JP2007066973A - Common mode choke coil - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small and low profile common mode choke coil. <P>SOLUTION: The common mode choke coil 1 comprises a laminate 10 in which a pair of spiral coils are buried while being arranged oppositely, and terminal electrodes 21-24 formed on the upper surface or the lower surface of the laminate 10. The laminate 10 is formed by laminating a first insulator layer 30 in which the pair of spiral coils 61 and 62 are buried, a pair of film-like magnetic body layers 41 and 42 formed by a non-sintering deposition method on the upper and lower surface of the first insulator layer 30, and a pair of second insulator layers 51 and 52 formed on the film-like magnetic body layers 41 and 42. Extraction electrodes 71-74 in which the terminal electrodes 21-24 are formed partially are buried in the second insulator layer 51 and connected with the coils 61 and 62 through via holes 81-84 penetrating the film-like magnetic body layer 41. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a common mode choke coil used for the purpose of removing common mode noise in applications such as high-speed differential transmission, and more particularly to a non-winding type common mode choke coil.

Common mode choke coils are roughly classified into a winding type and a non-winding type, and the latter non-winding type coil is preferable from the viewpoint of miniaturization and low profile. Conventionally, as a basic structure of a non-winding type common mode choke coil, one described in Patent Document 1 is known. The common mode choke coil includes a pair of magnetic substrates made of a ferrite sintered body and the like, and a laminated body sandwiched between the magnetic substrates. The laminate is a laminate of an insulator layer, a coil conductor layer, and an extraction electrode layer. The insulator layer is made of a material such as polyimide resin or epoxy resin.
JP-A-8-203737

  In this type of common mode choke coil, a major problem is to reduce the height, that is, to reduce the thickness of the component. In a conventional common mode choke coil, a ferrite plate having a thickness of several hundreds μm is used as a magnetic substrate, and the thickness of the ferrite plate occupies more than half of the thickness of the entire component. Therefore, as a direction for reducing the height, the magnetic substrate is considered to be thin. However, it is difficult to manufacture and mount a ferrite plate having a thickness of 100 μm or less because of mechanical strength.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a common mode choke coil having a small size and a low profile.

  In order to achieve the above object, in the present application, in a common mode choke coil including a laminated body in which a pair of spiral coils arranged opposite to each other is embedded, and a terminal electrode formed on the upper surface or the lower surface of the laminated body. The laminate includes a first insulator layer in which the pair of spiral coils are embedded, and a pair of films formed by a non-sintering film formation method on the upper and lower surfaces of the first insulator layer. A layered magnetic layer and a pair of second insulator layers formed on the film-like magnetic layer are laminated, and the terminal electrode is partially formed on the second insulator layer. Further, the present invention proposes a structure in which an extraction electrode is embedded and the extraction electrode is connected to the coil through a via hole penetrating the film-like magnetic layer.

  According to the present invention, since the magnetic body is made of an extremely thin film-like magnetic body formed by a non-sintered film forming method, it is greatly reduced in size and height compared to the conventional one using a ferrite plate. Is possible. Non-sintered film formation methods include ferrite plating, aerosol deposition method, sputtering method, laser vapor deposition method, CVD, etc. Using a film-like magnetic material formed by this non-sintered film formation method It has been confirmed by simulation that the common mode choke coil can produce the same or better performance than that using the sintered ferrite body.

  In addition, in this type of electronic component, reliability at the time of board mounting is also an important issue. Specifically, the impact resistance at the time of mounting becomes a problem. In the present invention, since the non-sintered film-like magnetic body that is relatively weak against impact is covered with the second insulator layer, the reliability can be easily improved. If an insulating resin layer is used as the second insulator layer, the shock absorption rate is excellent and the linear expansion coefficient can be easily adjusted, which is further preferable from the viewpoint of improving the reliability during mounting. It is.

  As described above, according to the common mode choke coil of the present invention, it is possible to realize a significant reduction in size and height as compared with the conventional product while maintaining the performance such as the common mode impedance.

(First embodiment)
A common mode choke coil according to a first embodiment of the present invention will be described with reference to the drawings. 1 is an external perspective view of a common mode choke coil, FIG. 2 is an exploded perspective view of the laminate, and FIG. 3 is a cross-sectional view of the laminate.

