JP2007096233A - Semiconductor device and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that will not generate expansion failures, electrode disconnections and substrate damages, and that is superior in resistance to heat, and to provide a method for manufacturing the device. <P>SOLUTION: This semiconductor device has an electrode 4, which is placed on a surface 2a of a substrate 2 and is electrically connected to a function element 5 within the corresponding surface, a through-hole 3 drilled on the substrate 2, to expose the electrode 4 from the other surface 2b to the surface 2a on the substrate 2, a conductive region which is formed to cover the side 3a within the through-hole 3 and the exposed region 4a of the electrode 4 and is connected electrically to the electrode 4, and a reinforcing material provided adjacent to the corresponding conductive region. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a semiconductor device including a functional element disposed on one surface of a semiconductor substrate, and a through electrode provided so as to be electrically connected to the functional element, and a method for manufacturing the semiconductor device.

  In recent years, electronic devices such as mobile phones have been improved in functionality, and in electronic devices such as ICs and LSIs and optical devices such as OEICs and optical pickups used in these devices, the devices themselves have been reduced in size and functionality. Development for planning is underway at various locations. For example, a technique of stacking such devices has been proposed. Specifically, a substrate on which one functional element is provided on one surface is provided from one surface of the substrate to the other surface. A technique using a penetrating electrode that penetrates may be mentioned.

In addition, copper, silver, and the like are expected as next-generation materials as wiring materials for these substrates.
In particular, copper is most expected and used as a wiring material because of its low specific resistance, high electromigration resistance compared to aluminum alloys, and low cost compared to silver.

  In general, a damascene process is conventionally used as a wiring forming method using copper plating. In a substrate obtained by using this damascene process, the mounting substrate is further integrated by reducing the opening diameter of the hole formed in the insulating layer.

FIG. 9 is a partial cross-sectional view schematically illustrating an example of a semiconductor device using a conventional substrate.
In the semiconductor substrate 100 shown in FIG. 9A, a substrate 101 made of a hard material such as ceramics or silicon, a through hole 102 provided through both surfaces of the substrate 101, and a hole in the through hole 102 are filled. A conductive portion 103 made of copper or the like; an electrode 104 disposed on one surface of the semiconductor substrate 100 so as to be exposed in the through hole 102; and an IC chip or an optical element disposed on the semiconductor substrate 100 And a wiring circuit 106 electrically connected to the electrode 104 and the functional element 105 on the substrate 101.
In the semiconductor substrate 100, the electrode 104 and the functional element 105 are electrically connected by the wiring portion 106, and both surfaces of the substrate can be electrically connected via the conductive portion 103 electrically connected to the electrode 104. It has become.

  For example, when manufacturing the semiconductor substrate 100 as shown in FIG. 9A using a damascene process, a method of forming a through hole 102 in the substrate 101 in advance and embedding a copper material in the through hole 102 (for example, a patent) The copper wiring is formed in the hole according to Reference 1). Through this copper plating process, the inside of the through hole 102 is completely filled with metal, and the conductive portion 103 penetrating both surfaces of the substrate 101 is formed to obtain the semiconductor substrate 100.

  Further, after forming the conductive portion 103, the copper plating layer formed on the surface of the substrate 101 can be patterned to be used as a wiring circuit, and a resin is applied to the surface of the substrate as a protective layer for the wiring. (For example, see Patent Documents 2, 3, and 4).

  By the way, in a semiconductor device or the like using the substrate as described above, the aspect ratio of the through hole 102 (ratio of the hole depth to the hole diameter) tends to increase with further integration. For this reason, when the copper plating is performed, the inside of the through hole 102 is not completely filled, and a void 107 (FIG. 9B) in which a closed space is generated or a seam in which a space connected to the outside is generated is generated. There was a problem that a plating defect called 108 (FIG. 9C) occurred.

The above-described void 107 and seam 108 are generated by the mechanism described below.
When the conductive portion 103 is formed in the through hole 102 by copper plating, the void 107 is formed when the opening side is first closed in a state where the plating does not grow uniformly along the inner wall in the through hole 102. (FIG. 9B) occurs, and the plating grows uniformly along the inner wall, but cannot be completely filled in the end, and the space is linear from the opening toward the bottom of the through hole. Seam 108 (FIG. 9C) is generated.
Usually, when performing copper plating, an acidic plating solution is often used. However, when the plating solution remains in the void 107 or the seam 108, the plating solution dissolves copper (the conductive portion 103) with the passage of time. By changing the quality, the long-term reliability of the substrate may be lowered. In addition, when there is a process including a thermal process after the formation process of the conductive part 103, the internal liquid (plating solution) is rapidly vaporized and the volume expands. There was a problem that breakage of the wire 104 and breakage of the wafer (substrate 101) occurred.
JP 2003-178999 A Japanese Patent Laid-Open No. 5-175652 Japanese Patent Laid-Open No. 11-354671 JP 2001-339165 A

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a semiconductor device and a method for manufacturing the semiconductor device in which poor electrical connection between a conductive portion and an electrode is unlikely to occur.

