JP2007090500A - Tape polishing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tape polishing apparatus capable of accurately polishing. <P>SOLUTION: The tape polishing apparatus employs a polishing head 16 having a base area A<SB>total</SB>larger than a size of a protrusion defect 12 of a rib 11. Further, pressing force F (=P<SB>total</SB>×A<SB>total</SB>) applied by a compression spring 17 is predetermined such that pressing force P<SB>total</SB>per unit area when the entire bottom of the head 16 is pressed against the rib 11 is smaller than the minimum pressing pressure value P<SB>min</SB>with which the defect 12 and a material of the rib 11 can be polished. Thus, the rib 11 is prevented from being polished below a normal top surface 11a. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a tape polishing apparatus, and more particularly to a tape polishing apparatus that polishes and corrects a protrusion defect portion of a fine pattern formed on a substrate.

  FIG. 8 is a perspective view showing the configuration of the rear glass substrate 101 of the plasma display. The plasma display is composed of two opposing glass substrates (a front glass substrate and a back glass substrate). Referring to FIG. 8, on the rear glass substrate 101 of the plasma display, ribs (fine patterns) 102 having a height of about 150 μm and a width of about 60 to 100 μm are formed at a pitch of several hundreds of μm. In the manufacturing process of the plasma display, a protrusion defect may occur in the rib 102.

  FIG. 9 is a perspective view showing the protrusion defect portion 103 of the rib 102. Referring to FIG. 9, there is a protrusion defect portion 103 that is raised from the normal top surface 102 a of the rib 102. If the rib 102 has the protrusion defect portion 103 as described above, a gap may be formed when the front glass substrate and the rear glass substrate are bonded to each other, or the protrusion defect portion 103 may be crushed to cause a defect. In order to improve the yield, before bonding the glass substrates, it is necessary to scrape and correct the protrusion defect portion 103 to the same height as the normal top surface 102a.

  Conventionally, as a method of correcting a projection defect portion generated in a manufacturing process of a flat panel display such as a plasma display, a laser processing method in which the projection defect portion is removed by irradiating a laser beam, and the projection defect portion is removed with a grindstone or a knife. There are a machining method for shaving, a tape polishing method for polishing a projection defect portion with an abrasive tape, and the like.

For example, the following Patent Document 1 discloses a foreign material correcting apparatus capable of measuring a distance to a color filter surface in a state where a polishing tape is in contact with a polishing head and correcting the thickness of the polishing tape with high accuracy. Is disclosed.
JP-A-9-234660

  However, it is difficult to perform high-precision processing by the laser processing method. In the machining method, the vibration of the pedestal on which the substrate is mounted affects the machining accuracy. Furthermore, the life of tools (grinding stones, blades) becomes a problem, and it takes time to change tools.

  The tape polishing method can be processed with relatively high accuracy. However, there is a problem that it is necessary to accurately measure the distance from the polishing head to the substrate, and the accuracy of the measurement affects the processing accuracy.

  Therefore, a main object of the present invention is to provide a tape polishing apparatus capable of performing polishing with high accuracy.

  A tape polishing apparatus according to the present invention is a tape polishing apparatus that polishes and corrects a projection defect portion of a fine pattern formed on a substrate, and polishes a polishing tape for polishing the projection defect portion and a bottom surface thereof. A polishing head for pressing the tape against the defective projection, a tape feed mechanism for feeding the polishing tape at a predetermined speed along the bottom surface of the polishing head, and the polishing head is moved downward while controlling to a predetermined pressing force. A tape polishing unit including a pressing control mechanism that presses, and a moving device that relatively moves the substrate and the tape polishing unit. The bottom surface of the polishing head is larger than the protrusion defect portion. The pressing pressure per unit area when the entire bottom surface is pressed against the fine pattern is lower than the minimum pressing pressure that can polish the material of the fine pattern. So that fence, characterized by presetting a predetermined pressing force.

  Preferably, the pressing control mechanism presses the polishing head downward by using an extension force of a compression spring or an expansion force of compressed air.

Preferably, the polishing head has a cylindrical shape.
Preferably, the edge of the bottom surface of the polishing head has a rounded R shape.

  Further preferably, the apparatus further comprises an inclination adjusting mechanism for adjusting an inclination of the tape polishing unit with respect to the substrate.