  As shown in FIG. 1, the common mode choke coil 1 is formed on a laminated body 10 in which a pair of coils are embedded, and either the upper surface or the lower surface of the laminated body 10, and is connected to each coil end. Terminal electrodes 21, 22, 23, and 24 are provided. The terminal electrodes 21, 22, 23, 24 are arranged at regular intervals in a lattice shape, and the pitch interval between the terminal electrodes 21, 22, 23, 24 is the same as that widely used in integrated circuits and the like. . The laminate 10 includes a first insulator layer 30 in which each coil is embedded, film-like magnetic layers 41 and 42 formed on both surfaces of the first insulator layer 30, and magnetic layers 41 and 42. The second insulator layers 51 and 52 formed outside are laminated. The second insulating layers 51 and 52 are respectively formed of insulating resin layers 53 and 54 formed on the outer sides of the magnetic layers 41 and 42 and coatings formed so as to cover the insulating resin layers 53 and 54. The layers 55 and 56 are stacked.

  The internal structure of the laminate 10 will be described with reference to an exploded perspective view of FIG. 2 and a cross-sectional view of FIG. Note that FIG. 2 omits illustration of the layer structure of the laminate 10 in order to explain the structure of the coil and the terminal electrode. FIG. 3 is a cross-sectional view taken along a line passing through the terminal electrodes 21 and 23.

  As shown in FIG. 2 and FIG. 3, in the laminated body 10, a pair of spiral coil conductors 61 and 62 arranged to face each other, and an outer peripheral side end portion or an inner peripheral side end portion of the coil conductors 61 and 62. Lead electrodes 71, 72, 73, 74 connected to are embedded. The coil conductors 61 and 62 are embedded in the first insulator layer 30. The extraction electrodes 71, 72, 73, 74 are embedded in the second insulator layer 51. More specifically, the extraction electrodes 71, 72, 73 and 74 are formed at the boundary between the insulating resin layer 53 and the coating layer 55. The terminal electrodes 21, 22, 23 and 24 are formed at one end of each of the extraction electrodes 71, 72, 73 and 74. The terminal electrodes 21, 22, 23, 24 are formed so as to penetrate the coating layer 55. The other ends of the extraction electrodes 71 and 72 extend to positions where they overlap with the outer peripheral side ends of the coil conductors 61 and 62 in the thickness direction, and the insulating resin layer 53, the magnetic layer 41, and the first insulating layer. The coil conductors 61 and 62 are electrically connected to the outer peripheral end portions of the coil conductors 61 and 62 through vias 81 and 82 penetrating 30. On the other hand, the other ends of the lead electrodes 73 and 74 extend to positions where they overlap with the inner peripheral side ends of the coil conductors 61 and 62 in the thickness direction, and the insulating resin layer 53, the magnetic layer 41, and the first end. The vias 83 and 84 that penetrate the insulator layer 30 are electrically connected to the inner peripheral side ends of the coil conductors 61 and 62.

  As a material for the coil conductors 61 and 62 and the extraction electrodes 71 to 74, a metal having excellent conductivity, for example, Ag, Pd, Cu, Al, or an alloy thereof is used. As materials for the terminal electrodes 21 to 24, solder (paste, ball, lead-free solder, etc.), electroless nickel / gold plating, or the like can be used.

  As the first insulator layer 30 and the insulating resin layers 53 and 54, the same base material used as an interlayer insulating layer in a printed wiring board or a thin film process is used, and benzocyclobutene generally used in these. (BCB) An organic resin such as polyimide, epoxy, or polyester is used as a material. Moreover, the linear expansion coefficient of the first insulator layer 30 and the insulating resin layers 53 and 54 is preferably a value close to the linear expansion coefficient of the mounting destination substrate, specifically 10 to 80 ppm. Specifically, the coating layers 55 and 56 are preferably organic resins such as epoxy resins and polyimide resins, particularly epoxy resins and polyimide resins used in solder masks, solder resists, coverlay films and the like.

