JP2014197613A - Inductor device and method of manufacturing inductor device - Google Patents

Inductor device and method of manufacturing inductor device Download PDF

Info

Publication number
JP2014197613A
JP2014197613A JP2013072580A JP2013072580A JP2014197613A JP 2014197613 A JP2014197613 A JP 2014197613A JP 2013072580 A JP2013072580 A JP 2013072580A JP 2013072580 A JP2013072580 A JP 2013072580A JP 2014197613 A JP2014197613 A JP 2014197613A
Authority
JP
Japan
Prior art keywords
coil
sheet
unit substrates
core
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013072580A
Other languages
Japanese (ja)
Inventor
豊田 治
Osamu Toyoda
治 豊田
Original Assignee
富士通株式会社
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社, Fujitsu Ltd filed Critical 富士通株式会社
Priority to JP2013072580A priority Critical patent/JP2014197613A/en
Publication of JP2014197613A publication Critical patent/JP2014197613A/en
Application status is Pending legal-status Critical

Links

Images

Abstract

PROBLEM TO BE SOLVED: To provide an inductor device which is easy to manufacture.SOLUTION: An inductor device 1 includes: a plurality of unit substrates 10a-10c each having an electrical insulating sheet 11 with a through hole 12 and a coil 14 which is arranged on the sheet 11 so as to be wound around the through hole 12; and a core 20 which is formed of a magnetic material and is inserted through the respective through holes 12 of the unit substrates 10a-10c. The plurality of unit substrates 10a-10c are arranged so that coils 14 of adjacent unit substrates overlap via the core 20. The coils 14 of the plurality of unit substrates 10a-10c are electrically connected in series.

Description

  The present invention relates to an inductor device and a method for manufacturing the inductor device.

  Conventionally, an inductor device has been used. The inductor device has a structure in which a core formed of a magnetic material is inserted into a coil.

  Recently, along with miniaturization of electronic devices using inductor devices, thin inductor devices have been developed.

JP-A-6-152145 JP 2009-94631 A

  As a manufacturing process of a thin inductor device, for example, there are the following examples.

  First, a lower wiring layer that forms a part of a coil is formed by patterning on an electrically insulating substrate, and an electric insulating layer is formed on the lower wiring layer.

  Next, a magnetic layer made of a magnetic material is patterned and disposed on the electrical insulating layer to form a core.

  Next, an upper wiring layer forming a part of the coil is formed on the core by patterning.

  And after the through-hole which penetrates an upper-layer wiring layer and a lower-layer wiring layer is formed, a conductor is filled with a through-hole and the coil which winds a core is formed. The coil is formed by an upper wiring layer, a lower wiring layer, and a conductor that electrically connects both layers.

  Thus, the thin inductor device has a problem that the number of manufacturing processes is large. In addition, there is a problem that the yield is poor due to the number of manufacturing steps.

  It is an object of the present specification to provide an inductor device that can be easily manufactured.

  Another object of the present specification is to provide a method for manufacturing an inductor device that is easy to manufacture.

  According to one form of the inductor device disclosed in the present specification, a plurality of sheets having an electrically insulating sheet having a through hole and a coil disposed on the sheet so as to wind around the through hole. And a core formed of a magnetic material and inserted through the through holes of each of the plurality of unit boards, the plurality of unit boards including the coil of the adjacent unit board, And the coils of the plurality of unit boards are electrically connected in series.

  Moreover, according to one form of the manufacturing method of the inductor device disclosed in the present specification, an electrically insulating sheet having a through hole and a coil disposed on the sheet so as to wind around the through hole And inserting a core formed of a magnetic material into each through hole of each of the plurality of unit substrates, and connecting the plurality of unit substrates to the unit substrate adjacent to each other. A coil is arrange | positioned so that it may overlap via the said core, and the coil of the said some unit board | substrate is electrically connected in series.

  The inductor device disclosed in the present specification described above is easy to manufacture.

  Moreover, according to the inductor device manufacturing method disclosed in the present specification, the manufacturing is easy.

  The objects and advantages of the invention will be realized and obtained by means of the elements and combinations particularly pointed out in the appended claims.

  Both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention as claimed.

