JP2007092036A - Polymer film, method for producing the same, and laminate for circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polymer film for a circuit board, having concavities and convexities on a surface thereof, to provide a laminate for the circuit board, given by applying an electrically-conductive metal to the surface of the polymer film, and to provide a method for producing the laminate. <P>SOLUTION: This polymer film has the concavities and the convexities on the surface, wherein motif parameters which are used for evaluating shape of the concavities and the convexities of the film, are stipulated in JIS B0631 (2000), and comprise a depth of roughness motif and a length of the roughness motif satisfy conditions (1) and (2) as follows: (1) an average depth of the roughness motif is in a range of 0.4-3.0 μm; and (2) X which is defined as a ratio of an average depth (μm) of the roughness motif to an average length (mm) of the roughness motif is in a range of 13 to 60. A method for producing the polymer film has at least a process for conducting roughening treatment of the surface of the polymer film by a sandblasting procedure, wherein the roughening treatment is conducted in such a state that a reverse surface to a roughened surface of the polymer film is adhered to a support. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a polymer film having a predetermined concavo-convex shape on the surface, a method for producing the polymer film, and a laminate for a wiring board in which a conductive metal film is formed on the surface of the polymer film.

  In an electronic device or the like, a printed wiring board having a circuit pattern formed on a base material is used to electrically connect electronic components. In particular, a flexible wiring board made of a laminate in which a copper foil is thermocompression-bonded or bonded onto a flexible base film (polyimide resin film or the like) is often used for a portion requiring bending.

  As a manufacturing method of the laminate, a casting method in which polyimic acid, which is a polyimide precursor, is applied to copper foil and heated, a method in which metal is deposited on the polyimide resin film by sputtering, a polyimide resin film and a copper foil are used. A typical example is a laminating method in which thermoplastic polyimide is used for bonding.

  As a laminating method using a liquid crystal polymer having excellent electrical properties, a technique for manufacturing a laminate in which a copper foil surface is roughened to form irregularities and a base film is heat-pressed thereon is disclosed in Patent Document 1. .

  In recent years, a method of forming a metal deposition film on a base film without using a copper foil has attracted attention for the formation of a fine pattern. This method is advantageous for forming a fine circuit pattern because the metal film can be thinned. For flexible wiring board applications, a method of forming a metal deposition film on a polyimide resin film by sputtering has been put into practical use. However, this method has a problem that the adhesion strength between the film and the metal deposit film is low.

  As a method for depositing a metal film without using a sputtering method, a method of roughening the surface of a substrate film and applying electroless plating thereto has been studied. As a roughening method of the base film surface, an etching method (Patent Document 2) that forms many fine holes on the film surface with an etching solution (Patent Document 2), and a blast method that mechanically forms an uneven shape on the film surface (Patent Document 3, 4) is known.

JP-A-5-345387 JP 2004-307980 A JP 11-320753 A JP 2000-124583 A

  However, the etching method has a problem that the film surface undergoes a chemical change and a surface fragile layer (Weak Boundary Layer) is easily generated. In particular, in the polyimide resin film, a low molecular weight polymer generated during film formation, an oligomer derived from a decomposition product, and the like move to the surface, and a surface fragile layer is generated.

  On the other hand, a drive blast method and a wet blast method are known as blast methods that do not generate a fragile layer on the surface. The drive blast method is typically a sand blast method in which an abrasive is collided with a base film at a high speed to mechanically form an uneven shape. In the sand blast method, the base film of a rigid printed circuit board is used. Although it is sometimes used in combination with an etching method for roughening, a flexible printed circuit board cannot obtain uniform roughening because the base film is thin. There was a problem that pinholes occurred through the film.

  The wet blasting method is a method in which an abrasive is mixed with a liquid such as water and collided with the surface of the polymer film by compressed air. This wet blasting method is less likely to generate pinholes and is more stable than the drive blasting method. However, as with the drive last method, when the polymer film is thin, there is a problem that uniform roughening cannot be obtained.

