JP2007096276A - Semiconductor device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture a semiconductor device with high yields where an element having a layer containing an organic compound is provided on a flexible substrate. <P>SOLUTION: In a method of manufacturing the semiconductor device: a separation layer is formed on the substrate; an inorganic compound layer, a first conductive layer, and the layer containing the organic compound, are formed on the separation layer; a second conductive layer in contact with the layer containing the organic compound and the inorganic compound layer is formed for forming an element formation layer; the first flexible substrate is bonded onto the second conductive layer; and the separation layer is separated from the element formation layer. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a semiconductor device including an element having a layer containing an organic compound over a flexible substrate and a manufacturing method thereof.

  In recent years, development of semiconductor devices having various functions in which a plurality of circuits are integrated on an insulating surface has been promoted. In addition, development of a semiconductor device capable of transmitting and receiving data wirelessly by providing an antenna is in progress. Such a semiconductor device is called a wireless chip (also referred to as an ID tag, an IC tag, an IC chip, an RF (Radio Frequency) tag, a wireless tag, an electronic tag, or an RFID (Radio Frequency Identification) tag). Has been introduced in the market.

  Many of these semiconductor devices in practical use have a circuit (also referred to as an IC (Integrated Circuit) chip) using a semiconductor substrate such as Si and an antenna, and the IC chip is a memory circuit (also referred to as a memory). ) And a control circuit. In particular, by providing a memory circuit capable of storing a large amount of data, a semiconductor device with higher functions and higher added value can be provided.

  In addition, these semiconductor devices are required to be manufactured at low cost, and in recent years, development of elements such as transistors, memories, and solar cells using layers containing organic compounds in a control circuit, a memory circuit, and the like has been actively performed. (For example, Patent Document 1).

  Various applications using such a semiconductor device are expected, but attempts have been made to use flexible plastic films in pursuit of miniaturization and weight reduction.

  Since the plastic film has low heat resistance, the maximum temperature of the process has to be lowered, and as a result, TFTs having better electrical characteristics cannot be formed when formed on a glass substrate.

Therefore, a technique has been proposed in which an element formed on a glass substrate is peeled off from the substrate and attached to another base material such as a plastic film (see Patent Document 2).
JP 2004-47791 A JP 2003-174153 A

  However, in the case of peeling an element having a layer containing an organic compound using a peeling step as shown in Patent Document 2, specifically, a peeling layer 102 is formed on a substrate 101 as shown in FIG. An insulating layer 103 is formed over the peeling layer 102, a thin film transistor 1111 is formed over the insulating layer 103, a first electrode layer 104 connected to the thin film transistor 1111 is formed, and an organic layer covering an end portion of the first electrode layer 104 is formed The insulator layer 1161 is formed, the layer 105 including an organic compound is formed over the organic insulator layer 1161, and the second electrode layer 1162 is formed over the layer 105 including the organic compound and the organic insulator layer 1161. In the case where the element 151 including the layer containing an organic compound and the layer 1163 including the element 151 are separated, the layer including the organic compound 105 and the second electrode layer 1162 are separated. There is a problem that peeling is. As a result, it is difficult to manufacture a semiconductor device in which an element including a layer containing an organic compound is provided over a plastic substrate with a high yield.

  This is because the adhesive force between the layer 105 containing an organic compound and the second electrode layer 106 is low. Specifically, since the polyimide, epoxy resin, acrylic resin, etc. that form the organic insulating layer have polar substituents such as imide group, cyano group, hydroxyl group, etc., a layer formed of an inorganic compound, here gate insulation Adhesiveness with the film and the first conductive layer is high. However, since the layer 105 containing an organic compound functions as a semiconductor, the layer 105 is formed using a material having a carrier transporting property. A material having carrier transportability generally has no polar substituent. As a result, the adhesion between the organic compound-containing layer 105 and the second electrode layer 106 becomes very small, and the organic compound-containing layer 105 and the second electrode layer 106 are separated in the separation step. .

  In view of the above problems, an object of the present invention is to manufacture a semiconductor device in which an element including a layer containing an organic compound is provided over a flexible substrate with high yield.

  The gist of the present invention is to form, on a substrate having a release layer, a region having low adhesion when the substrate is viewed from above and a region having high adhesion so as to surround the outer edge thereof. Further, in the cross section of the region having low adhesion, for example, the layer containing the organic compound having no polar substituent such as imide group, cyano group and hydroxyl group is in contact with the inorganic compound layer, and the cross section of the region having high adhesion , A plurality of inorganic compound layers are in contact with each other. The region 503 with high adhesion may surround the outer edge of the region 502 with low adhesion as shown in FIG. 22A as an example. Further, as illustrated in FIG. 22B as an example, the region 503 with high adhesion may be formed discontinuously so as to surround the outer edge of the region 502 with low adhesion. In addition, as shown in FIG. 22C as an example, a rectangular region 503 with high adhesiveness may be formed so as to correspond to each side of the region 502 with low adhesiveness. Note that the region with high adhesion can have various shapes such as a rectangular shape, a circular shape, an elliptical shape, and a curved shape.

  In addition, in the present invention, after forming an element formation layer in which a region 502 with low adhesion and a region 503 with high adhesion are formed so as to surround an outer edge of the region 502 on a substrate having a peeling layer 501, the substrate and the element formation are performed. The gist is to separate the layers in a release layer and attach them to a flexible substrate.

  Note that the region having low adhesion is typically a region where the layer containing the organic compound and the second electrode layer are in contact with each other, and the region having high adhesion is typically the second electrode layer and the inorganic compound. The area where the layers touch. In addition, the region having high adhesion is typically a region where the second electrode layer and the conductive layer are in contact with each other.

  Further, according to one embodiment of the present invention, a release layer is formed over a substrate, an inorganic compound layer, a first conductive layer, and a layer containing an organic compound are formed over the release layer, and the layer containing the organic compound and the inorganic compound A second conductive layer in contact with the layer is formed to form an element formation layer, and a first flexible substrate is attached to the second conductive layer, and then the substrate and the element formation layer are separated from each other in the separation layer. A method for manufacturing a semiconductor device is characterized in that separation is performed.

  Another embodiment of the present invention is a semiconductor device including a flexible substrate, an inorganic compound layer, a layer containing an organic compound, a layer containing an organic compound, and a conductive layer in contact with the inorganic compound layer. It is characterized by that.

  Note that the inorganic compound layer is an insulator layer or a conductive layer. A metal layer may be used instead of the inorganic compound layer. The inorganic compound layer may function as a gate insulating layer, an interlayer insulating layer, or a connection layer.

    The layer containing an organic compound and the conductive layer in contact with the layer containing an organic compound form part of a memory element or a light-emitting element.

  Moreover, this invention includes the following.

  According to one embodiment of the present invention, a separation layer is formed over a substrate, an inorganic compound layer, a semiconductor element, a first electrode layer connected to the semiconductor element, and an organic compound over the first electrode layer are formed over the separation layer. Forming a layer, forming a layer including an organic compound and a second electrode layer in contact with the inorganic compound layer to form an element formation layer, and attaching a first flexible substrate over the second electrode layer Then, the substrate and the element formation layer are separated at the separation layer after the combination, and a method for manufacturing a semiconductor device is provided.

  When the semiconductor element is a thin film transistor, the inorganic compound layer is formed of the same material as the gate electrode of the thin film transistor, the insulating layer that insulates the gate electrode of the thin film transistor, the gate insulating layer that insulates the gate electrode of the thin film transistor and the semiconductor layer, and the gate electrode of the thin film transistor. The same layer as the thin film transistor gate electrode, the same material as the thin film transistor wiring, and the same layer as the thin film transistor wiring, or the same material as the first electrode layer and the first electrode layer are in contact with each other It is a layer in contact with the same layer as the layer.

  In one embodiment of the present invention, after a release layer is formed over a substrate, a thin film transistor is formed over the release layer, a first electrode layer connected to the thin film transistor is formed, and an inorganic insulating layer covering an end portion of the first electrode layer Forming a physical layer, forming a layer containing an organic compound on a part of the inorganic insulating layer and an exposed portion of the first electrode layer, and forming a second electrode layer in contact with the layer containing the organic compound and the inorganic insulating layer. An element formation layer is formed, and a first flexible substrate is bonded to the second electrode layer, and then the substrate and the element formation layer are separated in a release layer. This is a manufacturing method.

  In one embodiment of the present invention, after forming a peeling layer over a substrate, an inorganic insulating layer that insulates the thin film transistor and the gate electrode and wiring of the thin film transistor is formed over the peeling layer, and the wiring of the thin film transistor is formed over the inorganic insulating layer. A first electrode layer to be connected is formed, an organic insulator layer that covers an end portion of the first electrode layer is formed, and an organic compound is included in a part of the organic insulator layer and an exposed portion of the first electrode layer Forming a layer, forming a layer containing an organic compound and a second electrode layer in contact with the inorganic insulating layer to form an element formation layer, and forming a first flexible substrate over the second electrode layer After bonding, the substrate and the element formation layer are separated in a separation layer.

  In one embodiment of the present invention, after a separation layer is formed over a substrate, a semiconductor layer is formed over the separation layer, a gate insulating layer formed of an inorganic insulator is formed over the semiconductor layer, and a gate is formed over the gate insulating layer. Forming an electrode, forming a first organic insulating layer on the gate electrode, removing a portion of the first organic insulating layer to expose a portion of the semiconductor layer and a portion of the gate insulating layer; A wiring connected to the semiconductor layer is formed on the first organic insulating layer, a first electrode layer connected to the wiring is formed, and a second organic insulating layer covering an end portion of the first electrode layer is formed Forming a layer containing an organic compound on a part of the second organic insulating layer and an exposed portion of the first electrode layer, and forming a second electrode layer in contact with the layer containing the organic compound and the gate insulating layer After forming the element formation layer and attaching the first flexible substrate to the second electrode layer, the substrate and the element formation layer are peeled off. A method for manufacturing a semiconductor device and separating the layers.

  In one embodiment of the present invention, after forming a separation layer over a substrate, an insulating layer is formed over the separation layer, a semiconductor layer is formed over the insulating layer, and a gate insulating layer formed with an inorganic insulator over the semiconductor layer Forming a gate electrode and a first conductive layer on the gate insulating layer, forming an organic insulating layer on the gate electrode and the first conductive layer, and selectively removing the organic insulating layer; A part of the semiconductor layer and a part of the first conductive layer are exposed, a wiring connected to the semiconductor layer is formed on the organic insulator layer, and a second conductive layer connected to the first conductive layer is formed An organic insulator that forms a first electrode layer connected to the wiring and a third conductive layer connected to the second conductive layer, and covers the ends of the first electrode layer and the third conductive layer; Forming a layer, forming a layer containing an organic compound on a part of the organic insulator layer and an exposed portion of the first electrode layer, and containing the organic compound And a second electrode layer in contact with at least one of the first to third conductive layers is formed to form an element formation layer, and a first flexible substrate is formed on the second electrode layer. After bonding, the substrate and the element formation layer are separated in a separation layer.

  After the element formation layer and the separation layer are separated, a second flexible substrate may be attached to the element formation layer.

  According to one embodiment of the present invention, an insulating layer formed over a first flexible substrate, a thin film transistor formed over the insulating layer, a first electrode layer connected to the thin film transistor, and a first electrode layer An inorganic insulating layer covering the edge of the first electrode layer, a layer containing an organic compound formed on the first electrode layer, a layer containing the organic compound, a second electrode layer in contact with the inorganic insulating layer, a second And a second flexible substrate formed over the electrode layer.

  One aspect of the present invention is an insulating layer formed over a first flexible substrate, a thin film transistor formed over the insulating layer, an inorganic insulating layer that insulates a gate electrode and a wiring of the thin film transistor, A first electrode layer formed on the inorganic insulator layer and connected to the thin film transistor, an organic insulator layer covering an end of the first electrode layer, and an organic compound formed on the first electrode layer A layer containing an organic compound, a layer containing an organic compound, an organic insulator layer, a second electrode layer in contact with the inorganic insulator layer, and a second flexible substrate formed on the second electrode layer; It is a semiconductor device characterized by having.

  According to one embodiment of the present invention, an insulating layer formed over a first flexible substrate, a thin film transistor formed over the insulating layer, and an inorganic insulator that insulates the gate electrode and the semiconductor layer of the thin film transistor Formed on a part of the gate insulating layer, a first organic insulating layer that insulates the gate electrode and the wiring of the thin film transistor, and the first organic insulating layer And a first electrode layer connected to the thin film transistor, a second organic insulator layer that covers the end of the first electrode layer and is formed on the first organic insulator layer, and a first electrode layer A layer formed on the organic compound layer; a layer including the organic compound; a second organic insulating layer; a second electrode layer in contact with the inorganic insulating layer; and the second electrode layer. And a second flexible substrate. That is a semiconductor device.

  According to one embodiment of the present invention, an insulating layer formed over a first flexible substrate, a thin film transistor formed over the insulating layer, and a first conductive layer formed with the same layer as the gate electrode of the thin film transistor A first organic insulating layer covering the gate electrode of the thin film transistor, a wiring formed on the first organic insulating layer, and the same layer as the wiring, and the first conductive layer A second conductive layer that is in contact with the first organic insulating layer, a first electrode layer that is connected to the wiring of the thin film transistor, and a first electrode layer that is formed on the same layer as the first electrode layer. A third conductive layer in contact with the second conductive layer, a second organic insulator layer covering an end portion of the first electrode layer, the second organic insulator layer, and the first electrode layer. A layer containing an organic compound and a second electrode in contact with the layer containing the organic compound and the third conductive layer. A layer, which is a semiconductor device characterized by having a substrate having a second flexible to be formed on the second electrode layer.

  The first electrode layer, the layer containing an organic compound, and the second electrode layer are part of a memory element or a light-emitting element.

  In the present invention, the adhesion between the inorganic compound layer and the conductive layer is higher than the adhesion between the organic compound-containing layer and the conductive layer. Hateful. For this reason, it is possible to prevent peeling at the interface between the conductive layer and the layer containing an organic compound by forming a region having low adhesion as viewed from above and a region having high adhesion so as to surround the outer edge thereof. is there. In addition, a layer having a memory element or a light-emitting element formed over the substrate can be peeled with a high yield. Furthermore, a semiconductor device in which an element including a layer containing an organic compound is provided over a flexible substrate can be manufactured with high yield.

  In addition, the semiconductor device of the present invention has many regions where the inorganic compound layer and the conductive layer are in contact with each other while the inorganic compound layer and the conductive layer sandwich the layer containing the organic compound or the organic insulator layer. For this reason, the region where the layer containing an organic compound or the organic insulating layer is exposed to the outside air is reduced, and moisture, oxygen, and the like are less likely to enter these regions, and deterioration of the semiconductor device can be reduced. .

