed between the two substrates is made of a nematic liquid crystal material having electro-optical characteristics.

  In the peripheral area of the liquid crystal panel, wirings corresponding to the gate driver drive signal, source driver drive signal, and liquid crystal drive video signal are formed. Furthermore, a terminal connected to the FPC 3 is formed on this wiring.

  A terminal for arranging the FPC 3b formed in the peripheral region 22b and an output terminal of the FPC 3b are connected by an ACF. The input end of the FPC 3b is connected to the PWB by the ACF.

  The drive circuit mounting substrate 41a includes chip parts for generating panel drive signals (gate driver drive signal, source driver drive signal, common electrode drive signal, and liquid crystal drive video signal) for driving the liquid crystal panel 2b.

  On the surface (referred to as the back surface) opposite to the surface (referred to as the front surface) to which the chip components of the drive circuit mounting substrate 41a are connected, the drive circuit mounting substrate input terminal connected to the signal supply terminal portion of the FPC 3b; A drive circuit mounting board output terminal connected to the signal output terminal portion of the FPC 3b is formed, and an input terminal and an output terminal for connecting to chip components are formed on the front surface of the drive circuit mounting board 41a. Yes.

  The chip component 6 connected to the drive circuit mounting substrate 41a is composed of a chip circuit component and / or a chip electronic component. The chip circuit component means an IC that applies some modulation to a potential or a signal input from the PWB, and includes, for example, a DCDC converter 42b, a DAC 41b, and an EEPROM. On the other hand, the chip electronic component 43b is a component such as a resistor or a ceramic capacitor, and generates a predetermined potential, signal, or the like in cooperation with the chip circuit component.

  Metal bumps are formed on the electrodes of the chip component, and the surface of the chip component on which the metal bumps are formed and the first region of the drive circuit mounting substrate 41a are opposed to each other by solid phase bonding or liquid layer bonding. The electrode of the chip component and the input terminal and output terminal of the drive circuit mounting substrate 4 are flip-chip connected. Further, in order to reinforce the connection between the chip component 6 and the drive circuit mounting substrate 4, an underfill resin is injected between the chip component 6 and the drive circuit mounting substrate 4 for sealing. In addition, as a metal used for the metal bump, solder, gold, or copper can be adopted.

  On the peripheral area of the liquid crystal panel 2b, the signal supply terminal portion of the FPC 3b and the drive circuit mounting substrate input terminal of the driving circuit mounting substrate 41a are connected via the ACF, and further, the signal output terminal portion of the FPC 3b and the driving circuit mounting substrate. The drive circuit mounting board output terminal 41a is connected via the ACF. The drive circuit mounting board input terminal portion is electrically connected to the driving circuit mounting board output terminal via the chip component.

  Unlike the first embodiment, a DCDC converter 42b, a DAC 41b, an EEPROM, and the like are connected as chip circuit components to the drive circuit mounting board 41a of the present embodiment, and a source driver circuit and a gate driver circuit are not arranged. .

  In the present embodiment, an example in which the gate driver circuit and the source driver circuit are formed on the element substrate has been described, but it is also possible to form circuits such as a control circuit and a video interface circuit on the element substrate.

  Even in such a configuration, the configuration related to the wiring and connection of the drive circuit mounting substrate 41a and the chip components is the same as that of the first embodiment, and thus the distance between the chip components can be reduced. In particular, as shown in FIG. 1B, if no wiring is provided between the chip components on the front surface, the space between the chip components can be made narrower, so that the drive circuit mounting substrate can be made smaller. Further, based on this, the display module can be reduced in size.

(Third embodiment)
FIG. 3 is a plan view schematically showing the configuration of the display module 11 according to the second embodiment. Hereinafter, the configuration will be described, but only differences from the first embodiment will be described, and the same components will be denoted by the same reference numerals and description thereof will be omitted.
As shown in FIG. 3, the display module 11 includes a liquid crystal panel 2, an FPC 13, and a drive circuit mounting substrate 4 that generates a panel drive signal. The FPC 13 and the drive circuit mounting substrate 4 are each a liquid crystal panel. The two peripheral regions 22 are electrically connected.
The liquid crystal panel 2 is divided into a display area 21 for displaying an image and a peripheral area 22 formed on one side of the liquid crystal panel 2 on which the FPC 3 and the drive circuit mounting substrate 4 are arranged. The peripheral region 22 is arranged on the element substrate 2a. The element substrate 2a includes a plurality of gate wirings provided so as to extend in parallel to each other, and source wirings extending in parallel in a direction orthogonal to the gate wiring. Is provided.

