JP2007067113A - Photoirradiation head and photoirradiation device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photoirradiation head which can be miniaturized. <P>SOLUTION: The photoirradiation head 2 is devised so that spreading efficiency of heat generating from an LED 10 is increased through cooperation with a heat radiator 14 and a case 9. That is, the heat radiator 14 is inserted into the case 9, and the front face of the heat radiator 14 is brought into contact with the rear face of the case 9, so that the face of the case 9 protecting the LED 10 can effectively be used as a heat radiating face. Thus, the area for heat radiation can be promoted for enlargement. As a result, outlines of the heat radiator 14 and the case 9 can be reduced in size, which can miniaturize the photoirradiation head 2. Furthermore, the front end face of the heat radiator 14 is brought into contact with the rear face of the LED 10, and a pair of conductive parts 23 connected, corresponding to each of terminals 10a, 10b of the LED 10 are pinched and fixed to the heat radiator 14. Accordingly, the photoirradiation head assembly is facilitated and contributes to a compact size. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention particularly relates to a light irradiation head and a light irradiation apparatus used as a spot light source such as UV and visible light.

  Conventionally, there is JP-A-2005-162880 as a technology in such a field. This publication discloses a light irradiating device. A condensing lens is disposed at the front end of a head portion provided in the light irradiating device, and an LED is disposed behind the condensing lens. This LED is a high-brightness type, and emits a large amount of heat. If this heat cannot be efficiently released, the light emission efficiency of the LED is lowered and the life of the LED is shortened. Therefore, an aluminum cooling block is brought into surface contact with the back surface of the LED, and heat from the LED is discharged to the outside through the cooling block. Further, a circuit board is disposed behind the cooling block, the circuit board is sandwiched between two divided housings, and the rear end of the cooling block is screwed to the front end of the housing.

JP 2005-162880 A JP 2004-111377 A

  However, the cooling block described above is exposed to the outside, and the cooling block alone is mainly responsible for heat dissipation of the LED. Therefore, to increase the heat dissipation efficiency of the LED, it is necessary to enlarge the cooling block. As a result, there is a problem in that the head portion provided in the light irradiation device is enlarged. Further, for example, when a UV curable adhesive is used for bonding small parts, it is necessary to set a plurality of head portions in a small jig, and miniaturization of the head portions is extremely beneficial.

  It is an object of the present invention to provide a light irradiation head that can be miniaturized and a light irradiation device provided with such a light irradiation head.

The light irradiation head according to the present invention has an LED housed in a housing, and is used by being fixed to the tip of a flexible cable.
The heat sink is inserted into the housing, the front surface is thermally connected to the back surface of the housing, and the front end surface is thermally connected to the back surface of the LED, and is housed in the housing and fixed so as to be sandwiched between the heat sinks. And a pair of conductive portions connected to the pair of terminals of the LED.

  This light irradiation head is a component scheduled to be fixed to the tip of the flexible cable, and light having a predetermined wavelength is emitted from the LED. And this invention is devised so that the diffusion efficiency of the heat | fever emitted from LED may be improved by cooperation with a heat radiator and a housing | casing. That is, by inserting the heat sink into the housing and bringing the surface of the heat sink into contact with the back surface of the housing, the surface of the housing protecting the LED can be effectively used as a heat dissipation surface. The expansion of the area can be promoted, and as a result, the outer shape of the heat radiating body and the housing can be reduced, and this makes it possible to reduce the size of the light irradiation head. Furthermore, the front end surface of the heat sink is in contact with the back surface of the LED, and a pair of conductive parts connected corresponding to the respective terminals of the LED are fixed so as to be sandwiched between the heat sinks. This facilitates assembly of the light irradiation head and contributes to downsizing.

  It is preferable to further include a condenser lens that is fixed to the housing and disposed in front of the LED. By this condensing lens, the light of LED can be efficiently condensed on the target.

  In addition, it is preferable that the radiator is made of a conductive material, and the conductive portion is fixed to the radiator through an electrical insulating portion. Such a configuration is optimal when a conductive material such as aluminum is used for the heat radiator.