  In the tape polishing apparatus according to the present invention, the polishing tape for polishing the protrusion defect portion, the polishing head for pressing the polishing tape against the protrusion defect portion on the bottom surface thereof, and the polishing tape along the bottom surface of the polishing head are predetermined. A tape polishing unit including a tape feeding mechanism that feeds at a speed of 5 mm, and a pressing control mechanism that presses the polishing head downward while controlling to achieve a predetermined pressing force, and a movement that relatively moves the substrate and the tape polishing unit The bottom surface of the polishing head is larger than the protrusion defect portion, and the pressing control mechanism is configured such that the pressing pressure per unit area when the entire bottom surface of the polishing head is pressed against the fine pattern is the material of the fine pattern. A predetermined pressing force is set in advance so as to be smaller than a minimum pressing pressure that can be polished. Therefore, the fine pattern is not polished down below the normal top surface, and the polishing process can be performed with high accuracy.

  FIG. 1 is a diagram showing an overall configuration of a tape polishing apparatus according to an embodiment of the present invention. In FIG. 1, this tape polishing apparatus measures an observation mechanism 2 for observing the surface of a substrate 1, a monitor 3 for displaying an observed image, and the height of a normal top surface of a rib formed on the substrate 1. A position detecting mechanism 4 that performs polishing, a tape polishing unit 5 that polishes a protrusion defect portion of a rib, a chip suction mechanism 6 that sucks chips generated during polishing, and a controller 7 that controls the entire apparatus. In addition, an XY table 8 for moving the substrate 1 in the XY direction (horizontal direction), an observation mechanism 2, a position detection mechanism 4, and a Z table 9 for moving the tape polishing unit 5 in the Z direction (vertical direction) are provided. It has been.

  Next, the usage method of this tape grinding | polishing apparatus is demonstrated. First, the surface of the substrate 1 is observed by the observation mechanism 2 to search for a protrusion defect portion of a rib formed on the substrate 1. Next, as shown in FIG. 2A, the position detection mechanism 4 is disposed above the vicinity of the protrusion defect portion 12 of the rib 11 formed on the substrate 1. Then, the height (reference position) of the normal top surface 11 a of the rib 11 is measured by the position detection mechanism 4. Normally, a non-contact displacement meter such as a laser displacement meter is used as the position detection mechanism 4.

  Next, as shown in FIG. 2B, the tape polishing unit 5 is disposed above the protrusion defect portion 12. The tape polishing unit 5 is polished on the polishing tape 13 for polishing the projection defect portion 12, the supply reel 14a and the take-up reel 14b that are rotationally driven at a predetermined rotation speed, auxiliary reels 15a and 15b, and the bottom surface thereof. A polishing head 16 for pressing the tape 13 against the projection defect portion 12, a compression spring 17 for pressing the polishing head 16 downward by the extension force of the spring, and a pressing force by the compression spring 17 become a predetermined pressing force F. And a pressing force control unit 18 to be controlled. The compression spring 17 and the pressing force control unit 18 constitute a pressing control mechanism that presses the polishing head 16 downward with a predetermined pressing force F. Instead of using the compression spring 17, an expansion force of compressed air may be used.

  The supply reel 14a, the take-up reel 14b, and the auxiliary reels 15a and 15b constitute a tape feeding mechanism that feeds the polishing tape 13 along the bottom surface of the polishing head 16 at a predetermined speed. The rotation speeds of the supply reel 14 a and the take-up reel 14 b are arbitrarily adjusted according to the material of the protrusion defect portion 12.

  Next, the tape polishing unit 5 is slowly lowered toward the protrusion defect portion 12. Then, as shown in FIG. 2 (C), the polishing tape 13 is pressed against the projection defect portion 12 while being fed at a predetermined speed to polish the projection defect portion 12. Subsequently, as shown in FIG. 2D, the tape polishing unit 5 is further lowered to polish the projection defect portion 12. Finally, the polishing head 16 is lowered to the reference position measured by the position detection mechanism 4, and the protrusion defect portion 12 is polished to the same height as the normal top surface 11a of the rib 11 to complete the polishing process ( (See FIG. 2 (E)).

  Here, in a conventional tape polishing apparatus, a cylindrical polishing head 16 having a small diameter (for example, φ0.1 to 0.5 mm) has been used. As the polishing head 16 has a smaller diameter, there is an advantage that, when the polishing head 16 is inclined with respect to the substrate 1, an adverse effect on processing accuracy is reduced. However, in recent years, the probability of occurrence of relatively large protrusion defects is increasing, and in order to correct a protrusion defect portion having a size larger than the bottom area of the polishing head 16, the protrusion defect portion is scanned while the polishing head 16 is scanned. There is a problem that the tact time becomes enormous because it is necessary to devise such as polishing 12 or pressing the polishing tape 13 against the protrusion defect portion 12 repeatedly for a plurality of times.