In order to solve the above-described problem, a semiconductor device according to claim 1 of the present invention is provided on one surface of a substrate and electrically connected to a functional element in the surface, and on the other surface of the substrate. A through hole opened in the substrate, a side surface in the through hole and an exposed portion of the electrode so as to expose the electrode disposed on one surface from the surface, and electrically connected to the electrode It is characterized by comprising a connected conductive part, and a reinforcing material arranged so as to be in contact with the conductive part.
A semiconductor device according to a second aspect of the present invention is the semiconductor device according to the first aspect, wherein the reinforcing material is embedded in a through hole covered with the conductive portion.
A semiconductor device according to a third aspect of the present invention is the semiconductor device according to the first or second aspect, wherein the conductive portion extends to the other surface.
A semiconductor device according to a fourth aspect of the present invention is the semiconductor device according to the third aspect, wherein the reinforcing material is arranged so as to cover at least a part of the conductive portion that is extended. Yes.
According to a fifth aspect of the present invention, in the semiconductor device according to any one of the first to fourth aspects, an insulating portion is disposed between the side surface in the through hole and the conductive portion. It is a feature.
According to a sixth aspect of the present invention, there is provided a method for manufacturing a semiconductor device, comprising: an electrode disposed on one surface of a substrate and electrically connected to a functional element in the surface; A through hole opened in the substrate so that the electrode disposed on the surface is exposed, a conductive surface that is disposed so as to cover the side surface in the through hole and the exposed portion of the electrode, and is electrically connected to the electrode And a reinforcing device disposed so as to be in contact with the conductive portion, wherein the electrode disposed on one surface is exposed from the other surface of the substrate, Forming a through hole in the substrate, forming a conductive part so as to be electrically connected to the electrode so as to cover a side surface in the through hole and the exposed part of the electrode, and the conductive part. And a step of forming a reinforcing material so as to cover It is.
The method for manufacturing a semiconductor device according to claim 7 of the present invention is the method for manufacturing a semiconductor device according to claim 6, wherein the step of forming the conductive portion is performed together with the side surface in the through hole and the exposed portion of the electrode. The method is characterized in that the conductive portion is provided so as to cover the other surface.

According to the semiconductor device of the present invention, the electrode disposed on one surface of the substrate and electrically connected to the functional element in the surface, and the electrode disposed on the one surface from the other surface of the substrate are provided. A through hole opened in the substrate so as to be exposed, a conductive part disposed so as to cover a side surface in the through hole and the exposed part of the electrode, and electrically connected to the electrode; and the conductive part And a reinforcing material arranged so as to be in contact with.
According to the method of manufacturing a semiconductor device of the present invention, the step of forming a through hole in the substrate so that the electrode disposed on the one surface from the other surface of the substrate is exposed, At least a step of forming a conductive portion so as to be electrically connected to the electrode so as to cover the side surface and the exposed portion of the electrode, and a step of forming a reinforcing material so as to cover the conductive portion. Do it.
As a result, even when the semiconductor substrate is used in a thermal cycle or in a high temperature environment, stress is applied to the thermal strain caused by the difference in thermal expansion coefficient between the substrate material and the electrode and conductive part material. Can be relaxed, and the electrode is not broken.
In addition, since the conductive portion is covered with the reinforcing material, oxidation, deformation, and deterioration of the conductive portion can be prevented.
Further, it is possible to prevent the plating solution from remaining due to the formation of voids, seams, and the like in the through-holes, and the residual solution from being rapidly vaporized in a process including a thermal process, thereby destroying the electrode and the substrate.
Accordingly, a highly reliable semiconductor device can be obtained without causing poor electrical connection between the conductive portion and the electrode, destruction of the substrate, and the like.

The best mode for carrying out a semiconductor device according to the present invention will be described below with reference to the drawings.
1 to 5 are cross-sectional views showing an example of the semiconductor device 10 of this embodiment.