  The magnetic layers 41 and 42 are made of a magnetic material having a permeability of 15 or more, and are formed by a non-sintered film forming method such as ferrite plating, aerosol deposition method, sputtering method, laser vapor deposition method, or CVD. It is a magnetic film. The thickness of the magnetic layers 41 and 42 is several tens of μm or less (less than 75 μm).

  The thickness of the magnetic layer of the present invention is recommended to be less than 75 μm, preferably less than 10 to 75 μm, more preferably 20 μm to 50 μm. If the magnetic layer is too thin, magnetic saturation is likely to occur, and desired characteristics may not be obtained. On the other hand, if the magnetic layer is too thick, it is difficult to reduce the height, which may lead to high costs.

  Next, a method for manufacturing the common mode choke coil will be described with reference to FIGS. In addition, about the part which quotes the number which is not referred in drawing, the part of the same referential mark of another drawing is shown, The description is abbreviate | omitted.

  First, a portion corresponding to the first insulator layer 30 is manufactured by using a build-up method that has been conventionally used in the manufacture of printed wiring boards. Specifically, as shown in FIG. 4, plating, etching, printing, an ink jet method, or the like is provided on both surfaces of the base 101 which is a portion interposed between the coil conductors 61 and 62 in the first insulator layer 30. Thus, the coil conductor pattern 102 is formed (FIG. 4A).

  Next, resin layers 103 corresponding to other portions of the first insulator layer 30 are formed on both surfaces of the base 101 (FIG. 4B). The resin layer 103 is formed by a thermal vacuum laminating or isostatic pressing method in the case of a copper clad laminate (RCC) or a dry film insulating material, and is formed by a spin coating method in the case of a liquid insulating material. To do. In particular, the use of a thermal vacuum laminate is preferable in terms of suppressing variations in film thickness. Various organic resins are used as the material of the resin layer 103, and the resin may be either a thermoplastic resin or a thermosetting resin.

  Examples of thermosetting resins include benzocyclobutene (BCB), epoxy resin, phenol resin, unsaturated polyester resin, vinyl ester resin, polyimide resin (PI), polyphenylene ether oxide resin (PPO), bismaleimide triazine cyanate ester Examples thereof include resins, fumarate resins, polybutadiene resins, and polyvinyl benzyl ether resins. Examples of thermoplastic resins include very low density polyethylene resin (VLDPE), low density polyethylene resin (LDPE), linear low density polyethylene resin (LLDPE), medium density polyethylene resin (MDPE), and high density polyethylene resin (HDPE). ), Polypropylene resin (PP), polybutene resin, polymethylpentene resin, polyvinyl alcohol resin, ethylene / vinyl alcohol copolymer, polyacrylonitrile, polyamide resin, polyacetal resin, polyethylene terephthalate resin, polybutylene terephthalate resin, polyphenylene sulfide resin, Examples include polyetheretherketone resins, isotactic polystyrene resins, liquid crystal polymers, and the like. In particular, epoxy resin, polyimide resin (PI), and benzocyclobutene (BCB) are highly reliable because of their low dielectric constant and low dielectric loss tangent, as well as excellent chemical resistance and low water absorption. Is preferable in that it can be secured.

  When a thermoplastic resin is used, it is important that the plastic temperature of the outer insulating resin layer is lower than that of the insulating resin layer serving as a base in order to prevent fluctuation of the inner insulating layer thickness due to lamination.

  Next, a magnetic material layer 104 made of a ferrite film is formed on both surfaces of the resin layer 103 by a non-sintered film forming method such as ferrite plating, aerosol deposition method, sputtering method, laser vapor deposition method, CVD, etc. (FIG. 4C). Next, the resin layer 105 corresponding to the insulating resin layers 53 and 54 is formed on the surface of the magnetic layer 104 by the same method and material as described above (FIG. 4D). Next, through holes are formed to form the vias 81, 82, 83, and 84, and the extraction electrode pattern 106 is formed (FIG. 4E). Next, a resin layer 107 corresponding to the covering layers 55 and 56 is formed so as to cover the insulating resin layers 53 and 54 and the extraction electrode pattern 106 (FIG. 5F). Next, a through hole 108 is formed in the resin layer 107 so that the extraction electrode pattern 106 is exposed at the position where the terminal electrode is formed (FIG. 5G). In the process of forming the resin layer 107 and the through hole 108, a conventionally known photosensitive solder resist method is used. Next, a terminal electrode 109 is formed in the through hole 108 by using a conventionally known photolithography method (FIG. 5H). Next, the laminate 10 is obtained by cutting the laminate for each unit part (FIG. 5 (i)). Finally, the common mode choke coil 1 can be obtained by forming a plating film on the surface of the terminal electrode and, if necessary, a ball bump.

