JP2007066538A5 - - Google Patents

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JP2007066538A5
JP2007066538A5 JP2005247265A JP2005247265A JP2007066538A5 JP 2007066538 A5 JP2007066538 A5 JP 2007066538A5 JP 2005247265 A JP2005247265 A JP 2005247265A JP 2005247265 A JP2005247265 A JP 2005247265A JP 2007066538 A5 JP2007066538 A5 JP 2007066538A5
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Prior art keywords
sealing member
organic electroluminescent
light emitting
pressure
electroluminescent element
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JP2005247265A
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JP2007066538A (en
JP4622746B2 (en
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Priority claimed from JP2005247265A external-priority patent/JP4622746B2/en
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Publication of JP2007066538A5 publication Critical patent/JP2007066538A5/ja
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Claims (11)

基板上に、少なくとも第１電極層と、発光層を含む有機化合物層と、第２電極を含む陰極層と、封止層とを順次形成する工程を有し、封止層の形成は可撓性封止部材を発光領域及び周辺に液状シール剤を介して貼合配置することで有機エレクトロルミネッセンス素子を製造する有機エレクトロルミネッセンス素子の製造方法において、
前記液状シール剤を少なくとも前記可撓性封止部材、前記基板上に形成された前記発光領域又は、前記発光領域の周辺の何れかに塗設した後、
前記可撓性封止部材を前記基板上に形成された前記発光領域上に載置し、
前記液状シール剤の拡散禁止領域を前記可撓性封止部材の上から第１圧着部材で圧着保持し、
前記液状シール剤の配置位置を第２圧着部材で圧着することで前記可撓性封止部材を一次貼合した後、
前記液状シール剤を硬化処理し、前記可撓性封止部材を貼合することを特徴とする有機エレクトロルミネッセンス素子の製造方法。 A step of sequentially forming at least a first electrode layer, an organic compound layer including a light emitting layer, a cathode layer including a second electrode, and a sealing layer on a substrate is formed, and the sealing layer is formed flexibly. In the manufacturing method of an organic electroluminescent element, an organic electroluminescent element is manufactured by laminating and arranging a conductive sealing member around a light emitting region and a periphery via a liquid sealant,
After coating the liquid sealant on at least the flexible sealing member, the light emitting region formed on the substrate, or the periphery of the light emitting region,
Placing the flexible sealing member on the light emitting region formed on the substrate;
The liquid sealing agent diffusion-inhibiting region is pressure-bonded and retained by the first pressure-bonding member from above the flexible sealing member,
After primary bonding of the flexible sealing member by crimping the position of the liquid sealing agent with a second crimping member,
A method for producing an organic electroluminescent element, comprising curing the liquid sealant and bonding the flexible sealing member. 基板上に、少なくとも第１電極層と、発光層を含む有機化合物層と、第２電極を含む陰極層と、封止層とを順次形成する工程を有し、封止層の形成は可撓性封止部材を発光領域及び周辺に液状シール剤を介して貼合配置することで有機エレクトロルミネッセンス素子を製造する有機エレクトロルミネッセンス素子の製造方法において、A step of sequentially forming at least a first electrode layer, an organic compound layer including a light emitting layer, a cathode layer including a second electrode, and a sealing layer on a substrate is formed, and the sealing layer is formed flexibly. In the manufacturing method of an organic electroluminescent element, an organic electroluminescent element is manufactured by laminating and arranging a conductive sealing member around a light emitting region and a periphery via a liquid sealant,
前記液状シール剤を少なくとも前記可撓性封止部材又は前記基板上に形成された前記発光領域の何れかに塗設した後、After coating the liquid sealant on at least the flexible sealing member or the light emitting region formed on the substrate,
前記可撓性封止部材を前記基板上に形成された前記発光領域上に載置し、Placing the flexible sealing member on the light emitting region formed on the substrate;
前記発光領域周囲を前記可撓性封止部材の上から第１圧着部材で圧着保持し、Press-holding the periphery of the light emitting region with the first pressure-bonding member from above the flexible sealing member,
前記液状シール剤の配置位置を第２圧着部材で圧着することで前記可撓性封止部材を一次貼合した後、After primarily laminating the flexible sealing member by crimping the placement position of the liquid sealing agent with a second crimping member,