As shown in FIG. 1, the semiconductor device 10 is disposed on one surface 2 a of the substrate 2, the electrode 4 electrically connected to the functional element 5 in the one surface 2 a, and the other of the substrate 2. The through hole 3 opened in the substrate 2, the side surface 3a in the through hole 3, and the exposed portion 4a of the electrode 4 are covered so that the electrode 4 disposed on the one surface 2a is exposed from the surface 2b. The conductive portion 16 is electrically connected to the electrode 4 and the reinforcing member 17 is disposed so as to be in contact with the conductive portion 16.
In FIG. 1, an example in which the side surface 3 a of the through hole 3 is entirely covered with the conductive portion 16 is shown.
In the example shown in FIG. 1, the reinforcing material 17 is disposed so as to fill the through hole 3 while being in contact with the conductive portion 16.

The substrate 2 is made of an insulating hard material such as a semiconductor base material made of silicon (Si), a glass base material, a ceramic base material, or the like.
The thickness of the substrate 2 is, for example, about several hundred μm.
In the example shown in FIG. 1, the substrate 2 is made of a semiconductor base material such as Si, and the surface layer portion 2 c of the side surface 3 a of the through hole 3 is insulated in addition to the one surface 2 a and the other surface 2 b of the substrate 2. It is configured to form an area. Further, when the substrate is formed of a semiconductor substrate, as in the example shown in FIG. 4, the insulating portion 9 is disposed between the through hole 3 and the conductive portion 16, and the semiconductor substrate 12 and the conductive portion 16 are electrically connected. It is good also as a structure insulated.
Further, when the substrate material is made of the above-described insulating hard material, the side surface 3a in the through hole 3 is an insulator, so that the through hole 3 provided in the substrate 21 and the conductive material are electrically conductive as in the example shown in FIG. It can be set as the structure which the part 26 contact | connected.

As shown in FIG. 1, the through hole 3 is opened in the substrate 2 so that an electrode 4 (described later) arranged on the one surface 2a is exposed in the hole from the other surface 2b. Become.
The diameter of the through hole 3 is, for example, about several tens of μm.
Further, the number of through holes 3 provided on the substrate 2 is not particularly limited.

The electrode 4 is disposed on one surface 2 a of the substrate 2, and is provided so that the exposed portion 4 a is exposed from the one opening portion 31 of the through hole 3 into the hole.
The electrode 4 is electrically connected to a later-described functional element 5 in the one surface 2a through a later-described wiring circuit 8.
The material of the electrode 4 is preferably a material having excellent conductivity such as aluminum (Al), copper (Cu), an aluminum-silicon (Al-Si) alloy, an aluminum-silicon-copper (Al-Si-Cu) alloy, or the like. Used for.

In this embodiment, the functional element 5 is composed of an optical element such as an IC chip or a CCD element.
Other examples of the functional element 5 include a micro relay, a micro switch, a pressure sensor, an acceleration sensor, a high frequency filter, a micro mirror, a micro reactor, a μ-TAS, a DNA chip, a MEMS device, a micro fuel cell, and the like. It is done.

The conductive portion 16 works effectively as a conductor by being disposed on at least a part of the side surface 3 a in the through hole 3.
In the example shown in the cross-sectional view of FIG. 1, the conductive portion 16 is disposed so as to cover the entire side surface 3 a, but is not limited thereto. For example, the conductive part 16 may be configured to be disposed on a part of the side surface 3 a between the one surface 2 a and the other surface 2 b of the substrate 2.

As the material of the conductive portion 16, it is preferable to use a material having excellent conductivity. Further, it is more preferable that the conductive portion 16 is excellent in adhesiveness with the electrode 4 and a material that does not diffuse the elements constituting the conductive portion 16 into the electrode 4 or the substrate 2 is used.
For example, when the conductive portion 16 is a single layer as in the example shown in FIG. 1, it is desirable to use the same material as the electrode 4. If a metal material such as Al, Cu, Ni, or Au is used, the conductive portion 16 is conductive. And the adhesiveness with the electrode 4 is preferable.
In addition, when the conductive portion 16 has a multilayer structure composed of two or more kinds of metal materials or a structure in which films of different materials are laminated, a material having excellent adhesion to the material forming the electrode 4 can be formed on the outer layer. A metal material (barrier metal) that can prevent element movement (diffusion) from occurring between the conductive portion 16 and the electrode 4 or the substrate 2 is disposed, and a metal having high conductivity is disposed in the inner layer. A configuration is preferable.
Further, between the conductive portion 16 and the through-hole 3 (or the insulating portion 9) or between the conductive portion 16 and the reinforcing material 17 described later, for example, a material having a stress relaxation action or a barrier for preventing element movement. A configuration in which an intermediate layer having a multilayer structure in which metal or a material having excellent adhesion is arranged may be provided.
For example, when the conductive portion 16 is Cu, examples of the barrier metal include TaN, Ta, W, WN, TiN, TiSiN, etc., and each has excellent adhesion. In addition to these materials, Cr, TiW, and the like can be cited as barrier metals with high adhesion.