Further, since the pressing force F by the compression spring 17 is increased in consideration of the polishing performance, the pressing pressure P of the polishing head 16 is higher than the minimum pressing pressure value P _min that can polish the material of the protrusion defect portion 12 and the rib 11. It was always getting bigger. In this case, the polishing performance is good, but it is necessary to accurately control the position of the polishing head 16 with respect to the reference position so that the normal ribs 11 are not scraped off. For example, if there is an error in the reference position measured by the position detection mechanism 4, the polishing process cannot be performed accurately, so that a highly accurate measurement performance is required.

Therefore, in this embodiment, as shown in FIG. 3A, a polishing head 16 having a bottom area A _total larger than the size of the protrusion defect portion 12 is used. For example, a cylindrical polishing head 16 having a diameter D _hed (for example, _φ2 mm or more) larger than the length L of the protrusion defect portion 12 is used. Further, the pressing force F (= P) by the compression spring 17 so that the pressing pressure P _total per unit area when the entire bottom surface of the polishing head 16 is pressed against the rib 11 is smaller than the minimum pressing pressure value P _{min. total} × A _total ) is set in advance. The bottom area A _total of the polishing head 16 is represented by π × (D _hed / 2) ² .

In this case, as shown in FIG. 3B, the pressing pressure P when the polishing head 16 is lowered together with the tape polishing unit 5 and the polishing tape 13 is pressed against the projection defect portion 12 for polishing is F / A. However, _let A be the area of the portion pressed against the protrusion defect portion 12 in the bottom area A _total of the polishing head 16.

The shape of the protrusion defect portion 12 is generally mountain-shaped, and the area A of the portion of the entire bottom surface of the polishing head 16 that is pressed against the protrusion defect portion 12 at the start of polishing is the bottom area A of the polishing head 16. _Since it is smaller than _total, the relationship of pressing pressure P (= F / A)> _Pmin is established. For this reason, the projection defect part 12 is polished satisfactorily.

  Subsequently, as shown in FIG. 3C, when the polishing head 16 is further lowered together with the tape polishing unit 5 and the polishing process is continued, the portion of the entire bottom surface of the polishing head 16 that is pressed against the protrusion defect portion 12. Since the area A of the substrate gradually increases, the pressing pressure P (= F / A) decreases and the projection defect portion 12 becomes difficult to be polished.

Then, as shown in FIG. 3D, when the polishing head 16 is lowered to the reference position and the protrusion defect portion 12 is polished to the same height as the normal top surface 11a of the rib 11, the entire bottom surface of the polishing head 16 is removed. It is pressed against the rib 11. At this time, the pressing force P _total (= F / A _total ) of the polishing head 16 is reduced by the compression spring 17 so as to be smaller than the minimum pressing pressure value P _min that can polish the material of the projection defect portion 12 and the rib 11. The pressing force F is preset. For this reason, the rib 11 is not polished down below the normal top surface 11a. Even if there is an error in the reference position measured by the position detection mechanism 4, the polishing process can be performed accurately.

Therefore, the projection defect portion 12 can be completely removed without being affected by the measurement accuracy of the position detection mechanism 4, and the rib 11 is not polished below the normal top surface 11a. Polishing can be performed with high accuracy. Furthermore, since the polishing head 16 having the bottom area A _total larger than the size of the protrusion defect portion 12 is used, the protrusion defect portion 12 can be corrected at a time, and the tact time can be greatly shortened. .

Although the case where the cylindrical polishing head 16 is used has been described here, the present invention is not limited to this. Regardless of the shape of the polishing head 16, the same effect can be obtained if the bottom area A _total of the polishing head 16 is made larger than the size of the protrusion defect portion 12.

However, in this embodiment, _since the polishing head 16 having a diameter D _hed larger than the conventional one is used, as shown in FIG. 4A, when the polishing head 16 is inclined with respect to the substrate 1, The adverse effect on machining accuracy is increased.

  For example, when there is an error in the reference position measured by the position detection mechanism 4, when the polishing head 16 is lowered together with the tape polishing unit 5, the rib 11 has a normal top as shown in FIG. The surface may be polished below the surface 11a. Then, as shown in FIG. 4C, even the normal ribs 11 are scraped off.