In addition, since a semiconductor device in which an element including a layer containing an organic compound is provided over a flexible substrate can be obtained, a lightweight and thin semiconductor device can be obtained.

Embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below. Note that in the structures of the present invention described below, the same reference numerals are used in common in different drawings.

(Embodiment 1)
In this embodiment, an element having a layer containing an organic compound and a method for separating an element formation layer having the element with high yield will be described with reference to FIGS.

  As shown in FIG. 1A, a separation layer 102 is formed over a substrate 101, and an insulating layer 103 is formed over the separation layer 102. Next, a semiconductor element is formed over the insulating layer 103. Here, a thin film transistor 1111 is formed as a semiconductor element. A first electrode layer 104 connected to the wiring 1305 of the thin film transistor 1111 is formed, and an inorganic insulating layer 1115 that covers an end portion of the first electrode layer 104 is formed. A layer 105 containing an organic compound is formed by a vapor deposition method over the first electrode layer 104 and the inorganic insulating layer 1115. In FIG. 1A, a region 1116 is an exposed inorganic insulating layer. Note that the layer 105 containing an organic compound is formed using a metal mask so that part of the inorganic insulating layer 1115 is exposed. Alternatively, after the layer 105 containing an organic compound is formed over the surfaces of the first electrode layer and the inorganic insulating layer 1115, part of the layer is etched to expose part of the inorganic insulating layer 1115.

  As the substrate 101, a glass substrate, a quartz substrate, a metal substrate or a stainless steel substrate with an insulating layer formed on one surface, a heat-resistant plastic substrate that can withstand the processing temperature in this step, or the like is used. Since there is no restriction on the size and shape of the substrate 101 listed above, for example, if a substrate having a side of 1 meter or more and a rectangular shape is used, the productivity is remarkably improved. Can do. This advantage is a great advantage compared to the case of using a circular silicon substrate.

The release layer 102 is formed of tungsten (W), molybdenum (Mo), titanium (Ti), tantalum (Ta), niobium (Nb), nickel (Ni), sputtering, plasma CVD, coating, printing, or the like. Selected from cobalt (Co), zirconium (Zr), zinc (Zn), ruthenium (Ru), rhodium (Rh), palladium (Pd), osmium (Os), iridium (Ir), and silicon (Si) A layer made of a single element or an alloy material containing the element as a main component or a compound material containing the element as a main component is formed by laminating a single layer or a plurality of layers. The crystal structure of the layer containing silicon may be any of amorphous, microcrystalline, and polycrystalline. Note that here, the coating method is a method of forming a film by discharging a solution onto an object to be processed, and includes, for example, a spin coating method and a droplet discharging method. The droplet discharge method is a method of forming a pattern with a predetermined shape by discharging a droplet of a composition containing fine particles from a minute hole.

In the case where the separation layer 102 has a single-layer structure, a layer containing tungsten, molybdenum, or a mixture of tungsten and molybdenum is preferably formed. Alternatively, a layer containing tungsten oxide or oxynitride, a layer containing molybdenum oxide or oxynitride, or a layer containing an oxide or oxynitride of a mixture of tungsten and molybdenum is formed.

In the case where the separation layer 102 has a stacked structure, it is preferable to form a layer containing tungsten, molybdenum, or a mixture of tungsten and molybdenum as the first layer, and oxidation of tungsten, molybdenum, or a mixture of tungsten and molybdenum as the second layer. A nitride of tungsten, molybdenum, or a mixture of tungsten and molybdenum, an oxynitride of tungsten, molybdenum, or a mixture of tungsten and molybdenum, or a nitrided oxide of tungsten, molybdenum, or a mixture of tungsten and molybdenum.

In the case where a layered structure of a layer containing tungsten and a layer containing an oxide of tungsten is formed as the separation layer 102, a layer containing tungsten is formed, and an insulating layer formed using an oxide is formed thereover. The fact that a layer containing an oxide of tungsten is formed at the interface between the layer containing tungsten and the insulating layer may be utilized. Further, the layer containing tungsten oxide may be formed by performing thermal oxidation treatment, oxygen plasma treatment, treatment with a strong oxidizing power such as ozone water, or the like on the surface of the layer containing tungsten. This also applies to the case where a layer containing tungsten nitride, oxynitride, and nitride oxide is formed. After forming a layer containing tungsten, a silicon nitride layer, a silicon oxynitride layer, and / or an upper layer thereof is formed. A silicon nitride oxide layer is preferably formed.

The oxide of tungsten is represented by WOx. x is in the range of 2 to 3, and when x is 2 (WO ₂ ), x is 2.5 (W ₂ O ₅ ), x is 2.75 (W ₄ O ₁₁ ), There are cases where x is 3 (WO ₃ ).

Further, according to the above process, the peeling layer 102 is formed so as to be in contact with the substrate 101, but the present invention is not limited to this process. An insulating layer serving as a base may be formed so as to be in contact with the substrate 101, and the peeling layer 102 may be provided so as to be in contact with the insulating layer.

The insulating layer 103 is formed as a single layer or a multilayer using an inorganic compound by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. As a typical example of the inorganic compound, silicon oxide or silicon nitride can be given. Typical examples of silicon oxide include silicon oxide, silicon oxynitride, silicon nitride oxide, and the like. Typical examples of silicon nitride include silicon nitride, silicon oxynitride, silicon nitride oxide, and the like.

Furthermore, the insulating layer 103 may have a stacked structure. For example, the layers may be stacked using an inorganic compound, and typically, silicon oxide, silicon nitride oxide, and silicon oxynitride may be stacked.

One mode of the thin film transistor 1111 is described with reference to FIGS. FIG. 21A illustrates an example of a top-gate thin film transistor. A separation layer 102 and an insulating layer 103 are provided over the substrate 101, and a thin film transistor 1111 is provided over the insulating layer 103. In the thin film transistor 1111, a semiconductor layer 1302 and a gate insulating layer 1113 formed using an inorganic insulator are provided over the insulating layer 103. A gate electrode 1304 is formed on the gate insulating layer 1113 so as to correspond to the semiconductor layer 1302, and an insulating layer (not shown) that functions as a protective layer and an inorganic insulating layer 1114 that functions as an interlayer insulating layer are formed thereover. Is provided. In addition, wirings 1305 connected to the source region and the drain region 1310 of the semiconductor layer are formed. Further, an insulating layer functioning as a protective layer may be formed thereon.

  The semiconductor layer 1302 is a layer formed of a semiconductor having a crystal structure, and a non-single-crystal semiconductor or a single-crystal semiconductor can be used. In particular, it is preferable to use a crystalline semiconductor crystallized by heat treatment or a crystalline semiconductor crystallized by a combination of heat treatment and laser light irradiation. In the heat treatment, a crystallization method using a metal element such as nickel which has an action of promoting crystallization of a silicon semiconductor can be applied. Further, by heating in the crystallization process of the silicon semiconductor, the surface of the separation layer can be oxidized at the interface between the separation layer 102 and the insulating layer 103 to form a metal oxide. By forming the metal oxide, separation between the separation layer 102 and the insulating layer 103 can be easily performed in a subsequent separation step.

In the case of crystallization by irradiating with laser light in addition to heat treatment, continuous wave laser light irradiation or repetition frequency is 10 MHz or more and pulse width is 1 nanosecond or less, preferably 1 to 100 picoseconds. By irradiating a certain high repetition frequency ultrashort pulse light, crystallization can be performed while continuously moving the melted zone where the crystalline semiconductor is melted in the irradiation direction of the laser light. By such a crystallization method, a crystalline semiconductor having a large particle diameter and a crystal grain boundary extending in one direction can be obtained. By adjusting the carrier drift direction to the direction in which the crystal grain boundary extends, the field-effect mobility in the transistor can be increased. For example, it is possible to realize the above 400cm ² / V · sec.

As the crystallization step, a large area glass substrate can be used when a crystallization process at a heat resistant temperature (about 600 ° C.) or lower of the glass substrate is used. Therefore, a large amount of semiconductor devices can be manufactured per substrate, and the cost can be reduced.

Alternatively, the semiconductor layer 1302 may be formed by performing a crystallization step by heating at a temperature equal to or higher than the heat resistant temperature of the glass substrate. Typically, a quartz substrate is used as the substrate 101 having an insulating surface, and an amorphous or microcrystalline semiconductor is heated at 700 ° C. or higher to form the semiconductor layer 1302. As a result, a semiconductor with high crystallinity can be formed. Therefore, a thin film transistor that has favorable characteristics such as response speed and mobility and can operate at high speed can be provided.

  The gate electrode 1304 can be formed using a metal or a polycrystalline semiconductor to which an impurity of one conductivity type is added. In the case of using a metal, tungsten (W), molybdenum (Mo), titanium (Ti), tantalum (Ta), aluminum (Al), or the like can be used. Alternatively, a metal nitride obtained by nitriding a metal can be used. Or it is good also as a structure which laminated | stacked the 1st layer which consists of the said metal nitride, and the 2nd layer which consists of the said metal. In the case of a laminated structure, the end portion of the first layer may have a shape protruding outward from the end portion of the second layer. At this time, a barrier metal can be formed by using a metal nitride for the first layer. That is, the second layer metal can be prevented from diffusing into the gate insulating layer 1113 and the semiconductor layer 1302 below the gate insulating layer 1113.

  Various structures such as a single drain structure, an LDD (low concentration drain) structure, and a gate overlap drain structure can be applied to the thin film transistor formed by combining the semiconductor layer 1302, the gate insulating layer 1113, the gate electrode 1304, and the like. Here, a thin film transistor having a single drain structure is shown. Furthermore, it is possible to apply a multi-gate structure in which transistors to which a gate voltage of the same potential is applied are connected in series, or a dual gate structure in which a semiconductor layer is sandwiched between gate electrodes.

  In this embodiment, the inorganic insulating layer 1114 is formed using an inorganic insulating material such as silicon oxide or silicon oxynitride.

  A wiring 1305 formed over the inorganic insulating layer 1114 can be provided so as to intersect with a wiring formed in the same layer as the gate electrode 1304, so that a multilayer wiring structure is formed. A multilayer wiring structure can be formed by stacking a plurality of insulating layers having functions similar to those of the inorganic insulating layer 1114 and forming wirings on the insulating layers. The wiring 1305 includes a low resistance material such as aluminum (Al), such as a laminated structure of titanium (Ti) and aluminum (Al), a laminated structure of molybdenum (Mo) and aluminum (Al), and titanium (Ti) or molybdenum ( It is preferably formed in combination with a barrier metal using a refractory metal material such as Mo).

  FIG. 21B illustrates an example of a bottom-gate thin film transistor. A peeling layer 102 and an insulating layer 103 are formed over a substrate 101, and a thin film transistor 1111 is provided thereover. The thin film transistor 1111 is provided with a gate electrode 1304, a gate insulating layer 1113, a semiconductor layer 1302, and an inorganic insulating layer 1114 functioning as an interlayer insulating layer. Further, an insulating layer functioning as a protective layer may be formed thereon. The wiring 1305 in contact with the source region and the drain region of the semiconductor layer 1302 can be formed over the inorganic insulating layer 1114.

Further, any structure may be used as long as it is a semiconductor element that can function as a switching element instead of the thin film transistor 1111. Typical examples of the switching element include MIM (Metal-Insulator-Metal), a diode, and the like.

In FIG. 1A, the first electrode layer 104 is formed using a sputtering method, a plasma CVD method, a coating method, a printing method, an electrolytic plating method, an electroless plating method, or the like, and a highly conductive metal, alloy, compound, or the like. It can be formed using a single layer or a multilayer structure. Typically, a metal, an alloy, a conductive compound, or a mixture thereof having a large work function (specifically, 4.0 eV or more), or a metal, an alloy having a small work function (specifically, 3.8 eV or less). , Conductive compounds, and mixtures thereof can be used.

As typical examples of metals, alloys, and conductive compounds having a high work function (specifically, 4.0 eV or more), indium tin oxide (hereinafter referred to as ITO), silicon-containing indium tin oxide, 2 Examples thereof include indium oxide containing -20 atomic% of zinc oxide (ZnO). Also, titanium (Ti), gold (Au), platinum (Pt), nickel (Ni), tungsten (W), chromium (Cr), molybdenum (Mo), iron (Fe), cobalt (Co), copper (Cu ), Palladium (Pd), or a nitride of a metal material (for example, titanium nitride: TiN, tungsten nitride (WN), molybdenum nitride (MoN)), or the like can also be used.

Typical examples of metals, alloys, and conductive compounds having a small work function (specifically, 3.8 eV or less) include metals belonging to Group 1 or 2 of the periodic table of elements, that is, lithium (Li) or cesium (Cs). Alkali metals such as magnesium (Mg), calcium (Ca), strontium (Sr), aluminum (Al) and alloys containing any of these (MgAg, AlLi), europium (Er), And rare earth metals such as ytterbium (Yb) and alloys containing these.

Note that in the case where an electrode for injecting holes into the layer containing an organic compound, that is, an anode is used for the first electrode layer 104 or the second electrode layer 106, a material having a high work function is preferably used. . Conversely, when using an electrode for injecting electrons into the layer containing an organic compound, that is, a cathode, it is preferable to use a material having a small work function.

The inorganic insulating layer 1115 is formed using an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, or aluminum nitride by a thin film formation method such as a CVD method or a sputtering method. Here, after the insulating film is formed by using a thin film formation method, the insulating film is selectively etched so that a part of the first electrode layer 104 is exposed, whereby the inorganic insulating layer 1115 is formed.

  The layer 105 containing an organic compound can be formed by an evaporation method, an electron beam evaporation method, a coating method, or the like. In the case where a layer containing an organic compound is formed using the above manufacturing method, the layer 105 containing an organic compound is formed while the region 1116 exposing a part of the inorganic insulating layer 1115 is formed. Alternatively, a region 1116 in which the inorganic insulating layer 1115 is exposed may be formed by selective etching after forming a layer containing an organic compound over the surfaces of the inorganic insulating layer 1115 and the first electrode layer 104.

Here, after a titanium film with a thickness of 50 to 200 nm is formed by a sputtering method, the first electrode layer 104 is formed by etching into a desired shape by a photolithography method. Next, a layer containing an organic compound formed of NPB is formed by a vapor deposition method.

Next, as illustrated in FIG. 1B, the second electrode layer 106 is formed over the inorganic insulating layer 1115 and the layer 105 containing an organic compound. As a result, a region 1117 in which the second electrode layer 106 is in contact with the inorganic insulating layer 1115 can be formed. In addition, the element 151 including a layer containing an organic compound can be formed using the first electrode layer 104, the layer 105 containing an organic compound, and the second electrode layer 106. The second electrode layer 106 can be formed by an evaporation method, a sputtering method, a CVD method, a printing method, a coating method, or the like. The second electrode layer 106 is formed using a material similar to that of the first electrode layer 104. Note that in the case where a material with a high work function is used for the first electrode layer 104, a material with a low work function is preferably used for the second electrode layer 106. In the case where a material with a low work function is used for the first electrode layer 104, a material with a high work function is preferably used for the second electrode layer 106.