  According to the common mode choke coil 1 according to the present embodiment, it is formed to a thickness of several tens of μm or less by a non-sintered film forming method such as ferrite plating, aerosol deposition method, sputtering method, laser vapor deposition method, or CVD. So it will be small and low profile. In addition, since the insulating resin layers 53 and 54 are formed on the upper and lower surfaces of the common mode choke coil 1 so as to cover the magnetic layers 41 and 42, the resin layer 53, 54 is excellent in impact resistance. By setting the linear expansion coefficient of 54 to 10 to 80 ppm, the reliability at the time of board mounting is improved.

  Further, in the present embodiment, since the first insulator layer 30 is formed by the build-up method in the direction of the magnetic layers 41 and 42 with the portion interposed between the pair of coil conductors 61 and 62 as a base, The interval between the pair of coil conductors 61 and 62 can be stabilized with high accuracy. Since this coil interval greatly affects the characteristics of the common mode choke coil, it is preferable from the viewpoint of stability of characteristics.

(Second Embodiment)
A common mode choke coil according to a second embodiment of the present invention will be described with reference to the drawings. FIG. 6 is a cross-sectional view of a common mode choke coil.

  The common mode choke coil 2 according to the present embodiment is different from the first embodiment in that the first embodiment is an open magnetic circuit type in which the magnetic path is opened. In the embodiment, the magnetic path is a closed magnetic circuit type. That is, the layer structure in the laminate 10 is different from that of the first embodiment. The electrode structures such as the coil conductors 61 and 62 and the extraction electrodes 71 to 74 are the same as those in the first embodiment.

  As shown in FIG. 6, the laminated body 10 has coil conductors 61 and 62, lead electrodes 71 to 74, and vias 81 to 84 embedded in an insulator layer 35 made of the same material as that of the first embodiment. It has a structure. The magnetic layers 41 and 42 are arranged between the formation layers of the coil conductors 61 and 62 and the formation layers of the extraction electrodes 71 to 74, as in the first embodiment. However, unlike the first embodiment, the magnetic layers 41 and 42 are connected by the second magnetic body 91 inside the inner peripheries of the coil conductors 61 and 62, and outside the outer peripheries of the coil conductors 61 and 62. In this case, the third magnetic body 92 is connected. The magnetic layer 41, the second magnetic body 91, and the third magnetic body 92 are integrally formed in a planar shape in a direction intersecting the laminated surface. Via holes 81 to 84 connecting the extraction electrodes 71 to 74 of the coil conductors 61 and 62 penetrate the magnetic layer 41. Further, the magnetic layers 41 and 42 do not extend to the side surface of the multilayer body 10, and have a structure formed up to the end of the third magnetic body 92. That is, the magnetic layers 41 and 42, the second magnetic body 91, and the third magnetic body 92 form a closed magnetic path.

  Next, a method for manufacturing the common mode choke coil 2 will be described with reference to FIGS.

  First, the laminated body 201 in which the coil conductor is embedded is obtained by the same method and procedure as in FIGS. 4A to 4B in the first embodiment (FIG. 7A). Next, a through-hole 202 for forming the above-described second magnetic body 91 is formed in the laminated body 201 inside the coil, and a through-hole 203 for forming the third magnetic body 92 is formed. Is formed inside the coil (FIG. 7B). The through holes 202 and 203 are formed by a method such as laser, sand blasting or chemical etching so as not to cut the internal electrode pattern.

  On the other hand, an insulating sheet 204 corresponding to the insulating resin layer 54 covering the magnetic layer 42 is prepared, and the above-described ferrite plating, aerosol deposition method, sputtering method, laser deposition method, CVD, etc. are applied to the insulating sheet 204. A magnetic film 205 is formed by a sintering method, and this insulating sheet 204 is bonded to the laminate 201 (FIGS. 7C and 7D).