  Moreover, it is preferable that the electrically insulating portion is an insulating substrate, and the conductive portion is formed on the insulating substrate. By using the insulating substrate on which the conductive portion is formed, it is possible to perform a simple operation of fixing the insulating substrate to the conductive heat radiating body with a screw or an adhesive when the light irradiation head is assembled.

  In addition, it is preferable that a recess for accommodating the insulating substrate is formed on the surface of the radiator. When such a configuration is adopted, when the light irradiation head is assembled, it is only necessary to fit the insulating substrate in the recess of the radiator, and the workability when the insulating substrate is attached to the radiator is improved. Substrate positioning is ensured.

  Further, it is preferable that a male screw portion is formed on the surface of the heat radiating body and a female screw portion is formed on the back surface of the housing. With such a configuration, it is possible to screw the radiator into the housing. Therefore, it is easy to fix the radiator in the housing. Moreover, by employing screw coupling, the contact area between the front surface of the radiator and the rear surface of the housing can be greatly increased, and thereby the heat dissipation effect can be greatly promoted. As a result, the radiator In addition, the outer shape of the housing can be made very small, which is extremely useful for promoting the miniaturization of the light irradiation head.

  In addition, it is preferable that thermally conductive grease is loaded between the surface of the radiator and the back surface of the housing. With such a configuration, heat can be efficiently transferred from the heat radiating body to the housing, and this also can greatly promote the heat radiating effect, which is extremely useful for promoting the miniaturization of the light irradiation head. .

  In addition, it is preferable that the radiator is formed of a non-conductive material and the conductive portion is disposed in a recess formed on the surface of the radiator. Such a configuration is optimal when a non-conductive material such as ceramic is used for the radiator.

  Further, it is preferable that a male screw portion is formed on the surface of the heat radiating body and a female screw portion is formed on the back surface of the housing. With such a configuration, it is possible to screw the radiator into the housing. Therefore, it is easy to fix the radiator in the housing. Moreover, by employing screw coupling, the contact area between the front surface of the radiator and the rear surface of the housing can be greatly increased, and thereby the heat dissipation effect can be greatly promoted. As a result, the radiator In addition, the outer shape of the housing can be made very small, which is extremely useful for promoting the miniaturization of the light irradiation head.

  In addition, it is preferable that thermally conductive grease is loaded between the surface of the radiator and the back surface of the housing. With such a configuration, heat can be efficiently transferred from the heat radiating body to the housing, and this also can greatly promote the heat radiating effect, which is extremely useful for promoting the miniaturization of the light irradiation head. .

The light irradiation apparatus according to the present invention supplies a light irradiation head having an LED housed in a housing, a drive unit for driving the LED, and both ends connected to the light irradiation head and the drive unit to supply power to the LED. In a light irradiation device having a flexible cable,
The light irradiation head is inserted into the housing, and the heatsink whose front surface is in contact with the back surface of the housing and whose front end surface is in contact with the back surface of the LED is housed in the housing and is sandwiched between the heatsink from the side. And a pair of conductive parts connected to a pair of terminals of the LED.

  The light irradiation head provided in this light irradiation apparatus is a component scheduled to be fixed to the tip of the flexible cable, and light having a predetermined wavelength is emitted from the LED. And this invention is devised so that the diffusion efficiency of the heat | fever emitted from LED may be improved by cooperation with a heat radiator and a housing | casing. That is, by inserting the heat sink into the housing, the contact area between the front surface of the heat sink and the back surface of the housing can be increased, thereby promoting the heat dissipation effect. The external shape of the body and the housing can be reduced, and this allows the light irradiation head to be miniaturized. Furthermore, the front end surface of the heat sink is in contact with the back surface of the LED, and a pair of conductive parts connected corresponding to the respective terminals of the LED are fixed so as to be sandwiched between the heat sinks. This facilitates assembly of the light irradiation head and contributes to downsizing.

  It is preferable that the light irradiation head further includes a condensing lens that is fixed to the housing and disposed in front of the LED. By this condensing lens, the light of LED can be efficiently condensed on the target.

  Further, it is preferable that the conductive wire of the flexible cable is connected to the conductive portion of the light irradiation head. Thereby, electrical connection between the drive unit and the LED terminal is achieved via the flexible cable.

