CN113539650A

CN113539650A - Method for processing inductance device in printed circuit board and printed circuit board

Info

Publication number: CN113539650A
Application number: CN202010306957.4A
Authority: CN
Inventors: 谷新; 潘光聪; 缪桦
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2020-04-17
Filing date: 2020-04-17
Publication date: 2021-10-22
Anticipated expiration: 2040-04-17
Also published as: CN113539650B

Abstract

The application provides a method for processing an inductance device in a printed circuit board and the printed circuit board. The method for processing the inductance device in the printed circuit board comprises the steps of providing a core board; wherein, an inductance coil is arranged on at least one surface of the core plate; a through hole is formed in the middle of an inductance coil of the core plate; filling a magnetic material in the through hole to form a magnetic core; wherein the inductor winding and the magnetic core form an inductor device. The method for processing the inductance device in the printed circuit board does not increase the thickness of the printed circuit board, and can meet the requirements of products on miniaturization and thinning.

Description

Method for processing inductance device in printed circuit board and printed circuit board

Technical Field

The invention relates to the technical field of printed circuit board production, in particular to a method for processing an inductance device in a printed circuit board and the printed circuit board.

Background

With the demand of electronic products toward higher functionality, higher signal transmission speed and higher circuit element density, the functions of the integrated circuit chip are stronger, and the number of passive elements matched with the integrated circuit chip for microwave communication products and consumer electronic products is increased. For example, an inductor is disposed on the printed circuit board.

At present, the method of matching inductors on a printed circuit board generally comprises the steps of punching the surface of the printed circuit board, then configuring a plurality of passive components (such as inductors) on the printed circuit board and welding; however, this method increases the thickness of the printed wiring board, and cannot satisfy the demand for miniaturization and thinning of products.

Disclosure of Invention

The application provides a method for processing an inductance device in a printed circuit board and the printed circuit board, and the method for processing the inductance device in the printed circuit board does not increase the thickness of the printed circuit board and can meet the requirements of products on miniaturization and thinning.

In order to solve the technical problem, the application adopts a technical scheme that: there is provided a method of processing an inductive device within a printed wiring board, the method comprising: providing a core plate; wherein, an inductance coil is arranged on at least one surface of the core plate; a through hole is formed in the middle of an inductance coil of the core plate; filling a magnetic material in the through hole to form a magnetic core; wherein the inductor winding and the magnetic core form an inductor device.

The step of providing the core plate specifically comprises the following steps: providing a multilayer core board; wherein, be provided with mutual intercommunication and the same multilayer inductance coils of direction of rotation on the multilayer core board.

Wherein, the step of providing the multilayer core board specifically comprises: providing a first inner core board; the first inner core board comprises a substrate, a first metal layer arranged on a first surface of the substrate and a second metal layer arranged on a second surface of the substrate; forming a first via hole in a preset position of the first inner core plate and electroplating a conductive layer in the first via hole to communicate the first metal layer with the second metal layer; respectively carrying out graphical processing on the first metal layer and the second metal layer to respectively form a first inductance coil and a second inductance coil; the first inductance coil and the second inductance coil are communicated through the first via hole and rotate in the same direction; sequentially laminating an adhesive layer and a metal layer on the first surface and the second surface of the first inner core plate respectively to form a second inner core plate layer; forming a second via hole at a preset position of the second inner core plate and electroplating a conductive layer in the second via hole to communicate the metal layers; respectively carrying out graphical processing on the metal layer on the first surface and the metal layer on the second surface of the second inner-layer core board to respectively form a third inductance coil and a fourth inductance coil; the third conductive coil and the fourth conductive coil are communicated through the first via hole and the second via hole and rotate along the same direction; the lamination is repeated and the patterning process is sequentially performed to obtain a multilayer core board.

Wherein, after the step of providing the core plate, the method further comprises: and respectively laminating insulating layers on the first surface and the second surface of the core plate to form a protective layer of the core plate.

Wherein, after the step of opening the through hole in the middle position of the inductance coil of the core plate, the method further comprises the following steps: and carrying out metallization treatment on the first surface and the second surface of the core plate and the side walls of the through holes so as to form metallization layers on the first surface and the second surface of the core plate and the side walls of the through holes.