  Next, the magnetic film 206 is integrally formed on the inner surfaces of the through holes 202 and 203 by a non-sintering film forming method such as ferrite plating, aerosol deposition method, sputtering method, laser vapor deposition method, CVD, etc. It forms (FIG.8 (e)). Then, a resin layer 207 is formed on the upper surface of the magnetic film 206 (FIG. 8F). At this time, the through hole 203 is also filled with resin. Thereafter, as in the first embodiment, formation of the extraction electrode 208 (FIG. 8G), formation of the coating layer 209 (FIG. 8H), formation of the terminal electrode (not shown), cutting ( The common mode choke coil 2 is obtained by performing a plating process (not shown) or the like (not shown).

  Next, another method for manufacturing the common mode choke coil 5 according to the present embodiment will be described with reference to FIGS.

  First, as in the first embodiment, a layered body 211 is obtained by creating a layer between the magnetic layers 41 and 42 by a build-up method or the like, and the above-described non-layered surface is formed on one surface of the layered body 211. A magnetic film 212 is formed by a sintering method (FIG. 9A). Next, a through-hole 213 for forming the above-described second magnetic body 91 is formed in the laminated body 211 outside the coil, and a through-hole 214 for forming the third magnetic body 92 is formed. Is formed inside the coil (FIG. 9B). The through holes 213 and 214 are formed by a method such as laser, sand blasting or chemical etching so as not to cut the internal electrode pattern.

  Next, an insulating sheet 215 corresponding to the insulating resin layer 54 covering the magnetic layer 42 is prepared, and this insulating sheet 215 is bonded to the laminate 211 (FIGS. 9C and 9D). Next, the magnetic film 216 is integrally formed on the inner surfaces of the through-hole 213 and the through-hole 214 and on the bottom surface of the through-hole 213 by the non-sintering film forming method (FIG. 9E). Thereafter, similarly to the method described with reference to FIGS. 7 and 8 and the first embodiment, a resin layer is formed on the upper surface of the magnetic film 216, an extraction electrode is formed, and a covering layer is formed. The common mode choke coil 2 is obtained by forming a terminal electrode, cutting the laminate, and performing a plating treatment of a short electrode (not shown).

  According to the common mode choke coil 2 according to the present embodiment, since the magnetic path is closed in the laminated body 10, the common mode impedance is improved. Other operations and effects are the same as those in the first embodiment.

(Third embodiment)
A common mode choke coil according to a third embodiment of the present invention will be described with reference to the drawings. FIG. 10 is an external perspective view of the common mode choke coil, and FIG. 11 is a cross-sectional view of the common mode choke coil.

  The common mode choke coil 3 according to the present embodiment is different from the first embodiment in that the first embodiment is a two-circuit, four-terminal common mode choke coil incorporating a pair of coils. On the other hand, in this embodiment, it is an array type common mode choke coil having 4 circuits and 8 terminals that incorporates two pairs of coils. In FIGS. 10 and 11, reference numerals “a” and “b” are attached to the end of the reference numerals in order to represent the respective systems.

  As shown in FIGS. 10 and 11, the common mode choke coil 3 includes terminal electrodes connected to the respective coil ends on either the upper surface or the lower surface of the multilayer body 10 as in the first embodiment. 21a-24a, 21b-24b are formed. The terminal electrodes 21a to 24a and 21b to 24b are arranged at regular intervals in a lattice shape, and the pitch intervals of the terminal electrodes 21a to 24a and 21b to 24b are common to those widely used in integrated circuits and the like. . As in the first embodiment, the multilayer body 10 includes a first insulator layer 30, magnetic layers 41 and 42 formed on both surfaces of the first insulator layer 30, and magnetic layers 41 and 42. It has a structure in which second insulator layers 51 and 52 formed on the surface are laminated. Similarly to the first embodiment, the second insulator layers 51 and 52 are formed of insulating resin layers 53 and 54 formed outside the magnetic layers 41 and 42, respectively, and the insulating resin layers 53, In this structure, coating layers 55 and 56 formed so as to cover 54 are laminated.

