JP2007090465A - Minute component handling method and minute component handling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique of rigidly arranging a number of minute components on the order of micrometers, such as magnetic head sliders, and taking out a desired one out of the minute components. <P>SOLUTION: In implementation of the technique, a number of the minute components (magnetic head sliders) 1a to 1f are arranged on a fixture 2, and bonded to the same by a hot-melt wax 3. In order to take out a specific one of the minute components (e. g. the magnetic head slider) 1c, a laser 4 is applied to the target minute component 1c. The minute component to which the laser is applied is heated and raised in temperature, and the hot-melt wax 3 bonded to the minute component 1c is melted to lose its adhesion. When the adhesion of the target minute component 1c is lost, the minute component 1c is pushed up to a location 1C indicated by a broken line by a pusher 5. In this manner, only the target minute member can be taken out without influencing the other minute components. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a technique for handling a minute part having a side length dimension of the order of micrometers, such as a slider for a magnetic head.

When processing, measuring, and inspecting micro parts of micrometer order, in order to perform these operations efficiently, many micro parts are often attached to a jig.
In such a case, of course, it is necessary to fix the large number of micro parts to the jig.
In many cases, it is necessary to remove only a specific minute part from a large number of fixed minute parts.

As an example of a micro component on the micrometer order, there is a magnetic head slider 1 shown in FIG.
In the first half of the manufacturing process of the magnetic head slider, a large number of sliders are formed on the wafer surface, but as the processing process proceeds, several tens of bars are cut into bars and further one by one.
FIG. 2B shows a conventional technique for handling a plurality of magnetic head sliders 1 separated from each other.

A number of magnetic head sliders 1 are arranged in a row on a fixed jig 2 having a horizontal top surface.
FIG. 2C shows a schematic drawing of the portion encircled by the chain line ellipse c in an enlarged manner in FIG. The distance between adjacent sliders is very narrow, such as 50-100 micrometers.
The magnetic head slider 1 placed on the fixed jig 2 is bonded by a heat-meltable wax 3. In this example, the hot-melt wax melts at 80 degrees Celsius. Further, the heat resistance limit of the slider is 120 degrees.

In the handling technique of this example (conventional example), the fixed jig 2 is placed on a hot plate (not shown) and heated in order to remove (separate) the bonded magnetic head slider.
When heated and the hot-melt wax is melted, the desired magnetic head slider is sandwiched and lifted with minute tweezers.
JP 05-159260 A JP 2005-88145 A

In the conventional example shown in FIG. 2, when the fixed jig 2 is heated on a hot plate (not shown), it takes some time for the hot-melt wax to reach the melting point, and the work efficiency is lowered. Invite.
Further, the hot-melt wax 3 bonding each of the multiple magnetic head sliders 1 is heated at the same time and melted. In such a state, the operation of pinching only one minute magnetic head slider with tweezers requires high skill and great labor.
That is, the slider adjacent to the slider to be picked up is loosely bonded due to the melting of the wax, so that it moves when touched a little.
The operation of returning to the original position is difficult because it is difficult to distinguish when many small parts of micrometer order move.

The present invention has been made in view of the circumstances described above, and the object is as follows.
When a large number of minute parts are arranged and bonded to a fixed jig, only the desired minute parts can be picked up quickly and easily, and there is no possibility of adversely affecting adjacent minute parts. To provide the equipment.

The basic technique of the present invention created to achieve the above object will be briefly described with reference to FIG. 1 (A) corresponding to one embodiment thereof.
When a large number of magnetic head sliders (1a, 1b, 1c, 1d, 1e) are arranged on the fixed jig (2) and bonded with hot-melt wax (3), respectively, a specific magnetic head slider In order to peel off (for example, 1c), the magnetic head slider (1) c which is the target is irradiated with a laser (4).
Then, only the target magnetic head slider (1c) is heated among the many magnetic head sliders. As a result, the hot-melt wax (3) adhering the target slider (1c) reaches the melting point and can be removed by applying an external force.

The configuration of the inventive method according to claim 1 is:
(See FIG. 1) In a method for handling a micro component having a side length of the order of micrometers, in which a plurality of micro components are arranged and temporarily fixed or peeled,
a. A plurality of micro parts (for example, magnetic head sliders 1a to 1e) are arranged on a jig having a substantially horizontal top surface (for example, fixed jig 2), and each is bonded with a heat-meltable wax (3).
b. Among the plurality of micro components, a specific micro component to be peeled (for example, the magnetic head slider 1c) is heated by irradiating a laser (4), thereby melting the hot-melt wax.
c. The specific micro component (magnetic head slider 1c) is extracted by applying an operating force.

The configuration of the inventive device according to claim 2 is as follows:
(Refer to FIG. 1) In a micropart handling apparatus having a side length of the order of micrometers, a plurality of microparts (for example, magnetic head sliders 1a to 1e) are placed on a hot-melt wax (3 ) And a fixing jig (2) having a structure that can be bonded with
Means for irradiating a specific micro component (1c) with a laser (4) among a plurality of micro components (1a to 1e) placed and bonded to the fixed jig (2);
(Refer to FIG. 2) It is characterized in that it comprises a conveying means (5) capable of selectively moving only the specific minute component (1c).