  In the peripheral region 22, an input signal wiring connected to the gate wiring and the source wiring is formed, and a relay signal wiring 70 for connecting to the drive circuit mounting substrate 4 and the FPC 13 is formed. A signal supply terminal 14c is formed in the input signal wiring, and is electrically connected to the drive circuit mounting board output terminal 4b of the driving circuit mounting board 4 via the ACF. Further, a connection terminal 5 for connecting to the FPC 13 is formed at one end of the relay signal wiring 70, and a connection terminal 14d of the liquid crystal panel 2 is formed at the other end. The connection terminal 5 is electrically connected to the output terminal 3a formed on one surface of the FPC 13 for connection to the peripheral region 22 and the connection terminal 14d via the drive circuit mounting board input terminal 4a via the ACF.

  In the other end region of the FPC 13, an input terminal is formed for connection to a PWB that controls the generation of control signals for operating the source driver and the gate driver and the timing of polarity inversion of the reference power supply circuit. Furthermore, the wiring arrange | positioned between the input terminal and the output terminal is provided.

  The drive circuit mounting substrate 4 includes a chip component 6 that generates a panel drive signal for driving the liquid crystal panel 2. A wiring board is used as the drive circuit mounting board 4. Plastic films are bonded to both surfaces of the core layer as a base, and metal wiring is formed on each plastic film. The metal wiring formed on both surfaces of the drive circuit mounting substrate 4 is electrically connected through a prepreg layer and a through hole and an electrode formed in the plastic film. As the core layer, prepreg, plastic, or LCP (Liquid Crystal Polymer) can be used.

  As the drive circuit mounting board 4, an FPC, a double-sided wiring board, a multilayer board, or a rigid flexible board can be adopted, but is not limited thereto.

  On the surface (referred to as the back surface) opposite to the surface (referred to as the front surface) on which the chip component 6 of the drive circuit mounting substrate 4 is provided, the drive circuit mounted substrate input terminal connected to the peripheral region terminal and A drive circuit mounting board output terminal is formed. An input terminal and an output terminal for connecting to the chip component 6 are formed on the front surface of the drive circuit mounting substrate 4.

  Then, the drive circuit mounting substrate 4 and the chip component 6 are flip-chip connected on the front surface of the drive circuit mounting substrate 4. As described above, even when the drive circuit mounting substrate 4 is directly connected to the peripheral region 22 of the display panel 2, the configuration related to wiring and connection between the drive circuit mounting substrate 4 and the chip component 6 is the same as that of the first embodiment. Since it is the same, it becomes possible to narrow the distance between chip components. In particular, as shown in FIG. 1B, if no wiring is provided between the chip components on the front surface, the space between the chip components can be made narrower, so that the drive circuit mounting substrate can be made smaller. Further, based on this, the display module can be reduced in size. Further, as compared with the first embodiment and the second embodiment, since the FPC is not disposed between the drive circuit mounting substrate 4 and the display panel 2, the thickness can be reduced.

  In this embodiment, the gate driver and the source driver are connected to the drive circuit mounting substrate 4, and the liquid crystal panel 2 is formed with wiring for inputting the gate signal, the source signal, and the common electrode drive signal. In the case of a driver monolithic liquid crystal panel in which the circuit configuration of a gate driver and a source driver is formed on the element substrate of the liquid crystal panel, wiring for inputting a gate signal, a source signal, and a liquid crystal drive video signal is formed in the liquid crystal panel become.

(Fourth embodiment)
FIG. 4 is a schematic plan view showing the configuration of the display module 20 according to the third embodiment. Hereinafter, the configuration will be described, but only differences from the third embodiment will be described, and the same components are denoted by the same reference numerals and description thereof will be omitted.