  The structure of the coil and the extraction electrode in the laminated body 10 is a structure in which the coil and the extraction electrode according to the first embodiment are arranged in parallel for two systems. A characteristic point of this embodiment is that the magnetic layers 41 and 42 are separated for each system as shown in FIG. That is, coil conductors 61a and 62a according to the first system are arranged between the magnetic layers 41a and 42a, and coil conductors 61b and 62b according to the second system are arranged between the magnetic layers 41b and 42b. Has been. Other configurations, materials, manufacturing methods, and the like are the same as those in the first embodiment.

  According to the common mode choke coil according to the present embodiment, the magnetic layers 41 and 42 are separated for each system, so that magnetic coupling between the systems can be reduced. Thereby, crosstalk between systems can be reduced. Other operations and effects are the same as those in the first embodiment. In addition, although this Embodiment was demonstrated as a modification of 1st Embodiment, the same structure is employable also with respect to the common mode choke coil of 2nd Embodiment.

(Fourth embodiment)
A common mode choke coil according to a fourth embodiment of the present invention will be described with reference to the drawings. 12 is a cross-sectional view of the common mode choke coil, and FIG. 13 is an exploded perspective view of the laminate.

  The common mode choke coil 4 according to the present embodiment is different from the second embodiment in that terminal electrodes are provided on both surfaces of the laminate 10 as shown in FIGS. Specifically, terminal electrodes 21 to 24 are formed on one surface of the laminate 10 as in the second embodiment, and the terminal electrode 21 is sandwiched between the laminate 10 on the other surface. Terminal electrodes 25 to 28 are formed at positions facing to 24.

  In the second insulator layer 52, extraction electrodes 75 to 78 similar to the extraction electrodes 71 to 74 embedded in the second insulator layer 51 are embedded. More specifically, each extraction electrode 75 to 78 is formed at the boundary between the insulating resin layer 54 and the coating layer 56. In addition, the extraction electrodes 75 to 78 are formed in positions and shapes that are symmetrical to the extraction electrodes 71 to 74 formed on the second insulator layer 51. The terminal electrodes 25 to 28 are formed at one end of the extraction electrodes 75 to 78. The other ends of the extraction electrodes 75 to 78 are connected to the ends of the coil conductors 61 and 62 through vias 85 to 88. With this configuration, the opposing terminal electrodes 21 and 25, 22 and 26, 23 and 27, and 24 and 28 are electrically connected. Other configurations, materials, manufacturing methods, and the like are the same as those in the second embodiment.

  According to the present embodiment, since the terminal electrodes 21 to 28 are formed on both surfaces of the laminate 10, the degree of freedom in mounting is improved. Specifically, since there are no parts up and down, bulk feeder mounting is possible, and compared to taping mounting, mounting cost can be reduced and processing of unnecessary tape after mounting can be reduced. In addition, when three-dimensional mounting is performed such as when the common mode choke coil is embedded in a component-embedded substrate, the upper or lower terminal electrodes can be arbitrarily selected. As a result, it is possible to route the wiring shorter without increasing the wiring pitch as compared with the conventional non-winding type common mode choke coil and as compared with the second embodiment. Other operations and effects are the same as those of the second embodiment. In addition, although this Embodiment was demonstrated as a modification of 2nd Embodiment, the same structure is employable also with respect to the common mode choke coil of 1st or 3rd Embodiment.

(Fifth embodiment)
A common mode choke coil according to a fifth embodiment of the present invention will be described with reference to the drawings. 14 is a cross-sectional view of the common mode choke coil, and FIG. 15 is an exploded perspective view of the laminate.

  The common mode choke coil 5 according to the present embodiment is different from the second embodiment in that the input-side terminal electrode and the output-side terminal electrode are connected to each other as shown in FIGS. It is in the point provided in a different surface. Specifically, terminal electrodes 21 and 22 are formed on one surface of the laminate 10, and terminal electrodes 23 and 24 are formed on the other surface.