Here, aluminum is vapor-deposited by an evaporation method to form the second electrode layer 106.

Note that here, a stack including the insulating layer 103 to the second electrode layer 106 is referred to as an element formation layer 1118.

Here, a more specific structure of the element 151 having a layer containing an organic compound is described below with reference to FIGS. Note that 205 in FIG. 5A corresponds to 105 in FIG. 1, 205 and 201 in FIG. 5B correspond to 105 in FIG. 1, and 205 and 202 in FIG. Corresponding to 105 in FIG. 1, a stack of 205 and 203 in FIG. 5D corresponds to 105, and a stack of 205, 245, and 244 in FIG. 5E corresponds to 105 in FIG.

As shown in FIG. 5A, a layer 205 containing an organic compound is formed using an organic compound whose crystal state, conductivity, and shape are changed by a voltage applied to the first electrode layer and the second electrode layer. Thus, the element 151 including a layer containing an organic compound functions as a memory element. Note that the layer 205 containing an organic compound may be provided as a single layer or a stack of a plurality of layers formed of different organic compounds.

The thickness of the layer 205 containing an organic compound is preferably such that the electrical resistance of the memory element changes due to voltage application to the first conductive layer and the second conductive layer. A typical thickness of the layer 205 containing an organic compound is 5 nm to 100 nm, preferably 10 nm to 60 nm, and more preferably 5 to 30 nm.

The layer 205 containing an organic compound can be formed using an organic compound having a hole-transport property or an organic compound having an electron-transport property.

Examples of the hole-transporting organic compound include phthalocyanine (abbreviation: H ₂ Pc), copper phthalocyanine (abbreviation: CuPc), vanadyl phthalocyanine (abbreviation: VOPc), and 4,4 ′, 4 ″ -tris ( N, N-diphenylamino) triphenylamine (abbreviation: TDATA), 4,4 ′, 4 ″ -tris [N- (3-methylphenyl) -N-phenylamino] triphenylamine (abbreviation: MTDATA), 1,3,5-tris [N, N-di (m-tolyl) amino] benzene (abbreviation: m-MTDAB), N, N′-diphenyl-N, N′-bis (3-methylphenyl) -1 , 1′-biphenyl-4,4′-diamine (abbreviation: TPD), 4,4′-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (abbreviation: NPB), 4,4′- Screw {N- [4- (M-Tolyl) amino] phenyl-N-phenylamino} biphenyl (abbreviation: DNTPD), 4,4′-bis [N- (4-biphenylyl) -N-phenylamino] biphenyl (abbreviation: BBPB), 4, Examples thereof include, but are not limited to, 4 ′, 4 ″ -tri (N-carbazolyl) triphenylamine (abbreviation: TCTA). Among the compounds described above, aromatic amine compounds typified by TDATA, MTDATA, m-MTDAB, TPD, DNTPD, BBPB, TCTA, and the like are easy to generate holes and are a group of compounds suitable as organic compounds. . The substances described here are mainly substances having a hole mobility of 10 ⁻⁶ cm ² / Vs or higher.

As the organic compound having an electron transporting property, tris (8-quinolinolato) aluminum (abbreviation: Alq ₃ ), tris (4-methyl-8-quinolinolato) aluminum (abbreviation: Almq ₃ ), bis (10-hydroxybenzo [h ] -Quinolinato) beryllium (abbreviation: BeBq ₂ ), bis (2-methyl-8-quinolinolato) -4-phenylphenolato-aluminum (abbreviation: BAlq), etc. Can be used. In addition, bis [2- (2-hydroxyphenyl) benzoxazolate] zinc (abbreviation: Zn (BOX) ₂ ), bis [2- (2-hydroxyphenyl) benzothiazolate] zinc (abbreviation: Zn (BTZ) A material such as a metal complex having an oxazole-based or thiazole-based ligand such as ₂ ) can also be used. In addition to metal complexes, 2- (4-biphenylyl) -5- (4-tert-butylphenyl) -1,3,4-oxadiazole (abbreviation: PBD), 1,3-bis [5- (P-tert-butylphenyl) -1,3,4-oxadiazol-2-yl] benzene (abbreviation: OXD-7), 3- (4-tert-butylphenyl) -4-phenyl-5- ( 4-biphenylyl) -1,2,4-triazole (abbreviation: TAZ), 3- (4-tert-butylphenyl) -4- (4-ethylphenyl) -5- (4-biphenylyl) -1,2, 4-triazole (abbreviation: p-EtTAZ), bathophenanthroline (abbreviation: BPhen), bathocuproin (abbreviation: BCP), and the like can be used. The substances mentioned here are mainly substances having an electron mobility of 10 ⁻⁶ cm ² / Vs or higher.

  In addition, as illustrated in FIG. 5B, an insulating layer 201 may be formed between the first electrode layer 104 and the layer 205 containing an organic compound in the memory element.

The insulating layer 201 is a layer that injects holes or electrons from the first electrode layer or the second electrode layer into the layer containing an organic compound by a tunnel effect. The insulating layer 201 is formed to have a thickness with which a charge can be injected into the layer 205 containing an organic compound by a tunnel effect at a predetermined voltage. A typical thickness of the insulating layer 201 is an insulating layer having a thickness of 1 nm to 4 nm, preferably 1 nm to 2 nm. Since the insulating layer 201 is extremely thin with a thickness of 1 nm to 4 nm, a tunnel effect is generated in the insulating layer 201, and charge injection into the layer 205 containing an organic compound is increased. Therefore, when the thickness of the insulating layer 201 is greater than 4 nm, the tunnel effect in the insulating layer 201 does not occur, charge injection into the layer 205 containing an organic compound becomes difficult, and the applied voltage at the time of writing to the memory element increases. To do. In addition, the thickness of the insulating layer 201 is as thin as 1 nm to 4 nm, so that throughput is improved.

The insulating layer 201 is formed of a thermally and chemically stable compound.

Representative examples of the inorganic compound forming the insulating layer 201 include Li ₂ O, Na ₂ O, K ₂ O, Rb ₂ O, BeO, MgO, CaO, SrO, BaO, Sc ₂ O ₃ , ZrO ₂ , and HfO _2. RfO ₂ , TaO ₂ , TcO ₂ , MnO ₂ , Fe ₂ O ₃ , CoO, PdO, Ag ₂ O, Al ₂ O ₃ , Ga ₂ O ₃ , Bi ₂ O _3, etc. Things.

Further, representative examples of the inorganic compound that forms the insulating layer 201 include LiF, NaF, KF, CsF, BeF ₂ , MgF ₂ , CaF ₂ , SrF ₂ , BaF ₂ , AlF ₃ , AgF, and MnF _3. Insulating fluorides, LiCl, NaCl, KCl, CsCl, BeCl ₂ , CaCl ₂ , BaCl ₂ , AlCl ₃ , SnCl ₄ , AgCl, ZnCl ₂ , TiCl ₄ , TiCl ₃ , ZrCl ₄ , FeCl ₃ , PdCl ₂ , SbCl ₃ , SbCl ₂ , SrCl ₂ , TlCl ₃ , CuCl, CuCl ₂ , MnCl ₂ , RuCl _{2, and} other insulating chlorides, KBr, CsBr, AgBr, BaBr ₂ , LiBr, etc. bromides having an insulating _{property, NaI, KI, BaI 2,} TlI 3, Ag Include iodides having _{TiI 4, CaI 2, SiI 4} , insulating typified by CsI or the like.

As typical examples of the inorganic compound that forms the insulating layer 201, Li ₂ CO ₃ , K ₂ CO ₃ , Na ₂ CO ₃ , MgCO ₃ , CaCO ₃ , SrCO ₃ , BaCO ₃ , MnCO ₃ , FeCO ₃ , CoCO ₃ , NiCO ₃ , CuCO ₃ , Ag ₂ CO ₃ , ZnCO _3, etc., insulating carbonates, Li ₂ SO ₄ , K ₂ SO ₄ , Na ₂ SO ₄ , MgSO ₄ , CaSO ₄ , SrSO ₄ , BaSO ₄ , Ti ₂ (SO ₄ ) ₃ , Zr (SO ₄ ) ₂ , MnSO ₄ , FeSO ₄ , Fe ₂ (SO ₄ ) ₃ , CoSO ₄ , Co ₂ (SO ₄ ) ₃ , NiSO ₄ , CuSO ₄ , Ag ₂ SO ₄ , ZnSO ₄ , Al ₂ (SO ₄ ) ₃ , In ₂ (SO ₄ ) ₃ , SnSO ₄ , Sn (SO ₄ ) ₂ , Sb ₂ (SO ₄ ) ₃ , Bi ₂ (SO ₄ ) _{3 and the} like, insulating sulfates such as LiNO ₃ , KNO ₃ , NaNO ₃ , Mg (NO ₃ ) ₂ , Ca (NO ₃ ) ₂ , Sr ( NO ₃ ) ₂ , Ba (NO ₃ ) ₂ , Ti (NO ₃ ) ₄ , Zr (NO ₃ ) ₄ , Mn (NO ₃ ) ₂ , Fe (NO ₃ ) ₂ , Fe (NO ₃ ) ₃ , Co (NO ₃ ) ₂ , Ni (NO ₃ ) ₂ , Cu (NO ₃ ) ₂ , AgNO ₃ , Zn (NO ₃ ) ₂ , Al (NO ₃ ) ₃ , In (NO ₃ ) ₃ , Sn (NO ₃ ) _2, etc. Examples thereof include nitrides having insulation properties typified by nitrates having typical insulation properties, AlN, SiN, and the like. In addition, the composition of these inorganic compounds does not need to be a strict integer ratio, and may deviate.

Note that in the case where the insulating layer 201 is formed using an inorganic compound, the thickness of the insulating layer is preferably greater than or equal to 1 nm and less than or equal to 2 nm. When the thickness of the insulating layer is 3 nm or more, the applied voltage at the time of writing increases.

Typical examples of the organic compound that forms the insulating layer 201 include polyimide, acrylic, polyamide, benzocyclobutene, polyester, novolac resin, melamine resin, phenol resin, epoxy resin, silicon resin, furan resin, diallyl phthalate resin, and the like. Organic resin to be used.

As a method for forming the insulating layer 201, an evaporation method, an electron beam evaporation method, a sputtering method, a CVD method, or the like can be used. A spin coating method, a sol-gel method, a printing method, a droplet discharge method, or the like can be used.

  Alternatively, as illustrated in FIG. 5C, a continuous insulating layer 202 having unevenness may be used. However, in this case, the thickness of the convex portion of the insulating layer is 1 nm to 4 nm, preferably 2 nm to 4 nm, and the thickness of the concave portion is 0.1 nm to less than 2 nm, preferably 1 nm to less than 2 nm. .

  Alternatively, as illustrated in FIG. 5D, a discontinuous insulating layer 203 dispersed over the first electrode layer 104 may be used. The discontinuous insulating layer 203 may have an island shape, a stripe shape, a mesh shape, or the like.

  Furthermore, insulating particles may be provided instead of the insulating layers 201 to 203. The insulating particles at this time preferably have a particle size of 1 nm to 4 nm.

  Furthermore, the insulating layers 201 to 203 or the insulating particles may be provided between the layer 205 containing an organic compound and the second electrode layer 106.

  By providing an insulating layer having a thickness of 4 nm or less, preferably 2 nm or less, between the first electrode layer and the layer containing an organic compound, or between the layer containing an organic compound and the second electrode layer, the insulation is performed. Since a tunnel current flows through the layer, variation in applied voltage and current value at the time of writing to the memory element can be reduced. Further, by providing an insulating layer having a thickness of 4 nm or less, preferably 2 nm or less, between the first electrode layer and the layer containing the organic compound, or between the layer containing the organic compound and the second electrode layer, Charge injection due to the tunnel effect is increased, the thickness of the layer containing an organic compound can be increased, and a short circuit in the initial state can be prevented. As a result, the reliability of the memory device and the semiconductor device can be improved.

  In the above memory element, a rectifying element may be provided for the first electrode layer 104 or the second electrode layer 106 (FIG. 5E). The element having a rectifying property is a transistor or a diode in which a gate electrode and a drain electrode are connected. Here, a diode 211 including a third electrode layer and a semiconductor layer is provided in contact with the first electrode layer 104. Further, the element having a rectifying property may be provided between the layer 205 containing an organic compound and the first electrode layer 104. Further, a rectifying element may be provided between the layer 205 containing an organic compound and the second electrode layer 106. Typical examples of the diode include a PN junction diode, a diode having a PIN junction, an avalanche diode, and the like. Moreover, you may use the diode of another structure. Thus, by providing a rectifying element, current flows only in one direction, so that errors are reduced and a read margin can be expanded.

Next, the layer 151 including an organic compound is formed using a layer having a light emitting function, so that the element 151 including a layer including an organic compound functions as a light emitting element. In this case, the layer 105 containing an organic compound is formed using a light-emitting organic compound.

Examples of the light-emitting organic compound include 9,10-di (2-naphthyl) anthracene (abbreviation: DNA) and 2-tert-butyl-9,10-di (2-naphthyl) anthracene (abbreviation: t-BuDNA). ), 4,4′-bis (2,2-diphenylvinyl) biphenyl (abbreviation: DPVBi), coumarin 30, coumarin 6, coumarin 545, coumarin 545T, perylene, rubrene, periflanthene, 2,5,8,11-tetra (Tert-butyl) perylene (abbreviation: TBP), 9,10-diphenylanthracene (abbreviation: DPA), 5,12-diphenyltetracene, 4- (dicyanomethylene) -2-methyl-6- [p- (dimethylamino) ) Styryl] -4H-pyran (abbreviation: DCM1), 4- (dicyanomethylene) -2-methyl-6- [2- Loridin-9-yl) ethenyl] -4H-pyran (abbreviation: DCM2), 4- (dicyanomethylene) -2,6-bis [p- (dimethylamino) styryl] -4H-pyran (abbreviation: BisDCM) and the like. Can be mentioned. In addition, bis [2- (4 ′, 6′-difluorophenyl) pyridinato-N, C ² ] (picolinato) iridium (abbreviation: FIrpic), bis {2- [3 ′, 5′-bis (trifluoromethyl) Phenyl] pyridinato-N, C ² } (picolinato) iridium (abbreviation: Ir (CF ₃ ppy) ₂ (pic)), Tris (2-phenylpyridinato-N, C ² ) iridium (abbreviation: Ir (ppy)) _3), (acetylacetonato) bis (2-phenylpyridinato--N, ^{C 2)} iridium (abbreviation: _Ir (ppy) 2 (acac)), (acetylacetonato) bis [2- (2'-thienyl ) pyridinato -N, ^{C 3]} iridium _{(abbreviation: Ir (thp) 2 (acac} )), ( acetylacetonato) bis (2-phenylquinolinato--N, ^{C 2)} Illizi Beam _{(abbreviation: Ir (pq) 2 (acac} )), ( acetylacetonato) bis [2- (2'-benzothienyl) pyridinato -N, ^{C 3]} iridium (abbreviation: _Ir (btp) 2 (acac)) A compound capable of emitting phosphorescence such as can also be used.