  According to the present invention, the light irradiation head can be downsized.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a light irradiation head and a light irradiation apparatus according to the present invention will be described in detail with reference to the drawings.

  As shown in FIG. 1, the light irradiation device 1 is a device for spot-irradiating ultraviolet rays (UV) onto an object, such as bonding of optical communication components, bonding of optical pickup components, bonding of magnetic heads, CCDs. It can be used for adhesive bonding, electronic component fixing, fiber coating curing, liquid crystal sealing, coil winding fixing, UV ink drying, UV excitation light source, and intense ultraviolet irradiation experiment.

  The light irradiation device 1 includes a light irradiation head 2 having an LED and a condenser lens, a drive unit 3 that drives an LED in the light irradiation head 2, and both ends connected to the light irradiation head 2 and the drive unit 3. The flexible cable 4 mainly supplies power to the LED. The drive unit 3 includes a metal housing 5 having a rectangular parallelepiped shape. The housing 5 accommodates an LED drive control circuit, a power supply circuit, and the like. An operation panel 6 is provided on the front surface of the housing 5. Yes. Furthermore, four light irradiation heads 2 can be attached to the drive unit 3, and a plug 4 a is provided at the base end of each flexible cable 4, and each plug is connected to the drive unit 3 by the plug 4 a. The flexible cable 4 can be attached and detached.

  Next, various embodiments of the light irradiation head applied to the light irradiation apparatus 1 will be described.

[First Embodiment of Light Irradiation Head]
As shown in FIG. 2, the LED 10 used in this embodiment is an ultraviolet light emitting chip type, and generates high-output ultraviolet rays. In addition, a cathode terminal 10a and an anode terminal 10b extending in parallel are provided at both ends of the back surface (surface opposite to the light emitting surface 10d) of the LED 10, and the cathode terminal 10a and the anode terminal 10b are provided on the back surface. A rectangular heat radiating surface 10c is provided between them. The high-power ultraviolet LED 10 generates a large amount of heat, and a metal heat radiating surface 10c is provided on the back surface of the LED 10 in order to prevent the output and life of the LED 10 from decreasing.

  As shown in FIGS. 3 to 5, the light irradiation head 2 has a cylindrical first casing 11 having both ends open and forming a part of the casing 9, and has a diameter of about 10 mm and a length of about 30 mm. The first casing 11 having an outer shape is made of conductive aluminum in consideration of heat dissipation effect and weight reduction. Furthermore, a female screw portion 11a is formed over the entire length of the back surface (inner wall surface) of the first casing 11, and the front end of the female screw portion 11a has an outer shape with a diameter of about 10 mm and a length of about 15 mm. The second housing 12 is screwed. The second housing 12 forms the other of the housing 9 and is formed of cylindrical aluminum with both ends open. The second housing 12 has a rear end of the first housing 11 at the rear end thereof. A male screw portion 12a to be screwed into the female screw portion 11a is formed, a condensing lens 13 is fixed to the second housing 12, and the condensing lens 13 is disposed in front of the LED 10 (on the light emitting direction side of the LED 10). Has been. As described above, by making the housing 9 of the light irradiation head 2 into a structure that can be divided into two parts by screw connection, the condenser lens 13 can be easily replaced.

  Further, a heat radiating body 14 made of conductive aluminum is inserted into the first housing 11, and a male screw that engages with the female screw portion 11 a of the first housing 11 is inserted into the surface of the heat radiating body 14. A portion 14a is formed. At the front end of the heat radiating body 14, a recess 14b for accommodating the LED 10 is formed, and a pair of protrusions 14h used for positioning the LED 10 are provided. On both sides of the radiator 14, recesses 14 c and 14 d extending in the longitudinal direction are provided, the recess 14 c and the recess 14 d are opposed to each other, and the boundary between the recess 14 c and the recess 14 d is at the center of the radiator 14. It is formed as a partition wall 14e extending in the longitudinal direction.

  In the radiator 14, a through hole 14 f into which the end of the flexible cable 4 can be inserted is formed behind the partition wall 14 e. A female screw portion 14g that is screwed into the male screw portion 16a of the cable clamp 16 provided at the end of the cable 4 is formed on the inner wall surface that forms the through hole 14f.