  In the second insulator layer 51, lead electrodes 73 and 74 connected to the inner peripheral side ends of the coil conductors 61 and 62 are embedded. More specifically, each extraction electrode 73 and 74 is formed at the boundary between the insulating resin layer 53 and the coating layer 55. The terminal electrodes 23 and 24 are formed at one end of the extraction electrodes 73 and 74. The other ends of the extraction electrodes 73 and 74 are connected to the inner peripheral side ends of the coil conductors 61 and 62 through vias 83 and 84.

  On the other hand, in the second insulator layer 52, lead electrodes 71 and 72 connected to the outer peripheral side ends of the coil conductors 61 and 62 are embedded. More specifically, each extraction electrode 71 and 72 is formed at the boundary between the insulating resin layer 54 and the coating layer 56. The terminal electrodes 21 and 22 are formed at one end of the extraction electrodes 71 and 72. The other ends of the extraction electrodes 71 and 72 are connected to the outer peripheral side ends of the coil conductors 61 and 62 through vias 81 and 82. Other configurations, materials, manufacturing methods, and the like are the same as those in the second embodiment.

  Note that the configuration as described above includes terminal electrodes 21, 22, 27, 28, lead electrodes 71, 72, 77, 78, and vias 81, 82, 87 from the common mode choke coil 4 according to the fourth embodiment. , 88 is removed.

  According to the present embodiment, since the input terminal electrode and the output terminal electrode are formed on different surfaces of the laminated body 10, the degree of freedom in mounting is improved. Specifically, when three-dimensional mounting is performed such as when the common mode choke coil is embedded in a component-embedded board, depending on the circuit configuration, the wiring pitch is not increased and compared with that of the second embodiment. Thus, the wiring can be routed shorter. In this case, noise may occur due to terminal electrodes, lead electrodes, and vias that are not used in the fourth embodiment, but there are no terminal electrodes, lead electrodes, and vias that are not used in this embodiment. Therefore, it is possible to prevent signal deterioration due to the above-described noise generation. Other operations and effects are the same as those of the second embodiment. In addition, although this Embodiment was demonstrated as a modification of 2nd Embodiment, the same structure is employable also with respect to the common mode choke coil of 1st or 3rd Embodiment.

(Sixth embodiment)
A common mode choke coil according to a sixth embodiment of the present invention will be described with reference to the drawings. 16 is a cross-sectional view of the common mode choke coil, and FIG. 17 is an exploded perspective view of the laminate.

  The common mode choke coil 6 according to the present embodiment is different from the second embodiment in that a pair of coils are formed in multiple layers. In this embodiment, as shown in FIGS. 15 and 16, coil conductors 61 and 63 relating to one coil are formed in different layers. The coil conductor 62 related to the other coil is disposed opposite to the coil conductor 61 as in the second embodiment. A coil conductor 64 is formed in a layer different from the coil conductor 62. Here, the coil conductors 61 and 63 related to one coil and the coil conductors 62 and 63 related to the other coil are alternately laminated.

  The inner peripheral side ends of the coil conductors 61 and 63 are connected to each other by a via 301. The outer peripheral side end of the coil conductor 61 is connected to the terminal electrode 23 via the via 83 and the extraction electrode 73. The outer peripheral side end of the coil conductor 63 is connected to the terminal electrode 21 via the via 81 and the extraction electrode 71.

  The inner peripheral side ends of the other coil conductors 62 and 64 are connected to each other by a via 302. The outer peripheral end of the coil conductor 62 is connected to the terminal electrode 24 via the via 84 and the extraction electrode 74. The outer peripheral side end of the coil conductor 64 is connected to the terminal electrode 22 via the via 82 and the extraction electrode 72. Other configurations, materials, manufacturing methods, and the like are the same as those in the second embodiment.

  According to the common mode choke coil 6 according to the present embodiment, the number of turns of each coil can be increased in the same mounting area as compared with the second embodiment, which means that the common mode impedance is improved. It is preferable from the viewpoint. Other operations and effects are the same as those of the second embodiment. Although this embodiment has been described as a modification of the second embodiment, the same configuration may be adopted for the common mode choke coils of the first or third to fifth embodiments. it can.