It is a top view of one embodiment of an inductor device indicated in this specification. (A) is an end view taken along line X1-X1 in FIG. 1, and (B) is an end view taken along line X2-X2 in FIG. (A) is a top view of the 1st surface of a unit substrate, (B) is a figure of the 2nd surface of a unit substrate. It is a figure which shows the electric power generating apparatus using the inductor apparatus of this embodiment. It is a figure which shows the modification of the inductor apparatus of this embodiment. It is a figure which shows the process (the 1) of one Embodiment of the manufacturing method of the inductor apparatus disclosed to this specification. It is a figure which shows the process (the 2) of one Embodiment of the manufacturing method of the inductor apparatus disclosed to this specification. It is a figure which shows the process (the 3) of one Embodiment of the manufacturing method of the inductor apparatus disclosed to this specification. It is a figure which shows the process (the 4) of one Embodiment of the manufacturing method of the inductor apparatus disclosed to this specification. It is a figure which shows the process (the 5) of one Embodiment of the manufacturing method of the inductor apparatus disclosed by this specification. It is a figure which shows the process (the 6) of one Embodiment of the manufacturing method of the inductor apparatus disclosed to this specification. It is a figure which shows the process (the 7) of one Embodiment of the manufacturing method of the inductor apparatus disclosed to this specification.

  Hereinafter, a preferred embodiment of an inductor device disclosed in the present specification will be described with reference to the drawings. However, the technical scope of the present invention is not limited to these embodiments, but extends to the invention described in the claims and equivalents thereof.

  FIG. 1 is a plan view of an embodiment of an inductor device disclosed in the present specification. 2A is an end view taken along line X1-X1 in FIG. 1, and FIG. 2B is an end view taken along line X2-X2 in FIG. 3A is a plan view of the first surface of the unit substrate, and FIG. 3B is a diagram of the second surface of the unit substrate.

  The inductor device 1 of this embodiment is a thin device having a planar coil and a small thickness.

  The inductor device 1 can be used as, for example, a thin transformer device that converts a voltage in an electronic circuit, a thin electromagnet device that generates magnetism in an electronic device, or a thin magnetostrictive vibration power generator.

  The inductor device 1 is formed of a magnetic material and a plurality of unit substrates 10a to 10c having a through hole 12 and coils 14 and 15 wound around the through hole 12, and is inserted into the through holes 12 of each of the plurality of unit substrates. The core 20 is provided.

  The unit substrates 10a to 10c are flexible and include an electrically insulating sheet 11 having a through hole 12 in the center.

  On the 1st surface 11a of the sheet | seat 11, the 1st coil 14 is arrange | positioned so that the circumference | surroundings of the through-hole 12 may be wound. A second coil 15 is disposed on the second surface 11 b of the sheet 11 so as to wind around the through hole 12.

  The first coil 14 and the second coil 15 may be formed of a thin film electrically conductive material. The first coil 14 and the second coil 15 are preferably deformable in response to deformation of the flexible sheet 11.

  The first coil 14 and the second coil 15 have the same shape and are arranged so as to face each other with the sheet 11 interposed therebetween.

  The first coil 14 has a first end portion 14a located on the through-hole 12 side and a second end portion 14b opposite to the first end portion 14a. The second end portion 14 b is located on the peripheral side of the sheet 11. The wire forming the first coil 14 extends from the first end 14a to the second end 14b while increasing the winding diameter.

  The 2nd coil 15 has the 1st end part 15a located in the through-hole 12 side, and the 2nd end part 15b on the opposite side to this 1st end part 15a. The second end portion 15 b is located on the peripheral side of the sheet 11. The wire forming the second coil 15 extends from the first end 15a to the second end 15b while increasing the winding diameter.

  The first end portion 14 a of the first coil 14 and the first end portion 15 a of the second coil 15 are electrically connected by the first conductive portion 16 that penetrates the sheet 11, and the second end of the first coil 14. The part 14 b and the second end 15 b of the second coil 15 are electrically connected by a second conductive part 17 that penetrates the sheet 11. That is, the first coil 14 and the second coil 15 are electrically connected in parallel by the first conductive portion 16 and the second conductive portion 17.