The reinforcing member 17 is disposed in the through hole 3 so as to be in contact with the inner surface of the conductive portion 16 and is made of a nonconductive material.
The reinforcing material 17 functions as a buffer material against stress generated by thermal strain or the like on the conductive portion 16 and overcoats the conductive portion 16 so as not to be exposed to the outside air.
The reinforcing member 17 is preferably formed so as to completely cover the entire inner surface of the conductive portion 16 in terms of overcoating the conductive portion 16 described above, and is filled (embedded) as in the example shown in FIG. It is preferable from the point of relieving the stress which arises in the electroconductive part 16 mentioned later.

As the material of the reinforcing member 17, unlike the metal material forming the conductive portion 16, it is preferable to use a non-conductive material having a stress relaxation action such as a resin or a conductive resin containing a metal powder. A resin material such as a curable epoxy resin may be used.
Further, when a conductive resin is used as the material of the reinforcing agent 17, the reinforcing material 17 disposed on the inner surface side of the conductive portion 16 even when the conductive portion 16 is cracked and becomes electrically disconnected. The electrically connected state can be maintained by (conductive resin).
In addition, when a solvent-free resin is used as the material of the reinforcing material 17 and the reinforcing material 17 is arranged by vacuum printing, the forming process and the operation of the reinforcing material 17 become smooth, and there are defects such as voids. Can be prevented. In this case, for example, a special vacuum printing system (model number: VPES-HA-IV) manufactured by Sanyu Rec Co., Ltd. can be used as the vacuum printing apparatus.

In the semiconductor device 10 of the present embodiment, when the conductive portion 16 is formed in the through hole 3, the metal material is not completely filled, and an opening is provided (see FIG. 1). Defects such as voids and seams (see FIG. 9) are highly likely to occur in a closed state with no openings, so these defects do not occur if the configuration is provided with openings. Further, by providing the opening, it is possible to clean and remove the liquid even when the liquid is accumulated inside.
Furthermore, the semiconductor device 10 has a configuration in which the reinforcing material 17 is disposed so as to cover the conductive portion 16 in the through hole 3. In the example illustrated in FIG. 1, the semiconductor device 10 is provided so as to fill the through hole 3. Yes. As a result, stress generated in the conductive portion 16 can be relieved, and oxidation and deformation caused by the conductive portion 16 being exposed to the outside air can be prevented.

  Further, when the semiconductor device is exposed to a thermal cycle or a high temperature environment, thermal distortion may occur due to a difference in thermal expansion coefficient between the material of the substrate 2 and the material of the conductive portion 16. In the semiconductor device 1 of the present embodiment, stress can be relieved by arranging a different material different from metal, specifically a reinforcing material made of a resin material, in the space 3b formed on the inner surface side of the conductive portion 16, The breakage of the conductive portion 16 and the electrode 4 can be prevented, and the reliability can be dramatically improved.

The reinforcing material may be configured as a reinforcing material 37 in which the conductive portion 36 is covered along the inner surface of the conductive portion 36 as in the example shown in FIG. Like the example shown, it is good also as a structure as the reinforcing material 47 with which only the lower part in the through-hole 3 was filled.
Further, as shown in the example shown in FIG. 4B, the inner surface of the reinforcing member 67b disposed so as to be covered along the inner surface of the conductive portion 66 is configured as a reinforcing member 67 that is disposed by filling the reinforcing member 67a. Also good. In this case, it is preferable to use a material having a greater stress relaxation effect for the reinforcing material 67b as the outer layer.

The wiring circuit 8 is disposed on the substrate 2 and electrically connects the electrodes 4 and the functional elements 5 to form a circuit.
As the material of the wiring circuit 8, the same material as that of the electrode 4 may be used. Aluminum (Al), copper (Cu), aluminum-silicon (Al-Si) alloy, aluminum-silicon-copper (Al-Si-Cu) ) A material having excellent conductivity such as an alloy is suitable.

  The semiconductor device 10 of the present embodiment may have a configuration in which another substrate such as a glass substrate is bonded to one surface 2a of the substrate 2 as necessary.