  As shown in FIG. 4, the display module 21 includes a liquid crystal panel 2, an FPC 23, and a drive circuit mounting board 4 that generates a panel drive signal. The terminal 4a is arranged on the same surface as the drive circuit mounting board output terminal 4b. However, in this embodiment, the terminal 4a is arranged on the opposite surface, and the FPC 13 is directly connected to the driving circuit mounting board input terminal 4a. .

  Therefore, the signal supply terminal 14c corresponding to the drive circuit mounting board output terminal 4b is provided in the peripheral region 22 of the display panel 2, but the connection terminal 14d corresponding to the drive circuit mounting board input terminal 4a is not provided. . Similarly, the connection terminal 5 connected to the FPC 13 is not provided.

  Even with such a configuration, the configuration related to the wiring and connection between the drive circuit mounting substrate 4 and the chip component 6 is the same as that in the first embodiment, and thus the distance between the chip components can be reduced. . In particular, as shown in FIG. 1B, if no wiring is provided between the chip components on the front surface, the space between the chip components can be made narrower, so that the drive circuit mounting substrate can be made smaller. Further, based on this, the display module can be reduced in size.

  Further, as compared with the first embodiment and the second embodiment, since the FPC is not disposed between the drive circuit mounting substrate 4 and the display panel 2, the thickness can be reduced. Further, when compared with the third embodiment, the number of connection points to the display panel 2 is small, so that poor connection is unlikely to occur.

  In this embodiment, the gate driver and the source driver are connected to the drive circuit mounting substrate 4, and the liquid crystal panel 2 is formed with wiring for inputting the gate signal, the source signal, and the common electrode drive signal. In the case of a driver monolithic liquid crystal panel in which the circuit configuration of a gate driver and a source driver is formed on the element substrate of the liquid crystal panel, wiring for inputting a gate signal, a source signal, and a liquid crystal drive video signal is formed in the liquid crystal panel become.

(Fifth embodiment)
FIG. 5 is a schematic plan view showing the configuration of the display module 31 according to the fifth embodiment. Hereinafter, the configuration will be described, but only differences from the fourth embodiment will be described, and the same components will be denoted by the same reference numerals and description thereof will be omitted.

As shown in FIG. 5, the fifth embodiment is different in that a rigid flexible substrate is used as the drive circuit mounting substrate.
The drive circuit mounting substrate 33 includes an FPC portion and a hard substrate portion. The hard substrate portion is formed by laminating a prepreg layer 35 and a rigid layer 36 on both sides of the FPC layer 34. On the other hand, the FPC portion is formed by extending the FPC layer 34 of the hard substrate portion from the end portion of the hard substrate portion. Further, the prepreg layer 35 or the rigid layer 36 has a wiring formed of copper foil or the like formed therein. The wiring of the FPC layer 34 and the wiring of the prepreg layer 35, the wiring of the rigid layer 36, or the wiring disposed on the surface of the hard substrate portion are internally connected through a through hole.

  One of the surfaces (front surface) of the hard substrate portion is provided with a terminal for connecting to a terminal of the chip component, and this terminal and the chip component are flip-chip connected. This terminal is also internally connected to the FPC layer 34, the prepreg layer 35, the rigid layer 36, or the wiring on the back surface of the hard substrate portion through a through hole.

The internal connection is formed so that at least a part of the internal connection is disposed inside the first region. As a result, the wiring between the chip components can be reduced, and the drive circuit mounting substrate 33 can be downsized. In addition, when the wiring between the chip components on the front surface is eliminated, the distance between the chip components can be made closer. In the above, an example in which the fourth embodiment is modified is described. However, similar modifications can be made to the examples described in the first to third embodiments.

(Sixth embodiment)
FIG. 6 is a schematic plan view showing the configuration of the display module 41 according to the sixth embodiment. Hereinafter, the configuration will be described, but only differences from the first embodiment will be described, and the same components will be denoted by the same reference numerals and description thereof will be omitted.

  As shown in FIG. 6, the display module 41 includes the liquid crystal panel 2, the FPC 43, and the drive circuit mounting substrate 4.