  The core 20 may be formed in a horizontally long thin film or plate shape. The first end 20a in the longitudinal direction of the core 20 passes through the through hole 12 of the unit substrate 10a and extends to the outside of the unit substrate 10a. The second end portion 20b in the longitudinal direction of the core 20 passes through the through hole 12 of the unit substrate 10c and extends to the outside of the unit substrate 10c.

  The core 20 is formed by covering a core body (not shown) made of a magnetic material with an electric insulating layer (not shown).

  The unit substrates 10 a to 10 c are bent at the bending portion L, and the core 20 is inserted through the through hole 12.

  In the adjacent unit substrate 10a and unit substrate 10b, the first coil 14 and the second coil 15 of the unit substrate 10a and the first coil 14 and the second coil 15 of the unit substrate 10b are arranged so as to overlap with each other via the core 20. Is done.

  A portion of the unit substrate 10a from the through hole 12 to the unit substrate 10b is opposed to a portion of the unit substrate 10b from the through hole 12 to the unit substrate 10a via the core 20.

  Similarly, in the adjacent unit substrate 10b and unit substrate 10c, the first coil 14 and the second coil 15 of the unit substrate 10b overlap with the first coil 14 and the second coil 15 of the unit substrate 10c through the core 20. Are arranged as follows.

  A portion of the unit substrate 10b on the side of the unit substrate 10c from the through hole 12 is opposed to a portion of the unit substrate 10c on the side of the unit substrate 10b from the through hole 12 via the core 20.

  Further, in the adjacent unit substrate 10a and unit substrate 10b, the first coil 14 of the unit substrate 10a and the second coil 15 of the unit substrate 10b are arranged such that the wires forming the respective coils are alternately arranged via the core 20. Facing each other. Leakage of the magnetic flux density vector can be reduced by arranging the wires forming the coils alternately.

  Similarly, in the adjacent unit substrate 10b and unit substrate 10c, the first coil 14 of the unit substrate 10b and the second coil 15 of the unit substrate 10c are arranged such that the wires forming the coils are staggered and the core 20 is Are facing each other.

  In the adjacent unit substrate 10a and unit substrate 10b, the first conductive portion 16 of the unit substrate 10a and the second conductive portion 17 of the unit substrate 10b are electrically connected via the electrically conductive connection portion 19. .

  Accordingly, the first ends 14a and 15a of the first and second coils 14 and 15 of the unit substrate 10a are electrically connected to the second ends 14b and 15b of the first and second coils 14 and 15 of the unit substrate 10b. Connecting.

  Similarly, in the adjacent unit substrate 10b and unit substrate 10c, the first conductive portion 16 of the unit substrate 10b and the second conductive portion 17 of the unit substrate 10c are electrically connected via the electrically conductive connection portion 19. Connect to.

  Accordingly, the first ends 14a and 15a of the first and second coils 14 and 15 of the unit substrate 10b are electrically connected to the second ends 14b and 15b of the first and second coils 14 and 15 of the unit substrate 10c. Connecting.

  Thus, in the inductor device 1, the first and second coils 14 and 15 of the plurality of unit substrates 10a to 10c are electrically connected in series, and the second conductive portion 17 of the unit substrate 10a and the unit substrate 10c are connected. The first conductive portion 16 is electrically connected.

  An electrically insulating insulating sheet 18 is disposed between the first coil 14 of the unit substrate 10a and the second coil 15 of the unit substrate 10b, and both coils are prevented from being electrically connected. .

  Similarly, an electrically insulating insulating sheet 18 is disposed between the first coil 14 of the unit substrate 10b and the second coil 15 of the unit substrate 10c, and both the coils can be electrically connected. Is prevented.

  When current is passed through the first coil 14 and the second coil 15 of the inductor device 1, the second conductive portion 17 of the unit substrate 10a and the first conductive portion 16 of the unit substrate 10c may be connected to a current source. .

  In the inductor device 1, for example, as illustrated in FIG. 2B, when a current is passed through the first coil 14 in the cross direction (the direction from the front of the paper to the back), the core 20 is moved in the longitudinal direction. A magnetic flux density vector B is generated along the first end 20a. Further, when a current is passed through the first coil 14 in the cross direction, a current flows in the dot direction (the direction from the back of the paper toward the front) in the second coil 15 (see FIG. 2B). . Thus, when a current is passed through the second coil 15 in the direction of the dots, the magnetic flux density vector B toward the first end portion 20a is generated along the longitudinal direction of the core 20. Therefore, when a current is passed through the first coil 14 and the second coil 15, a magnetic flux density vector in which the magnetic flux density vectors generated by the respective coils are combined is generated in the core 20.