Wherein, after the step of filling the magnetic material in the through hole to form the magnetic core, further comprising: the metallization layers on the first and second surfaces of the core board are removed to open the magnetic core and the inductor coil.

Wherein, the magnetic material is magnetic metal or alloy.

Wherein, the magnetic core is in a hollow tubular structure.

In order to solve the above technical problem, another technical solution adopted by the present application is: providing a printed wiring board comprising a core board and an inductive device; wherein, the core plate is provided with a through hole; the inductor comprises a magnetic core and at least one layer of inductance coil; the magnetic core is arranged in the through hole in a penetrating mode, and the at least one layer of inductance coil is located on the first surface and/or the second surface of the core plate and wound with the magnetic core.

The core board is a multilayer core board, a plurality of layers of inductance coils are arranged on the multilayer core board, and the multilayer inductance coils are mutually communicated and are wound with the magnetic core in a spiral mode.

The application provides a method for processing an inductance device in a printed circuit board and the printed circuit board, the method for processing the inductance device in the printed circuit board comprises the steps of providing a core plate, arranging an inductance coil on at least one surface of the core plate, then arranging a through hole in the middle of the inductance coil of the core plate, and filling a magnetic material in the through hole to form a magnetic core, so that an inductance is formed by the magnetic core and the inductance coil surrounding the magnetic core; the formed magnetic core is positioned in the core board, and the inductance coil is positioned on the surface of the core board, so that the formed inductance is integrated in the core board, the thickness of the printed circuit board is not increased by the method, and the requirements of products on miniaturization and thinning can be met.

Drawings

Fig. 1 is a schematic structural diagram of a printed circuit board according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of an inductor on a printed circuit board according to an embodiment of the present disclosure;

fig. 3 is a schematic flow chart of a method for processing an inductive device in a printed wiring board according to a first embodiment of the present application;

fig. 4 is a schematic view of a product structure corresponding to step S11 in fig. 3;

fig. 5 is a schematic view of a product structure corresponding to step S12 in fig. 3;

fig. 6 is a schematic view of a product structure corresponding to step S13 in fig. 3;

fig. 7 is a schematic flow chart of a method for processing an inductive device in a printed wiring board according to a second embodiment of the present application;

FIG. 8 is a sub-flowchart of step S21 in FIG. 7;

fig. 9 is a schematic view of the structure of the product obtained after the processing from step S211 to step S213 in fig. 8;

FIG. 10 is a schematic diagram of a planar structure of a first inductor coil;

FIG. 11 is a schematic diagram of a planar structure of a second inductor coil;

fig. 12 is a schematic view of a product structure corresponding to step S214 in fig. 8;

FIG. 13 is a schematic diagram of the product structure obtained after the processing from step S215 to step S216 in FIG. 8;

fig. 14 is a schematic plan view of a third inductor;

fig. 15 is a schematic plan view of a fourth inductor;

fig. 16 is a schematic view of a product structure corresponding to step S22 in fig. 7;

fig. 17 is a schematic view of a product structure corresponding to step S24 in fig. 7;

fig. 18 is a schematic view of a product structure corresponding to step S26 in fig. 7.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The present application will be described in detail with reference to the accompanying drawings and examples.

Referring to fig. 1 and fig. 2, in which fig. 1 is a schematic structural diagram of a printed circuit board according to an embodiment of the present application; fig. 2 is a schematic structural diagram of an inductor on a printed circuit board according to an embodiment of the present disclosure; in the present embodiment, there is provided a printed wiring board including a core board 11 and an inductance device 12; in which the inductance device 12 is integrated in the core board 11, so that the printed wiring board can satisfy the demand for miniaturization and thinning.