  The liquid crystal panel 2 includes a display area 21 for displaying an image and a peripheral area 22 formed on one side of the liquid crystal panel 2 on which the FPC 43 is disposed.

The peripheral region 22 is arranged on the element substrate 2a, and a signal line connected to the gate wiring and the source wiring and a signal supply terminal 14c for arranging the FPC 43 are formed. The signal supply terminal 14c formed in the peripheral region 22 of the liquid crystal panel 2 is electrically connected to the output terminal 3a formed in the FPC 43 by ACF.
The FPC 43 is formed in a U shape in a plan view (the state shown in FIG. 6A), and an output terminal 3a is disposed at one end and an input terminal 3b is disposed at the other end. A terminal 3e connected to the drive circuit mounting substrate 4 is provided in an intermediate region connecting the first short side region where the output terminal 3a is provided and the second short side region where the input terminal 3b is provided. It has been. Moreover, the output terminal 3a, the input terminal 3b, and the terminal 3e are arrange | positioned on the same surface.

The terminal 3e includes a signal input terminal 3c for inputting a signal to the drive circuit mounting board 4 and a signal output terminal 3d for outputting a signal from the drive circuit mounting board 4. The signal input terminal 3c is an input terminal 3b. The signal output terminal 3d is connected to the output terminal 3a by wiring.
In both the first short side region and the second short side region, the output region 3a is connected to the signal supply terminal 14c of the liquid crystal panel 2, and the intermediate region is outside the end surface of the liquid crystal panel 2 (the display region 21 side). It has a length that is arranged on the opposite side).
After the drive circuit mounting substrate 4 to which the chip component 6 is flip-chip connected is connected to such an FPC 43, the output terminal 3a of the FPC 43 is connected to the signal supply terminal 14c of the display panel 2. The connection between the drive circuit mounting substrate 4 and the chip component 6, the connection between the drive circuit mounting substrate 4 and the FPC 43, and the connection between the FPC 43 and the liquid crystal panel 2 are the same as in the first embodiment.
In the present embodiment, after connecting in this way, the drive circuit mounting substrate 4 is opposite to the surface of the liquid crystal panel 2 on which the source signal line and the gate signal line are formed (the surface on which the peripheral region 22 is disposed). The first short side region of the FPC 43 is bent so that the first short side region is disposed on the surface. At this time, an adhesive is placed on the surface facing the peripheral region 22 with the liquid crystal panel 2 interposed therebetween.
Thus, since the drive circuit mounting substrate 4 can be disposed on the surface facing the peripheral region with the liquid crystal panel 2 interposed therebetween, more space can be used effectively and a display module can be formed in a small size. .
The example in which the first embodiment is modified has been described above, but the same modification can be applied to the second to fifth embodiments.

(Seventh embodiment)
FIG. 7 is a schematic plan view showing the configuration of the display module 51 according to the seventh embodiment. Hereinafter, the configuration will be described, but only differences from the sixth embodiment will be described, and the same components will be denoted by the same reference numerals and description thereof will be omitted.
As shown in FIG. 7, the arrangement position of the drive circuit mounting substrate 4 with respect to the FPC 53 is different from that of the sixth embodiment. That is, in the sixth embodiment, the output terminal 3a, the input terminal 3b, and the terminal 3e are arranged on the same surface. In the present embodiment, the input terminal 3a and the output terminal 3b are the same surface, but the terminal 3e. Is disposed on the opposite surface, and the drive circuit mounting board 4 is different from the input terminal 3a and the output terminal 3b.
Even in this case, if the FPC 53 is bent as in the sixth embodiment and the drive circuit mounting substrate 4 is fixed to a surface facing the peripheral region 22 with the liquid crystal panel 2 interposed therebetween, the input terminal 3b can be connected to the liquid crystal. The panel 2 is disposed at a position that does not overlap any of the display area and the peripheral area (see FIGS. 7B and 7C).
Thus, since the drive circuit mounting substrate 4 can be disposed on the surface facing the peripheral region with the liquid crystal panel 2 interposed therebetween, more space can be used effectively and a display module can be formed in a small size. .
The example in which the first embodiment is modified has been described above, but the same modification can be applied to the second to fifth embodiments.