In these conventional methods, the film is floated in a hollow state with tension applied to both ends, and the abrasive is collided with the compressed air or pressurized water containing the abrasive is injected. For this reason, the abrasive material spray causes the film to repeat a slight amplitude movement in the abrasive material injection direction. As a result, even if the injection pressure, injection amount, etc. are constant, the collision speed of the abrasive material to the film varies. It was difficult to obtain a predetermined uneven shape. Furthermore, the problem that the abrasive material penetrates through the film tends to occur, and this is more remarkable as the film is thinner.
For this reason, the present inventors have intensively studied, and by performing sandblasting in a state where the back surface of the polymer film to be roughened is in close contact with the support base, an extremely uniform uneven shape can be obtained. I found out.

On the other hand, the uneven shape of the film surface roughened by the blast method is generally the arithmetic average roughness (Ra), maximum height (Ry or Rmax), and ten-point average roughness specified in JIS B0601 (1994). Although it is often evaluated by (Rz), these values have a large variation after the roughening treatment, and the uneven shape on the surface of the obtained polymer film cannot be appropriately evaluated.
When the motif parameters defined in JIS B0631 (2000) are used, the surface irregularities of the polymer film suitable for forming a practical use wiring board laminate are appropriate for the surface irregularities of the film of the present invention. Can be evaluated.

  An object of the present invention is to produce a polymer film having a predetermined uneven shape on the surface, a laminate for a wiring board in which a conductive metal film is formed on the surface of the polymer film, and the polymer film.

The invention according to claim 1 is a polymer film having a predetermined concavo-convex shape on the surface, wherein the concavo-convex shape is defined by JIS B0631 (2000), the depth of the roughness motif and the length of the roughness motif. When the evaluation is made using the motif parameter consisting of the above, the motif parameter is a polymer film characterized by satisfying the following conditions (1) and (2).
(1) The range of the average depth of the roughness motif is 0.4 μm to 3.0 μm.
(2) When X = average depth of roughness motif (μm) / average length of roughness motif (mm), the range of X is 13-60.

  The invention according to claim 2 is the polymer film according to claim 1, wherein the polymer film exhibits optical anisotropy (liquid crystallinity) when melted.

  The invention according to claim 3 is a laminate for a wiring board, wherein a conductive metal film is formed on the surface of the polymer film according to claim 1 or 2.

  The invention according to claim 4 is characterized in that the conductive metal film is formed of any one of Cu, Cu alloy, Ni, Ni alloy, Co, and Co alloy. It is a laminated body.

  Invention of Claim 5 has the process of roughening the surface of the said polymer film by the sandblast method at least in the manufacturing method of the polymer film of Claim 1 or 2, The said roughening process, It is a method for producing a polymer film, which is performed in a state where the back surface of the surface to be roughened of the polymer film is in close contact with a support.

  The invention according to claim 6 is the method for producing a polymer film according to claim 5, wherein the support is advanced or rotated in synchronization with the polymer film.

  The invention according to claim 7 is the method for producing a polymer film according to claim 5 or 6, wherein in the roughening treatment by sandblasting, air or gas is ionized and sprayed together with an abrasive on the film surface. is there.

  The invention according to claim 8 is the method for producing a polymer film according to any one of claims 5 to 7, wherein the sand blasting method is a wet blasting method.

  The invention according to claim 9 is the method for producing a polymer film according to claim 8, wherein the opening width of the injection nozzle is wider than the width of the polymer film.

Since the following uneven | corrugated shape was formed in the polymer film of this invention on the surface, an electroconductive metal film can be firmly stuck.
When evaluating with the motif parameters defined by JIS B0631 (2000) consisting of the depth of the roughness motif and the length of the roughness motif, the motif parameters satisfy the following conditions (1) and (2) A polymer film characterized by
(1) The range of the average depth of the roughness motif is 0.4 μm to 3.0 μm.
(2) When X = average depth of roughness motif (μm) / average length of roughness motif (mm), the range of X is 13-60.