Wherein, the core board 11 includes a substrate 114 and a metal layer disposed on at least one surface of the substrate 114; and the core plate 11 is provided with a through hole 111. The inductive device 12 comprises a magnetic core 121 and at least one layer of an inductor winding 122; the magnetic core 121 specifically penetrates through the through hole 111 of the core plate 11; in one embodiment, the magnetic core 121 may be a hollow tube, and the material of the magnetic core 121 may be a magnetic metal or alloy, for example, the material of the magnetic core 121 may be Ni, Ni-Cr, Ni-Fe, Fe-Co-Ni, or Fe-Cr. At least one layer of inductance coil 122 is located on the first surface and/or the second surface of the core plate 11 and is wound with the magnetic core 121; specifically, the inductor 122 is formed on the metal layer of the core 11, so that the inductor 12 is integrated in the core 11, and thus the thickness of the printed circuit board is not increased by the inductor 12 on the printed circuit board.

In an embodiment, the printed circuit board includes a multi-layer core 11, a plurality of inductor coils 122 are disposed on the multi-layer core 11, and the plurality of inductor coils 122 are spirally wound around the magnetic core 121, and the spiral directions are the same (see fig. 2 for a specific structure), so as to avoid the occurrence of demagnetization. Specifically, each layer of core board 11 is provided with a via hole, and a conductive layer is electroplated in the via hole to connect two adjacent layers of inductance coils 122. It is understood that the multi-layer inductor 122 is connected to each other by conductive plated vias.

Specifically, the printed wiring board described above can be specifically manufactured by the following method for processing an inductive device in a printed wiring board.

Referring to fig. 3, fig. 3 is a schematic flowchart illustrating a method for processing an inductor device in a printed circuit board according to a first embodiment of the present application; in this embodiment, a method for processing an inductor device in a printed circuit board is provided, where the manufacturing method specifically includes:

step S11; a core board is provided.

Specifically, referring to fig. 4, fig. 4 is a schematic view of a product structure corresponding to step S11 in fig. 3; at least one layer of inductance coil 122 is disposed on the core board 11. In one embodiment, a layer of inductor 122 is disposed on the core 11; in another embodiment, a plurality of inductor coils 122 are disposed on the core 11, and the plurality of inductor coils 122 are connected to each other and rotate in the same direction, and the specific structure thereof can be seen in fig. 2.

Specifically, the thickness of the core 11 may be selected according to the electrical performance requirement, for example, the thickness of the core 11 may be selected from a thickness of 20 micrometers to 2 millimeters, which is not limited in this embodiment.

Step S12: and a through hole is formed in the middle of the inductance coil of the core plate.

Referring to fig. 5, fig. 5 is a schematic view of a product structure corresponding to step S12 in fig. 3; specifically, the core plate 11 may be provided with the through holes 111 by laser drilling or mechanical drilling commonly used for printed circuit boards, and the aperture size of the through holes 111 may specifically be in a range of 0.06 mm to 3 mm.

Step S13: and filling the through hole with a magnetic material to form a magnetic core.

Specifically, the structure of the product obtained after the processing in step S13 can be specifically seen in fig. 6, and fig. 6 is a schematic diagram of the structure of the product corresponding to step S13 in fig. 3.

The specific structure of the inductance device 12 formed by the inductance coil 122 and the magnetic core 121 can be seen in fig. 2. In the specific implementation process, the number of layers of the inductor coils 122 in the inductor device 12 and the number of turns of each layer of the inductor coils 122 may be adjusted according to the electrical requirements of the device. In the specific implementation process, the magnetic material can be filled in the through hole 111 by adopting an electroplating mode; the magnetic material may be magnetic metal or alloy, and the metal material may be Ni, Ni-Cr, Ni-Fe, Fe-Co-Ni or Fe-Cr.

In the method for processing an inductor device in a printed circuit board provided by this embodiment, a core board 11 is provided, and an inductor 122 is disposed on at least one surface of the core board 11, then a through hole 111 is formed in the middle of the inductor 122 of the core board 11, and a magnetic material is filled in the through hole 111 to form a magnetic core 121, so that the magnetic core 121 and the inductor 122 surrounding the magnetic core 121 are used to form an inductor device 12; the formed magnetic core 121 is located in the core board 11, and the inductance coil 122 is located on the surface of the core board 11, so that the formed inductance device 12 is integrated in the core board 11, and further, the thickness of the printed circuit board is not increased by the method, and the requirements of the product on miniaturization and thinning can be met.