  6A corresponds to 105 in FIG. 1, and 173, 176, and 177 in FIG. 6B correspond to 105 in FIG. As shown in FIG. 6A, a hole injection layer 171 formed of a hole injection material, a hole transport layer 172 formed of a hole transport material, and light emission on the first electrode layer 104. A light emitting layer 173 formed of a conductive organic compound, an electron transport layer 174 formed of an electron transporting material, an electron injection layer 175 formed of an electron injecting material, and the second electrode layer 106 are stacked. An element 151 functioning as a light-emitting element may be formed.

Here, as the hole-transporting material, the hole-transporting materials listed for the layer 205 containing an organic compound in FIG. 5A can be used as appropriate.

As the hole-injecting material, a phthalocyanine-based compound is effective, and phthalocyanine (abbreviation: H ₂ Pc), copper phthalocyanine (abbreviation: CuPc), vanadyl phthalocyanine (abbreviation: VOPc), or the like can be used. In addition, there is a material obtained by chemically doping a conductive polymer compound, and polyethylenedioxythiophene (abbreviation: PEDOT) or polyaniline (abbreviation: PAni) doped with polystyrene sulfonic acid (abbreviation: PSS) can also be used. . Also effective are inorganic semiconductor thin films such as molybdenum oxide (MoO _x ), vanadium oxide (VO _x ), nickel oxide (NiO _x ), and ultra-thin films of inorganic insulators such as aluminum oxide (Al ₂ O ₃ ). . In addition, 4,4 ′, 4 ″ -tris (N, N-diphenyl-amino) -triphenylamine (abbreviation: TDATA), 4,4 ′, 4 ″ -tris [N- (3-methylphenyl) -N-phenyl-amino] -triphenylamine (abbreviation: MTDATA), N, N'-bis (3-methylphenyl) -N, N'-diphenyl-1,1'-biphenyl-4,4'-diamine (Abbreviation: TPD), aromatic amine compounds such as 4,4′-bis {N- [4- (N, N-di-m-tolylamino) phenyl] -N-phenylamino} biphenyl (abbreviation: DNTPD) Can also be used. Furthermore, a substance showing acceptability to these aromatic amine compounds may be added. Specifically, 2,3,5,6-tetrafluoro-7,7,8,8 which is an acceptor for VOPc. - tetracyanoquinodimethane _{(abbreviation:} F 4 -TCNQ) obtained by adding or may be used after addition of MoO _x is an acceptor to NPB.

Here, as the electron-transporting material, the electron-transporting materials listed in the layer 205 containing an organic compound in FIG. 5A can be used as appropriate.

Examples of the electron injection material include alkali metal halides such as LiF and CsF, alkaline earth halides such as CaF ₂ , and alkali metal oxides such as Li ₂ O in addition to the electron transport materials described above. Insulator ultrathin films are often used. Alkali metal complexes such as lithium acetylacetonate (abbreviation: Li (acac)) and 8-quinolinolato-lithium (abbreviation: Liq) are also effective. Furthermore, the material which mixed the electron transport material mentioned above and metals with small work functions, such as Mg, Li, and Cs by co-evaporation etc. can also be used.

As shown in FIG. 6B, the first electrode layer 104, a hole transport layer 176 formed of an organic compound and an inorganic compound having an electron accepting property with respect to the organic compound, a light emitting layer 173, an organic compound Alternatively, the electron transport layer 177 formed using an inorganic compound having an electron donating property with respect to the organic compound, and the element 151 functioning as a light-emitting element may be formed using the second electrode layer 106.

The hole transport layer 176 formed of an organic compound and an inorganic compound having an electron accepting property with respect to the organic compound is formed using the above-described hole transporting organic compound as appropriate as the organic compound. The inorganic compound may be anything as long as it can easily receive electrons from the organic compound, and various metal oxides or metal nitrides can be used. Such transition metal oxides are preferable because they easily exhibit electron accepting properties. Specific examples include titanium oxide, zirconium oxide, vanadium oxide, molybdenum oxide, tungsten oxide, rhenium oxide, ruthenium oxide, and zinc oxide. Among the metal oxides described above, any of the transition metal oxides in Groups 4 to 8 of the periodic table has a high electron accepting property and is a preferred group. Vanadium oxide, molybdenum oxide, tungsten oxide, and rhenium oxide are particularly preferable because they can be vacuum-deposited and are easy to handle.

The electron transport layer 177 formed of an organic compound and an inorganic compound having an electron donating property with respect to the organic compound is formed using the above-described electron transport organic compound as appropriate as the organic compound. The inorganic compound may be anything as long as it easily gives an electron to the organic compound, and various metal oxides or metal nitrides can be used. Alkali metal oxides, alkaline earth metal oxides can be used. Rare earth metal oxides, alkali metal nitrides, alkaline earth metal nitrides, and rare earth metal nitrides are preferred because they easily exhibit electron donating properties. Specific examples include lithium oxide, strontium oxide, barium oxide, erbium oxide, lithium nitride, magnesium nitride, calcium nitride, yttrium nitride, and lanthanum nitride. In particular, lithium oxide, barium oxide, lithium nitride, magnesium nitride, and calcium nitride are preferable because they can be vacuum-deposited and are easy to handle.

An electron transport layer or a hole transport layer formed of an organic compound and an inorganic compound has excellent electron injection / transport characteristics. Therefore, both the first electrode layer 104 and the second electrode layer 106 are almost limited in work function. Various materials can be used without being subjected to this. In addition, the driving voltage can be reduced.

Next, as illustrated in FIG. 1C, the insulating layer 107 is formed over the second electrode layer 106. Next, the substrate 108 is attached to the surface of the insulating layer 107.

  The insulating layer 107 is preferably formed by applying a composition using a coating method, followed by drying and heating. Such an insulating layer 107 is preferably an insulating layer with less surface unevenness because it is provided as a protective layer in a subsequent peeling step. Such an insulating layer can be formed by a coating method. Alternatively, the insulating layer 107 may be formed by polishing a surface by a CMP method after being formed by a thin film formation method such as a CVD method or a sputtering method. The insulating layer 107 formed using the coating method is acrylic resin, polyimide resin, melamine resin, polyester resin, polycarbonate resin, phenol resin, epoxy resin, polyacetal, polyether, polyurethane, polyamide (nylon), furan resin, diallyl. Organic compounds such as phthalate resins, inorganic siloxane polymers containing Si-O-Si bonds, or alkylsiloxane polymers among compounds consisting of silicon, oxygen, and hydrogen formed from siloxane polymer materials typified by silica glass , Alkyl silsesquioxane polymer, hydrogenated silsesquioxane polymer, organic siloxax in which hydrogen bonded to silicon represented by hydrogenated alkyl silsesquioxane polymer is substituted with an organic group such as methyl or phenyl It is formed of a polymer. The insulating layer formed by forming the insulating film by the above-described thin film forming method and then polishing the surface by the CMP method is formed of silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, or the like.

  As the substrate 108, a flexible substrate is preferably used, and a thin and light substrate is preferable. Typically, PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PES (polyethersulfone), polypropylene, polypropylene sulfide, polycarbonate, polyetherimide, polyphenylene sulfide, polyphenylene oxide, polysulfone, polyphthalamide, etc. A substrate can be used. Also, paper made of a fibrous material, a laminated film of a base film (polyester, polyamide, inorganic vapor deposition film, paper, etc.) and an adhesive organic resin film (acrylic organic resin, epoxy organic resin, etc.) are used. You can also. In the case of using the substrate, although not illustrated, an adhesive layer is provided between the insulating layer 107 and the substrate 108, and the insulating layer 107 and the substrate 108 are attached to each other.

  Further, as the substrate 108, a film having a bonding layer on which the object to be processed and a lamination process are performed by thermocompression bonding (a laminate film (made of polypropylene, polyester, vinyl, polyvinyl fluoride, vinyl chloride, or the like)) may be used. . Laminate film is an adhesive layer provided on the surface of the base film, or a layer provided on the outermost layer (not an adhesive layer) is melted by heat treatment, and bonded by pressure to the workpiece. It is possible to glue the film. In this case, it is not necessary to separately provide an adhesive layer between the insulating layer 107 and the substrate 108.

  Here, the insulating layer 107 is formed using an epoxy resin by applying a composition by a coating method, followed by drying and baking. Next, a laminate film is thermocompression bonded to the surface of the insulating layer 107, and the substrate 108 is attached to the insulating layer 107.

  Next, as illustrated in FIG. 1D, the insulating layer 103 is separated from the separation layer 102. Here, the inorganic insulating layer 1115 and the second electrode layer 106 are in contact with each other. Since the adhesiveness between the inorganic insulating layer 1115 and the second electrode layer 106 is high, it is difficult to peel off at the interface between the layer 105 containing an organic compound and the second electrode layer 106 in the peeling step. 103 peels off.

Note that in this embodiment, a peeling layer and an insulating layer are formed between the substrate and the element formation layer, a metal oxide film is provided between the peeling layer and the insulating layer, and the metal oxide film is weakened by crystallization. Although the method of physically peeling the element formation layer is used, the present invention is not limited to this. (1) A method in which an amorphous silicon film containing hydrogen is provided between a substrate and an element formation layer, and the substrate is separated by releasing hydrogen gas from the amorphous silicon film by laser light irradiation. A peeling layer and an insulating layer are formed between the element formation layers, a metal oxide film is provided between the peeling layer and the insulating layer, the metal oxide film is weakened by crystallization, and a part of the peeling layer is made into a solution or NF ₃ , A method of physically peeling off a weakened metal oxide film after etching with a halogen fluoride gas such as BrF ₃ or ClF ₃ , and (3) mechanically removing only the substrate on which the element formation layer is formed. (4) A metal layer and a metal oxide as a peeling layer between a substrate having high heat resistance and a layer having a transistor, or a method of removing by etching or etching with a halogen fluoride gas such as NF ₃ , BrF ₃ , ClF _3, etc. The metal oxide provided with a layer The layer is weakened by crystallization, and part of the metal layer is removed by etching with a solution or halogen fluoride gas such as NF ₃ , BrF ₃ , ClF ₃ , and then physically peeled off in the weakened metal oxide layer The method of performing etc. can be used suitably.

  Next, as illustrated in FIG. 1E, a substrate 109 is attached to the surface of the insulating layer 103. As the substrate 109, a substrate similar to the substrate 108 can be used as appropriate. Here, the substrate 109 is attached to the insulating layer 103 by thermocompression bonding of the laminate film.

  Through the above steps, an element including a layer containing an organic compound can be provided over a flexible substrate with high yield by using a separation step.

(Embodiment 2)
In this embodiment mode, a method for peeling an element formation layer different from that in Embodiment Mode 1 will be described with reference to FIGS. The present embodiment is different from the first embodiment in that an organic insulating layer is formed instead of the inorganic insulating layer covering the end portion of the first electrode layer.

  As shown in FIG. 2A, a separation layer 102 is formed over a substrate 101, an insulating layer 103 is formed over the separation layer 102, and a thin film transistor 1111 is formed over the insulating layer 103 as in Embodiment Mode 1. . In this embodiment, as in Embodiment 1, an interlayer insulating layer that insulates the gate electrode of the thin film transistor 1111 from the wiring is formed using the inorganic insulating layer 1114. Next, the first electrode layer 104 is formed over the inorganic insulating layer 1114.

  Next, an organic insulating layer 1121 that covers an end portion of the first electrode layer 104 is formed. The organic insulator layer preferably has an inclination angle of 30 to 75 degrees, preferably 35 to 60 degrees in cross-sectional shape. By having such an inclination angle, it is possible to increase the cross-sectional coverage of a layer containing an organic compound to be formed later, prevent disconnection, and improve the yield.

The organic insulating layer 1121 is photosensitive such as acrylic resin, polyimide resin, melamine resin, polyester resin, polycarbonate resin, phenol resin, epoxy resin, polyacetal, polyether, polyurethane, polyamide (nylon), furan resin, diallyl phthalate resin, or the like. A non-photosensitive organic compound is used and formed by a coating method, a printing method, or a droplet discharge method. Note that the organic compound forming the organic insulating layer 1121 has a polar substituent such as an imide group, a cyano group, or a hydroxyl group.

In the case where the organic insulating layer 1121 is formed by applying a non-photosensitive organic compound using a coating method, the composition is applied, dried and baked to form an insulating film, and then a resist formed by a photolithography process. The insulating film is selectively etched using a mask, so that the organic insulating layer 1121 is formed so that a part of the first electrode layer 104 and a part of the inorganic insulating layer 1114 are exposed. In the case where the organic insulating layer 1121 is formed by applying a photosensitive organic compound by a coating method, the composition is applied, dried, exposed, developed, and baked, so that a part of the first electrode layer 104 is formed. The organic insulating layer 1121 is formed so as to expose a part of the inorganic insulating layer 1114. An organic insulating layer 1121 formed by exposing and developing a photosensitive organic compound is an insulating layer having an upper end having a curvature. For this reason, it is possible to prevent disconnection of a layer including an organic compound formed later, and to improve yield. In the case where the organic insulating layer 1121 is formed by a printing method or a droplet discharge method, the composition is applied so as to cover an end portion of the first electrode layer 104 and to expose a part of the inorganic insulating layer 1114. Then, drying and baking are performed to form the organic insulating layer 1121.

  Here, a composition containing a photosensitive polyimide is applied using a coating method, dried and baked to form an insulating film formed of polyimide, and then the insulating film is exposed and developed by a photolithography process. The organic insulating layer 1121 is formed so that a part of one electrode layer 104 and a part of the inorganic insulating layer 1114 are exposed. That is, the organic insulating layer 1121 is formed so as to form the exposed portion 1122 of the inorganic insulating layer 1114.

  Next, a layer 105 containing an organic compound is formed on the exposed surfaces of the organic insulator layer 1121 and the first electrode layer 104 as in Embodiment Mode 1. Note that the layer 105 containing an organic compound is formed so that part of the inorganic insulating layer 1114 is exposed.