When a polymer film capable of forming an optically anisotropic melt phase is used as the polymer film, the adhesion strength between the polymer film and the metal film is further improved.
The above-described uneven shape conditions are high between the film and the metal film formed on the film when applied to the surface of a polymer film capable of forming an optically anisotropic melt phase, that is, a liquid crystal polymer film. Adhesion can be obtained.

  Since the laminate for a wiring board of the present invention is obtained by depositing a conductive metal in a film shape on the surface of a polymer film having a predetermined uneven shape, the adhesion strength between the polymer film and the conductive metal film is high, A wiring board using the laminate is excellent in reliability.

  The method for producing the polymer film includes a step of roughening the surface of the polymer film by at least sand blasting, and the roughening treatment is performed by using the back surface of the surface to be roughened of the polymer film as a support. Since it carries out in the state where it was stuck and supported, a pinhole does not arise but the uneven shape of the surface is formed appropriately.

By rotating or rotating the support in synchronism with the polymer film, the surface of the polymer film is more sharply formed, and the adhesion strength between the polymer film and the conductive metal film is further improved. In addition, the roughening process is performed efficiently.
The sand blasting method may be either a drive blasting method in which an abrasive is collided with compressed air or a wet blasting method in which an abrasive is mixed with a liquid and collided with compressed air. The wet blast method requires a large apparatus, but is effective when static electricity generated by the drive last method becomes a problem. Further, in the wet blasting method, by making the injection nozzle width of the injection nozzle wider than the polymer film width, processing unevenness due to relative movement between the injection nozzle and the polymer film can be reduced.

When the polymer film of the present invention evaluates the uneven shape of the surface with a motif parameter consisting of the depth of the roughness motif and the length of the roughness motif defined in JIS B0631 (2000), the roughness motif The average depth range is 0.4 to 3.0 μm, and the ratio (X = R / AR) of the average depth R (μm) of the roughness motif to the average length AR (mm) of the roughness motif is The polymer film satisfying this condition, which is 13 to 60, does not cause pinholes and has high adhesion strength with the conductive metal film. Therefore, the polymer film laminate of the present invention can obtain an optimum wiring pattern processing accuracy.
The X value of the surface of the polymer film of the present invention is preferably 15 to 50, and more preferably 18 to 40. These values have been clarified by experiments by the present inventors.

  Conventionally, the concavo-convex shape on the surface of the polymer film has been evaluated by arithmetic average roughness (Ra), maximum roughness (Ry or Rmax), and ten-point average roughness (Rz), which are basic parameters of surface roughness. In this method, when the unevenness formed by the roughening treatment is very fine, the film surface itself has small waviness, and thus no clear difference was observed before and after the roughening. Even if the cut-off value λc defined in JIS B0601 (1994) is set and a filter is applied to obtain the Ra, Ry, and Rz, the fine irregularities generated by the roughening treatment are small undulations on the film surface itself. It was buried in and could not be detected.

  In the present invention, the polymer film is made of polyimide, polyamideimide, polyetheretherketone, liquid crystal polymer, fluororesin, polyphenylene sulfide, polysulfone, polyamide, polyethylene terephthalate, polybutylene terephthalate, aromatic polyester, etc. A film having a thickness of 5 to 200 μm is used.

In the present invention, the polymer film is a polymer film exhibiting optical anisotropy when melted, that is, a liquid crystal film having a molten state having a property of transmitting polarized light under a polarization microscope orthogonal Nicol equipped with a heating device. Molecular films are desirable because of their excellent adhesion to conductive metal films.
Among them, a thermoplastic liquid crystal polymer film containing a wholly aromatic polyester having a molecular structure shown in the following [Chemical Formula 1] and partially containing an aliphatic polyester is recommended.