Referring to fig. 7, fig. 7 is a schematic flowchart illustrating a method for processing an inductor device in a printed circuit board according to a second embodiment of the present application; in this embodiment, a method for processing an inductive device in a printed wiring board is provided, the method comprising:

step S21: a multilayer core panel is provided.

The multilayer core board 11 is provided with a plurality of inductor coils 122 which are communicated with each other and have the same rotation direction. In particular, the specific structure of the multilayer inductor 122 can be seen in fig. 2.

Referring to fig. 8, fig. 8 is a sub-flowchart of step S21 in fig. 7; specifically, step S21 includes:

step S211: a first inner core panel is provided.

The first core board 11 includes a substrate 114, and a first metal layer disposed on a first surface of the substrate 114 and a second metal layer disposed on a second surface of the substrate. The metal layer may be a copper foil.

Step S212: and forming a first via hole at a preset position of the first inner core plate and electroplating a conductive layer in the first via hole to communicate the first metal layer with the second metal layer.

Specifically, a laser blind hole or mechanical through hole process can be selected to open a first via hole 112 at a preset position of the first inner core plate; and electrically interconnecting the first metal layer and the second metal layer by electroplating for hole filling or copper plating on the hole wall.

Step S213: and respectively carrying out graphical processing on the first metal layer and the second metal layer to respectively form a first inductance coil and a second inductance coil.

Please refer to fig. 9 to 11, wherein fig. 9 is a schematic structural diagram of the product obtained after the processing in steps S211 to S213 in fig. 8; fig. 10 is a schematic plan view of a first inductor winding, and fig. 11 is a schematic plan view of a second inductor winding; specifically, the structure of the product obtained after the processing in steps S211 to S213 can be seen in fig. 9, the planar structure of the first inductor 1221 can be seen in fig. 10, and the planar structure of the second inductor 1222 can be seen in fig. 11.

Specifically, the first inductor 1221 and the second inductor 1222 are communicated through the first via hole 112 and rotate in the same direction, and the specific rotation direction can be seen in fig. 2; in a specific implementation, the line inductor 122 may be formed on the first metal layer and the second metal layer of the surface of the substrate 114 by a printed circuit board circuit pattern forming process; the pattern processing process may be a subtractive process, or may be an improved semi-additive process or a semi-additive process.

Step S214: a bonding layer and a metal layer are laminated in this order on the first surface and the second surface of the first inner core sheet, respectively, to form a second inner core sheet layer.

Specifically, the product structure obtained through the processing in step S214 can be seen in fig. 12, and fig. 12 is a schematic view of the product structure corresponding to step S214 in fig. 8.

The bonding layer 115 may be a prepreg, and the metal layer 116 may be a copper foil; that is, in the implementation process, prepregs and copper foils are stacked on the first surface and the second surface of the first core board on which the first inductor 1221 and the second inductor 1222 are processed, respectively, and are subjected to high temperature pressing and curing to form a second core board; the thickness of the prepreg can be 10-500 micrometers, in the specific implementation process, a plurality of prepregs can be adopted to realize thicker thickness, and the material of the prepreg can be epoxy resin, bismaleimide triazine resin, polytetrafluoroethylene, polyimide or polyphenylene ether resin and the like; wherein, the copper foil can be selected from 2 micrometers to 35 micrometers.

Step S215: and forming a second via hole at a preset position of the second inner core plate and electroplating a conductive layer in the second via hole to communicate the metal layers.

Specifically, the implementation process of step S215 is the same as or similar to the implementation process of step S212, and the same or similar technical effects can be achieved, which is not described herein again.

Step S216: and respectively carrying out graphical processing on the metal layer on the first surface and the metal layer on the second surface of the second inner-layer core board to respectively form a third inductance coil and a fourth inductance coil.

Wherein, the third and fourth

conductive coils

1223 and 1224 are communicated through the first and second via

holes

112 and 113 and rotate in the same direction; specifically, the specific implementation process of step S215 can refer to the specific implementation process of step S213, and the same or similar technical effects can be achieved, which is not described herein again.