Hereinafter, a method for manufacturing the semiconductor device 10 of the present embodiment will be described with reference to FIGS.
FIG. 6 is a schematic cross-sectional view showing the semiconductor device 10 of this embodiment in the order of steps, and a part of the semiconductor device 10 is also viewed from the top for easy understanding.
In the manufacturing method of the semiconductor device 10 of the present embodiment, the electrode 4 disposed on one surface 2a of the substrate 2 and electrically connected to the functional element 5 in the surface, and the other surface 2b of the substrate 2 are used. The through-hole 3 opened in the substrate 2 and the side surface 3a in the through-hole 3 and the exposed portion 4a of the electrode 4 are arranged so as to expose the electrode 4 arranged on the one surface 2a. A method for manufacturing a semiconductor device 10 comprising a conductive portion 16 electrically connected to an electrode 4 and a reinforcing member 17 disposed so as to be in contact with the conductive portion 16, wherein the other surface 2 b of the substrate 2 is provided. Step A for forming the through hole 3 in the substrate 2 so that the electrode 4 disposed on the one surface 2a is exposed (see FIGS. 6A and 6B), and the side surface in the through hole 3 3a and a process for forming the conductive portion 16 so as to be electrically connected to the electrode 2 so as to cover the exposed portion 4a of the electrode 4 B (see FIG. 6 (c)), a step C of forming a reinforcing member 17 so as to cover the conductive portion 16 (see FIG. 6 (d)), is characterized by comprising at least comprises a.

With the above-described configuration, as shown in FIG. 1, the conductive portion 16 is provided so as to cover at least a part of the side surface 3 a in the through hole 3 and the exposed portion 4 a of the electrode 4, and covers the inner surface of the conductive portion 16. Thus, it is possible to efficiently manufacture the semiconductor device 10 that is filled and provided with the reinforcing material 17.
In addition, since the exposed portion 4a of the exposed electrode 4 is covered with the conductive portion 16 and then the conductive portion 16 is covered with the reinforcing material 17 after the through hole 3 is formed, the conductive portion 16 is exposed to the outside air. It can be overcoated and protected without becoming.

  In the following description, an example in which a non-conductive material such as glass or ceramic material is used as the material of the substrate 2 of the semiconductor device 10 will be described.

(A) Process A
FIG. 6A shows a substrate 2 made of glass or ceramic material, completed after a normal manufacturing process, an electrode 4 for electrical connection with the outside, a photodiode group or a microlens group, Alternatively, a semiconductor device is shown in which a functional element 5 made of an IC chip or the like, and a wiring circuit 8 for electrically connecting the electrode 4 and the functional element 5 are arranged.
In this example, the thickness of the substrate 2 is 200 μm, and the electrode 4 and the wiring circuit 8 are made of aluminum (Al) metal. The electrode 4 is a square of 100 μm × 100 μm.

  First, as shown in FIG. 6B, an electrode is formed from a position facing the electrode 4 on the other surface 2b between the one surface 2a on which the functional element 5 and the like are arranged and the other surface 2b. Through-holes 3 penetrating the substrate 2 are formed until reaching the back surface of 4 (that is, the surface overlapping the one surface 2a of the electrode 4). At this time, the through hole 3 is formed so that at least a part of the back surface of the electrode 4 is exposed as the exposed portion 4a from the opening 31 into the hole.

  In this example, through holes 3 which are fine holes having a hole diameter of 80 μm and a depth of 200 μm are formed by removing the portion of the non-conductive material forming the substrate 2 where the electrodes 4 are disposed by etching.

(B) Process B
Next, as shown in FIG. 6C, a seed layer of the conductive portion 16 made of a metal material is formed so as to cover the side surface 3 a in the through hole 3 and the exposed portion 4 a of the electrode 4. In this example, the metal material forming the seed layer is formed by sputtering using Cr on the outer side in contact with the side surface 3a and Cu on the inner side, but may be formed by MOCVD, electroless plating, or the like. . Thereby, the side surface 3a in the through-hole 3 and the exposed portion 4a of the electrode 4 are covered with the seed layer. And the electroconductive part 16 is formed by plating Cu to the inner surface side of the said seed layer.
In this example, an example in which the conductive portion 16 is formed so as to cover the entire exposed portion 4a and the side surface 3a has been described. However, the conductive portion 16 includes the one surface 2a of the substrate 2 and the other side. What is necessary is just to be distribute | arranged between the surface 2b, and to be electrically connected with the electrode 4, for example, the electroconductive part formed in linear form on the surface of the side surface 3a may be sufficient.