The polymer film of the present invention is produced, for example, as shown in FIG.
That is, the back surface 1a side of the polymer film 1 is synchronized with a rotating metal roll (support) 2, and the blast device 3 is used on the polymer film surface 1b in a state where the film back surface 1a and the roll surface 2a are in close contact with each other. Then, the abrasive 4 is jetted from the jet nozzle 3a together with the compressed air to collide. Thereafter, the abrasive 4 and the like attached by the cleaning device 5 are removed. In FIG. 1, 6 is a compressor (compressed air generator), 7 is a film tension control roll, and 8 is a guide roll.

  In this method, since the polymer film is in close contact with the roll surface 2a, the polymer film does not vibrate, the collision speed of the abrasive to the polymer film is constant, and the polymer film surface is fine and uniform. An uneven shape is formed. Furthermore, since the roll surface that is in close contact with the back surface of the film absorbs a part of the collision force of the abrasive, the abrasive is difficult to penetrate and no pinhole is generated even if the polymer film is thin.

  In the drive last, when the abrasive material collides with the polymer film, electric charges accumulate on the surface of the film, sparks due to static electricity may occur, and a depression mark may be generated in the polymer film. In that case, sandblasting was performed using an ionizer. When ionizers are installed at both ends of the sandblast spray nozzle and positive electrolysis accumulates on the film surface, the air is ionized negatively and collides with the film together with the abrasive to suppress charging and prevent the occurrence of static sparks. did. On the other hand, static electricity is not generated in wet blasting because the abrasive is mixed with the liquid. If the polymer film is easily charged with static electricity, wet blasting is more effective.

The polymer film laminate of the present invention is, for example, pretreated on the surface of a roughened polymer film, then applied with a plating catalyst, further electrolessly plated with a base, and a conductive metal thereon. Manufactured by electroplating the membrane. As the electroless plating solution, a commercial product manufactured by Rohm and Haas or Meltex can be used.
A typical example of electroless plating is to electrolessly plate copper, nickel, cobalt, and the like after applying a catalyst using a palladium tin-based or palladium colloid-based catalyst solution.

  In the present invention, a commercially available electroplating solution can be used for electroplating. For the electroplating of copper, a copper sulfate bath or a copper borofluoride bath can be used. A watt bath or a sulfamic acid bath can be used for electroplating of nickel.

In the present invention, it is desirable to increase the adhesion between the polymer film and the conductive metal film by forming a conductive metal film on the surface of the polymer film and then performing a heat treatment.
The heat treatment is carried out at a temperature not lower than 50 ° C. and not higher than the melting temperature of the film or not higher than the heat distortion temperature for an appropriate time. The heat treatment is desirably performed in an inert gas atmosphere in order to prevent oxidation of the conductive metal film.

  The surface of the polymer film is continuously sandblasted and roughened by the method shown in FIG. 1, washed with water, then treated with conditioner (pre-treatment), pre-dip treatment, catalyst treatment, accelerator treatment, electroless plating. The laminated body was manufactured by performing the treatment and electroplating treatment of the conductive metal film in this order. Table 1 shows the sandblasting conditions.

  As the polymer film, a liquid crystal polymer film (trade name: BIAC) manufactured by Japan Gore-Tex Corporation and a liquid crystal polymer film (trade name: Vecstar (CT-50N)) manufactured by Kuraray Co., Ltd. were used. The film has a thickness of 50 μm and a width of 530 mm.

  In the sandblasting process, a suction type sandblasting apparatus 3 (see FIG. 2) provided with five spray nozzles arranged in parallel at equal intervals was used. The blast device 3 has an air nozzle diameter of 3 mmφ and an injection nozzle diameter of 7 mmφ. WA # 600 to # 1500 white alumina was used as the abrasive. A roll having a diameter of 500 mm whose surface was covered with stainless steel was used as a roll for supporting the polymer film.