  The recesses 14c and 14d formed on the surface of the heat radiating body 14 have such a size that the rectangular insulating substrates (electrical insulating portions) 17 and 18 having electrical insulation are fitted and positioned, and the insulating substrates 17 and 18 is fixed to the radiator 14 by screwing the set screws 19 and 20 into the screw holes 21 and 22 of the partition wall 14e. At this time, the back surfaces of the left and right insulating substrates 17 and 18 are in close contact with the surface of the partition wall 14 e, and the insulating substrate 17 and the insulating substrate 18 are arranged in parallel so as to sandwich the partition wall 14 e in the radiator 14. When the light irradiation head is assembled, it is only necessary to fit the insulating substrates 17 and 18 in the recesses 14c and 14d of the heat radiating body 14, and workability when the insulating substrates 17 and 18 are mounted on the heat radiating body 14 is improved. In addition, the positioning of the insulating substrates 17 and 18 is ensured.

  The back surfaces of the insulating substrates 17 and 18 having the same shape are formed flat so as to be in close contact with the surface of the partition wall 14e, and substantially the entire surface is formed on the front surface side of the insulating substrates 17 and 18. Conductive portions 23 and 24 are vapor-deposited, and insulating films 26 and 27 are provided on the conductive portions 23 and 24 so that a part of the conductive portion 23 is exposed (see FIG. 6). On the insulating substrates 17 and 18 having such a configuration, the front conductive parts 23a and 24a soldered to the cathode terminal 10a and the anode terminal 10b of the LED 10 and the soldered conductors 4a and 4b of the cable 4 are soldered. Side conductive portions 23b and 24b are provided. In this way, the conductive portion 23 on the insulating substrate 17 and the conductive portion 24 on the insulating substrate 18 form a pair, and the pair of conductive portions 23 and 24 are lateral to the radiator 14 (on the optical axis of the LED 10). It is fixed so as to be sandwiched from (substantially perpendicular direction). By using the insulating substrates 17 and 18 on which the conductive portions 23 and 24 are formed, the insulating substrates 17 and 18 can be easily attached to the conductive heat radiating body 14 with screws or adhesives when the light irradiation head 2 is assembled. Can be fixed.

  Furthermore, as shown in FIG. 6, since the thickness of the partition wall 14e substantially corresponds to the width of the heat radiating surface 10c of the LED 10, each of the insulating substrates 17 and 18 fitted in the recesses 14c and 14d of the heat radiating body 14 is provided. The end portions are positioned so as to expose the cathode terminal 10a and the anode terminal 10b of the LED 10, thereby enabling the terminals 10a and 10b and the front conductive portions 23a and 24a to be soldered. Further, it is possible to solder the conductive wires 4a and 4b of the cable 4 and the rear conductive portions 23b and 24b. In soldering, the heat radiating surface 10c of the LED 10 comes into contact with the front end surface A of the heat radiating body 14, that is, the front end surface A of the partition wall 14e, so that heat generated from the LED 10 is appropriately transmitted to the heat radiating body 14. And this heat is transmitted to the 1st housing | casing 11 from the thermal radiation body 14 currently screw-coupled, and is discharge | released outside. Further, by soldering the terminals 10a, 10b of the LED 10 and the front conductive portions 23a, 24a on the insulating substrates 17, 18, the heat of the LED 10 can be released to the insulating substrates 17, 18, and this heat is dissipated. 14 is transmitted to the first housing 11 via 14 and released to the outside.

  Thus, it is devised to increase the diffusion efficiency of the heat emitted from the LED 10 by the cooperation of the radiator 14 and the housing 11. That is, by inserting the heat radiating body 14 into the housing 11 and bringing the surface of the heat radiating body 14 into contact with the back surface of the housing 11, the surface of the housing 11 protecting the LED 10 is effectively used as a heat radiating surface. Therefore, the expansion of the heat radiation area can be promoted, and as a result, the outer shape of the heat radiating body 14 and the housing 11 can be reduced, which enables the light irradiation head 2 to be reduced in size. ing. Further, the front end surface A of the radiator 14 contacts the back surface of the LED 10, and a pair of conductive portions 23 and 24 connected corresponding to the terminals 10 a and 10 b of the LED 10 sandwich the radiator 14 from the side. So that it is fixed. As a result, the light irradiation head 2 can be easily assembled and contributes to compactness.