(C) Process C
Next, as shown in FIG. 6D, the reinforcing material 17 is formed so as to cover the inner surface side of the conductive portion 16 formed in the through hole 3 with a resin material. The reinforcing material 17 described in this example is formed using a thermosetting epoxy resin as a resin material and having an opening 17a toward the other surface 2b.
As a method of forming the reinforcing member 17, for example, a resin material such as a solvent-free resin is printed on the substrate 2 on which the conductive portion 16 is formed by a vacuum printing method, thereby the inner surface of the conductive portion 16 in the through hole 3 is formed. A method of pushing the resin into the substrate may be used.
Further, if a method of directly applying resin to the inner surface of the conductive portion 16 in the through-hole 3 using a nozzle is used, the reinforcing material 17 can be formed by applying an appropriate amount of the resin material and reducing the pressure together with the substrate 2. it can.

  Through the above-described steps, the semiconductor device 10 of this embodiment can be manufactured efficiently.

  In this example, the size and shape of the electrode 4 is a 100 μm square, but the shape of the electrode 4 is not limited to this, and may be any shape such as a circle, an ellipse, a triangle, and a rectangle. Any size may be used as long as the function as an electrode used for electrical wiring can be maintained. Furthermore, although the material of the electrode 4 and the wiring circuit 8 is also Al in this example, it is not limited to this, but copper (Cu), aluminum-silicon (Al-Si), aluminum-silicon-copper (Al-Si) Any other wiring material such as -Cu) may be used.

  In this example, the diameter of the through hole 3 is formed as a circle of 80 μm. However, the present invention is not limited to this, and the entire contact surface between the through hole 3 and the electrode 4 is located inside the electrode 4. Any size may be used as long as it is a large size, and the shape may be not only a circle but also any shape such as an ellipse, a rectangle, a triangle, and a rectangle.

In the semiconductor device manufacturing method of the present embodiment, a semiconductor substrate using a semiconductor wafer made of silicon (Si) or the like as the material of the substrate 2 is described as an example. In this case, as described above, An insulating portion 9 made of, for example, SiN or SiO ₂ can be formed on the side surface 3a in the through hole 3 formed in the semiconductor substrate 12 (see FIG. 4). By forming the conductive portion 16 so as to cover the side surface of the insulating portion 9 and the exposed portion 4a of the electrode 4, the semiconductor substrate 12 and the conductive portion 16 can be electrically insulated.
For forming the through hole 3 and the insulating portion 9 in the semiconductor substrate 12, a conventional method can be used.
In the case where a non-conductive material such as a glass material is used for the substrate, it is not necessary to form the insulating portion 9.

  In this example, a resin material is used as the material of the reinforcing material 17, but the present invention is not limited to this, and a metal material having a stress relaxation action may be used as the material of the reinforcing material 17.

As described above, according to the semiconductor device 10 of the present embodiment, the electrode 4 disposed on one surface 2a of the substrate 2 and electrically connected to the functional element 5 in the surface, and the substrate 2 A through-hole 3 opened in the substrate 2 such that the electrode 4 disposed on the one surface 2a is exposed from the other surface 2b of the substrate, and the side surface 3a in the through-hole 3 and the exposed portion 4a of the electrode 4 The conductive portion 16 is disposed so as to cover the conductive portion 16 and is electrically connected to the electrode 4, and the reinforcing member 17 is disposed so as to be in contact with the conductive portion 16.
Further, according to the method for manufacturing the semiconductor device 10 of the present embodiment, the through hole 3 is formed in the substrate 2 so that the electrode 4 disposed on the one surface 2a is exposed from the other surface 2b of the substrate 2. Step A for forming, Step B for forming the conductive portion 16 so as to be electrically connected to the electrode 4 so as to cover the side surface 3a in the through hole 3 and the exposed portion 4a of the electrode 4, and the conductive portion 16 And at least a step C of forming the reinforcing member 17 so as to cover it.
Thereby, even when the semiconductor device 10 is used in a thermal cycle or a high temperature environment, it is caused by a difference in thermal expansion coefficient between the material forming the substrate 2 and the material forming the electrode 4 and the conductive portion 16. The stress can be relaxed with respect to the thermal strain generated, and the electrode is not broken.
In addition, since the conductive portion 16 is covered with the reinforcing material 17, oxidation, deformation, and deterioration of the conductive portion 16 can be prevented.
Further, it is possible to prevent the plating solution from remaining due to the formation of voids, seams, and the like in the through-holes, and the residual solution from being rapidly vaporized in a process including a thermal process, thereby destroying the electrode and the substrate.
Therefore, a highly reliable semiconductor device 10 can be obtained without causing an electrical connection failure between the conductive portion 16 and the electrode 4 or destruction of the substrate 2.