  On the other hand, when the magnitude of the magnetic flux density vector is varied along the longitudinal direction of the core 20, an electromotive force is generated in each of the first coil 14 and the second coil 15. The electromotive force generated in the first coil 14 and the second coil 15 is taken out from the second conductive portion 17 of the unit substrate 10a and the first conductive portion 16 of the unit substrate 10c.

  Next, the dimension of each component of the inductor device 1 will be described below.

  In the present embodiment, the first coil 14 and the second coil 15 may have the same dimensions.

  As a width | variety of the wire which forms the 1st coil 14 and the 2nd coil 15, it can be 0.05 mm, for example. Moreover, the space | interval of a wire and a wire can be 0.05 mm, for example. Moreover, the thickness of a wire is, for example. It can be 0.010 mm. The number of wires in the vertical direction forming the first coil 14 and the second coil 15 can be 400 (200 on each side of the through hole 12), for example, and the number of wires in the horizontal direction is 400, for example. It is possible to make a book (200 on each side of the through hole 12).

  As a dimension of the through-hole 12, it can be set as the square whose length of one side is 4 mm, for example.

  The dimensions of the core 20 can be, for example, 4 mm wide and 160 mm long.

  Next, materials for forming each component of the inductor device 1 will be described below.

  As a material for forming the core 20, for example, the following materials can be used. The materials listed below are particularly preferable when the inductor device 1 is used as a magnetostrictive vibration power generator.

(1) Magnetic material that is called a giant magnetostrictive material and whose magnetostriction coefficient has an absolute value of 5 ppm or more. Examples of such a material include TbDyFe-based alloys (for example, Terfenol-D), FeGa-based alloys (for example, Galfenol), and the like. Can be used. The material exhibiting positive magnetostriction preferably has a magnetostriction coefficient of +5 ppm or more, particularly +30 ppm or more, and more preferably +100 ppm or more. The material exhibiting negative magnetostriction is preferably −5 ppm or less, particularly −30 ppm or less, and more preferably −100 ppm or less.

(2) Soft magnetic material that is not normally magnetized and magnetizes when exposed to a magnetic field (eg, paramagnetic material)
As such a material, for example, ferrite, amorphous Fe, Fe-based metallic glass, or the like can be used.

(3) Ferromagnetic shape memory alloy whose magnetization direction changes with twin deformation As such a material, for example, a NiMnAl alloy, a NiCoMnSn alloy, a NiFeGaCo alloy, a CoNiAl alloy, or the like can be used.

(4) Metaferromagnetic shape memory alloy in which the martensite dislocation point changes due to stress and the austenite phase becomes ferromagnetic. As such a material, for example, a NiCoMnIn alloy or the like can be used.

(5) A vibration damping material that attenuates stress including vibration, and a material that dissipates a part of displacement energy due to stress by movement of domain walls, twins, grain boundaries, etc. As such a material, for example, SUS430, An Fe—Al alloy, an FeCrAl alloy (Silentalo), or the like can be used.

  When using a material with low mechanical strength among the magnetic materials, the core 20 may be formed by mixing and molding particles obtained by pulverizing the magnetic material and a resin such as an epoxy resin.

  The material for forming the sheet 11 can be used without particular limitation as long as it has an electrical insulation property. However, the flexibility makes the manufacture of the inductor device 1 easy, and the magnetostrictive type. It is preferable from the viewpoint of obtaining a large electromotive force when used for vibration power generation.

  As a material for forming the sheet 11, for example, liquid crystal polymer (LCP) or polyimide resin can be used.

  The material for forming the first coil 14 or the second coil 15 can be used without particular limitation as long as it is an electrically conductive material that can be formed into a thin film or plate shape. Specifically, for example, a metal such as copper can be used as a material for forming the first coil 14 or the second coil 15.

  Next, an example in which the above-described inductor device 1 is used as a power generation device will be described below with reference to FIG.