Specifically, refer to fig. 13 to 15, wherein fig. 13 is a schematic structural diagram of a product obtained after processing in steps S215 to S216 in fig. 8; fig. 14 is a schematic plan view of a third inductor, and fig. 15 is a schematic plan view of a fourth inductor; the structure of the product after the processing of steps S215 to S216 can be seen in fig. 13, the planar structure of the third inductor 1223 can be seen in fig. 14, and the planar structure of the fourth inductor 1224 can be seen in fig. 15.

Step S217: the lamination is repeated and the patterning process is sequentially performed to obtain a multilayer core board.

Specifically, if more layers of the inductor 122 need to be processed, the process from step S214 to step S216 may be referred to until a predetermined number of core boards 11 are obtained. In one embodiment, two layers of core 11 may be processed; of course, in other embodiments, the core board 11 with odd number layers, such as three layers, five layers, seven layers, etc., may be processed, and this embodiment is not limited thereto.

Step S22: and respectively laminating insulating layers on the first surface and the second surface of the core plate to form a protective layer of the core plate.

Specifically, the structure of the product obtained through the processing in step S22 can be seen in fig. 16, and fig. 16 is a schematic view of the structure of the product corresponding to the step S22 in fig. 7; the insulating layer can be a prepreg or other high-temperature-resistant insulating materials; in a specific implementation, a lamination process and a resin printing process may be used to laminate insulating layers on the first and second surfaces of the core board 11 to form the protective layer 117.

Step S23: and a through hole is formed in the middle of the inductance coil of the core plate.

Specifically, referring to fig. 5, the specific implementation process of step S23 is the same as or similar to the specific implementation process of step S12 in the method for processing an inductor device in a printed circuit board according to the first embodiment, and the same or similar technical effects can be achieved.

Step S24: and carrying out metallization treatment on the first surface and the second surface of the core plate and the side walls of the through holes so as to form metallization layers on the first surface and the second surface of the core plate and the side walls of the through holes.

Specifically, the product result obtained through the processing in step S24 can be seen in fig. 17, and fig. 17 is a schematic diagram of the product structure corresponding to the step S24 in fig. 7.

In an embodiment, the first surface and the second surface of the core board 11 and the sidewalls of the through holes 111 may be metallized by physical sputtering, so as to form a metallized layer 118 on the first surface and the second surface of the core board 11 and the sidewalls of the through holes 111, so as to make the core board 11 electrically conductive; the metallization layer 118 is made of nickel, nickel-chromium alloy, nickel-iron alloy, or nickel-cobalt alloy.

In another embodiment, the first surface and the second surface of the core board 11 and the sidewalls of the through holes 111 may also be metallized by electroless plating, so as to form a metallized layer 118 on the first surface and the second surface of the core board 11 and the sidewalls of the through holes 111, so as to make the core board 11 electrically conductive; wherein, the metallization layer 118 is made of nickel-phosphorus alloy or nickel-boron alloy; wherein the P and B contents are between 3 and 5 wt%, the smaller the P content is, the better in the specific implementation process.

Step S25: and filling the through hole with a magnetic material to form a magnetic core.

Specifically, the structure of the product obtained through the processing of step S25 can be seen in fig. 6; wherein inductor winding 122 and magnetic core 121 form inductive device 12.

Specifically, the specific implementation process of step S25 is the same as or similar to the specific implementation process of step S13 in the method for processing an inductor device in a printed circuit board provided in the first embodiment, and the same or similar technical effects can be achieved.

Step S26: the metallization layers on the first and second surfaces of the core board are removed to open the magnetic core and the inductor coil.

Specifically, the structure of the product obtained after the processing in step S26 can be seen in fig. 18, and fig. 18 is a schematic view of the structure of the product corresponding to step S26 in fig. 7. In a specific implementation, the metallization layer 118 may be chemically etched to remove the metallization layer 118 from the first and second surfaces of the core 11.

In the method for processing the inductor in the printed circuit board provided by this embodiment, the magnetic core 121 is formed by filling the through hole 111 on the core plate 11 with the electroplated magnetic material, and the circuit pattern processing process and the laser blind via interconnection process of the printed circuit board are adopted around the magnetic core 121, so as to realize the good winding of the inductor 122 and the magnetic core 121, and finally realize the integration of the inductor 12 in the printed circuit board, so that the method does not need to increase the thickness of the printed circuit board, can maintain the miniaturization and thinning design of the printed circuit board, and further can well meet the requirement of high-density integration of electronic products.