(Eighth embodiment)
FIG. 8 is a schematic plan view showing the configuration of the display module 61 according to the eighth embodiment. Hereinafter, the configuration will be described, but only differences from the sixth embodiment will be described, and the same components will be denoted by the same reference numerals and description thereof will be omitted.
As shown in FIG. 8, unlike the example described in the sixth embodiment, the drive circuit mounting substrate 4 has a configuration that also serves as an intermediate region in the FPC 43 of the sixth embodiment. That is, each of the rectangular output side FPC 63 and the rectangular input side FPC 65 is connected to the drive circuit mounting board 4, and the FPC is U-shaped with the output side FPC 63, the input side FPC 65, and the drive circuit mounting board 4. It is formed to become. Of course, the output side FPC is provided with an output terminal 3a, and the input side FPC 65 is provided with an input terminal 3b.
Even in such a case, the drive circuit mounting substrate 4 can be disposed on the surface facing the peripheral region 22 with the liquid crystal panel 2 interposed therebetween by bending the output side FPC 63, and the input terminal 3 b is provided on the liquid crystal panel 2. The display area and the peripheral area are not positioned so as to overlap with each other (see FIGS. 8B and 8C).
Thus, since the drive circuit mounting substrate 4 can be disposed on the surface facing the peripheral region with the liquid crystal panel 2 interposed therebetween, more space can be used effectively and a display module can be formed in a small size. .
The example in which the first embodiment is modified has been described above, but the same modification can be applied to the second to fifth embodiments.

(Ninth embodiment)
FIG. 9 is a schematic plan view showing the configuration of the display module 61 according to the ninth embodiment. Hereinafter, the configuration will be described, but only differences from the sixth embodiment will be described, and the same components will be denoted by the same reference numerals and description thereof will be omitted.
As shown in FIG. 9, unlike the example described in the sixth embodiment, a rigid flexible substrate is used as the drive circuit mounting substrate. The configuration of this rigid flexible substrate is similar to that described in the fifth embodiment, and the difference from the configuration described in the fifth embodiment is that the FPC extended from the drive circuit mounting substrate. Are formed in parallel from both ends of the same side, and as a result, the hard substrate portion 73 forms a U-shaped intermediate region, and the FPC includes the first short side region 74 and the second short side region 75. Will come to form. The output terminal 3 a is disposed in the first short side region 74, and the input terminal 3 b is disposed in the second short side region 75.
Even in such a case, the drive circuit mounting substrate 4 can be disposed on the surface facing the peripheral region 22 with the liquid crystal panel 2 interposed therebetween by bending the first short side, and the input terminal 3b is connected to the first terminal 3b. It is arranged at a position that does not overlap any of the display area and the peripheral area of the liquid crystal panel 2 via the FPC of the short side area of 2 (see FIGS. 9B and 9C).
Thus, since the drive circuit mounting substrate 4 can be disposed on the surface facing the peripheral region with the liquid crystal panel 2 interposed therebetween, more space can be used effectively and a display module can be formed in a small size. .
The example in which the first embodiment is modified has been described above, but the same modification can be applied to the second to fifth embodiments.