  FIG. 4 is a diagram showing a power generation device using the inductor device 1 of the present embodiment.

  As a material for forming the core 20, a material having a magnetostriction coefficient of several hundred ppm or more is used.

  A magnetic field H is applied from the outside along the longitudinal direction of the core 20. Here, since the core 20 is formed using a positive magnetostrictive material, the core 20 extends in the direction of the magnetic field H.

  When the first end portion 20a of the core 20 is fixed and an external force F1 is applied to the second end portion 20b of the core 20 in the direction in which the longitudinal dimension of the core 20 contracts, the inductor device 1 has an inverse magnetostriction. An electromotive force is generated in the first coil 14 and the second coil 15 due to the phenomenon (bilari effect).

  Even if the first end portion 20a of the core 20 is fixed and an external force F2 is applied to the second end portion 20b of the core 20 in a direction crossing or orthogonal to the longitudinal direction of the core 20, the inductor device 1 , An electromotive force is generated in the first coil 14 and the second coil 15 due to the inverse magnetostriction phenomenon (billary effect). By applying an external force to the core 20 in a direction crossing the longitudinal direction, the core 20 can be greatly deformed, so that a larger electromotive force can be generated. Moreover, it is preferable that the sheet | seat 11 has flexibility so that it may not prevent that the core 20 deform | transforms. An oscillating external force may be applied to the second end 20b of the core 20 as the external force F1 or F2.

  The electromotive force generated in the first coil 14 and the second coil 15 is taken out from the second conductive portion 17 of the unit substrate 10a and the first conductive portion 16 of the unit substrate 10c.

  FIG. 5 is a view showing a modified example of the inductor device of the present embodiment.

  In the embodiment described above, in the adjacent unit substrates, the first coil 14 of one unit substrate and the second coil 15 of the other unit substrate that overlap with each other via the core 20 are arranged such that the wire forming each coil is alternately positioned. Was.

  In the adjacent unit substrates in the inductor device 1 of the present modified example, the first coil 14 of one unit substrate and the second coil 15 of the other unit substrate that overlap with each other via the core 20 are opposed to the wire material forming each coil. Located to be.

  Next, an embodiment of a preferable method for manufacturing the above-described inductor device will be described below with reference to the drawings.

  First, as shown in FIGS. 6A and 6B, a sheet laminate in which a first conductive layer 31 is laminated on a first surface of a sheet 11 and a second conductive layer 32 is laminated on a second surface. 30 is prepared. Here, FIG. 6B is an end view taken along line Y1-Y1 of FIG.

  Next, as shown in FIGS. 7A and 7B, a first through hole 33 and a second through hole 34 that penetrate the sheet laminate 30 are formed. The first through hole 33 is formed in a portion of the sheet 11 where the first conductive portion 16 will be formed in the future, and the second through hole 34 is formed in a portion of the sheet 11 where the second conductive portion 17 will be formed in the future. . Here, FIG. 7B is an end view taken along line Y2-Y2 of FIG.

  As a method of forming the first through hole 33 and the second through hole 34, for example, mechanical processing using a drill or laser processing or the like can be used.

  Next, as shown in FIGS. 8A and 8B, the first through hole 33 and the second through hole 34 are filled with the conductor, and the first conductive portion 16 and the first through hole 30 are filled in the sheet laminate 30. Two conductive portions 17 are formed. Here, FIG. 8B is an end view taken along line Y3-Y3 of FIG. As a method of filling the first through hole 33 and the second through hole 34 with a conductor, for example, a plating method or a soldering method can be used.

  Next, as shown in FIGS. 9A to 9C, the first conductive layer 31 and the second conductive layer 32 of the sheet laminate 30 are respectively patterned, so that the first coil 14 and the second coil 15 are patterned. Is formed. 9B is an end view taken along line Y4-Y4 of FIG. 9A, and FIG. 9C is an end view taken along line Y5-Y5 of FIG. 9A. Specifically, the first conductive layer 31 is patterned on the first surface 11 a of the sheet 11, and the first coil 14 is formed so as to wind the center of the sheet 11. The second conductive portion 17 is electrically connected. Further, the second conductive layer 32 is patterned on the second surface 11b of the sheet 11, and the second coil 15 is formed so as to wind around the center of the sheet 11, and the first conductive portion 16 and the second conductive layer are formed. The part 17 is electrically connected.

