JP2007067300A5 - - Google Patents

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Publication number
JP2007067300A5
JP2007067300A5 JP2005254127A JP2005254127A JP2007067300A5 JP 2007067300 A5 JP2007067300 A5 JP 2007067300A5 JP 2005254127 A JP2005254127 A JP 2005254127A JP 2005254127 A JP2005254127 A JP 2005254127A JP 2007067300 A5 JP2007067300 A5 JP 2007067300A5
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JP
Japan
Prior art keywords
glass
light emitting
heat
wiring
glass component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005254127A
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Japanese (ja)
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JP2007067300A (en
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Publication date
Application filed filed Critical
Priority to JP2005254127A priority Critical patent/JP2007067300A/en
Priority claimed from JP2005254127A external-priority patent/JP2007067300A/en
Publication of JP2007067300A publication Critical patent/JP2007067300A/en
Publication of JP2007067300A5 publication Critical patent/JP2007067300A5/ja
Withdrawn legal-status Critical Current

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Claims (6)

耐熱性基板と、
前記耐熱性基板の上に形成された配線と、
前記配線と電気的に接続する電極を備えた発光素子と、
溶融法によって作製されて、前記発光素子を被覆するガラス部材とを有する発光装置であって、
前記配線は第１のガラス成分を含み、
前記ガラス部材と、前記耐熱性基板および前記配線との間に第２のガラス成分を含む接着材が設けられていることを特徴とする発光装置。 A heat-resistant substrate,
Wiring formed on the heat-resistant substrate;
A light emitting element having a pre-Symbol wiring electrodes electrically connected,
A light emitting device manufactured by a melting method and having a glass member covering the light emitting element,
The wiring includes a first glass component;
A light emitting device, wherein an adhesive material including a second glass component is provided between the glass member, the heat resistant substrate, and the wiring. 前記第１のガラス成分と前記第２のガラス成分とは同じであって、
これらの軟化点は、前記ガラス部材を構成するガラスの軟化点より高いことを特徴とする請求項１に記載の発光装置。 The first glass component and the second glass component are the same,
The light emitting device according to claim 1, wherein the softening point is higher than the softening point of the glass constituting the glass member. 前記第１のガラス成分と前記第２のガラス成分とは異なっていて、
前記第１のガラス成分の軟化点をＴ１、前記第２のガラス成分の軟化点をＴ２、前記ガラス部材を構成するガラスの軟化点をＴ３とすると、
Ｔ１＞Ｔ２＞Ｔ３
の関係が成立することを特徴とする請求項１に記載の発光装置。 The first glass component and the second glass component are different,
T 1 The softening point of the first glass component, T 2 the softening point of the second glass component, the softening point of the glass constituting the glass member and T 3,
T 1 > T 2 > T 3
The light emitting device according to claim 1, wherein the relationship is established. 前記第１のガラス成分は、前記配線中に０．５重量％〜５重量％の範囲で含まれることを特徴とする請求項１〜３のいずれか１項に記載の発光装置。 4. The light-emitting device according to claim 1, wherein the first glass component is included in the wiring in a range of 0.5 wt% to 5 wt%. 前記ガラス部材は、ＴｅＯ２−Ｂ２Ｏ３−ＺｎＯ系ガラスであって、ＴｅＯ２を１０ｍｏｌ％以上含むことを特徴とする請求項１〜４のいずれか１項に記載の発光装置。 5. The light emitting device according to claim 1, wherein the glass member is TeO 2 —B 2 O 3 —ZnO-based glass and contains 10 mol% or more of TeO 2 . 耐熱性基板を準備する工程と、Preparing a heat-resistant substrate;
前記耐熱性基板の上に、第１のガラス成分を含む配線材料からなる配線パターンを形成する工程と、  Forming a wiring pattern made of a wiring material containing a first glass component on the heat-resistant substrate;
前記耐熱性基板の上の所定領域に、第２のガラス成分を含む接着材パターンを形成する工程と、  Forming an adhesive pattern containing a second glass component in a predetermined region on the heat-resistant substrate;
前記配線パターンを形成した後に、前記配線材料を加熱処理する工程と、  A step of heat-treating the wiring material after forming the wiring pattern;
発光素子を前記加熱処理後の配線パターンに電気的に接続する工程と、  Electrically connecting a light emitting element to the wiring pattern after the heat treatment;
前記発光素子の上にガラス材料を載せる工程と、  Placing a glass material on the light emitting element;
５５０℃〜７００℃の温度で加熱することにより前記ガラス材料を溶融して、前記発光素子を封止し且つ前記接着材パターンを介して前記耐熱性基板に接合するガラス部材を形成する工程とを有することを特徴とする発光装置の製造方法。  A step of melting the glass material by heating at a temperature of 550 ° C. to 700 ° C., sealing the light emitting element, and forming a glass member that is bonded to the heat resistant substrate through the adhesive pattern; A method for manufacturing a light-emitting device, comprising:
JP2005254127A 2005-09-01 2005-09-01 Light emitting device and method of manufacturing same Withdrawn JP2007067300A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005254127A JP2007067300A (en) 2005-09-01 2005-09-01 Light emitting device and method of manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005254127A JP2007067300A (en) 2005-09-01 2005-09-01 Light emitting device and method of manufacturing same

Publications (2)

Publication Number Publication Date
JP2007067300A JP2007067300A (en) 2007-03-15
JP2007067300A5 true JP2007067300A5 (en) 2008-09-04

Family

ID=37929115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005254127A Withdrawn JP2007067300A (en) 2005-09-01 2005-09-01 Light emitting device and method of manufacturing same

Country Status (1)

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JP (1) JP2007067300A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007080884A (en) * 2005-09-09 2007-03-29 Asahi Glass Co Ltd Light emitting device, method of manufacturing the same, and intermediate part therefor

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6344937Y2 (en) * 1981-05-26 1988-11-22
JPH03134905A (en) * 1989-10-19 1991-06-07 Showa Denko Kk Copper paste
JP2002236357A (en) * 2000-12-01 2002-08-23 Kansai Paint Co Ltd Method for forming conductive pattern
JP2003152130A (en) * 2001-11-16 2003-05-23 Tdk Corp Integrated circuit device
JP2004207367A (en) * 2002-12-24 2004-07-22 Toyoda Gosei Co Ltd Light emitting diode and light emitting diode arrangement plate
US7824937B2 (en) * 2003-03-10 2010-11-02 Toyoda Gosei Co., Ltd. Solid element device and method for manufacturing the same
JP4465989B2 (en) * 2003-06-18 2010-05-26 旭硝子株式会社 Light emitting diode element

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