JP2007105836A - 研磨パッドおよび研磨装置 - Google Patents

研磨パッドおよび研磨装置 Download PDF

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Publication number
JP2007105836A
JP2007105836A JP2005299724A JP2005299724A JP2007105836A JP 2007105836 A JP2007105836 A JP 2007105836A JP 2005299724 A JP2005299724 A JP 2005299724A JP 2005299724 A JP2005299724 A JP 2005299724A JP 2007105836 A JP2007105836 A JP 2007105836A
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Japan
Prior art keywords
polishing
polishing pad
layer
pad according
hole
Prior art date
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JP2005299724A
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English (en)
Japanese (ja)
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JP2007105836A5 (https=
Inventor
Kunitaka Jiyou
邦恭 城
Tomoyuki Honda
智之 本田
Kin Kuroda
欣 黒田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
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Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP2005299724A priority Critical patent/JP2007105836A/ja
Publication of JP2007105836A publication Critical patent/JP2007105836A/ja
Publication of JP2007105836A5 publication Critical patent/JP2007105836A5/ja
Withdrawn legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2005299724A 2005-10-14 2005-10-14 研磨パッドおよび研磨装置 Withdrawn JP2007105836A (ja)

Priority Applications (1)

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JP2005299724A JP2007105836A (ja) 2005-10-14 2005-10-14 研磨パッドおよび研磨装置

Applications Claiming Priority (1)

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JP2005299724A JP2007105836A (ja) 2005-10-14 2005-10-14 研磨パッドおよび研磨装置

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JP2007105836A true JP2007105836A (ja) 2007-04-26
JP2007105836A5 JP2007105836A5 (https=) 2008-11-20

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ID=38032094

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JP2005299724A Withdrawn JP2007105836A (ja) 2005-10-14 2005-10-14 研磨パッドおよび研磨装置

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JP (1) JP2007105836A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010023134A (ja) * 2008-07-16 2010-02-04 Fujibo Holdings Inc 研磨パッド
JP2021137893A (ja) * 2020-03-03 2021-09-16 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP2021137892A (ja) * 2020-03-03 2021-09-16 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010023134A (ja) * 2008-07-16 2010-02-04 Fujibo Holdings Inc 研磨パッド
JP2021137893A (ja) * 2020-03-03 2021-09-16 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP2021137892A (ja) * 2020-03-03 2021-09-16 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP7509551B2 (ja) 2020-03-03 2024-07-02 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP7525271B2 (ja) 2020-03-03 2024-07-30 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法

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