(Tenth embodiment)
FIG. 10 is a schematic plan view showing the configuration of the display module 81 according to the tenth embodiment. Hereinafter, the configuration will be described, but only differences from the seventh embodiment will be described, and the same components will be denoted by the same reference numerals and description thereof will be omitted.
As shown in FIG. 10, the FPC 83 and the drive circuit mounting substrate 4 are different from the seventh embodiment. That is, in the seventh embodiment, the input terminal 3a and the output terminal 3b are arranged on the same surface, and the terminal 3e is arranged on the opposite surface, and the drive circuit mounting board 4 is connected to the input terminal 3a and the output terminal 3b. Are arranged on opposite surfaces, but the present embodiment is different in that the output terminal 3f is arranged on the same surface on which the input terminal 3a and the output terminal 3b are arranged. The output terminal 3 f is disposed on the side facing the side where the first short side region and the second short side region are provided, among the sides facing the intermediate region of the FPC 83.
Further, as shown in FIG. 10, a multilayer circuit board is used as the drive circuit mounting board 4. Note that a resin substrate can be adopted as each substrate constituting the multilayer substrate, and LCP, polyimide, epoxy, or the like can be adopted as the resin substrate. Although an example of three layers in which the chip component side is the first layer is shown, the present invention is not limited to the embodiment, and a drive circuit mounting substrate that is further multilayered may be used.
Each resin substrate constituting the drive circuit mounting substrate 4 is formed with vias, and metal plating or metal embedding is performed on the vias. Since the opening is formed in the resin substrate by the via, it becomes possible to form a vertical wiring by plating or embedded metal, and it is electrically connected to the wiring and via formed in the resin substrate of another layer. It becomes possible to connect to. In FIG. 10C, the via 100a is formed in the first layer, and the wiring formed in the first layer and the wiring formed in the second layer are electrically connected via the via 100a. . In the via 100b, the via formed in the first layer and the via formed in the second layer are electrically connected, and the via formed in the first layer is a wiring formed in the first layer. The via formed in the second layer is electrically connected to the wiring formed in the third layer. The via 100c is also formed in the same manner as the via 100b, and the via 100b and the via 100c are electrically connected by a wiring formed in the third layer. In addition, the via 100d is electrically connected to the via formed in the first layer, the via formed in the second layer, and the via formed in the third layer, and further formed in the first layer. The vias are electrically connected to the wiring formed in the first layer, and the vias formed in the third layer are electrically connected to the wiring formed on the surface facing the surface adjacent to the second layer.

As shown in FIG. 10, the display module 81 includes the liquid crystal panel 2, the FPC 83, the drive circuit mounting substrate 4, and the liquid crystal panel 201. In FIG. 10C, the liquid crystal panel 2 is displayed upward, and the liquid crystal panel 201 is displayed downward.
The liquid crystal panel 201 includes a display area for displaying an image and a peripheral area formed on one side of the liquid crystal panel 201 on which the FPC 83 is disposed. A peripheral region of the liquid crystal panel 201 is disposed on the element substrate 201a, and a signal line connected to the gate wiring and the source wiring and a signal supply terminal for arranging the FPC 83 are formed. The signal supply terminal formed in the peripheral region of the liquid crystal panel 201 is electrically connected to the output terminal 3f formed in the FPC 83 by the ACF.
Even if it does in this way, if FPC83 is bent similarly to 7th Embodiment and it arrange | positions so that the element board | substrate 2 side of the liquid crystal panel 2 and the element board | substrate 201a side of the liquid crystal panel 201 may face each other, the input terminal 3b will be described above. The liquid crystal panel 2 is disposed at a position that does not overlap any of the display area and the peripheral area (see FIGS. 10B and 10C).
Note that, in the space 202 between the liquid crystal panel 2 and the liquid crystal panel 201 in 10 (c), a backlight for the panel 2 and a backlight for the panel 202 which are omitted in the drawing are arranged.

  Thus, since the drive circuit mounting substrate 4 can be disposed on the surface facing the peripheral region with the liquid crystal panel 2 interposed therebetween, more space can be used effectively and a display module can be formed in a small size. .

1 is a schematic plan view showing a configuration of a liquid crystal module 1 according to a first embodiment. It is a schematic plan view which shows the structure of the liquid crystal module which concerns on 2nd Embodiment. It is a schematic plan view which shows the structure of the liquid crystal module which concerns on 3rd Embodiment. It is a schematic plan view which shows the structure of the liquid crystal module which concerns on 4th Embodiment. It is a schematic plan view which shows the structure of the liquid crystal module which concerns on 5th Embodiment. It is a schematic plan view which shows the structure of the liquid crystal module which concerns on 6th Embodiment. It is a schematic plan view which shows the structure of the liquid crystal module which concerns on 7th Embodiment. It is a schematic plan view which shows the structure of the liquid crystal module which concerns on 8th Embodiment. It is a schematic plan view which shows the structure of the liquid crystal module which concerns on 9th Embodiment. It is a schematic plan view which shows the structure of the liquid crystal module which concerns on 10th Embodiment. It is a substantially plane which shows the structure of the liquid crystal module which concerns on a prior art. It is a substantially plane which shows the structure of the liquid crystal module which concerns on a prior art. It is a substantially plane which shows the structure of the liquid crystal module which concerns on a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Display module 2 Liquid crystal panel 21 Display area 22 Peripheral area 2a Element board | substrate 2b Liquid crystal layer 2c Opposite board | substrate 3 FPC
3a output terminal 3b input terminal 3c signal supply terminal 3d signal output terminal 4 drive circuit mounting board 5 connection terminal 6 chip component 7 wiring 8 wiring