  Furthermore, since the heat radiator 14 can be screwed into the first housing 11, the heat radiator 14 can be easily fixed to the housing 11. Moreover, by adopting screw coupling, the contact area between the front surface of the radiator 14 and the back surface of the housing 11 can be greatly increased, and as a result, the heat dissipation effect can be greatly promoted. The external shapes of the heat radiating body 14 and the housing 11 can be made very small, which is extremely useful for promoting the miniaturization of the light irradiation head 2.

  When the first casing 11 and the radiator 14 are screwed together at the time of assembly, it is preferable that thermally conductive grease is loaded between the front surface of the radiator 14 and the rear surface of the casing 11. With this grease, heat can be efficiently transferred from the heat radiating body 14 to the housing 11, the heat radiating effect can be remarkably promoted, and it is extremely beneficial for promoting the miniaturization of the light irradiation head 2. Further, when the heat radiating surface 10c of the LED 10 and the front end surface A of the heat radiating body 14 are brought into contact with each other, it is preferable to use thermally conductive grease. Furthermore, the insulating substrates 17 and 18 and the housing 11 may be thermally connected by filling the recesses 14c and 14d of the radiator 14 with thermally conductive grease to fill the gaps.

  Next, a modification of the first embodiment will be described. As shown in FIGS. 7 and 8, the light irradiation head 30 has a short heat radiating body 31 made of aluminum, and conductive portions 34 and 35 are provided on short insulating substrates 32 and 33. The insulating substrates 32 and 33 are loaded in the recesses 31c and 31d of the heat radiator 31, and are fixed to the wall surface of the partition wall 31e with an adhesive. Since the other configuration of the light irradiation head 30 is the same as or equivalent to that of the light irradiation head 2, the same reference numerals are given to the drawings, and the description thereof is omitted.

[Second Embodiment of Light Irradiation Head]
As shown in FIG. 9, the LED 40 used in this embodiment is an ultraviolet light emitting chip type, and generates high-output ultraviolet rays. A cathode terminal 40a and an anode terminal 40b are provided at both ends of the back surface of the LED 40, and an H-shaped heat radiation surface 40c is provided on the back surface so as to surround the terminals 40a and 40b. In the LED 40, the heat dissipation surface 40c is increased in size.

  As shown in FIGS. 10 to 12, the light irradiation head 42 according to the second embodiment has a narrow insulating substrate 43, corresponding to the size of the cathode terminal 40 a and the anode terminal 40 b on the back surface of the LED 40. 44. Further, the aluminum radiator 45 is provided with recesses 45c and 45d corresponding to the width of the insulating substrates 43 and 44, and a partition wall 45e having a large width. The heat transfer efficiency from the LED 40 to the heat radiating body 45 is enhanced by the partition wall 45e having a large width. Further, the left and right insulating substrates 43 and 44 are fixed to the partition wall 45e by two set screws 46 and 47. In addition, since it is the same as that of the light irradiation head 2 about the structure other than this of the light irradiation head 42, it attaches | subjects the same code | symbol to drawing and the description is abbreviate | omitted.

[Third Embodiment of Light Irradiation Head]
As shown in FIG. 13, the LED 50 used in this embodiment is an ultraviolet light emitting chip type, and generates high-output ultraviolet rays. A heat radiating surface 50c is provided in substantially the entire back surface of the LED 50, and a cathode terminal 50a and an anode terminal 50b are provided on both side surfaces of the LED 50. In the LED 50, the heat dissipation surface 50c is enlarged.

  As shown in FIGS. 14 to 16, the aluminum radiator 55 of the light irradiation head 52 according to the third embodiment is provided with a large partition wall 55e so as to correspond to the large heat radiating surface 50c. ing. The insulating substrates 17 and 18 are fixed to the partition wall 55e by set screws 19 and 20, respectively. At this time, the surfaces of the front conductive portions 23a and 24a of the insulating substrates 17 and 18 and the terminals 50a and 50b of the LED 50 are flush with each other, so that the soldering operation is facilitated. And the heat transfer efficiency from LED50 to the thermal radiation body 55 is raised by adoption of the partition wall 55e of a big width. In addition, in the light irradiation head 52, about the structure same or equivalent to the light irradiation head 2, the same code | symbol is attached | subjected to drawing and the description is abbreviate | omitted.