When the method of the invention of claim 1 is applied, only a specific microcomponent is heated by a laser among a number of microcomponents bonded and fixed with hot-melt wax. Only the molten wax is heated and melted, and only desired micro parts can be taken out.
In this case, it is not necessary to heat and heat the fixed jig having a large heat capacity, and only the vicinity of the target micro component is heated, so that the required time is short and the required energy is small.
The hot-melt wax that adheres the microparts adjacent to the target micropart is not yet reached the melting point and is firmly fixed. is there.

According to the invention device of the second aspect (see FIG. 1), a fixed jig (2) having a structure in which a micro component (for example, a slider for a magnetic head) can be placed and bonded with hot melt wax;
Means for irradiating a laser (4) to a specific minute part (for example, 1c) among a plurality of minute parts (1a to 1e) mounted and bonded to the fixed jig;
(Refer to FIG. 2) Since the conveyance means (5) capable of selectively moving only the specific micro component (1c) is provided, only the specific micro component can be heated. Therefore, it is possible to melt only the hot-melt wax that bonds the specific microparts. Thereby, a desired minute part can be quickly and easily taken out from a large number of minute parts.
That is, the method of the invention of claim 1 can be easily carried out to fully demonstrate its purpose.

FIG. 1 is a perspective view schematically illustrating an embodiment of the apparatus of the present invention.
A plurality of magnetic head sliders 1 a, 1 b, 1 c, 1 d, 1 e are arranged on the fixed jig 2, and each is bonded with a hot-melt wax 3 (the above-described configuration relating to this embodiment is This is the same as the conventional example shown in FIG.
In this embodiment, the laser 4 is irradiated to the magnetic head slider 1c to be peeled off and taken out.

The target slider 1c irradiated with the laser is heated to raise the temperature, and the hot-melt wax adhering the slider 1c receives the heat conduction to raise the temperature. In this way, only the hot-melt wax functioning as the adhesive for the target slider can flow.
A schematic plan view of this state is shown in FIG. Also in this figure (B), only the magnetic head slider 1c among the many magnetic head sliders 1a to 1f is laser-heated to melt the wax.

For convenience of explanation, horizontal orthogonal coordinates XY are assumed as shown in the figure. The top surface of the fixed jig 2 is along the XY plane, and a large number of magnetic head sliders 1a to 1f are arranged in the X-axis direction.
The pusher 5 pushes the “magnetic head slider 1c with loose adhesion” parallel to the Y axis, that is, perpendicular to the slider arrangement direction (arrow a).
Although it is a hot-melt wax that acts as an adhesive when consolidated, it loses the adhesive function in the melted state, and rather represents an action close to that of a lubricant, and the magnetic head slider 1c at the solid line position is moved to the broken line position 1C Lead.

As described above, when the target magnetic head slider 1c is pushed in the Y-axis direction, there is no possibility of affecting even if the distance between the adjacent sliders (1b, 1d) is narrow.
After pushing and moving to the broken line position 1C, it is carried out without fear of adversely affecting other magnetic head sliders (1a, 1b, 1d to 1f), whether it is vacuum-sucked or pinched using an appropriate conveying means. Can do.
At this time, the temperature of the target magnetic head slider 1c is lowered before it is peeled off from the fixed jig 2, and it is difficult to solidify the hot-melt wax. Therefore, if necessary, the conveying member (for example, the clamping claw) is warmed. It is desirable to keep it.

1A and 1B show an embodiment of the present invention, in which FIG. 1A is a perspective view schematically illustrating a state in which a laser is irradiated on a magnetic head slider, and FIG. Top view schematically depicting the state 1A and 1B are views for explaining a conventional technique related to fixing and peeling of a magnetic head slider, wherein FIG. 1A is an external perspective view of the magnetic head slider, and FIG. 2B is a number of magnetic head sliders on a fixing jig. The external appearance perspective view of the state which arranged A, (C) is an expanded sectional view of the portion surrounded by the chain line ellipse

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1,1a-1f ... Slider for magnetic heads, 2 ... Fixed jig, 3 ... Hot melt wax, 4 ... Laser, 5 ... Pusher.

Claims (2)

In a method of handling a minute part whose length of one side is on the order of micrometers, in which a plurality of minute parts are arranged and temporarily fixed or separated,
a. A plurality of micro parts are arranged on a jig having a substantially horizontal surface and bonded with a heat-meltable wax.
b. By irradiating and heating a specific minute part to be peeled out of the plurality of minute parts, the thermally fusible wax is melted,
c. A method of handling a micro component, wherein the specific micro component is moved by applying an operating force. A fixing jig having a structure in which a plurality of micro parts can be mounted and bonded with hot-melt wax in a micro part handling apparatus having a side length of the order of micrometers.
Means for irradiating a specific minute component with a laser among a plurality of minute components placed and bonded to the fixed jig;
A handling device for micro parts, comprising: a conveying unit capable of selectively moving only the specific micro parts.

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