In the semiconductor device of the present embodiment, the example in which the entire conductive portion 16 and the reinforcing material 17 are accommodated in the through hole 3 as illustrated in FIG. 1 is described. However, in the example illustrated in FIG. Thus, a semiconductor device in which the conductive portion extends to the other surface 2 b of the substrate 2 may be used. In the example of illustration, the electroconductive part 26 is extended as extended part 26a, 26b on the other surface 2b. By adopting such a configuration, the wiring on the other surface 2b side can also be formed in a lump, and the manufacturing process can be reduced.
Further, as in the example shown in FIG. 5, the reinforcing material 57 may be arranged so as to cover at least a part of the conductive portion 56 that is extended. In the illustrated example, the conductive portion 56 is extended as extended portions 56a and 56b on the other surface 2b, and the reinforcing member 57 is extended as covering portions 57a and 57b on the other surface 2b. The covering portions 57a and 57b are formed so as to cover the extending portions 56a and 56b, respectively. By setting it as such a structure, a reinforcing material can serve as the overcoat layer for forming the bump mentioned later.

  When manufacturing a semiconductor device in which a conductive portion is extended on any surface of the substrate 2 as shown in FIGS. 2 and 5, the step of forming the conductive portion 26 (56) is performed through the through hole 3. The side surface 3a of the electrode 4 and the exposed portion 4a of the electrode 4 may be provided so that the extended portions 26a and 26b (56a and 56b) of the conductive portion cover the other surface 2b.

Further, as shown in FIG. 5, the semiconductor device of this embodiment has an overcoat layer (covering portion) for protecting the conductive portion 56 and the wiring circuit 8 by extending a reinforcing material 57 on the surface of the substrate 2. 57a, 57b), the covering portions 57a, 57b provided with the reinforcing material 57 can be integrally formed as an overcoat layer while covering the inner surface of the conductive portion 56 with the reinforcing material 57, and the working process Can be reduced.
At this time, by providing an opening 57c through which the conductive portion 56a can be looked into in a part of the covering portion, the solder bump 58 can be provided in the opening 57c. In other words, by forming the reinforcing material 57 and the covering portions 57a and 57b as one body, an overcoat layer that conventionally had to be provided separately is formed together, so that adhesion is improved and processes are reduced. As a result, cost reduction can be realized. Further, in this case, the material covering the conductive portion 56 and the material overcoating the surface of the substrate 2 are the same material and are formed as a seamless continuous body. It is possible to prevent peeling of the overcoat layer that occurs in moisture absorption, high temperature environment, and the like.
Further, when the reinforcing member 57 and the covering portions 57a and 57b to be the overcoat layers are integrally formed, if a photosensitive resin is used as the material, the covering portion having a highly accurate pattern shape according to the wiring on the surface of the substrate 2 57a and 57b can be formed.

  In addition, the semiconductor device according to the present embodiment includes a conductive portion so as to cover only the side surface of the through hole even when the through hole is provided at a position where no electrode is provided on the substrate. The above-described effects can be obtained by adopting a configuration in which the reinforcing material is arranged so as to cover and touch.

  Examples of the semiconductor device according to the present invention will be described below with reference to FIGS.

[Production process]
A silicon semiconductor substrate having a thickness of 200 μm and a size of 6 inches (a circle having a diameter of 150 mm) was used as a substrate, and electrodes, functional elements, and wiring circuits (not shown) were arranged on one surface of the substrate. An Al pad was used as the electrode.
And the through-hole whose hole diameter is 80 micrometers was formed in the board | substrate by DRIE (etching process) so that the electrode distribute | arranged to one side might be exposed from the other side of a board | substrate. A SiO ₂ film was formed on the side surface of the through hole as an insulating portion (not shown).
And after forming a conductive part by arranging a seed layer (Cr) and a copper material so as to cover the side surface in the through hole and the exposed part of the electrode, the inner surface of the conductive part is filled with a thermosetting epoxy resin. Thus, a reinforcing material was formed by embedding the semiconductor device according to the present invention (Example) (see FIG. 8A).

  Further, in the same manner as described above, after the through hole is formed in the substrate, a conductive portion is formed so as to be electrically connected to the electrode so as to cover the side surface in the through hole and the exposed portion of the electrode. A conventional semiconductor device (comparative example) was obtained with a space on the inner surface side of the part (see FIG. 7A).