  As a method of forming the first coil 14 and the second coil 15, for example, a known printed circuit board patterning technique such as a double-side exposure apparatus can be used.

  Next, as shown in FIGS. 10A to 10C, a through-hole 12 penetrating the sheet is formed in the center of the sheet 11 to form a unit substrate 10a. Here, FIG. 10B is an end view taken along line Y6-Y6 in FIG. 10A, and FIG. 10C is an end view taken along line Y7-Y7 in FIG. Unit substrates 10b and 10c are formed in the same manner as the unit substrate 10a.

  The first coil 14 and the second coil 15 are electrically connected to the unit substrates 10a to 10c by the first conductive portion 16, and the first coil 14 and the second coil 15 are second. It is inspected that it is electrically connected by the conductive portion 17. For the manufacture of the inductor device 1, a unit substrate whose electrical connection has been confirmed is used.

  Next, as shown in FIG. 11, the unit substrates 10 a to 10 c in which the solder paste 35 is applied to the first conductive unit 16 or the second conductive unit 17 are bent, so that the unit substrates 10 a to 10 c are adjacent unit substrates. The first and second coils 14 and 15 are arranged so as to overlap with each other via a core 20 inserted through the through-hole 12 in the future.

  Next, as shown in FIG. 12, the core 20 is inserted into the through holes 12 of the unit substrates 10a to 10c with respect to the unit substrates 10a to 10c. In the unit substrates 10 a to 10 c in which the core 20 is inserted into the through hole 12, the first and second coils 14 and 15 of the adjacent unit substrates are arranged so as to overlap with each other via the core 20. In the core 20, a core body (not shown) formed of a magnetic material is covered with an electric insulating layer (not shown), and the electric insulating layer is formed of a heat-resistant material such as a polyimide resin or an oxide film. Is done.

  Then, the unit substrates 10a to 10c in which the core 20 is inserted into the through holes 12 are heated using a reflow furnace or the like to dissolve and weld the solder particles in the solder paste 35, and then the solder is cooled to A connecting portion 19 that electrically connects the first conductive portion 16 and the second conductive portion 17 is formed. In this way, the inductor device 1 shown in FIGS. 1 to 3 is obtained. The connecting portion 19 may be formed using a conductive adhesive.

  In the embodiment of the inductor device manufacturing method described above, the core is inserted into the through hole after the coils of the adjacent unit substrates are electrically connected. However, the coil of the adjacent unit substrate after the core is inserted into the through hole. May be electrically connected.

  According to the inductor device 1 of the present embodiment described above, manufacture is easy. Specifically, the unit substrates 10a to 10c can be manufactured in large quantities using a known printed circuit board manufacturing technique. Further, the number of unit boards forming the inductor device 1 may be changed as appropriate according to the design because the number of unit boards inserted through the core 20 may be changed.

  In addition, according to the inductor device 1 of the present embodiment, since it is manufactured using a unit substrate with good electrical connection, the manufacturing yield of the inductor device is improved.

  For example, in the conventional method for manufacturing an inductor device, as described above, after a through-hole penetrating the upper wiring layer and the lower wiring layer is formed, the through-hole is filled with a conductor and the core is wound. A coil was formed. Here, in the case where there are a large number of through-holes, when a contact failure between the upper wiring layer and the lower wiring layer occurs in the conductor filled in any one of the through-holes, the inductor device itself There was a problem that would be defective.

  On the other hand, in the method for manufacturing an inductor device according to the present embodiment, such a problem can be solved because a unit substrate that has been inspected to have good electrical connection is used.

  In the present invention, the inductor device and the method for manufacturing the inductor device according to the above-described embodiment can be appropriately changed without departing from the gist of the present invention. In addition, the configuration requirements of one embodiment can be applied to other embodiments as appropriate.

  For example, in the above-described embodiment, the inductor device 1 includes the three unit substrates 10a to 10c. However, the inductor device may include two or four or more unit substrates.

  In the above-described embodiment, the sheet 11 has flexibility, but the sheet 11 may not have flexibility.