  Next, as illustrated in FIG. 2B, the second electrode layer 106 is formed in the exposed portion 1122 of the organic compound-containing layer 105 and the organic insulating layer 1121 in the same manner as in Embodiment Mode 1. As a result, a region 1123 in which the second electrode layer 106 is in contact with the inorganic insulating layer 1114 can be formed. In the region 1123 where the second electrode layer 106 is in contact with the inorganic insulator layer 1114, the adhesiveness between the inorganic insulator layer 1114 and the second electrode layer 106 is high; It is difficult to peel off at the interface between the two electrode layers 106, and peeling can be performed with the peeling layer 102 and the insulating layer 103.

Note that here, a stack including the insulating layer 103 to the second electrode layer 106 is referred to as an element formation layer 1124.

  Hereinafter, the formation of the insulating layer 107 illustrated in FIG. 2C, the bonding of the substrate 108, the peeling step illustrated in FIG. 2D, and the bonding of the substrate 109 illustrated in FIG. Since it is the same as above, it is omitted here.

  Through the above steps, an element including a layer containing an organic compound can be provided over a flexible substrate with high yield by using a separation step.

(Embodiment 3)
In this embodiment mode, a method for peeling an element formation layer, which is different from those in Embodiment Modes 1 and 2, will be described with reference to FIGS. This embodiment is different from the second embodiment in that an organic insulating layer is formed instead of an inorganic insulating layer that insulates a gate electrode of a thin film transistor from a wiring.

    As shown in FIG. 3A, the separation layer 102 is formed over the substrate 101 as in Embodiment 1, the insulating layer 103 is formed over the separation layer 102, and the thin film transistor 1111 is formed over the insulating layer 103. .

In this embodiment mode, unlike in Embodiment Modes 1 and 2, an interlayer insulating layer that insulates a gate electrode and a wiring of the thin film transistor 1111 is formed using the first organic insulating layer 1131. Further, when forming a wiring, after removing a part of the first organic insulating layer by dry etching to expose a part of the gate insulating layer 1113, a part of the gate insulating layer 1113 covering the semiconductor layer is further removed. Etch to expose the semiconductor layer. After that, a wiring 1305 connected to the semiconductor layer is formed.

The organic insulator layer 1131 can be formed by appropriately selecting a material and a formation method of the organic insulator layer 1121 described in Embodiment 2. Here, the organic insulating layer 1131 is formed using a non-photosensitive acrylic resin.

Next, the first electrode layer 104 connected to the wiring 1305 is formed over the first organic insulating layer 1131.

  Next, a second organic insulator layer 1132 that covers an end portion of the first electrode layer 104 is formed. This can be formed in a manner similar to that of the organic insulator layer 1121 of Embodiment 2.

  Here, a composition containing photosensitive polyimide is applied using a coating method, and after drying to form an insulating film formed of polyimide, the insulating film is exposed, developed by a photolithography process, baked after being developed, The second organic insulating layer 1132 is formed so that a part of the first electrode layer 104 and a part of the gate insulating layer 1113 are exposed. That is, the exposed portion 1133 of the gate insulating layer 1113 is formed.

  Next, a layer 105 containing an organic compound is formed on the exposed surfaces of the second organic insulating layer 1132 and the first electrode layer 104 in the same manner as in Embodiment Mode 1. Note that the layer 105 containing an organic compound is formed so as not to cover the exposed portion 1133 of the gate insulating layer 1113.

  Next, as illustrated in FIG. 3B, the second electrode layer 106 is formed so as to be in contact with the layer 105 containing an organic compound and the exposed portion 1133 of the gate insulating layer 1113. As a result, a region 1134 where the second electrode layer 106 is in contact with the gate insulating layer 1113 can be formed. In the region 1134 where the second electrode layer 106 is in contact with the gate insulating layer 1113, the adhesiveness between the gate insulating layer 1113 and the second electrode layer 106 is high; Peeling is difficult at the interface of the electrode layer 106, and peeling can be performed with the peeling layer 102 and the insulating layer 103.

Note that here, a stack including the insulating layer 103 to the second electrode layer 106 is referred to as an element formation layer 1135.

  Hereinafter, the formation of the insulating layer 107 illustrated in FIG. 3C, the bonding of the substrate 108, the peeling step illustrated in FIG. 3D, and the bonding of the substrate 109 illustrated in FIG. Since it is the same as above, it is omitted here.

  Through the above steps, an element including a layer containing an organic compound can be provided over a flexible substrate with high yield by using a separation step.

(Embodiment 4)
In this embodiment mode, a method for peeling an element formation layer having a structure different from those in Embodiment Modes 1 to 3 will be described with reference to FIGS. In this embodiment mode, the second electrode layer is formed in the same manner as the gate electrode of the thin film transistor and the second conductive layer formed in the same manner as the wiring of the thin film transistor, as compared with the third embodiment. The difference is that it is in contact with one or more of the conductive layer and the third conductive layer formed in the same manner as the first electrode layer. In this embodiment mode, the first conductive layer, the second conductive layer, and the third conductive layer are stacked, and the third conductive layer and the second electrode layer are in contact with each other. Show about.

  As shown in FIG. 4A, as in Embodiment 1, the separation layer 102 is formed over the substrate 101, the insulating layer 103 is formed over the separation layer 102, and the thin film transistor 1111 is formed over the insulating layer 103. . In this embodiment, after a conductive film is formed over the gate insulating layer 1113, the conductive film is selectively etched using a resist mask formed by a photolithography process, so that the gate electrode 1304 and the first conductive layer 1141 are formed. Form.

Further, similarly to Embodiment Mode 3, an interlayer insulating layer that insulates the gate electrode of the thin film transistor 1111 from the wiring is formed using the first organic insulating layer 1140. Further, part of the first organic insulating layer 1140 exposes part of the first conductive layer 1141. After that, a wiring 1305 connected to the semiconductor layer is formed, and a second conductive layer 1142 in contact with the first conductive layer 1141 is formed. Typically, after a conductive film is formed over the first organic insulating layer 1140, the gate electrode 1304, and the first conductive layer 1141, the conductive film is selectively formed using a resist mask formed by a photolithography process. Etching is performed to form a wiring 1305 and a second conductive layer 1142.

Next, the first electrode layer 104 is formed over the first organic insulator layer 1140, and the third conductive layer 1144 is formed over the second conductive layer 1142.

  Next, a second organic insulator layer 1132 that covers an end portion of the first electrode layer 104 is formed. The second organic insulator layer 1132 can be formed in a manner similar to that of the organic insulator layer 1121 in Embodiment 2.

  Next, a layer 105 containing an organic compound is formed on the exposed surfaces of the second organic insulating layer 1132 and the first electrode layer 104 in the same manner as in Embodiment Mode 1. Note that the layer 105 containing an organic compound is formed so that part of the third conductive layer 1144 is exposed. Note that an exposed portion of the third conductive layer 1144 is denoted by 1143.

  Next, as illustrated in FIG. 4B, the second electrode layer 106 is formed in a manner similar to that of Embodiment 1 so as to be in contact with the layer 105 containing an organic compound and the exposed portion 1143 of the third conductive layer 1144. To do. As a result, a region 1145 where the second electrode layer 106 is in contact with the third conductive layer 1144 can be formed. In the region 1145 where the second electrode layer 106 is in contact with the third conductive layer 1144, the adhesion between the third conductive layer 1144 and the second electrode layer 106 is high, and thus the layer 105 containing an organic compound is used in the separation step. In addition, separation at the interface between the second electrode layer 106 and the second electrode layer 106 is difficult, and separation with the separation layer 102 and the insulating layer 103 is possible.

Note that the second electrode layer 106 may be in contact with the second conductive layer 1142 and the third conductive layer 1144 as illustrated in FIG.

In addition, as illustrated in FIG. 11B, the second electrode layer 106 may be in contact with the first conductive layer 1141, the second conductive layer 1142, and the third conductive layer 1144.

In addition, as illustrated in FIG. 11C, the second electrode layer 106 may be in contact with the first conductive layer 1141 and the third conductive layer 1144.

In addition, as illustrated in FIG. 11D, the second electrode layer 106 may be in contact with the third conductive layer 1144. Note that here, the third conductive layer 1144 is also in contact with the first conductive layer 1141.

In addition, as illustrated in FIG. 11E, the second electrode layer 106 may be in contact with the first conductive layer 1141 and the second conductive layer 1142.

In addition, the second electrode layer 106 may be in contact with the second conductive layer 1142 as illustrated in FIG. Note that here, the second conductive layer 1142 is also in contact with the first conductive layer 1141.

In addition, as illustrated in FIG. 11G, the second electrode layer 106 may be in contact with the third conductive layer 1144. Note that here, the third conductive layer 1144 is also in contact with the gate insulating layer 1113.

In addition, the second electrode layer 106 may be in contact with the second conductive layer 1142 as illustrated in FIG. Note that here, the second conductive layer 1142 is also in contact with the gate insulating layer 1113.

In addition, as illustrated in FIG. 11I, the second electrode layer 106 may be in contact with the first conductive layer 1141. Note that here, the first conductive layer 1141 is also in contact with the gate insulating layer 1113.

Note that as illustrated in FIG. 4B, a stack from the insulating layer 103 to the second electrode layer 106 is referred to as an element formation layer 1146 here.

  Hereinafter, the formation of the insulating layer 107 illustrated in FIG. 4C, the bonding of the substrate 108, the peeling step illustrated in FIG. 4D, and the bonding of the substrate 109 illustrated in FIG. Since it is the same as that, it abbreviate | omits here.

  Through the above steps, an element including a layer containing an organic compound can be provided over a flexible substrate with high yield by using a separation step.

In this embodiment, a semiconductor device having a memory element as an element having a layer containing an organic compound, typically a memory device will be described.

  8A shows an example of a structure of the semiconductor device shown in this embodiment. A memory cell array 222 in which memory cells 221 are provided in a matrix, a decoder 223, a word line driver circuit 224, a selector 225, A read / write circuit 226 is included. Note that the structure of the memory device 216 described here is merely an example, and may include other circuits such as a sense amplifier, an output circuit, and a buffer.

The bit line driver circuit, the word line driver circuit 224, the writing circuit, the interface, and the like can be formed over the substrate using a thin film transistor, similarly to the memory element. Further, it may be externally attached as an IC chip.

  The memory cell 221 includes a first wiring connected to the bit line Bx (1 ≦ x ≦ m), a second wiring connected to the word line Wy (1 ≦ y ≦ n), a thin film transistor 240, and a memory element 241. And have. The memory element 241 has a structure in which a layer containing an organic compound is sandwiched between a pair of conductive layers.

  Next, an example of a top view and a cross-sectional view of the memory cell array 222 having the above structure is described with reference to FIGS. Note that FIG. 9A illustrates an example of a top view of the memory cell array 222, and FIG. 9B is a cross-sectional view taken along a line AB in FIG. 9A and FIG. 9A. Although not shown, the peripheral portion of the memory cell array 222 is indicated by CD. Note that in FIG. 9A, the organic insulating layer 364, the insulating layer 331, the layer 265 containing an organic compound, and the second electrode layer 366 which are formed over the first electrode layer 243 are omitted. Yes.

  In the memory cell array 222, a plurality of memory cells 221 are provided in a matrix. The memory cell 221 is provided with a thin film transistor 240 functioning as a switching element and a memory element 241 connected to the thin film transistor 240 over a substrate 334, here a plastic substrate (FIGS. 9A and 9B). )reference.).

The memory element 241 includes a first electrode layer 243 formed over the organic insulator layer 368, a layer 365 containing an organic compound that covers the first electrode layer 243 and the organic insulator layer 364, and a second electrode. Layer 366. In addition, an organic insulator layer 364 is formed to cover a part of the first electrode layer.

In the peripheral portion CD, a region 367 where the gate insulating layer 369 of the thin film transistor 240 is in contact with the second electrode layer 366 is formed.

In addition, an insulating layer 331 for reducing surface unevenness is formed over the second electrode layer 366, and a plastic substrate 335 is attached to the insulating layer 331.

  Note that in FIG. 9B, an example in which the layer 365 including an organic compound is formed over a plurality of first electrode layers is shown; however, the layer 365 including an organic compound is selectively used only in each memory cell. May be provided. In this case, an evaporation method using a metal mask can be applied. In addition, the use efficiency of the material can be improved by selectively providing a layer containing an organic compound by discharging and baking an organic compound using a droplet discharge method or the like.

  A material and a formation method of the first electrode layer 243 and the second electrode layer 366 can be similarly performed using any of the materials and the formation method described in Embodiment Mode 1.

  The layer 365 including an organic compound can be provided using a material and a formation method similar to those of the layer 105 including an organic compound described in Embodiment 1.

  Further, as the substrates 334 and 335, a flexible substrate, a laminate film, a paper made of a fibrous material, or the like described in the substrates 108 and 109 described in Embodiment Mode 1 is used, so that the semiconductor device can be made small and thin. It is possible to reduce the weight.

Next, a method for manufacturing an active matrix semiconductor device is described with reference to FIGS.

  FIG. 10A is a cross-sectional view of a memory cell array of an active matrix semiconductor device. Note that peripheral circuits such as a bit line driving circuit, a word line driving circuit, and an interface are omitted.

  As shown in FIG. 10A, a separation layer 302 with a thickness of 30 nm is formed over a substrate 301, and an insulating layer 303 is formed over the separation layer 302. Next, the TFT 240 is formed over the insulating layer 303. Here, a glass substrate is used as the substrate 301.

  Here, an interlayer insulating layer for insulating the gate electrode of the TFT 240 from the source electrode and the drain electrode is formed of an organic insulating layer 368. For this reason, in the peripheral portion CD, a part of the organic insulating layer 368 is removed, and the gate insulating layer 369 of the TFT is exposed.

  Next, an organic insulator layer 364 is formed over the TFT 240. Next, a layer 365 containing an organic compound is formed over the organic insulator layer 364 and the exposed portion of the source or drain electrode of the TFT, and a second layer 365 containing the organic compound and the gate insulating layer 369 are formed over the second layer 365. An electrode layer 366 is formed.

Here, the second electrode layer 366 is formed so that a region 367 in which the gate insulating layer 369 and the second electrode layer 366 are in contact with each other is formed. In the region where the gate insulating layer 369 and the second electrode layer 366 are in contact with each other, the adhesiveness between the gate insulating layer 369 and the second electrode layer 366 is high, so that the separation layer and the insulating layer are separated with high yield in a subsequent separation step. It is possible.

  Next, as illustrated in FIG. 10B, after an insulating layer 331 is formed over the second electrode layer 366, a plastic film 332 having an adhesive layer is attached to the insulating layer 331. Next, after a weak adhesive tape (not shown) is bonded to the surface of the substrate 301, the adhesive layer of the plastic film 332 is plasticized by heating at 120 to 150 degrees, and the plastic film 332 is formed into the insulating layer 331. Adhere.