[Evaluation test]
Each of the above samples was used in the quantity of Example n = 260 and Comparative Example n = 100, and the thermal cycle test was performed in total of 100 cycles with 1 hour as a total of −40 ° C .: 30 minutes and 125 ° C .: 30 minutes. : Performed for 100 hours.
After the thermal cycle test, the presence or absence of breakage of the electrode of each sample was observed and confirmed with a microscope.

[Evaluation results]
As shown in FIG. 8C, the semiconductor device according to the present invention does not break the electrode even when the thermal cycle test under the above conditions is performed, and the initial state (see FIG. 8B). ) Did not change. Of the 260 samples in the example, no sample had electrode breakage.

On the other hand, as shown in FIG. 7C, in the conventional semiconductor device, after performing the thermal cycle test under the above conditions, breakage of electrodes occurred in 78 of 100 samples of the comparative example.
In the initial state shown in FIG. 7 (b), the electrode surface is not broken, but after the thermal cycle test, as shown in FIG. 7 (c), the electrode surface has a circular shape along the through hole and the conductive portion. The fracture mark is generated. Further, as shown in the sectional view of FIG. 7D, the portion of the electrode in contact with the conductive portion and the portion in contact with the substrate are completely broken.

  From the above results, even when the semiconductor device according to the present invention is used in a thermal cycle or a high temperature environment, it is caused by the difference in thermal expansion coefficient between the substrate material and the electrode and conductive part material. It is clear that the stress can be relieved by arranging a reinforcing material made of another material such as resin in the space on the inner surface side of the conductive part against the generated thermal strain, and the electrode is not broken and has high reliability. became.

It is sectional drawing explaining an example of the semiconductor device which concerns on this invention. It is sectional drawing explaining the other example of the semiconductor device which concerns on this invention. It is principal part sectional drawing explaining the other example of the semiconductor device which concerns on this invention. It is principal part sectional drawing explaining the other example of the semiconductor device which concerns on this invention. It is principal part sectional drawing explaining the other example of the semiconductor device which concerns on this invention. It is process drawing explaining an example of the manufacturing method of the semiconductor device which concerns on this invention. It is the schematic explaining the state at the time of performing a heat cycle test using the conventional semiconductor device. It is the schematic explaining the state at the time of performing a thermal cycle test using the semiconductor device concerning the present invention. It is sectional drawing explaining the conventional semiconductor device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2,12 ... Board | substrate, 2a ... One side, 2b ... The other side, 3 ... Through-hole, 3a ... Side surface, 4 ... Electrode, 4a ... Exposed part, 5 ... Functional element, 16, 26, 36, 46, 56 ... conductive parts, 26a, 26b, 56a, 56b ... extension parts, 17, 27, 37, 47, 57 ... reinforcing materials, 27a, 27b, 57a, 57b ... covering parts, 8 ... wiring circuits, 9 ... insulating parts, 10, 20 ... Semiconductor device

Claims (7)

An electrode disposed on one surface of the substrate and electrically connected to a functional element in the surface;
A through hole opened in the substrate so that the electrode disposed on the one surface from the other surface of the substrate is exposed;
A conductive portion disposed so as to cover the side surface in the through hole and the exposed portion of the electrode, and electrically connected to the electrode;
A reinforcing material disposed so as to be in contact with the conductive portion;
A semiconductor device comprising:   The semiconductor device according to claim 1, wherein the reinforcing material is embedded in a through hole covered with the conductive portion.   The semiconductor device according to claim 1, wherein the conductive portion extends to the other surface.   The semiconductor device according to claim 3, wherein the reinforcing material is disposed so as to cover at least a part of the conductive portion that is extended.   5. The semiconductor device according to claim 1, wherein an insulating portion is disposed between a side surface in the through-hole and the conductive portion. An electrode that is disposed on one surface of the substrate and is electrically connected to a functional element in the surface and an electrode disposed on the one surface from the other surface of the substrate are opened in the substrate. A through hole, a conductive part electrically connected to the electrode, and a reinforcing member arranged to be in contact with the conductive part, covering the side surface in the through hole and the exposed part of the electrode A method for manufacturing a semiconductor device comprising:
Forming a through hole in the substrate so that the electrode disposed on the one surface from the other surface of the substrate is exposed;
Forming a conductive portion so as to be electrically connected to the electrode so as to cover the side surface in the through hole and the exposed portion of the electrode;
Forming a reinforcing material to cover the conductive portion;
A method for manufacturing a semiconductor device, comprising: 7. The semiconductor device according to claim 6, wherein the step of forming the conductive portion is provided so that the conductive portion covers the other surface together with the side surface in the through hole and the exposed portion of the electrode. Manufacturing method.

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