JP3164062B2 - Jig for heat sink soldering - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to relates again and again Chiko for the heat sink soldering.

[0002]

2. Description of the Related Art A conventional method of soldering a heat sink to a substrate is as follows: a heat sink 21 is placed on the surface of a hot plate 22 and a soldering iron 23 is used together, as shown in FIG.
Melt solder 25 and confirm that solder 25 has melted,
Place the board 26 on which the components are mounted on the heat sink 21,
Positioning was performed with the pliers-type jig 27, and after soldering, the work of grasping and lifting was performed.

[0003] However, such a method has a drawback that it is a single item operation, requires too many man-hours, and has low mass productivity. The method shown in FIG. 4 is another method which has been conventionally performed. In the state where the heat sink 21 is fixed with the jig 30,
The jig 30 is placed on the heating surface 32, and after confirming that the solder has melted, the substrate 26 is placed on a heat sink and soldered.

However, in the above-described method, since the heat sink 21 is fixed by the jig 30, the bottom surface of the heat sink 21 does not securely adhere to the heating surface 32. The amount of heat transmitted to each heat sink varies. Therefore, the heat sink 21
Not only does the time required for the upper solder 25 to melt becomes longer, but also there is the disadvantage that the dispersion of the solder melting time in the jig increases.

Further, the heat transmitted to the heat sink 21 is
Since it escapes to the jig 30, it takes time to reach the amount of heat required to melt the solder 25, and since the jig 30 has reached a temperature substantially equal to that of the heat sink 25, the time for cooling also becomes longer (healing). It takes about one hour to cool to room temperature at a tool surface temperature of about 200 ° C.).

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to improve the above-mentioned disadvantages of the prior art, and in particular to eliminate variations in solder melting time and to finish soldering a plurality of heat sinks in a short time. Moreover, to suppress the temperature rise of the tools, it hereinafter, there is provided a Chiko tool for new heat sink soldering that was allowed improve work efficiency.

[0007]

SUMMARY OF THE INVENTION The present invention is directed to the above objects.
To achieve this, you will basically use the techniques described below.
It employs a surgical configuration. That is, the heat according to the present invention.
The first aspect of the jig for soldering a heat sink is as follows.Flat e
Place the heat sink on the hot plate and
Solder the board onto the heat sink with a rate of heat
Tool for Hold the heat sink in between
At the same time as the heat sink.
A pair of clampers formed and the one clamper
The fixed plate provided with
Movable plate provided with the other clamper portion
Heat the clamper provided on the movable plate
Advance in sink direction and away from heat sink
An operation unit that operates to retreat in the direction
To secure the substrate on the link in place.
A pair of substrates for fixing the substrate fixed on the fixed plate and the movable plate
And a supporting member.
Also, the second aspect isBetween the substrate and the one substrate support portion
Between them, an elastic member is provided, and through this elastic member,
The substrate support unit fixes the substrate.
Things,Also, a third aspect is as follows.Soldering the heat sink
For placing the jigs and tools on the hot plate
A leg is provided, which is in point contact with the hot plate
Characterized in that they are configured to contact each other in a state.
You.

[0008]

[0009]

A jig for soldering a heat sink according to the present invention clamps a heat sink on which solder is printed by a first clamper, and positions a substrate on the heat sink by a second clamper. , Clamp the substrate.

In this state, when the jig of the present invention is placed on the heat sink, the jig is clamped so that the bottom surface of the heat sink does not contact the surface of the hot plate which is the heating surface. When the clamp of the heat sink is released in this state, the heat sink falls on the hot plate, and the substrate at the same time. At this time, since the falling distance is extremely small, the substrate is also placed at a predetermined position on the heat sink.

Since the bottom surface of the heat sink is in close contact with the hot plate, the heat of the hot plate heats the heat sink, whereby the solder on the heat sink melts and the heat sink is assembled to the substrate. And
Again, clamp the heat sink with the first clamper,
The jig is moved from the hot plate to a predetermined position.