  Next, the substrate 301 is placed on the surface of the flat portion, and a roller (not shown) having an adhesive layer is pressure-bonded to the surface of the plastic film 332, so that the peeling layer 302 and the insulating layer 303 are bonded as shown in FIG. Peel at the interface.

  Next, as shown in FIG. 10D, a substrate 334 having an adhesive layer is attached to the surface of the insulating layer 303 and heated to 120 to 150 degrees to plasticize the adhesive layer of the substrate 334, thereby insulating the substrate 334. Adhere to the surface of layer 303.

  Through the above steps, an active matrix semiconductor device can be formed over a plastic film. In this embodiment, any of Embodiment Modes 1 to 4 can be applied.

  Next, an operation when data is written to the storage device 216 will be described (FIGS. 8 and 9).

Here, an operation when data is written by electrical action, typically, voltage application will be described. Writing is performed by changing the electrical characteristics of the memory cell. The initial state of the memory cell (the state where no electrical action is applied) is data “0”, and the state where the electrical characteristic is changed is “1”. To do.

A case where data is written to the memory cell 221 in the nth row and the mth column will be described. When data “1” is written in the memory cell 221, first, the memory cell 221 is selected by the decoder 223 and the selector 225. Specifically, the decoder 223 applies a predetermined voltage V22 to the word line Wn connected to the memory cell 221. In addition, the bit line Bm connected to the memory cell 221 is connected to the read / write circuit 226 by the decoder 223 and the selector 225. Then, the write voltage V21 is output from the read / write circuit 226 to the bit line B3.

In this manner, the thin film transistor 240 included in the memory cell is turned on, the common electrode and the bit line are electrically connected to the memory element 241, and a voltage of approximately Vw = Vcom−V21 is applied. By appropriately selecting the voltage Vw, a layer containing an organic compound provided between the electrode layers is physically or electrically changed, and data “1” is written. Specifically, at the read operation voltage, the electrical resistance between the first electrode layer and the second electrode layer in the data “1” state is significantly smaller than that in the data “0” state. It may be changed as described above, or it may be simply short-circuited. The short-circuited memory element has a short-circuited region 212 as shown in FIG. The potential may be appropriately selected from the range of (V21, V22, Vcom) = (5-15V, 5-15V, 0V), or (-12 to 0V, -12 to 0V, 3 to 5V). The voltage Vw may be 5-15V, or -15--5V.

Note that data “1” is controlled not to be written in the memory cell connected to the non-selected word line and the non-selected bit line. Specifically, a potential (for example, 0 V) for turning off the transistor of the memory cell to be connected is applied to the non-selected word line, and the non-selected bit line is in a floating state or approximately equal to Vcom. A potential may be applied.

On the other hand, when data “0” is written in the memory cell 221, it is not necessary to apply electrical action to the memory cell 221. In the circuit operation, for example, as in the case of writing “1”, the memory cell 221 is selected by the decoder 223 and the selector 225, but the output potential from the read / write circuit 226 to the bit line B3 is approximately the same as Vcom. Alternatively, the bit line B3 is brought into a floating state. As a result, a small voltage (for example, −5 to 5 V) is applied to the memory element 241 or no voltage is applied, so that the electrical characteristics do not change and data “0” writing is realized.

Next, an operation when data is read by electrical action will be described (FIG. 8). Data is read by utilizing the fact that the electrical characteristics of the memory element 241 are different between the memory cell having the data “0” and the memory cell having the data “1”. For example, the electrical resistance of the memory element constituting the memory cell having data “0” is R0 at the read voltage, and the electrical resistance of the memory element constituting the memory cell having data “1” is R1 at the read voltage. A method of reading using the difference will be described. Note that R1 <R0. As the read / write circuit, for example, a circuit 226 using a resistance element 246 and a differential amplifier 247 illustrated in FIG. The resistance element has a resistance value Rr, and R1 <Rr <R0. A transistor 250 may be used instead of the resistance element 246, and a clocked inverter 251 may be used instead of the differential amplifier (FIG. 8C). Of course, the circuit configuration is not limited to FIG.

When data is read from the memory cell 221 in the nth row and mth column, first, the memory cell 221 is selected by the decoder 223 and the selector 225. Specifically, the decoder 223 applies a predetermined voltage V24 to the word line Wn connected to the memory cell 221 to turn on the thin film transistor 240. In addition, the bit line Bm connected to the memory cell 221 is connected to the terminal P of the read / write circuit 226 by the decoder 223 and the selector 225. As a result, the potential Vp of the terminal P becomes a value determined by resistance division of Vcom and V0 by the resistance element 246 (resistance value Rr) and the memory element 241 (resistance value R0 or R1). Therefore, when the memory cell 221 has data “0”, Vp0 = Vcom + (V0−Vcom) × R0 / (R0 + Rr). When the memory cell 221 has data “1”, Vp1 = Vcom + (V0−Vcom) × R1 / (R1 + Rr). As a result, in FIG. 8B, Vref is selected to be between Vp0 and Vp1, and in FIG. 8C, the change point of the clocked inverter is selected to be between Vp0 and Vp1. Thus, the output potential Vout is Low / High (or High / Low) according to the data “0” / “1”, and reading can be performed.

For example, the differential amplifier is operated at Vdd = 3V, and Vcom = 0V, V0 = 3V, and Vref = 1.5V. If it is assumed that R0 / Rr = Rr / R1 = 9 and the on-resistance of the thin film transistor 240 can be ignored, when the data in the memory cell is “0”, Vp0 = 2.7V and Vout is output high, and the memory cell When the data of “1” is “1”, Vp1 = 0.3V and Vout is output as Low. Thus, the memory cell can be read.

According to the above method, the voltage value is read by utilizing the difference in resistance value of the memory element 241 and the resistance division. Of course, the reading method is not limited to this method. For example, in addition to using the difference in electrical resistance, reading may be performed using the difference in current value. In addition, when the electrical characteristics of the memory cell have data “0” and “1” and diode characteristics with different threshold voltages, reading may be performed using the threshold voltage difference.

Note that this embodiment can be freely combined with the above embodiment mode.

By using the present invention, it is possible to perform peeling at the interface of the peeling layer without peeling at the layer containing the organic compound of the memory element. Therefore, the layer having the memory element formed over the heat resistant substrate can be peeled and provided over the flexible substrate. By using the present invention, data can be written (added) other than during chip manufacture and cannot be rewritten, so that a semiconductor device capable of preventing forgery due to rewriting can be obtained. In addition, since the semiconductor device of the present invention includes a memory element having a simple structure in which a layer containing an organic compound is sandwiched between a pair of conductive layers, an inexpensive semiconductor device can be provided.

  In this embodiment, a method for manufacturing a semiconductor device capable of reading and writing data without contact will be described with reference to FIGS.

  FIG. 12A is a cross-sectional view of a memory cell array of a semiconductor device capable of reading and writing data without contact. Note that peripheral circuits such as a bit line driving circuit, a word line driving circuit, and an interface are omitted.

  As shown in FIG. 12A, a separation layer 302 with a thickness of 30 nm is formed over a substrate 301 as in Example 1, and an insulating layer 303 is formed over the separation layer 302. Next, TFTs 381 to 383 are formed over the insulating layer 303. Here, the TFT 381 is a TFT connected to a conductive layer functioning as an antenna, and the TFTs 382 and 383 are TFTs connected to a memory element.

  Here, as in the first embodiment, an interlayer insulating layer for insulating the gate electrodes of the TFTs 381 to 383 from the source electrode and the drain electrode is formed of an organic insulating layer 388. Therefore, a part of the organic insulating layer 388 is removed, and the gate insulating layer 389 of the TFT is exposed. Therefore, a region 387 in which the gate insulating layer 389 which is an inorganic insulating layer is in contact with the second electrode layer 385 formed using a metal layer is provided.

  Next, an organic insulator layer 364 is formed over the TFTs 361 to 363 as in the first embodiment. Next, a layer 384 containing an organic compound is formed over the organic insulator layer 364 and the exposed portion of the TFT source electrode or drain electrode, and a second electrode layer 385 is formed over the layer 384 containing the organic compound. At the same time, a conductive layer 386 functioning as an antenna is formed. Note that the second electrode layer 385 is in contact with the layer 384 containing an organic compound and the gate insulating layer 389. The organic insulator layer 364, the layer 384 containing an organic compound, and the second electrode layer 385 are the same as the organic insulator layer 310, the layer 311 containing an organic compound, and the second electrode layer 312 shown in Example 1, respectively. Can be formed.

Here, the second electrode layer 385 is formed so that a region 387 where the gate insulating layer 389 and the second electrode layer 385 are in contact with each other is formed. In the region where the gate insulating layer 389 and the second electrode layer 385 are in contact with each other, the adhesiveness between the gate insulating layer 389 and the second electrode layer 385 is high; therefore, in a later peeling step, the layer 384 containing the organic compound and the second electrode The separation layer and the insulating layer can be separated with high yield without separation between the layers 385.

  Next, as illustrated in FIG. 12B, as in Example 1, after forming the insulating layer 331 over the second electrode layer, the plastic film 332 having an adhesive layer is bonded over the insulating layer 331. .

  Hereinafter, the peeling step illustrated in FIG. 12D and the bonding of the substrate 109 illustrated in FIG. 12E are the same as those in Embodiment 1, and thus are omitted here.

  Through the above steps, a semiconductor device capable of reading and writing data without contact can be formed on a plastic film. In this embodiment, any of Embodiment Modes 1 to 4 can be applied.

  In this embodiment, a method for manufacturing a semiconductor device capable of reading and writing data without contact, which is different from that in Embodiment 2, will be described with reference to FIGS.

  As shown in FIG. 13A, a separation layer 302 with a thickness of 30 nm is formed over a substrate 301 as in Example 1, and an insulating layer 303 is formed over the separation layer 302. Next, TFTs 381 to 383 are formed over the insulating layer 303.

  Next, an organic insulating layer 364 is formed over the TFTs 381 to 383 in the same manner as in the first embodiment. Next, a layer 384 containing an organic compound is formed over the organic insulator layer 364 and the exposed portion of the TFT source electrode or drain electrode, and a second electrode layer 385 is formed over the layer 384 containing the organic compound. At the same time, the connection terminal 390 is formed. The organic insulator layer 364, the layer 384 containing an organic compound, and the second electrode layer 385 are the same as the organic insulator layer 310, the layer 311 containing an organic compound, and the second electrode layer 312 shown in Example 1, respectively. Can be formed.

Here, the second electrode layer 385 is formed so that a region 387 where the gate insulating layer 389 and the second electrode layer 385 are in contact with each other is formed. Since the adhesiveness between the gate insulating layer 389 and the second electrode layer 385 is high, the separation layer and the insulating layer can be separated with high yield in a later separation step.

  Next, the protective layer 391 is formed over the second electrode layer 385. However, the protective layer 391 is formed so as to expose the connection terminal 390. Next, as illustrated in FIG. 13B, an adhesive layer 392 is formed over the protective layer 391, and a substrate 393 is attached to the adhesive layer 392. The adhesive layer 392 is formed using a plastic adhesive such as a thermoplastic adhesive, a thermoplastic adhesive, or a chemical adhesive. The substrate 393 can be similar to the substrate 301. Here, a photoplasticizing resin is used for the adhesive layer 392 and a glass substrate is used for the substrate 393.

  Next, as illustrated in FIG. 13C, separation is performed at the interface between the separation layer 302 and the insulating layer 303.

  Next, as shown in FIG. 17D, a plastic film 394 having an adhesive layer is bonded to the surface of the insulating layer 303 and heated to 120 to 150 degrees to plasticize the adhesive layer of the plastic film 394. 394 is bonded to the surface of the insulating layer 303.

Next, the adhesive layer 392 is plasticized to remove the substrate 393 and the adhesive layer 392. Here, the adhesive layer 392 is irradiated with UV light to plasticize the adhesive layer, and the substrate is removed.

  Next, as illustrated in FIG. 13E, a substrate having a TFT and a memory element and a substrate 399 provided with a conductive layer 398 functioning as an antenna are formed using an anisotropic conductive film or an anisotropic conductive adhesive. Use and paste together. Here, the connection terminal 390 and the conductive layer 398 functioning as an antenna are electrically connected to each other with the conductive particles 396 included in the adhesive using an anisotropic conductive adhesive 397. Note that since the second electrode layer 385 is protected by the protective layer 391, the second electrode layer 385 and the conductive layer 398 are not electrically connected.

  Through the above steps, a semiconductor device capable of reading and writing data without contact can be formed on a plastic film.

In this embodiment, any of Embodiment Modes 1 to 4 can be applied.

Here, the structure of the semiconductor device having the elements shown in Embodiments 2 and 3 will be described with reference to FIG. As shown in FIG. 14A, the semiconductor device 20 of the present invention has a function of communicating data without contact, and includes a power supply circuit 11, a clock generation circuit 12, a data demodulation / modulation circuit 13, and other circuits. A control circuit 14 for controlling, an interface circuit 15, a memory circuit 16, a bus 17, and an antenna 18 are included.

Further, as shown in FIG. 14B, the semiconductor device 20 of the present invention has a function of communicating data without contact, and includes a power supply circuit 11, a clock generation circuit 12, a data demodulation / modulation circuit 13, and the like. In addition to the control circuit 14, the interface circuit 15, the storage circuit 16, the bus 17, and the antenna 18, the central processing unit 51 may be included.

Further, as shown in FIG. 14C, the semiconductor device 20 of the present invention has a function of communicating data without contact, and includes a power supply circuit 11, a clock generation circuit 12, a data demodulation / modulation circuit 13, and the like. In addition to the control circuit 14 that controls the circuit, the interface circuit 15, the storage circuit 16, the bus 17, the antenna 18, and the central processing unit 51, a detection unit 52 including a detection element 53 and a detection control circuit 54 may be included.

The semiconductor device of this embodiment includes a power supply circuit 11, a clock generation circuit 12, a data demodulation / modulation circuit 13, a control circuit 14 for controlling other circuits, an interface circuit 15, a storage circuit 16, a bus 17, an antenna 18, a central processing unit. In addition to the unit 51, the detection unit 53 including the detection element 53, the detection control circuit 54, and the like can be configured to form a small and multifunctional semiconductor device.

  The power supply circuit 11 is a circuit that generates various power supplies to be supplied to each circuit inside the semiconductor device 20 based on the AC signal input from the antenna 18. The clock generation circuit 12 is a circuit that generates various clock signals to be supplied to each circuit inside the semiconductor device 20 based on the AC signal input from the antenna 18. The data demodulation / modulation circuit 13 has a function of demodulating / modulating data communicated with the reader / writer 19. The control circuit 14 has a function of controlling the memory circuit 16. The antenna 18 has a function of transmitting / receiving electromagnetic waves or radio waves. The reader / writer 19 controls communication and control with the semiconductor device and processing related to the data. The semiconductor device is not limited to the above-described configuration, and may be a configuration in which other elements such as a power supply voltage limiter circuit and hardware dedicated to cryptographic processing are added.