  In the above-described embodiment, the first coil 14 and the second coil 15 are wound in a rectangular shape, but there is no particular limitation on the shape in which the first coil 14 or the second coil 15 is wound. For example, the first coil 14 or the second coil 15 may be wound into a circle or a polygon.

  In the above-described embodiment, in the unit substrates 10 a to 10 c, the wire material forming the first coil 14 and the wire material forming the second coil 15 are arranged to face each other with the sheet 11 interposed therebetween. However, the wire that forms the first coil 14 and the wire that forms the second coil 15 may be arranged alternately.

  Further, in the above-described embodiment, the unit substrates 10a to 10c have the first coil 14 and the second coil 15, but it is only necessary to have one of them.

  All examples and conditional words mentioned herein are intended for educational purposes to help the reader deepen and understand the inventions and concepts contributed by the inventor. All examples and conditional words mentioned herein are to be construed without limitation to such specifically stated examples and conditions. Also, such exemplary mechanisms in the specification are not related to showing the superiority and inferiority of the present invention. While embodiments of the present invention have been described in detail, it should be understood that various changes, substitutions or modifications can be made without departing from the spirit and scope of the invention.

DESCRIPTION OF SYMBOLS 1 Inductor apparatus 10a, 10b, 10c Unit board | substrate 11 Sheet | seat 11a 1st surface 11b 2nd surface 12 Through-hole 14 1st coil 14a 1st edge part 14b 2nd edge part 15 2nd coil 15a 1st edge part 15b 2nd edge Part 16 First conductive part 17 Second conductive part 18 Insulating sheet 19 Connection part L Deflection part 20 Core 20a First end part 20b Second end part 30 Sheet laminate 31 First conductive layer 32 Second conductive layer 33 First penetration Hole 34 Second through hole 35 Solder paste

Claims (6)

  1. An electrically insulating sheet having a through hole;
    A coil disposed on the sheet so as to wind around the through hole;
    A plurality of unit substrates having:
    A core formed of a magnetic material and inserted through the through holes of each of the plurality of unit substrates;
    With
    The plurality of unit substrates are arranged such that the coils of the adjacent unit substrates overlap with each other via the core, and the coils of the plurality of unit substrates are electrically connected in series .
  2. The coil of the unit substrate includes a first coil disposed on the first surface of the sheet and a second coil disposed on the second surface,
    The inductor device according to claim 1, wherein the first coil and the second coil are electrically connected in parallel by a conductive portion penetrating the sheet.
  3. The coil has a first end located on the through-hole side, and a second end opposite to the first end,
    In the two adjacent unit substrates, the first end of the coil of one of the unit substrates is electrically connected to the second end of the coil of the other unit substrate. The inductor device described in 1.
  4.   The inductor device according to any one of claims 1 to 3, wherein the core is formed of a magnetic material having an absolute value of a magnetostriction coefficient of 5 ppm or more.
  5. An electrically insulating sheet having a through hole;
    A coil disposed on the sheet so as to wind around the through hole;
    For a plurality of unit substrates having
    A core formed of a magnetic material is inserted into the through holes of each of the plurality of unit substrates, and the plurality of unit substrates are arranged so that the coils of the adjacent unit substrates overlap with each other via the cores. And the manufacturing method of the inductor apparatus which connects the coil of the said several unit board | substrate electrically in series.
  6. The coil of the unit substrate includes a first coil disposed on the first surface of the sheet and a second coil disposed on the second surface,
    The first coil and the second coil are electrically connected in parallel by a conductive portion that penetrates the sheet,
    The method for manufacturing an inductor device according to claim 4, wherein the plurality of unit substrates that are inspected to be electrically connected to the first coil and the second coil are used.
JP2013072580A 2013-03-29 2013-03-29 Inductor device and method of manufacturing inductor device Pending JP2014197613A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013072580A JP2014197613A (en) 2013-03-29 2013-03-29 Inductor device and method of manufacturing inductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013072580A JP2014197613A (en) 2013-03-29 2013-03-29 Inductor device and method of manufacturing inductor device

Publications (1)

Publication Number Publication Date
JP2014197613A true JP2014197613A (en) 2014-10-16

Family

ID=52358215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013072580A Pending JP2014197613A (en) 2013-03-29 2013-03-29 Inductor device and method of manufacturing inductor device