[Fourth Embodiment of Light Irradiation Head]
As shown in FIG. 17, the LED 60 used in this embodiment is an ultraviolet light emission lead type, and generates high-output ultraviolet rays. A heat dissipating surface 60c is provided over substantially the entire back surface of the LED 60, and the base ends of the lead-like cathode terminal 60a and the anode terminal 60b are fixed to both side surfaces of the LED 60. In the LED 60, the heat dissipation surface 60c is enlarged. In addition, since the light irradiation head 62 which concerns on 4th Embodiment shown by FIGS. 18-20 is the same as the light irradiation head 52 shown by FIGS. 14-16 except LED, about the same or equivalent structure, The same reference numerals are given to the drawings, and the description thereof is omitted.

[Fifth Embodiment of Light Irradiation Head]
As shown in FIG. 2, the LED 10 used in this embodiment is an ultraviolet light emitting chip type, and generates high-output ultraviolet rays. In addition, a cathode terminal 10a and an anode terminal 10b extending in parallel are provided at both ends of the back surface of the LED 10, and a rectangular heat radiation surface 10c is provided between the cathode terminal 10a and the anode terminal 10b on the back surface. It has been.

  As shown in FIGS. 21 to 23, the light irradiation head 72 according to the fifth embodiment has a non-conductive heat dissipation body 75 made of ceramic. A male screw portion 75a is formed on the outer periphery of the heat radiating body 75, and a conductive material (gold, silver, copper, etc.) is metalized in the recesses 75c, 75d formed on both side surfaces of the heat radiating body 75. Conductive portions 76 and 77 are integrally provided on the radiator 75. Furthermore, a metal surface 75f that enables soldering to the heat radiating surface 10c of the LED 10 is provided at the front end of the partition wall 75e. Then, the cathode terminal 10 a and the anode terminal 10 b of the LED 10 are fixed to the end surfaces of the conductive portions 76 and 77 by reflow soldering, and the heat dissipation surface 10 c of the LED 10 is fixed to the metal surface 75 f of the heat radiator 75. Thus, by adopting the non-conductive heat dissipation body 75 made of ceramic, an insulating substrate is not required, and the configuration of the light irradiation head 72 is simplified.

  Further, an aluminum cylindrical connecting member 80 is screwed to the rear end of the first housing 11, and the front portion of the connecting member 80 is screwed to the female screw portion 11 a of the first housing 11. A male screw portion 80a is formed, and a female screw portion 80b that is screwed into the male screw portion 16a of the cable clamp 16 is formed at the rear portion of the connecting member 80. In addition, in the light irradiation head 72, about the structure same or equivalent to the light irradiation head 2, the same code | symbol is attached | subjected to drawing and the description is abbreviate | omitted.

  It goes without saying that the present invention is not limited to the embodiment described above. For example, instead of an LED that generates ultraviolet light, an LED that emits visible light may be used. In fixing the insulating substrate to the radiator, either a set screw or an adhesive may be used. Moreover, you may press-fit a heat sink in a housing | casing. A plate material that transmits ultraviolet light may be fixed to the front end of the housing.