The forming manner of the magnetic core 121 according to the above embodiment is only exemplary, and of course, in other embodiments, magnetic core pillars or magnetic beads matching with the through holes 111 may be directly selected, and printed or mechanically attached, and finally the magnetic core beads or magnetic beads are fixed by resin to form the magnetic core 121 of the inductor device 12 on the printed circuit board; alternatively, the magnetic powder may be printed in the through hole 111 by printing, and finally the material is baked at a certain high temperature to realize the magnetic property.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A method of processing an inductive device in a printed wiring board, comprising:

providing a core plate; wherein, the core board is provided with at least one layer of inductance coil;

a through hole is formed in the middle of the inductance coil of the core plate;

filling a magnetic material in the through hole to form a magnetic core; wherein the inductor coil and the magnetic core form an inductive device.

2. The method of processing an inductive device within a printed wiring board of claim 1, wherein said step of providing a core board specifically comprises:

providing a plurality of layers of the core sheet; the multilayer inductance coils which are communicated with each other and have the same rotation direction are arranged on the multilayer core plates.

3. The method of manufacturing an inductive device in a printed wiring board of claim 2, wherein said step of providing a plurality of layers of said core specifically comprises:

providing a first inner core board; the first inner core board comprises a substrate, a first metal layer arranged on a first surface of the substrate and a second metal layer arranged on a second surface of the substrate;

forming a first via hole in a preset position of the first inner core board and electroplating a conductive layer in the first via hole to communicate the first metal layer with the second metal layer;

respectively carrying out graphical processing on the first metal layer and the second metal layer to respectively form a first inductance coil and a second inductance coil; the first inductance coil and the second inductance coil are communicated through the first via hole and rotate along the same direction;

sequentially laminating an adhesive layer and a metal layer on the first surface and the second surface of the first inner core plate respectively to form a second inner core plate layer;

forming a second via hole in a preset position of the second inner core board and electroplating the conductive layer in the second via hole to communicate the metal layers;

respectively carrying out graphical processing on the metal layer on the first surface and the metal layer on the second surface of the second inner-layer core board to respectively form a third inductance coil and a fourth inductance coil; the third conductive coil and the fourth conductive coil are communicated through the first via hole and the second via hole and rotate along the same direction;

and repeating the lamination and carrying out the patterning treatment in sequence to obtain the multilayer core board.

4. The method of manufacturing an inductive device in a printed wiring board of claim 1, wherein said step of providing a core board is followed by the steps of:

and respectively laminating insulating layers on the first surface and the second surface of the core plate to form a protective layer of the core plate.

5. The method of claim 1, wherein after the step of forming a via hole in the center of the inductor winding of the core, the method further comprises:

and carrying out metallization treatment on the first surface and the second surface of the core board and the side walls of the through holes so as to form metallization layers on the first surface and the second surface of the core board and the side walls of the through holes.

6. The method of manufacturing an inductive device in a printed wiring board as claimed in claim 5, wherein said step of filling said via with a magnetic material to form a magnetic core further comprises:

removing the metallization layers on the first and second surfaces of the core board to open the magnetic core and the inductor coil.

7. The method for processing an inductive device within a printed wiring board as claimed in any of claims 1 to 6, wherein said magnetic material is a magnetic metal or alloy.

8. The method for processing an inductive device within a printed wiring board as claimed in any of claims 1 to 6, wherein said magnetic core is of a hollow tubular configuration.

9. A printed wiring board, comprising:

the core plate is provided with a through hole;

the inductance device comprises a magnetic core and at least one layer of inductance coil; the magnetic core is arranged in the through hole in a penetrating mode, and at least one layer of inductance coil is located on the first surface and/or the second surface of the core board and wound on the magnetic core.

10. The printed wiring board of claim 9, wherein the core is a multilayer core, the multilayer core has a plurality of inductor coils disposed thereon, and the plurality of inductor coils are connected to each other and spirally wound around the core.