  The memory circuit 16 includes one or a plurality of memory elements selected from the memory elements described in any of Embodiments 1 to 4, Embodiment 1 and Embodiment 2. Since a memory element having a layer containing an organic compound can simultaneously realize downsizing, thinning, and large capacity, by providing the memory circuit 16 with a memory element having a layer containing an organic compound, A reduction in size and weight can be achieved.

The detection unit 52 can detect temperature, pressure, flow rate, light, magnetism, sound wave, acceleration, humidity, gas component, liquid component, and other characteristics by physical or chemical means. The detection unit 52 includes a detection element 53 that detects a physical quantity or chemical quantity, and a detection control circuit 54 that converts the physical quantity or chemical quantity detected by the detection element 53 into an appropriate signal such as an electrical signal. Yes. The detection element 53 can be formed of a resistance element, a capacitive coupling element, an inductive coupling element, a photovoltaic element, a photoelectric conversion element, a thermoelectric element, a transistor, a thermistor, a diode, or the like. A plurality of detection units 52 may be provided. In this case, a plurality of physical quantities or chemical quantities can be detected simultaneously.

The physical quantity here refers to temperature, pressure, flow rate, light, magnetism, sound wave, acceleration, humidity, etc., and the chemical quantity refers to chemicals such as components contained in gas components such as gases and liquids such as ions. It refers to substances. In addition, the chemical amount includes organic compounds such as specific biological substances contained in blood, sweat, urine and the like (for example, blood glucose level contained in blood). In particular, when a chemical amount is to be detected, a specific substance is inevitably selectively detected. Therefore, a substance that selectively reacts with a substance to be detected is provided in the detection element 53 in advance. . For example, when detecting a biological substance, it is preferable that an enzyme, an antibody molecule, a microbial cell, or the like that selectively reacts with the biological substance to be detected by the detection element 53 is fixed to a polymer or the like.

  According to the present invention, a semiconductor device functioning as a wireless chip can be manufactured. Applications of wireless chips are wide-ranging. For example, banknotes, coins, securities, bearer bonds, certificates (driver's license, resident's card, etc., see FIG. 20A), packaging containers (wrapping paper and Bottle, etc., see FIG. 20C), recording medium (DVD software, video tape, etc., see FIG. 20B), vehicles (bicycle, etc., see FIG. 20D), personal items (bags, glasses, etc.) ), Used for goods such as foods, plants, animals, human bodies, clothing, daily necessities, electronic devices, etc. and goods such as luggage tags (see FIGS. 20E and 20F). be able to. Electronic devices refer to liquid crystal display devices, EL display devices, television devices (also simply referred to as televisions, television receivers, television receivers), mobile phones, and the like.

The semiconductor device 20 of the present invention is fixed to an article by being mounted on a printed board, pasted on a surface, or embedded. For example, a book is embedded in paper, and a package made of an organic resin is embedded in the organic resin, and is fixed to each article. Since the semiconductor device 20 of the present invention realizes a small size, a thin shape, and a light weight, the design of the article itself is not impaired even after being fixed to the article. In addition, by providing the semiconductor device 20 of the present invention on bills, coins, securities, bearer bonds, certificates, etc., an authentication function can be provided, and if this authentication function is utilized, forgery can be prevented. Can do. In addition, by providing the semiconductor device of the present invention in packaging containers, recording media, personal items, foods, clothing, daily necessities, electronic devices, etc., the efficiency of a system such as an inspection system can be improved.

In this example, a manufacturing process of a semiconductor device having a light-emitting element will be described.

  As shown in FIG. 15A, a separation layer 402 is formed over a substrate 401. In this embodiment, AN100 is used as the substrate. A separation layer 402, here a tungsten layer (thickness: 10 nm to 200 nm, preferably 50 nm to 75 nm) is formed over the glass substrate by a sputtering method, and then an insulating layer 403 is formed. Here, a silicon nitride oxide film with a thickness of 140 nm and a silicon oxynitride film with a thickness of 100 nm are formed by a CVD method.

Next, p-channel TFTs 414 and 416 and an n-channel TFT 415 are formed over the insulating layer 403. Note that a driver circuit is formed by the p-channel TFT 414 and the n-channel TFT 415. The p-channel TFT 416 functions as a driving element that drives the light emitting element.

  A first interlayer insulating layer 417 that insulates the gate electrodes and wirings of the TFTs 414 to 416 is stacked using silicon oxynitride, silicon nitride oxide, and acrylic resin. In addition, wirings 418 to 423 and a connection terminal 424 which are connected to the semiconductor layer of the TFT are formed over the first interlayer insulating layer 417. Here, a Ti film 100 nm, an Al film 700 nm, and a Ti film 100 nm are successively formed by sputtering, and then selectively etched using a resist mask formed by a photolithography process, whereby wirings 418 to 423 and connection are made. A terminal 424 is formed. Thereafter, the resist mask is removed.

Next, a second interlayer insulating layer 425 is formed over the interlayer insulating layer 417, the wirings 418 to 423, and the connection terminal 424. As the second interlayer insulating layer 425, an inorganic insulating film such as a silicon oxide film, a silicon nitride film, or a silicon oxynitride film can be used. If these insulating films are formed as a single layer or two or more layers, Good. As a method for forming the inorganic insulating film, a sputtering method, an LPCVD method, a plasma CVD method, or the like may be used.

In this embodiment, the second interlayer insulating layer 425 made of an inorganic insulating film is formed with a thickness of 100 nm to 150 nm using a plasma CVD method.

  Next, the second interlayer insulating layer 425 is selectively etched using a resist mask formed by a photolithography process, so that a contact hole reaching the wiring 423 of the driving TFT and the connection terminal 424 is formed. Thereafter, the resist mask is removed.

  Next, a first electrode layer 426 connected to the wiring 423 of the driving TFT and a conductive layer 430 connected to the connection terminal 424 are formed. The first electrode layer 426 and the conductive layer 430 are formed by forming a film of ITO containing silicon oxide with a thickness of 125 nm by a sputtering method and then selectively etching the film using a resist mask formed by a photolithography process.

By forming the second interlayer insulating layer 425 as in this embodiment, exposure of TFTs and wirings in the driver circuit portion can be prevented and the TFTs can be protected from contaminants.

  Next, an organic insulating layer 427 covering the end portion of the first electrode layer 426 is formed. Here, after photosensitive polyimide is applied and baked, exposure and development are performed to expose the driver circuit, the first electrode layer 426 in the pixel region, and the second interlayer insulating layer 425 in the periphery of the pixel region. Thus, the organic insulating layer 427 is formed.

Next, a layer 428 containing a light-emitting substance is formed over part of the first electrode layer 426 and the organic insulating layer 427 by an evaporation method. The layer 428 containing a light-emitting substance is formed using an organic compound having a light-emitting property. The layer 363 containing an organic compound is formed using a red light-emitting organic compound, a blue light-emitting organic compound, and a green light-emitting organic compound, respectively, so that a red light-emitting pixel and a blue light-emitting organic compound are used. Pixels and green light-emitting pixels are formed.

Here, as a layer containing a red light-emitting organic compound, DNTPD is 50 nm, NPB is 10 nm, bis [2,3-bis (4-fluorophenyl) quinoxalinato] iridium (acetylacetonate) (abbreviation: Ir (Fdpq ) ₂ (acac)) is added to 30 nm, Alq ₃ to 60 nm, and LiF to 1 nm.

Further, a layer containing a green light-emitting organic compound is formed by stacking DNTPD at 50 nm, NPB at 10 nm, coumarin 545T (C545T) -added Alq ₃ at 40 nm, Alq ₃ at 60 nm, and LiF at 1 nm. .

In addition, as a layer containing a blue light-emitting organic compound, DNTPD is 50 nm, NPB is 10 nm, 2,5,8,11-tetra (tert-butyl) perylene (abbreviation: TBP) is added, and 9- [ It is formed by stacking 4- (N-carbazolyl)] phenyl-10-phenylanthracene (abbreviation: CzPA :) at 30 nm, Alq ₃ at 60 nm, and LiF at 1 nm.

Further, a white light-emitting pixel may be formed using a white light-emitting organic compound. By providing white light-emitting pixels, power consumption can be reduced.

Next, as illustrated in FIG. 15B, a second electrode layer 431 is formed over the layer 428 containing a light-emitting substance, the organic insulating layer 427, and the second interlayer insulating layer 425. Here, an Al film having a thickness of 200 nm is formed by an evaporation method. At this time, a region 432 in contact with the second interlayer insulating layer 425 and the second electrode layer 431 formed of an inorganic compound is formed. In the region 432 where the second interlayer insulating layer 425 and the second electrode layer 431 which are formed using an inorganic compound are in contact with each other, the adhesion between the layer 428 containing the light-emitting substance and the second electrode layer 431 is high in a subsequent peeling step. Separation can be performed with the separation layer 302 and the insulating layer 303 without separation.

  Next, as illustrated in FIG. 15C, the protective layer 441 is formed over the second electrode layer 431. The protective layer is for preventing moisture, oxygen, and the like from entering the light emitting element. The protective layer 441 uses a thin film formation method such as a plasma CVD method or a sputtering method, and includes silicon nitride, silicon oxide, silicon nitride oxide, silicon oxynitride, aluminum oxynitride, or aluminum oxide, diamond-like carbon (DLC), and nitrogen content It is preferable to use carbon (CN) or another insulating material.

Next, the insulating layer 442 is formed over the protective layer 441. Here, the insulating layer 442 is formed using an epoxy resin formed by applying and baking the composition. Next, a plastic film 443 is attached to the insulating layer 442. Next, after attaching a weak adhesive tape (not shown) to the surface of the substrate 401, the adhesive layer of the plastic film 443 is plasticized by heating at 120 to 150 degrees, and the plastic film 443 is formed into the insulating layer 442. Adhere.

  Next, the substrate 401 is placed on the surface of the flat portion, and a roller (not shown) having an adhesive layer is pressure-bonded to the surface of the plastic film 443, and as shown in FIG. Peel at the interface.

  Next, as shown in FIG. 16B, a plastic film 451 having an adhesive layer is attached to the surface of the insulating layer 403, and heated to 120 to 150 degrees to plasticize the adhesive layer of the plastic film 451, and the plastic A film 451 is adhered to the surface of the insulating layer 403.

Next, the FPC 454 is attached to the conductive layer 430 in contact with the connection terminal 424 using the anisotropic conductive layer 453.

  Through the above steps, a semiconductor device having an active matrix light-emitting element can be formed over a plastic film.

Here, in this embodiment, an equivalent circuit diagram of a pixel in the case of full color display is shown in FIG. In FIG. 17, a TFT 639 surrounded by a broken line corresponds to the driving TFT 603 in FIG.

In the pixel displaying red, an OLED 703R that emits red light is connected to the drain region of the driving TFT 639, and an anode-side power supply line (R) 706R is provided in the source region. The OLED 703R is provided with a cathode side power supply line 700. The switching TFT 638 is connected to the gate wiring 705, and the gate electrode of the driving TFT 639 is connected to the drain region of the switching TFT 638. Note that the drain region of the switching TFT 638 is connected to the capacitor 707 connected to the anode power supply line (R) 706 (R).

In the pixel displaying green, an OLED 703G that emits green light is connected to the drain region of the driving TFT, and an anode power supply line (G) 706G is provided in the source region. The switching TFT 638 is connected to the gate wiring 705, and the gate electrode of the driving TFT 639 is connected to the drain region of the switching TFT 638. Note that the drain region of the switching TFT 638 is connected to the capacitor 707 connected to the anode power supply line (G) 706 (G).

In the pixel displaying blue, an OLED 703B that emits blue light is connected to a drain region of a driving TFT, and an anode power supply line (B) 706B is provided in a source region. The switching TFT 638 is connected to the gate wiring 705, and the gate electrode of the driving TFT 639 is connected to the drain region of the switching TFT 638. Note that the drain region of the switching TFT 638 is connected to the capacitor 707 connected to the anode power supply line (B) 706 (B).

Different voltages are applied to the pixels of different colors depending on the EL material.

Here, the source wiring 704 and the anode side power supply lines 706R, 706G, and 706B are formed in parallel. However, the present invention is not limited to this, and the gate wiring 705 and the anode side power supply lines 706R, 706G, and 706B are parallel. It may be formed. Furthermore, the driving TFT 639 may have a multi-gate electrode structure.

In the light emitting device, a driving method for screen display is not particularly limited, and for example, a dot sequential driving method, a line sequential driving method, a surface sequential driving method, or the like may be used. Typically, a line sequential driving method is used, and a time-division gray scale driving method or an area gray scale driving method may be used as appropriate. The video signal input to the source line of the light-emitting device may be an analog signal or a digital signal, and a drive circuit or the like may be designed in accordance with the video signal as appropriate.

Further, in a light emitting device in which a video signal is digital, there are a video signal input to a pixel having a constant voltage (CV) and a constant current (CC). A video signal having a constant voltage (CV) includes a signal having a constant voltage applied to the light emitting element (CVCV) and a signal having a constant current applied to the light emitting element (CVCC). . In addition, when the video signal has a constant current (CC), the signal voltage applied to the light emitting element is constant (CCCV), and the signal applied to the light emitting element has a constant current (CCCC). There is.

  In the light emitting device, a protection circuit (such as a protection diode) for preventing electrostatic breakdown may be provided.

  Through the above steps, a semiconductor device having an active matrix light-emitting element provided over a plastic film can be manufactured.

In this embodiment, any of Embodiment Modes 1 to 4 can be applied.

  Next, an example in which an FPC and a driving IC for driving are mounted on the EL display panel shown in Embodiment 5 will be described. Here, a chip-like driving circuit formed of TFTs is referred to as a driving IC.

18A illustrates an example of a top view of a light-emitting device in which an FPC 1009 is attached to four terminal portions 1008. FIG. A pixel portion 1002 including a light emitting element and a TFT, a gate side driver circuit 1003 including a TFT, and a first driver circuit 1001 including a TFT are formed over the substrate 1010. The active layer of the TFT is composed of a semiconductor film having a crystal structure, and these circuits are formed on the same substrate. Therefore, an EL display panel that realizes system-on-panel can be manufactured.

Further, connection regions 1007 provided at two positions so as to sandwich the pixel portion are provided in order to contact the second electrode (cathode) of the light emitting element with a lower wiring. Note that the first electrode (anode) of the light-emitting element is electrically connected to a TFT provided in the pixel portion.