前記液状シール剤を硬化処理し、前記可撓性封止部材を貼合することを特徴とする有機エレクトロルミネッセンス素子の製造方法。A method for producing an organic electroluminescent element, wherein the liquid sealing agent is cured, and the flexible sealing member is bonded. 前記可撓性封止部材と接触する第１圧着部材のヤング率が１×１０The Young's modulus of the first pressure-bonding member in contact with the flexible sealing member is 1 × 10 -3-3 ＧＰａ〜８０ＧＰａであることを特徴とする請求項１又は２に記載の有機エレクトロルミネッセンス素子の製造方法。It is GPa-80GPa, The manufacturing method of the organic electroluminescent element of Claim 1 or 2 characterized by the above-mentioned. 前記可撓性封止部材と接触する第２圧着部材の面のヤング率が１×１０The Young's modulus of the surface of the second pressure-bonding member in contact with the flexible sealing member is 1 × 10 -3-3 ＧＰａ〜８０ＧＰａであることを特徴とする請求項１〜３の何れか１項に記載の有機エレクトロルミネッセンス素子の製造方法。It is GPa-80GPa, The manufacturing method of the organic electroluminescent element of any one of Claims 1-3 characterized by the above-mentioned. 前記第１圧着部材による液状シール剤の拡散禁止領域を圧着するときの面圧が１×１０The surface pressure when pressure-bonding the diffusion prohibition region of the liquid sealant by the first pressure-bonding member is 1 × 10 -2-2 ＭＰａ〜１０ＭＰａであることを特徴とする請求項１、３及び４の何れか１項に記載の有機エレクトロルミネッセンス素子の製造方法。The method for producing an organic electroluminescent element according to any one of claims 1, 3, and 4, wherein the pressure is from 10 to 10 MPa. 前記第１圧着部材による発光領域周囲を圧着するときの面圧が１×１０The surface pressure when crimping around the light emitting region by the first crimping member is 1 × 10 -2-2 ＭＰａ〜１０ＭＰａであることを特徴とする請求項２に記載の有機エレクトロルミネッセンス素子の製造方法。The method for producing an organic electroluminescent element according to claim 2, wherein the pressure is from 10 to 10 MPa. 前記第２圧着部材による液状シール剤の配置位置を圧着するときの面圧が１×１０The surface pressure when the liquid sealant is disposed by the second pressure-bonding member is 1 × 10. -2-2 ＭＰａ〜１０ＭＰａであることを特徴とする請求項１〜６の何れか１項に記載の有機エレクトロルミネッセンス素子の製造方法。It is MPa-10MPa, The manufacturing method of the organic electroluminescent element of any one of Claims 1-6 characterized by the above-mentioned. 前記拡散禁止領域が発光領域であることを特徴とする請求項１、３、４、５及び７の何れか１項に記載の有機エレクトロルミネッセンス素子の製造方法。The method of manufacturing an organic electroluminescence element according to claim 1, wherein the diffusion prohibition region is a light emitting region. 前記拡散禁止領域が外部電極取り出し領域であることを特徴とする請求項１、３、４、５及び７の何れか１項に記載の有機エレクトロルミネッセンス素子の製造方法。8. The method of manufacturing an organic electroluminescence element according to claim 1, wherein the diffusion prohibition region is an external electrode extraction region. 前記可撓性封止部材のヤング率が１×１０The Young's modulus of the flexible sealing member is 1 × 10 -3-3 ＧＰａ〜８０ＧＰａであり、厚みが１０μｍ〜５００μｍであることを特徴とする請求項１〜９の何れか１項に記載の有機エレクトロルミネッセンス素子の製造方法。It is GPa-80GPa and thickness is 10 micrometers-500 micrometers, The manufacturing method of the organic electroluminescent element in any one of Claims 1-9 characterized by the above-mentioned. 前記可撓性封止部材の貼合は、１０Ｐａ〜１×１０The bonding of the flexible sealing member is 10 Pa to 1 × 10. -4-Four Ｐａの減圧条件で行われることを特徴とする請求項１〜１０の何れか１項に記載の有機エレクトロルミネッセンス素子の製造方法。The method for producing an organic electroluminescent element according to claim 1, wherein the process is performed under a reduced pressure condition of Pa.
JP2005247265A 2005-08-29 2005-08-29 Method for manufacturing organic electroluminescence element Expired - Fee Related JP4622746B2 (en)

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JP2007066538A5 true JP2007066538A5 (en) 2008-05-08
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JP5109606B2 (en) * 2007-11-15 2012-12-26 コニカミノルタホールディングス株式会社 Organic electroluminescence device manufacturing method and protective film
KR101538058B1 (en) * 2012-12-27 2015-07-21 엘아이지인베니아 주식회사 Apparatus and method for attaching substrates

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JP3912711B2 (en) * 1998-11-27 2007-05-09 ローム株式会社 Organic EL device
JP3705190B2 (en) * 2001-10-03 2005-10-12 ソニー株式会社 Manufacturing method of display device
JP4010394B2 (en) * 2001-12-14 2007-11-21 大日本印刷株式会社 Electroluminescent element
JP4089263B2 (en) * 2002-04-03 2008-05-28 セイコーエプソン株式会社 ELECTROLUMINESCENT DEVICE, ITS MANUFACTURING METHOD, ELECTRONIC DEVICE

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