The feeding speed of the polymer film was 0.1 m to 0.5 m / min, and the number of spray nozzles used was increased or decreased according to the feeding speed of the polymer film. That is, the number is 1 for 0.1 mm / min, and 2 for 0.2 mm / min.
The rotational speed of the roll and the feeding speed of the polymer film were matched (tuned). The spray nozzle was programmed to reciprocate in the direction perpendicular to the film feed direction to adjust the spray amount. The abrasive, the injection amount, the injection distance, and the injection pressure were variously changed. The blast conditions are shown in Table 1.

  After the sandblast treatment, the surface of the polymer film was washed with water by applying a fountain flow to remove the adhered abrasive (alumina powder).

  After washing with water and drying, the number of pinholes in the polymer film was measured using a watermark microscope as a light source. The number of pinholes is shown by the number per 10 cm square.

  Next, the surface roughness of the polymer film was measured using a contact-type surface roughness meter (SV-300S4 manufactured by Mitutoyo Corporation). For the surface roughness, arithmetic average roughness (Ra), maximum height (Ry), and ten-point average roughness (Rz) were determined based on JIS B0601 (1994). Since the detector uses 4 mN and Ra is 0.1 μm to 2.0 μm, the reference length and the cutoff value λc are 0.8 mm, the evaluation length is 4 mm, and the measurement speed is 0.5 mm / second. did.

Moreover, the motif parameter was measured based on JIS B0631 (2000) using the said surface roughness meter. The measurement conditions were a roughness motif upper limit length of 0.1 mm, an evaluation length of 3.2 mm, and a coarse measurement speed of 0.5 mm / second. The average depth (R) of the roughness motif and the average length (AR) of the roughness motif were measured to obtain X = R / AR. The unit is R value in μm and AR value in mm.
Each surface roughness was measured five times for each of two directions, ie, the stretching direction (generally referred to as the MD direction) of the film formation and the stretching and the vertical direction (generally referred to as the TD direction), and the average value was recorded.

  The conditioner treatment was performed by dipping (50 ° C., 5 minutes) in a cleaner C / N 3320 manufactured by Rohm and Haas to charge the film surface positively.

  The catalyst treatment is performed by pre-dip (25 ° C., 1 minute) using CP404 made by Rohm and Haas, and then immersed in CAT44 made by Rohm and Haas (42 ° C., 3 minutes). gave. By this treatment, a palladium and tin colloid catalyst was applied to the film surface.

  The accelerator treatment was performed by immersing (30 ° C., 7 minutes) in ACC5410 manufactured by Rohm and Haas Co. to remove tin in the catalyst and activate palladium.

  The electroless plating was performed by dipping (32 ° C., 15 minutes) in a circular deposit 880 bath manufactured by Rohm and Haas to deposit copper on the film. The bath contains 2 g / L of copper, and contains appropriate amounts of EDTA (chelating agent), formaldehyde (reducing agent), and sodium hydroxide (for pH adjustment).

  The electroplating treatment was performed using a copper sulfate plating solution, and copper was electroplated in a film shape to a thickness of 18 μm on the surface of the polymer film to obtain a laminate for a wiring board.

After heating the laminated body at 250 ° C. for 1 hour in a nitrogen atmosphere, the adhesion strength between the film and the metal film of the laminated body was measured by a 90 ° direction peeling test (peel test) defined in JIS C5016. The results are shown in Table 2 (BIAC) and Table 3 (Vecstar).
In Tables 2 and 3, the surface roughness of the polymer film after roughening (Ra, Ry, Rz, R, AR, R / AR) and the number of pinholes are shown.

[Comparative Example 1]
A laminated body for a wiring board in which copper was formed to a thickness of 18 μm was manufactured by the same method as in Example 1 except that the sandblast treatment was performed under the conditions shown in Table 4, and the peel strength was measured by the same method as in Example 1. . WA # 300, # 600, # 3000 white alumina was used as the abrasive. The results of Example 1 and Comparative Example 1 are shown in Tables 2, 3, 5, and 6.