Country Status (1)

Country Link
JP (1) JP2014197613A (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0684647A (en) * 1992-09-02 1994-03-25 Nippon Telegr & Teleph Corp <Ntt> Inductance element
JPH07263229A (en) * 1994-03-23 1995-10-13 Yokogawa Electric Corp Print coil
JPH09199327A (en) * 1996-01-16 1997-07-31 Matsushita Electric Ind Co Ltd Coil component
JP2004363235A (en) * 2003-06-03 2004-12-24 Alps Electric Co Ltd Dust core
JP2009246141A (en) * 2008-03-31 2009-10-22 Casio Comput Co Ltd Coil-like electronic parts
JP2011139533A (en) * 2011-03-15 2011-07-14 Murata Mfg Co Ltd Electronic apparatus
WO2012091108A1 (en) * 2010-12-28 2012-07-05 ソニーケミカル&インフォメーションデバイス株式会社 Antenna module, communication device and method of manufacturing antenna module
WO2013057913A1 (en) * 2011-10-17 2013-04-25 パナソニック 株式会社 Non-contact power supply apparatus and primary coil block for non-contact power supply apparatus

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0684647A (en) * 1992-09-02 1994-03-25 Nippon Telegr & Teleph Corp <Ntt> Inductance element
JPH07263229A (en) * 1994-03-23 1995-10-13 Yokogawa Electric Corp Print coil
JPH09199327A (en) * 1996-01-16 1997-07-31 Matsushita Electric Ind Co Ltd Coil component
JP2004363235A (en) * 2003-06-03 2004-12-24 Alps Electric Co Ltd Dust core
JP2009246141A (en) * 2008-03-31 2009-10-22 Casio Comput Co Ltd Coil-like electronic parts
WO2012091108A1 (en) * 2010-12-28 2012-07-05 ソニーケミカル&インフォメーションデバイス株式会社 Antenna module, communication device and method of manufacturing antenna module
JP2011139533A (en) * 2011-03-15 2011-07-14 Murata Mfg Co Ltd Electronic apparatus
WO2013057913A1 (en) * 2011-10-17 2013-04-25 パナソニック 株式会社 Non-contact power supply apparatus and primary coil block for non-contact power supply apparatus

Similar Documents

Publication Publication Date Title
TWI258154B (en) Electronic transformer/inductor devices and methods for making same
TWI534844B (en) Packing unit for multi-layered ceramic capacitors and method thereof
CN101615490B (en) Coil component
JP2008048376A (en) Antenna coil to be mounted on circuit board and antenna device
KR101555398B1 (en) Magnetic electrical device
JPWO2004055841A1 (en) Multiple choke coil and electronic device using the same
US8373534B2 (en) Flexible coil
KR101072784B1 (en) Multilayered chip power inductor using the magnetic sheet and the method for manufacturing the same
JP2005340385A (en) Wiring circuit board and connection structure thereof
JP2009246363A (en) Conductor circuit manufacturing method, coil sheet, and laminated coil
CN101657938A (en) Magnetic field coupling type antenna, magnetic field coupling type antenna module, magnetic field coupling type antenna device,and their manufacturing methods
KR101248499B1 (en) Plane coil
US9595384B2 (en) Coil substrate, method for manufacturing coil substrate, and inductor
CN102428622A (en) Electronic device having an inductive receiver coil with ultra-thin shielding layer and method
CN102893345A (en) Miniature power inductor and methods of manufacture
JP2010171857A (en) Antenna device
JP2015088753A (en) Coil component and manufacturing method of the same, coil component built-in substrate, and voltage adjustment module including the substrate
TW200414502A (en) Inductor whose energy loss is small
US7696849B2 (en) Electronic component
EP0856855A2 (en) Printed coil with magnetic layer
KR101792281B1 (en) Power Inductor and Manufacturing Method for the Same
EP2485225A1 (en) Electronic unit
TWI406306B (en) Highly coupled inductor
JP5549600B2 (en) Manufacturing method of module with flat coil and module with flat coil
CN201898209U (en) Antenna, antenna element and communication device using antenna and antenna element

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20151204

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20161019

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20161101

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161212

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170530

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20171219