In particular, according to the present invention, when the heat sink is heated, the clamp of the heat sink is released to reduce the heat conduction to the jig, thereby reducing the temperature variation at the time of melting the solder. Improves mass productivity.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A specific example of a jig for soldering a heat sink according to the present invention will be described below in detail with reference to the drawings. FIGS. 1A and 1B show the structure of a specific example of a jig for soldering a heat sink according to the present invention.
(C) is a perspective view in which a heat sink is attached to the substrate. In these figures, a jig for soldering the substrate 3 on the heat sink 1 to the heat sink 1 is shown. The first clampers 4 and 5 for clamping, the second clampers 6 and 7 for clamping the substrate 3 on the heat sink 1, and the first and second clampers are almost simultaneously
A jig and tool for soldering a heat sink, which comprises an operation unit 11 for moving forward and backward in the direction, is shown.

Next, the present invention will be described in more detail. FIG.
In the figure, 1 is a heat sink, 2 is a solder printed on the heat sink, and 3 is a board on which an electronic component 3a as a heating element to be soldered on the heat sink via the solder 2 is assembled. Reference numeral 4 denotes a fixed plate constituting the first clamper. Reference numeral 5 denotes a movable plate constituting the first clamper provided so as to face the fixed plate 4. Reference numerals 4a and 5a denote the fixed plate 4 and the movable plate 5, respectively. It is a clamper section, and a clamper section 4
Reference numerals a and 5a are formed so as to make substantially point contact with the heat sink 1 so that the heat of the heat sink 1 is not transmitted as much as possible to the tool.

Reference numeral 6 denotes a substrate support for supporting the substrate 3 constituting a second clamper provided on the fixed plate 4, and 7 denotes a second support provided on the movable plate 5 so as to face the substrate support 6. The movable substrate supporting portion 8 constituting the clamper is a spring which is an elastic member provided at a portion of the substrate supporting portion 7 which comes into contact with the substrate 3. Numeral 9 advances the movable plate 5 and the substrate supporting portion 7 in the direction of the heat sink 1, and clamps the heat sink 1 by the first clamper, or slides on the fixed plate 4 for releasing the clamp by retracting in the opposite direction. And a handle 10 for moving the slider 9 forward and backward.
Is composed. A spring 12, which is an elastic member, is provided between the movable plate 5 and the slider 9, and is configured to clamp the heat sink 1 with a predetermined force.

Also, the jig of the present invention is hot plate 15
The legs 13 are provided so that high-temperature heat of the hot plate 15 is not transmitted to the jig as much as possible when placed on the top. The legs 13 are formed in such a shape as to make substantially point contact with the surface of the hot plate 15. Next, the operation of the heat sink soldering jig of the present invention will be described.

When the handle 10 is turned to the left as shown in FIG. 1A, the slider 9 is pushed forward in the direction of arrow A, and the movable plate 5 presses the heat sink 1 via the spring 12 to fix the heat sink 1 to the fixed plate. 4 clamper portion 4a and movable plate 5
And the clamper 5a. In such a state,
Bottom 1a of heat sink 1 and hot plate (heating body)
It is clamped so as to form a gap t between the surface 15. In this state, when the handle 10 is turned right, FIG.
As shown in (b), the slider 9 retreats, so that the movable plate 5 separates from the heat sink 1, and the heat sink 1
The heat sink 1 is released while being positioned on the side surface of the fixing plate 4, falls on the hot plate (heating body) surface 15 by its own weight, and the bottom surface 1 a of the heat sink 1 contacts the surface of the hot plate 15.