Further, the sealing substrate 1004 is fixed to the substrate 1010 with a sealant 1005 surrounding the pixel portion and the driver circuit and a filling material surrounded by the sealant 1005. Moreover, it is good also as a structure filled with the filling material containing a transparent desiccant. Further, a desiccant may be disposed in a region that does not overlap with the pixel portion.

Note that in this embodiment, a part of the sealant 1005 is provided so as to overlap with the gate side driver circuit 1003 including the TFT, but it may be provided so as to surround the outer periphery of the display region. That is, it may be provided so as not to overlap with the gate side driver circuit 1003.

  Further, the structure shown in FIG. 18A is a preferable example of a light emitting device having a relatively large size (for example, 4.3 inches diagonal), but FIG. 18B has a narrow frame. This is an example of adopting a COG method suitable for a small size (for example, a diagonal of 1.5 inches).

In FIG. 18B, the driving IC 1011 is mounted on the substrate 1010, and the FPC 1019 is mounted on the terminal portion 1018 arranged at the tip of the driving IC. A plurality of driver ICs 1011 to be mounted may be formed on a rectangular substrate having a side of 300 mm to 1000 mm from the viewpoint of improving productivity. That is, a plurality of circuit patterns having a drive circuit portion and an input / output terminal as one unit are formed on the substrate, and finally, the drive ICs may be taken out by dividing them. The long side of the driving IC may be formed in a rectangular shape having a long side of 15 to 80 mm and a short side of 1 to 6 mm in consideration of the length of one side of the pixel portion and the pixel pitch. Or a length obtained by adding one side of the pixel portion and one side of each driver circuit.

The advantage of the external dimensions of the driving IC over the IC chip is the length of the long side. When a driving IC formed with a long side of 15 to 80 mm is used, the number of chips to be mounted is smaller than when an IC chip is used. This can be reduced and the manufacturing yield can be improved. In addition, when a driving IC is formed over a glass substrate, the shape of the substrate used as a base is not limited, and thus productivity is hardly impaired. This is a great advantage compared with the case where the IC chip is taken out from the circular silicon wafer.

Alternatively, a TAB method may be employed. In that case, a plurality of tapes may be attached and a driving IC may be mounted on the tapes. As in the case of the COG method, a single drive IC may be mounted on a single tape. In this case, a metal piece or the like for fixing the drive IC may be attached together due to strength problems. .

In addition, a connection region 1017 provided between the pixel portion 1102 and the driver IC 1011 is provided in order to contact the second electrode layer of the light-emitting element with a lower wiring. Note that the first electrode of the light-emitting element is electrically connected to a TFT provided in the pixel portion.

Further, the sealing substrate 1014 is fixed to the substrate 1010 with a sealing material 1015 surrounding the pixel portion 1012 and a filling material surrounded by the sealing material.

Note that an IC chip formed of a Si chip may be used instead of the driving IC.

In the case where an amorphous semiconductor film is used as the active layer of the TFT in the pixel portion, it is difficult to form a driver circuit on the same substrate, so the structure shown in FIG. It becomes.

Here, the connection region 1007 will be described with reference to FIG. Except for the connection region 1007, this embodiment is the same as the fourth embodiment, the fifth embodiment, or the sixth embodiment, and thus description thereof is omitted.
As described above, the present invention is implemented, that is, various electronic devices can be completed using the structure of the light-emitting element of Example 5.

Next, one mode of an electronic device in which the semiconductor device of the present invention is mounted will be described with reference to the drawings. The electronic device illustrated here is a mobile phone, which includes housings 2700 and 2706, a panel 2701, a housing 2702, a printed wiring board 2703, operation buttons 2704, and a battery 2705 (see FIG. 19). The panel 2701 is detachably incorporated in the housing 2702, and the housing 2702 is fitted on the printed wiring board 2703. The shape and dimensions of the housing 2702 are changed as appropriate in accordance with the electronic device in which the panel 2701 is incorporated. A plurality of packaged semiconductor devices are mounted on the printed wiring board 2703, and the semiconductor device 2710 of the present invention can be used as one of them. The plurality of semiconductor devices mounted on the printed wiring board 2703 have any one function of a controller, a central processing unit (CPU), a memory, a power supply circuit, a sound processing circuit, a transmission / reception circuit, and the like.

The panel 2701 is connected to the printed wiring board 2703 through the connection film 2708. The panel 2701, the housing 2702, and the printed wiring board 2703 are housed in the housings 2700 and 2706 together with the operation buttons 2704 and the battery 2705. A pixel region 2709 included in the panel 2701 is arranged so as to be visible from an opening window provided in the housing 2700. A semiconductor device as described in Embodiments 5 and 6 can be used for the panel 2701.

As described above, the semiconductor device of the present invention is characterized in that it is small, thin, and lightweight, and the limited space inside the housings 2700 and 2706 of the electronic device can be effectively used due to the above characteristics. .

Note that the housings 2700 and 2706 are examples of the appearance of a mobile phone, and the electronic device according to the present embodiment can be transformed into various modes depending on the function and application.

FIG. 11 is a cross-sectional view illustrating a manufacturing process of a semiconductor device of the present invention. FIG. 11 is a cross-sectional view illustrating a manufacturing process of a semiconductor device of the present invention. FIG. 11 is a cross-sectional view illustrating a manufacturing process of a semiconductor device of the present invention. FIG. 11 is a cross-sectional view illustrating a manufacturing process of a semiconductor device of the present invention. FIG. 11 is a cross-sectional view illustrating a structure of a memory element that can be applied to the present invention. FIG. 10 is a cross-sectional view illustrating a structure of a light-emitting element applicable to the present invention. FIG. 11 is a cross-sectional view illustrating a structure of a memory element that can be applied to the present invention. It is a figure explaining the semiconductor device of the present invention. 4A and 4B are a top view and a cross-sectional view illustrating a semiconductor device of the invention. FIG. 11 is a cross-sectional view illustrating a manufacturing process of a semiconductor device of the present invention. It is sectional drawing explaining the structure of the semiconductor device of this invention. FIG. 11 is a cross-sectional view illustrating a manufacturing process of a semiconductor device of the present invention. FIG. 11 is a cross-sectional view illustrating a manufacturing process of a semiconductor device of the present invention. It is a figure explaining the semiconductor device of the present invention. FIG. 11 is a cross-sectional view illustrating a manufacturing process of a semiconductor device of the present invention. FIG. 11 is a cross-sectional view illustrating a manufacturing process of a semiconductor device of the present invention. It is a figure explaining the equivalent circuit of the semiconductor device of this invention. It is a top view explaining the structure of the semiconductor device of this invention. It is an expanded view explaining the structure of the semiconductor device of this invention. It is a figure explaining the usage pattern of the semiconductor device of this invention. FIG. 10 is a cross-sectional view illustrating a structure of a thin film transistor applicable to the present invention. It is a top view illustrating a semiconductor device of the present invention. It is sectional drawing explaining the conventional semiconductor device.

Claims (19)

Forming a release layer on the substrate,
Forming an inorganic compound layer, a semiconductor element, a first electrode layer connected to the semiconductor element, and a layer containing an organic compound on the first electrode layer on the release layer;
Forming a layer containing the organic compound and a second electrode layer in contact with the inorganic compound layer to form an element forming layer;
A method for manufacturing a semiconductor device, wherein a first flexible substrate is attached to the second electrode layer, and then the substrate and the element formation layer are separated in the separation layer.   2. The method for manufacturing a semiconductor device according to claim 1, wherein the semiconductor element is a thin film transistor, and the inorganic compound layer is an insulating layer that insulates a gate electrode and a wiring of the thin film transistor.   2. The method for manufacturing a semiconductor device according to claim 1, wherein the semiconductor element is a thin film transistor, and the inorganic compound layer is a gate insulating layer that insulates the gate electrode and the semiconductor layer of the thin film transistor.   2. The semiconductor device according to claim 1, wherein the semiconductor element is a thin film transistor, and the inorganic compound layer is formed of the same material as the gate electrode of the thin film transistor and is in contact with the same layer as the gate electrode of the thin film transistor. Manufacturing method.   2. The semiconductor device according to claim 1, wherein the semiconductor element is a thin film transistor, and the inorganic compound layer is formed of the same material as the wiring of the thin film transistor and is in contact with the same layer as the wiring of the thin film transistor. Method.   2. The method for manufacturing a semiconductor device according to claim 1, wherein the inorganic compound layer is formed of the same material as the first electrode layer and is in contact with the same layer as the layer in contact with the first electrode layer. . Forming a release layer on the substrate,
A thin film transistor is formed on the release layer, a first electrode layer connected to the thin film transistor is formed, an inorganic insulating layer covering an end portion of the first electrode layer is formed, and one of the inorganic insulating layers is formed. A layer containing an organic compound is formed on the exposed portion of the first electrode layer and the first electrode layer, and a second electrode layer in contact with the layer containing the organic compound and the inorganic insulating layer is formed to form an element forming layer ,
A method for manufacturing a semiconductor device, wherein a first flexible substrate is attached to the second electrode layer, and then the substrate and the element formation layer are separated in the separation layer. Forming a release layer on the substrate,
A thin film transistor and an inorganic insulating layer that insulates a gate electrode and a wiring of the thin film transistor are formed on the release layer, a first electrode layer connected to the wiring of the thin film transistor is formed on the inorganic insulating layer, and the first Forming an organic insulating layer covering an end portion of one electrode layer, forming a layer containing an organic compound in a part of the organic insulating layer and an exposed portion of the first electrode layer, and including the organic compound; Forming a layer and a second electrode layer in contact with the inorganic insulator layer to form an element forming layer;
A method for manufacturing a semiconductor device, wherein a first flexible substrate is attached to the second electrode layer, and then the substrate and the element formation layer are separated in the separation layer. Forming a release layer on the substrate,
A semiconductor layer is formed on the release layer, a gate insulating layer formed of an inorganic insulator is formed on the semiconductor layer, a gate electrode is formed on the gate insulating layer, and an organic insulator is formed on the gate electrode Forming a layer, removing a part of the organic insulating layer to expose a part of the semiconductor layer and a part of the gate insulating layer, and connecting a wiring connected to the semiconductor layer on the organic insulating layer Forming a first electrode layer connected to the wiring, forming an organic insulator layer covering an end portion of the first electrode layer, a part of the organic insulator layer, and the first electrode; Forming a layer containing an organic compound on the exposed portion of the layer, forming a layer containing the organic compound and a second electrode layer in contact with the gate insulating layer to form an element forming layer;
A method for manufacturing a semiconductor device, wherein a first flexible substrate is attached to the second electrode layer, and then the substrate and the element formation layer are separated in the separation layer. Forming a release layer on the substrate,
An insulating layer is formed on the peeling layer, a semiconductor layer is formed on the insulating layer, a gate insulating layer formed of an inorganic insulator is formed on the semiconductor layer, a gate electrode and a gate electrode are formed on the gate insulating layer A first conductive layer is formed, an organic insulator layer is formed on the gate electrode and the first conductive layer, and the organic insulator layer is selectively removed to remove a part of the semiconductor layer and the first conductive layer. A part of the conductive layer is exposed, a wiring connected to the semiconductor layer is formed on the organic insulating layer, and a second conductive layer connected to the first conductive layer is formed and connected to the wiring Forming a first electrode layer to be formed, forming a third conductive layer connected to the second conductive layer, and covering the end portions of the first electrode layer and the third conductive layer And a layer containing an organic compound in a part of the organic insulator layer and an exposed portion of the first electrode layer Formed, the forming a second electrode layer in contact with the one or more of the the layer containing an organic compound first to third conductive layers to form an element-forming layer,
A method for manufacturing a semiconductor device, wherein a first flexible substrate is attached to the second electrode layer, and then the substrate and the element formation layer are separated in the separation layer.   11. The first electrode layer, the layer containing an organic compound, and the second electrode layer according to claim 1 are part of a memory element or a light-emitting element. A method for manufacturing a semiconductor device.   12. The semiconductor according to claim 1, wherein after the element formation layer and the separation layer are separated from each other, a second flexible substrate is attached to the element formation layer. Device fabrication method. An insulating layer formed on the first flexible substrate;
A thin film transistor formed on the insulating layer;
A first electrode layer connected to the thin film transistor;
An inorganic insulator layer covering an end of the first electrode layer;
A layer containing an organic compound formed on the first electrode layer;
A second electrode layer in contact with the organic compound-containing layer and the inorganic insulating layer;
And a second flexible substrate formed on the second electrode layer. An insulating layer formed on the first flexible substrate;
A thin film transistor formed on the insulating layer;
An inorganic insulator layer for insulating the gate electrode and wiring of the thin film transistor;
A first electrode layer formed on the inorganic insulator layer and connected to the thin film transistor;
An organic insulator layer covering an end of the first electrode layer;
A layer containing an organic compound formed on the first electrode layer;
A layer containing the organic compound, the organic insulator layer, and a second electrode layer in contact with the inorganic insulator layer;
And a second flexible substrate formed on the second electrode layer. An insulating layer formed on the first flexible substrate;
A thin film transistor formed on the insulating layer;
A gate insulating layer formed of an inorganic insulator that insulates the gate electrode and the semiconductor layer of the thin film transistor; and
A first organic insulating layer formed on a part of the gate insulating layer and insulating a gate electrode and a wiring of the thin film transistor;
A first electrode layer formed on the first organic insulator layer and connected to the thin film transistor;
A second organic insulator layer covering an end of the first electrode layer and formed on the first organic insulator layer;
A layer containing an organic compound formed on the first electrode layer;
A layer containing the organic compound, the second organic insulator layer, and a second electrode layer in contact with the inorganic insulator layer;
A semiconductor device comprising: a second flexible substrate formed on the second electrode layer. An insulating layer formed on the first flexible substrate;
A thin film transistor formed on the insulating layer;
A first conductive layer formed of a layer similar to the gate electrode of the thin film transistor;
A first organic insulator layer covering a gate electrode of the thin film transistor;
Wiring formed on the first organic insulator layer;
A second conductive layer formed of the same layer as the wiring and in contact with the first conductive layer;
A first electrode layer formed on the first organic insulator layer and connected to a wiring of the thin film transistor;
A third conductive layer formed of the same layer as the first electrode layer and in contact with the second conductive layer;
A second organic insulator layer covering an end of the first electrode layer;
A layer containing an organic compound formed on the second organic insulator layer and on the first electrode layer;
A layer containing the organic compound and a second electrode layer in contact with the third conductive layer;
A semiconductor device comprising: a second flexible substrate formed on the second electrode layer.   17. The first electrode layer, the layer containing an organic compound, and the second electrode layer according to claim 13 are part of a memory element or a light-emitting element. A semiconductor device.   18. The semiconductor device according to claim 13, further comprising: a conductive layer functioning as an antenna; and a transistor connected to the conductive layer.   19. The semiconductor device according to claim 13, further comprising: a diode connected to the first electrode layer or the second electrode layer.

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