It is a perspective view which shows one Embodiment of the light irradiation apparatus which concerns on this invention. It is a perspective view which shows LED. It is a disassembled perspective view which shows 1st Embodiment of the light irradiation head which concerns on this invention. It is sectional drawing of the light irradiation head shown in FIG. It is a side view which shows the state which connected the cable and LED to the electroconductive part on the insulated substrate attached to the heat radiator. It is a principal part expanded sectional view of the light irradiation head shown in FIG. It is a disassembled perspective view which shows the modification of the light irradiation head shown in FIG. It is a principal part expanded sectional view of the light irradiation head shown in FIG. It is a perspective view which shows LED. It is a disassembled perspective view which shows 2nd Embodiment of the light irradiation head which concerns on this invention. It is sectional drawing of the light irradiation head shown in FIG. It is a principal part expanded sectional view of the light irradiation head shown in FIG. It is a perspective view which shows LED. It is a disassembled perspective view which shows 3rd Embodiment of the light irradiation head which concerns on this invention. It is sectional drawing of the light irradiation head shown in FIG. It is a principal part expanded sectional view of the light irradiation head shown in FIG. It is a perspective view which shows LED. It is a disassembled perspective view which shows 4th Embodiment of the light irradiation head which concerns on this invention. It is sectional drawing of the light irradiation head shown in FIG. It is a principal part expanded sectional view of the light irradiation head shown in FIG. It is a disassembled perspective view which shows 5th Embodiment of the light irradiation head which concerns on this invention. It is sectional drawing of the light irradiation head shown in FIG. It is a principal part expanded sectional view of the light irradiation head shown in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Light irradiation apparatus, 2, 30, 42, 52, 62, 72 ... Light irradiation head, 3 ... Drive unit, 4 ... Flexible cable, 4a, 4b ... Conductive wire of cable 10, 40, 50, 60 ... LED, 10a, 10b, 40a, 40b, 50a, 50b ... LED terminal, 9 ... housing, 11 ... first housing, 12 ... second housing, 11a ... female screw portion, 13 ... condensing light Lens, 14, 31, 45, 55, 75 ... radiator, 14a, 75a ... male screw part, 14c, 14d, 75c, 75d ... concave part, 17, 18, 32, 33, 43, 44 ... insulating substrate (electrical insulation) Part), 23, 24, 76, 77 ... conductive part, A ... front end face of the radiator.

Claims (13)

In a light irradiation head that has an LED housed in a housing and is used by being fixed to the tip of a flexible cable,
A heat radiator that is inserted into the housing, the front surface is thermally coupled to the back surface of the housing, and the front end surface is thermally coupled to the back surface of the LED;
A light irradiation head comprising: a pair of conductive parts housed in the housing and fixed so as to be sandwiched with respect to the heat radiating body, and connected to a pair of terminals of the LED.   The light irradiation head according to claim 1, further comprising a condensing lens fixed to the housing and disposed in front of the LED.   3. The light irradiation head according to claim 1, wherein the heat radiator is formed of a conductive material, and the conductive portion is fixed to the heat radiator via an electric insulating portion.   The light irradiation head according to claim 3, wherein the electrical insulating portion is an insulating substrate, and a conductive portion is formed on the insulating substrate.   The light irradiation head according to claim 4, wherein a recess for accommodating the insulating substrate is formed on the surface of the radiator.   The light irradiation according to claim 1, wherein a male screw part is formed on the front surface of the heat radiating body, and a female screw part is formed on the rear surface of the housing. head.   The light irradiation head according to claim 1, wherein thermally conductive grease is loaded between the front surface of the radiator and the back surface of the housing.   2. The light irradiation head according to claim 1, wherein the heat radiator is formed of a non-conductive material, and the conductive portion is disposed in a recess formed on the surface of the heat radiator.   The light irradiation head according to claim 8, wherein a male screw portion is formed on the front surface of the heat radiating body, and a female screw portion is formed on the back surface of the housing.   The light irradiation head according to claim 8, wherein thermally conductive grease is loaded between the front surface of the heat radiating body and the back surface of the housing. A light irradiation head having an LED housed in a housing;
A drive unit for driving the LED;
In the light irradiation device having both ends connected to the light irradiation head and the drive unit and a flexible cable for supplying power to the LED,
The light irradiation head includes:
Inserted into the housing, the front surface is in contact with the back surface of the housing, and the front end surface is in contact with the back surface of the LED;
A light irradiation apparatus comprising: a pair of conductive parts housed in the casing and fixed so as to be sandwiched between the heat radiating bodies and connected to a pair of terminals of the LED.   The light irradiation apparatus according to claim 11, wherein the light irradiation head further includes a condenser lens fixed to the housing and disposed in front of the LED.   The light irradiation apparatus according to claim 11 or 12, wherein the conductive wire of the flexible cable is connected to the conductive portion of the light irradiation head.

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