Claims (10)

A plurality of semiconductor devices that generate a panel drive signal based on an external signal, a drive circuit mounting substrate on which at least one semiconductor device among the plurality of semiconductor devices is flip-chip connected, and a panel drive generated by the semiconductor device A display module having a display panel to which a signal is input,
The drive circuit mounting substrate includes: an electrode connected to a semiconductor device; a first wiring that is connected to the electrode and at least partially formed inside a first region that is a region facing the semiconductor device; A first region and a second region facing each other across the drive circuit mounting substrate, a second wiring formed at least partially inside the second region, and the first wiring and the second wiring are connected to each other. Display module with internal wiring. The display module according to claim 1,
A relay board that is electrically connected to the drive circuit mounting board and supplies an external signal supplied from the outside to the drive circuit mounting board;
The drive circuit mounting board is connected to the relay board, and is disposed to face a peripheral area that is an area other than the display area of the display panel. The display module according to claim 1,
A relay board that is electrically connected to the drive circuit mounting board and supplies an external signal supplied from the outside to the drive circuit mounting board;
The display module in which the drive circuit mounting substrate and the relay substrate are both arranged to face a peripheral region that is a region other than the display region of the display panel. The display module according to claim 1,
A relay board that is electrically connected to the drive circuit mounting board and supplies an external signal supplied from the outside to the drive circuit mounting board;
The display module in which the driving circuit mounting substrate is connected to the display panel, and the relay substrate is connected to the driving circuit mounting substrate in the peripheral region. The display module according to claim 2 or claim 3,
The relay board is formed in a U shape in plan view, and an output portion is provided at one end of the U shape, an input portion is provided at the other end, and the drive circuit mounting board is provided between the one end and the other end. It has an arrangement part,
The drive circuit mounting board is electrically connected to the terminals provided in the drive circuit mounting board arrangement portion, the output section is connected to the peripheral area, and the drive circuit mounting board is arranged in the peripheral area of the display panel. Display module placed on the opposite side of the surface. The display module according to claim 5,
The display module, wherein the drive circuit mounting substrate is disposed on the same surface as the output portion forming surface of the relay substrate.   It is formed in a U shape in plan view using a material having flexibility, and an output portion is displayed at one end of the U shape, an input portion is displayed at the other end, and displayed between the one end and the other end. A relay substrate having a region having terminals for arranging a drive circuit mounting substrate for generating a panel drive signal for driving a panel. A drive circuit mounting substrate to which at least one semiconductor device among a plurality of semiconductor devices generating a panel drive signal based on an external signal is flip-chip connected,
An electrode connected to the semiconductor device, and a first wiring at least partially formed inside a first region that is connected to the electrode and is opposed to the semiconductor device;
A second region opposed to the first region across the drive circuit mounting substrate; a second wiring formed at least partially inside the second region; the first wiring and the second wiring; A drive circuit mounting board having internal wiring to be connected. An electronic device comprising the display module according to any one of claims 1 to 7. A plurality of semiconductor devices that generate a panel drive signal based on an external signal, a drive circuit mounting substrate on which at least one semiconductor device among the plurality of semiconductor devices is flip-chip connected, and a panel drive generated by the semiconductor device A display module having a display panel to which a signal is input,
The drive circuit mounting substrate is composed of a resin substrate having two or more layers,
The resin substrate facing the semiconductor device includes an electrode connected to the semiconductor device, and a first wiring at least partially formed inside a first region that is connected to the electrode and faces the semiconductor device The other resin substrate includes an internal wiring that connects the wiring formed in the region facing the first region and the wiring formed in the region facing the first region. And a display module.

Images