Next, the soldering operation and its procedure will be described. Place the heat sink soldering tool on a flat work surface and loosen the handle 10. A solder 2 having a thickness of about 150 to 200 μm is printed in advance on a portion to which the substrate 3 on which the components of the heat sink 1 are mounted by soldering with a cream solder printer or the like, and the heat sink 1 is set in a jig. You. In the following, the substrate 3 on which electronic components such as the FET and the chip capacitor in SMT reflow or the like on a substrate on which a circuit pattern is formed is mounted, fixed on the heat sink 1 solder 2 is printed. All chicks
After inserting the heat sink into the jig, pull the handle 10
Then, the heat sink 1 is fixed. Heat sink 1 is placed on a hot plate (heated body) 15 heated to 260 ° C.
Then, the jig for soldering the heat sink of the present invention is placed, the handle 10 is loosened, and the clamp of the heat sink 1 is released. The opened heat sink 1 comes into contact with the surface of the hot plate (heating body) 15 by its own weight, and the heat of the hot plate 15 heats the heat sink 1.

After the handle 10 is opened, the soldering of all the heat sinks 1 and the component mounting boards 3 is completed in 60 seconds. After 60 seconds, the handle 10 is closed again, and the jig and tool together with the heat sink 1 are taken out of the hot plate 15. Place it on a flat work table, loosen the handle 10 again, pull up the jig and take out the heat sink 1 from the jig,
Complete all soldering work.

Note that, as shown in FIG.
7 are provided so that they can be inserted into and removed from the holes 4b and 5b of the fixed plate 4 and the movable plate 5, so that the jig of the present invention can be used even in solder printing. Can be made possible.

[0021]

As described above, the jig for heat sink soldering of the present invention is constructed as described above, so that the fixing of the heat sink on the hot plate surface (heating surface) is released.
The bottom surface of each heat sink adheres to the heating surface. Further, since the heat of the heat sink is not transmitted to the jig by releasing the clamp, the individual heat sinks are uniformly heated.

As a result, the heat distribution of the heat sink in the jig becomes uniform, and the dispersion of the solder melting time is reduced. According to the experimental values, the solder melting time was 50 seconds for 260 pieces heated at 9 pieces, and the variation was within 10 seconds. Further, the heat sink and the component mounting board can be mounted in a short time. In addition, heat is hardly transmitted to the jig body, the cooling time of the jig is short, and the operation rate of the jig is improved.

[Brief description of the drawings]

1A and 1B are diagrams showing the structure of a specific example of a jig for soldering a heat sink according to the present invention, FIG.
(C) is a perspective view in which a heat sink is attached to the substrate.

FIG. 2 is a diagram showing another specific example of the present invention.

FIG. 3 is a diagram showing a conventional technique.

FIG. 4 is a diagram showing a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat sink 2 Solder 3 Substrate 4 Fixed plate 5 Movable plate 6 and 7 Substrate support part 8 Leaf spring 9 Slider 10 Handle 11 Operation part 12 Spring 13 Leg 15 Hot plate

Claims (3)

(57) [Claims] (1)Heat sink on flat hot plate
And heat the hot plate to heat the heat sink.
Jig for soldering the board on the While fixing the heat sink in between, the heat sink
A pair of clampers formed to make point contact with the sink
A fixing plate provided with the one clamper,
The other clamp is provided so as to face the fixing plate of
A movable plate provided with a par portion, and a movable plate provided on the movable plate.
Advance the clamper toward the heat sink,
Operate so that it retreats away from the heat sink
Operating part, and the substrate on the heat sink
Fixed on the fixed plate and the movable plate for fixing
And a pair of substrate support members for fixing the substrate.
Jig and tool for heat sink soldering. 2. The method according to claim 1 , further comprising : a step between the substrate and the one substrate support.
Is provided with an elastic member, and through this elastic member,
Wherein the substrate support fixes the substrate.
A jig for soldering a heat sink according to claim 1. 3. A jig for soldering the heat sink.
Legs for mounting on the hot plate are provided,
This leg contacts the hot plate in point contact
3. The method according to claim 1 or 2, wherein
Jig for heat sink soldering.