As is apparent from Tables 2 and 3, the laminate of the present invention has a peel strength of 0.5 kN / m or more because R / AR is 13 or more, and a pinhole is generated because R / AR is 60 or less. None of them were practical.
Note that the relationship between peel strength and R / AR is shown in FIG. 4 (BIAC) and FIG. 5 (Vecstar), but the peel strength increases rapidly when R / AR is 13 or more.

  On the other hand, as is clear from Tables 5 and 6, the comparative product is less peel strength when R / AR is less than 13, and pinholes occur when sandblasting when R / AR exceeds 60. None of them were suitable for practical use.

  On the other hand, when the surface roughness is small, the measured values of Ra, Ry, and Rz are unclear in the correlation with the peel strength, and the surface unevenness has not been accurately evaluated. In the measurement using the motif parameter, an appropriate surface condition could be evaluated from the relationship between the average depth of the roughness motif and the average length of the roughness motif.

The surface of the polymer film (BIAC manufactured by Japan Gore-Tex) was roughened by sandblasting by the batch method shown in FIG. That is, an A4 size polymer film 11 sandwiched between the jigs 10 was brought into close contact with the stainless steel base 12, and an abrasive was sprayed from the spray nozzle 3a on the surface of the polymer film 11 to form an uneven shape. The spray nozzle 3a was controlled in plane position by an XY stage and moved up and down to adjust the spray distance. Blasting conditions such as the injection pressure of the abrasive 4 were variously changed.
The accelerator treatment was performed by immersing in a self-accelerator type Rohm and Haas Circoposit 4500 bath (bath temperature 52 ° C., 5 minutes). Otherwise, a laminate was produced in the same manner as in Example 1.
Table 7 shows the blasting conditions, and Table 8 shows the surface roughness, peel strength, and the number of pinholes.

  As is clear from Table 8, the laminate of the present invention example has a peel strength of 0.67 kN / m or more because R / AR is 13 or more, and the occurrence of pinholes because R / AR is 60 or less. None of them were practical.

  Copper was deposited on the polymer film by the same method as in Example 1 except that nickel was electrolessly plated to a thickness of 0.3 μm on a polymer film (Vecstar) using a 1580 bath manufactured by Rohm and Haas. A wiring board laminate having a thickness of 18 μm was produced, and the peel strength was measured by the same method as in Example 1.

The polymer film (Vecstar) was coated on the polymer film in the same manner as in Example 1 except that cobalt was electrolessly plated to a thickness of 0.3 μm using an ammonia alkaline bath (bath temperature 50 ° C.) having the following composition. A laminate for a wiring board in which copper was formed to a thickness of 18 μm was manufactured, and peel strength was measured by the same method as in Example 1. The results are shown in Table 9.
[Ammonia alkaline bath composition]
Cobalt sulfate 0.07 mol / L
Sodium hypophosphite 0.16
Sodium citrate 0.15
pH 9-10

  As is clear from Table 9, the adhesion strength was highest when the base plating metal was cobalt, followed by nickel and copper. Nickel and copper are practical at lower cost than cobalt.

  In Tables 2, 3, and 9, the conductive metal film electroplated without sandblasting (the blast condition is “before blasting”) is also shown. The peelable metal film peeled off, and the peel strength could not be measured. Therefore, the peel strength was set to zero.

  A laminate was produced by the same method as in Example 1 except that a wet blasting device was used as the blasting device, and R / AR and the like were determined by the same method as in Example 1. As shown in FIG. 6, the structure of the wet blasting device 13 is substantially the same as that in FIG. 1, but here the abrasive 4 was injected in a state of being mixed with water 41 (abrasive concentration 15 mass%). As the injection nozzle 13a, one having a width H (350 mm) of the injection port larger than the width h (300 mm) of the polymer film was used. As the abrasive material, white alumina of # 800, # 1200, and # 2000 was used. The injection amount of the abrasive 4 was set to 100 g / min. The injection pressure was changed in three ways: 0.15 MPa, 0.2 MPa, and 0.25 MPa. The interval between the spray nozzle and the polymer film was 50 mm. The running speed of the polymer film was 1.2 m / min. The length of the injection port (length in the film running direction) is 1 mm, and the thickness of the polymer film 1 is 50 μm. The polymer film was brought into close contact with the roll surface by applying tension. Table 10 shows the wet blasting conditions, and Table 11 shows the surface state, peel strength, and number of pinholes.