  Therefore, in this embodiment, an inclination adjusting mechanism for finely adjusting the inclination of the tape polishing unit 5 is provided. 5A and 5B are diagrams showing the configuration and operation of the tilt adjusting mechanism of the tape polishing unit 5. Referring to FIG. 5A, nuts 21a and 21b are both fixed to Z table 9 shown in FIG. 1, and adjustment screws 22a and 22b are screwed into nuts 21a and 21b, respectively. The tape polishing unit 5 is provided on the Z table 9 shown in FIG.

  The nuts 21a and 21b and the adjusting screws 22a and 22b constitute an inclination adjusting mechanism, and polish the substrate 1 when the tape polishing unit 5 is inclined or when the XY table 8 on which the substrate 1 is mounted is inclined. Even when the head 16 is inclined, the inclination of the tape polishing unit 5 can be finely adjusted so that the polishing head 16 is perpendicular to the substrate 1 (see FIG. 5B). Therefore, the polishing process can be performed accurately.

In order to minimize the influence of the inclination of the tape polishing unit 5, as shown in FIG. 6, a cylindrical polishing head 16 having an R shape with a rounded bottom edge may be used. . However, the pressing pressure P _total (= F / A _total ) <minimum pressing pressure value P _min with respect to the bottom area A _{total of the} flat surface portion that does not include the R-shaped portion of the bottom surface of the polishing head 16. Further, as shown in FIG. 7, a cylindrical polishing head 16 having a spherical bottom surface may be used.

  Further, in this embodiment, the case where the projection defect portion 12 of the rib 11 formed on the rear glass substrate 1 of the plasma display is corrected has been described. However, the present invention is not limited to this application, and other than the plasma display. It is also possible to correct a projection defect portion generated in the manufacturing process of the flat panel display.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is a figure showing the whole tape polisher composition by one embodiment of this invention. It is a figure which shows the usage method of the tape grinding | polishing apparatus shown in FIG. It is a figure which shows operation | movement of the principal part of the tape grinding | polishing unit shown in FIG. It is a figure which shows operation | movement of the principal part of a tape grinding | polishing unit in case a grinding | polishing head inclines with respect to a board | substrate. It is a figure which shows the structure and operation | movement of the inclination adjustment mechanism of a tape grinding | polishing unit. It is a figure which shows the example of a change of the shape of a grinding | polishing head. It is a figure which shows the other example of a change of the shape of a grinding | polishing head. It is a perspective view which shows the structure of the back surface glass substrate of a plasma display. It is a perspective view which shows the protrusion defect part of a rib.

Explanation of symbols

  1, 101 substrate, 2 observation mechanism, 3 monitor, 4 position detection mechanism, 5 tape polishing unit, 6 chip suction mechanism, 7 controller, 8 XY table, 9 Z table, 11, 102 rib, 11a, 102a top surface, 12, 103 Protrusion defect part, 13 Polishing tape, 14a Supply reel, 14b Take-up reel, 15a, 15b Auxiliary reel, 16 Polishing head, 17 Compression spring, 18 Pressing force control part, 21a, 21b Nut, 22a, 22b Adjustment screw .

Claims (5)

A tape polishing apparatus for polishing and correcting a projection defect portion of a fine pattern formed on a substrate,
A polishing tape for polishing the protrusion defect portion, a polishing head for pressing the polishing tape against the protrusion defect portion on the bottom surface thereof, and sending the polishing tape along the bottom surface of the polishing head at a predetermined speed A tape polishing unit including a tape feeding mechanism, and a pressing control mechanism that presses the polishing head downward while controlling the predetermined pressing force, and a moving device that relatively moves the substrate and the tape polishing unit. Prepared,
The bottom surface of the polishing head is larger than the protrusion defect,
In the pressing control mechanism, the pressing pressure per unit area when the entire bottom surface of the polishing head is pressed against the fine pattern is smaller than the minimum pressing pressure capable of polishing the material of the fine pattern. Thus, the predetermined pressing force is preset, and the tape polishing apparatus is characterized in that   2. The tape polishing apparatus according to claim 1, wherein the pressing control mechanism presses the polishing head downward using an extension force of a compression spring or an expansion force of compressed air.   The tape polishing apparatus according to claim 1, wherein the polishing head has a cylindrical shape.   The tape polishing apparatus according to any one of claims 1 to 3, wherein an edge of a bottom surface of the polishing head has a rounded R shape.   The tape polishing apparatus according to any one of claims 1 to 4, further comprising an inclination adjusting mechanism that adjusts an inclination of the tape polishing unit with respect to the substrate.

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