JP2007060339A5 - - Google Patents

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Publication number
JP2007060339A5
JP2007060339A5 JP2005243739A JP2005243739A JP2007060339A5 JP 2007060339 A5 JP2007060339 A5 JP 2007060339A5 JP 2005243739 A JP2005243739 A JP 2005243739A JP 2005243739 A JP2005243739 A JP 2005243739A JP 2007060339 A5 JP2007060339 A5 JP 2007060339A5
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JP
Japan
Prior art keywords
bonded
electronic component
substrate
piezoelectric device
shelf
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JP2005243739A
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Japanese (ja)
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JP4508041B2 (en
JP2007060339A (en
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Priority to JP2005243739A priority Critical patent/JP4508041B2/en
Priority claimed from JP2005243739A external-priority patent/JP4508041B2/en
Publication of JP2007060339A publication Critical patent/JP2007060339A/en
Publication of JP2007060339A5 publication Critical patent/JP2007060339A5/ja
Application granted granted Critical
Publication of JP4508041B2 publication Critical patent/JP4508041B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (4)

段差を有する凹部が形成され、この凹部の凹底部分及び前記段差の上面の棚部に複数の電極が設けられたパッケージ本体と、
圧電振動片と、複数の電子部品と、前記パッケージ本体の前記凹部内を気密に封止する蓋体と、を備え、
前記圧電振動片及び前記電子部品が、前記パッケージ本体の複数の電極に電気的に接続されている構造の圧電デバイスであって、
前記電子部品は基板に接合され、
前記電子部品が接合された前記基板は、前記凹部の前記凹底部分に設けられた前記電極に接合され、
前記圧電振動片は、前記電子部品が接合された前記基板の上方に位置されるように、前記段差の前記上面の前記棚部に備えられた前記電極に接合され、
前記基板に接合された前記電子部品が樹脂封止されていることを特徴とする圧電デバイス。 A package body in which a concave portion having a step is formed, and a plurality of electrodes are provided on a concave bottom portion of the concave portion and a shelf portion on the upper surface of the step,
Comprising a piezoelectric vibrating piece, and a plurality of electronic components, and a lid for sealing hermetically the said recess of the package body,
A piezoelectric device having a structure in which the piezoelectric vibrating piece and the electronic component are electrically connected to a plurality of electrodes of the package body,
The electronic component is bonded to a substrate;
Wherein the substrate on which the electronic components are bonded is bonded to the electrode provided on the concave bottom portion of the recess,
The piezoelectric vibrating piece such that said electronic component is located above the substrate bonded, is bonded to the electrode to which the provided on the shelf portion of the upper surface of the step,
A piezoelectric device , wherein the electronic component joined to the substrate is sealed with a resin . 請求項１に記載の圧電デバイスにおいて、
前記基板が、前記電子部品を上側に位置させて前記電極に接合されていることを特徴とする圧電デバイス。 The piezoelectric device according to claim 1.
The piezoelectric device is characterized in that the substrate is bonded to the electrode with the electronic component positioned on the upper side. 第１の段差及び前記第１の段差より上方に位置する第２の段差を有する凹部が形成され、この凹部の凹底部分、前記第１の段差の上面の第１の棚部、及び前記第２の段差の上面の第２の棚部に複数の電極が設けられたパッケージ本体と、  A recess having a first step and a second step positioned above the first step is formed, a recessed bottom portion of the recess, a first shelf on an upper surface of the first step, and the first step A package body provided with a plurality of electrodes on the second shelf on the upper surface of the two steps;
圧電振動片と、電子部品と、前記パッケージ本体の前記凹部内を気密に封止する蓋体と、を備え、  A piezoelectric vibrating piece, an electronic component, and a lid that hermetically seals the inside of the recess of the package body,
前記圧電振動片及び前記電子部品が、前記パッケージ本体の複数の電極に電気的に接続されている構造の圧電デバイスであって、  A piezoelectric device having a structure in which the piezoelectric vibrating piece and the electronic component are electrically connected to a plurality of electrodes of the package body,
前記電子部品は基板に接合され、  The electronic component is bonded to a substrate;
前記電子部品が接合された前記基板は、前記第１の段差の前記上面の前記第１の棚部に設けられた前記電極に接合され、  The substrate to which the electronic component is bonded is bonded to the electrode provided on the first shelf on the upper surface of the first step,
前記圧電振動片は、前記電子部品が接合された前記基板の上方に位置されるように、前記第１の段差より上方に位置する前記第２の段差の前記第２の棚部に備えられた前記電極に接合され、  The piezoelectric vibrating reed is provided on the second shelf of the second step located above the first step so that the piezoelectric vibrating piece is located above the substrate to which the electronic component is bonded. Bonded to the electrode,
前記基板に接合された前記電子部品が樹脂封止されていることを特徴とする圧電デバイス。  A piezoelectric device, wherein the electronic component joined to the substrate is sealed with a resin. 請求項３に記載の圧電デバイスにおいて、
前記基板が、前記電子部品を下側に位置させて前記電極に接合されていることを特徴とする圧電デバイス。 The piezoelectric device according to claim 3 .
The piezoelectric device, wherein the substrate is bonded to the electrode with the electronic component positioned on the lower side.
JP2005243739A 2005-08-25 2005-08-25 Piezoelectric device Expired - Fee Related JP4508041B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005243739A JP4508041B2 (en) 2005-08-25 2005-08-25 Piezoelectric device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005243739A JP4508041B2 (en) 2005-08-25 2005-08-25 Piezoelectric device

Publications (3)

Publication Number Publication Date
JP2007060339A JP2007060339A (en) 2007-03-08
JP2007060339A5 true JP2007060339A5 (en) 2008-09-25
JP4508041B2 JP4508041B2 (en) 2010-07-21

Family

ID=37923415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005243739A Expired - Fee Related JP4508041B2 (en) 2005-08-25 2005-08-25 Piezoelectric device

Country Status (1)

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JP (1) JP4508041B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101069241B1 (en) * 2009-09-01 2011-10-04 주식회사 이노칩테크놀로지 Piezoelectric element and Piezoelectric buzzer and Piezoelectric buzzer module using thereof and Fabrication method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05299802A (en) * 1992-04-21 1993-11-12 Fujitsu General Ltd Mounting method of capacitor
JP4061714B2 (en) * 1998-06-24 2008-03-19 エプソントヨコム株式会社 Piezoelectric oscillator and manufacturing method thereof
JP2000278047A (en) * 1999-03-24 2000-10-06 Nippon Dempa Kogyo Co Ltd Surface mount crystal oscillator and its manufacture
JP4269412B2 (en) * 1999-06-23 2009-05-27 エプソントヨコム株式会社 Piezoelectric oscillator
JP2001177347A (en) * 1999-12-16 2001-06-29 Nippon Dempa Kogyo Co Ltd Crystal oscillator
JP4479075B2 (en) * 2000-08-03 2010-06-09 エプソントヨコム株式会社 Piezoelectric oscillator
JP2003101349A (en) * 2001-09-26 2003-04-04 Kyocera Corp Quartz oscillator

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