  As is clear from Table 11, the laminated body of the inventive example (Example 5) had a R / AR of 15 to 52 and a uniform roughened state. The peel strength was 0.81 kN / m or more, and good adhesion was obtained. There were no pinholes. Since the width H of the injection port was made larger than the width h of the polymer film, processing unevenness such as the end of the polymer film not being blasted was not generated.

[Comparative Example 2]
A laminate was produced by the same method as in Example 5 except that the polymer film was floated in the air and blasted, and R / AR and the like were determined by the same method as in Example 5. The results are shown in Table 12.

  As is clear from Table 12, in Comparative Example 2, the polymer film was floated in the air and blast roughened, so that when the injection pressure was 0.2 MPa or more, the polymer film was broken during the blast roughening. It was. When the injection pressure was 0.15 MPa, the film was not damaged, but the film was damaged and many wrinkles were generated, and the film was in a state that could not withstand practical use.

It is a whole explanatory view showing an embodiment of a continuous roughening method of a polymer film of the present invention. It is a partial explanatory view of the continuous roughening method of the polymer film of the present invention. It is explanatory drawing of the batch type roughening method of the polymer film of this invention. Relationship between peel strength and R / AR (polymer film: BIAC) Relationship between peel strength and R / AR (polymer film: Vecstar) Other embodiment of the continuous roughening method of the polymer film of this invention is shown, (A) is front explanatory drawing, (B) is AA cross-section explanatory drawing of (A).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Polymer film 1a Polymer film back surface 1b Polymer film surface 2 Metal roll (support)
2a metal roll surface 3 drive last device 3a drive last device injection nozzle 4 abrasive 5 cleaning device 6 compressor 7 polymer film tension control roll 8 guide roll 10 jig 11 for sandwiching polymer film polymer film 12 stainless steel stand 13 Wet Blasting Device 13a Wet Blasting Device Spray Nozzle 41 Water

Claims (9)

A polymer film having a predetermined concavo-convex shape on the surface, wherein the concavo-convex shape is evaluated by a motif parameter defined by JIS B0631 (2000) consisting of the depth of the roughness motif and the length of the roughness motif The polymer parameter satisfies the following conditions (1) and (2):
(1) The range of the average depth of the roughness motif is 0.4 μm to 3.0 μm.
(2) When X = average depth of roughness motif (μm) / average length of roughness motif (mm), the range of X is 13-60.   The polymer film according to claim 1, wherein the polymer film exhibits optical anisotropy in a molten state.   A laminate for a wiring board, wherein a conductive metal film is formed on the surface of the polymer film according to claim 1.   The laminate for a wiring board according to claim 3, wherein the conductive metal film is formed of any one of Cu, Cu alloy, Ni, Ni alloy, Co, and Co alloy.   The method for producing a polymer film according to claim 1 or 2, further comprising a step of washing the polymer film after performing a roughening treatment on a surface of the polymer film by at least a sandblast method. The process is performed in a state where the back surface of the surface to be roughened of the polymer film is in close contact with the support.   The method for producing a polymer film according to claim 5, wherein the support advances or rotates in synchronization with the polymer film.   The method for producing a polymer film according to claim 5 or 6, wherein, in the roughening treatment by sandblasting, air or gas is ionized and sprayed onto the film surface together with an abrasive.   The method for producing a polymer film according to any one of claims 5 to 7, wherein the sand blasting method is a wet blasting method.   The method for producing a polymer film according to claim 8, wherein the opening width of the spray nozzle is wider than the polymer film width.

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