  In the present embodiment, the coil conductors 61 and 63 related to one coil and the coil conductors 62 and 63 related to the other coil are alternately stacked, but the coil conductors 61 and 63 related to one coil are stacked. The coil conductors 62 and 63 related to the other coil may be laminated in this order. However, as a result of the simulation, the alternately laminated layers can reduce the normal impedance, so that alternately laminated layers are preferable from this viewpoint.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to this. For example, in the above embodiment, a common mode choke coil having two circuits and four terminals and four circuits and eight terminals having a pair of coils built in has been described. However, the present invention can also be applied to a common mode choke coil having three circuits and six terminals. it can. Moreover, in the said 6th Embodiment, although one coil was formed over two layers, you may make it form over three or more layers.

External perspective view of the common mode choke coil according to the first embodiment The disassembled perspective view explaining the structure of the laminated body which concerns on 1st Embodiment Sectional drawing of the laminated body which concerns on 1st Embodiment The figure explaining the manufacturing method of the common mode choke coil which concerns on 1st Embodiment The figure explaining the manufacturing method of the common mode choke coil which concerns on 1st Embodiment Sectional drawing of the laminated body which concerns on 2nd Embodiment The figure explaining the manufacturing method of the common mode choke coil which concerns on 2nd Embodiment The figure explaining the manufacturing method of the common mode choke coil which concerns on 2nd Embodiment The figure explaining the manufacturing method which concerns on the other example of the common mode choke coil which concerns on 2nd Embodiment External perspective view of a common mode choke coil according to a third embodiment Sectional drawing of the laminated body which concerns on 3rd Embodiment Sectional drawing of the laminated body which concerns on 4th Embodiment The exploded perspective view explaining the structure of the laminated body which concerns on 4th Embodiment Sectional drawing of the laminated body which concerns on 5th Embodiment The exploded perspective view explaining the structure of the laminated body which concerns on 5th Embodiment Sectional drawing of the laminated body which concerns on 6th Embodiment The exploded perspective view explaining the structure of the laminated body which concerns on 6th Embodiment

Explanation of symbols

  1, 2, 3, 4, 5, 6 ... common mode choke coil, 10 ... laminate, 21-28 ... terminal electrode, 30, 35, 51, 52 ... insulator layer, 53, 54 ... insulating resin layer, 55, 56 ... coating layer, 41, 42 ... magnetic material layer, 61-64 ... coil conductor, 71-78 ... extraction electrode, 81-88, 301, 302 ... via, 91 ... second magnetic material, 92 ... first 3. Magnetic material.

Claims (7)

In a common mode choke coil comprising a laminate in which a pair of spiral coils arranged opposite to each other is embedded, and a terminal electrode formed on the upper surface or the lower surface of the laminate,
The laminated body includes a first insulator layer in which the pair of spiral coils are embedded, and a pair of film shapes formed on the upper surface and the lower surface of the first insulator layer by a non-sintering film forming method. A magnetic layer and a pair of second insulator layers formed on the film-like magnetic layer;
In the second insulator layer, an extraction electrode partially formed with the terminal electrode is embedded,
The extraction electrode is connected to the coil via a via hole penetrating the film-like magnetic layer. A common mode choke coil, wherein: The pair of film-like magnetic layers are connected to each other by a second film-like magnetic body formed on a surface intersecting with the first insulator layer inside the inner periphery of the coil. Item 2. The common mode choke coil according to Item 1. The pair of film-shaped magnetic layers are connected to each other by a third film-shaped magnetic body formed on a surface crossing the first insulator layer outside the outer periphery of the coil. The common mode choke coil according to any one of 1 and 2. The second insulator layer is formed by laminating an insulating resin layer formed on the film-like magnetic layer and a coating layer covering the insulating resin layer and the extraction electrode so that only the terminal electrode is exposed. The common mode choke coil according to any one of claims 1 to 3, wherein: 5. The common mode choke coil according to claim 1, wherein the common mode choke coil includes a plurality of pairs of coils, and the film-like magnetic layer is separately formed corresponding to each coil pair. The common mode choke coil according to any one of claims 1 to 5, wherein the thickness of the film-like magnetic layer is less than 75 µm. 7. The common mode choke coil according to claim 1, wherein a linear expansion coefficient of the insulating resin layer is 10 ppm or more and 80 ppm or less.

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