JP2007059776A - Electronic part mounting device, method for mounting electronic part and method for detecting noise level - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic part mounting device, a method for mounting an electronic part, and a method for detecting a noise level capable of accurately measuring the height of an electronic part by eliminating the affection of a delayed call in a sensor. <P>SOLUTION: The height of the electronic part is measured based on an approximate value of the noise level by averaging the noise level s2 detected at the time of noise drop and the noise level s4 detected at the time of noise rise, to calculate a true noise level s1 and an approximate value of s3, because a noise level is detected as deviated from a true noise level due to the delayed call of the sensor caused by a response time Δt required to transmit and receive a sensor signal. This allows the height of the electronic part to be accurately measured by correcting deviation in detected values caused by the delayed call of the sensor. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus, an electronic component mounting method, and a nozzle height detection method for picking up an electronic component by a nozzle and mounting the picked up electronic component on a substrate.

  In the field of electronic component mounting where electronic components are picked up by a nozzle and mounted on a substrate, the height of the electronic component picked up by the nozzle is measured in order to accurately mount the electronic component on a mounting target such as a substrate. . The measured height of the electronic component is fed back to the nozzle height positioning control at the time of mounting, and is checked against the dimension data of the electronic component to determine the suction posture of the electronic component. And the like are detected in a posture other than that in which the mounting surface is attracted downward. This prevents a mounting defect that is mounted on a substrate or the like in an unstable state of the electronic component.

As means for measuring the height of an electronic component, one using an optical sensor is known (see, for example, Patent Document 1). This is because the nozzle is lowered between the light projector and the light receiver that are spaced apart from each other, and the light projected from the light projector to the light receiver is blocked by the nozzle body and the electronic components picked up by the nozzle. The height is detected, and the height of the electronic component is calculated from the difference between the nozzle heights.
JP 11-298196 A

  The detection of the nozzle height by the means described in Patent Document 1 is performed by detecting the encoder value of the drive unit that drives the raising and lowering of the nozzle. The encoder value is detected in response to an electrical signal that is emitted when the amount of light received by the light receiver reaches a certain threshold value. An encoder value that deviates by a response delay from the true encoder value when a certain threshold is reached is detected.

  The encoder value deviation due to such a response delay can be corrected to some extent by applying a preset correction value. However, the encoder value may vary depending on conditions such as the nozzle lowering speed and the height of the picked-up electronic component. Since the amount of deviation is different, it is difficult to accurately set a correction value corresponding to each condition. Also, electronic components that do not meet the conditions cannot be handled at a preset correction location. On the other hand, with the further improvement in productivity and miniaturization of parts in recent years, detection of the nozzle height at high speed and high accuracy has been demanded.

  Accordingly, an object of the present invention is to provide an electronic component mounting apparatus, an electronic component mounting method, and a nozzle height detection method capable of accurately measuring the height of an electronic component by eliminating the influence of response delay in a sensor. To do.

The invention described in claim 1 is an electronic component mounting apparatus that measures the height of an electronic component picked up by being picked up by a lower end portion of a nozzle and mounts it on a substrate, and receives light projected from a projector. A light receiving device, nozzle driving means for moving the nozzle up and down with respect to the light projected and received between the light projector and the light receiving device, and the lower end of the nozzle intersects with the light by the raising and lowering of the nozzle. The first height of the nozzle at the time of rising and lowering of the nozzle is detected by using the height of the nozzle when the amount of light received by the detector reaches a predetermined threshold as the first height of the nozzle. In addition, the height of the nozzle when the electronic component adsorbed on the lower end of the nozzle by the raising and lowering of the nozzle intersects the light and the amount of light received by the light receiver reaches a predetermined threshold value is determined. Second height An average value is calculated from detection means for detecting the second height of the nozzle when the nozzle is raised and lowered, and the first height of the nozzle when the nozzle is raised and lowered. And a first computing means for calculating an average value from the second height of the nozzle at the time of ascent and descent, an average value of the first height of the nozzle and a second height of the nozzle. Second calculating means for calculating the height of the electronic component adsorbed on the lower end portion of the nozzle from the average value.

  According to the second aspect of the present invention, the height of the nozzle provided in the electronic component mounting apparatus so as to be movable up and down is detected by a light emitting / receiving photoelectric sensor, and the height of the electronic component picked up by being picked up by the lower end of the nozzle is detected. An electronic component mounting method for measuring the height and mounting the substrate on a substrate, wherein the first lowering step of lowering the nozzle with respect to the photoelectric sensor, and the light at which the lower end portion of the nozzle is projected and received by the photoelectric sensor A first detection step of detecting the height of the nozzle at the time when the amount of light received by the photoelectric sensor reaches a predetermined threshold as a first height when the nozzle is lowered; A first raising step for raising the nozzle, and a height of the nozzle at the time when the amount of light received by the photoelectric sensor reaches a predetermined threshold again in the first raising step, And a first calculation step of calculating an average value of the first height of the nozzles from the first height when the nozzle is lowered and the first height when the nozzle is raised. A second lowering step of lowering the nozzle having the electronic component adsorbed on its lower end with respect to the photoelectric sensor, and the electronic component adsorbed on the lower end of the nozzle intersecting with light projected and received by the photoelectric sensor Then, a third detection step of detecting the height of the nozzle when the amount of light received by the photoelectric sensor reaches a predetermined threshold as a second height when the nozzle is lowered, and the lowered nozzle A second raising step for raising, and the height of the nozzle when the amount of light received by the photoelectric sensor again reaches a predetermined threshold in the second raising step is defined as a second height when the nozzle is raised. 4th detection to detect A second computing step of calculating an average value of the second height of the nozzle from the second height when the nozzle is lowered and the second height when the nozzle is raised, and the first of the nozzle And a third calculation step of calculating the height of the electronic component adsorbed on the lower end portion of the nozzle from the average value of the height and the average value of the second height of the nozzle.

  The invention according to claim 3 is a nozzle height detection method for detecting the height of a nozzle provided in an electronic component mounting apparatus so as to be movable up and down by a light emitting / receiving photoelectric sensor, wherein the nozzle is positioned relative to the photoelectric sensor. And detecting the height of the nozzle when the amount of light received by the photoelectric sensor reaches a predetermined threshold when the lower end of the nozzle intersects the light projected and received by the photoelectric sensor. A first detecting step, a rising step for raising the lowered nozzle, and a height of the nozzle at the time when the amount of light received by the photoelectric sensor reaches a predetermined threshold again in the rising step. A second detection step, and a step of calculating an average value of the heights of the nozzles detected by the first detection step and the second detection step.

  According to the present invention, the nozzle height detection error due to the response delay of the sensor is eliminated by taking the average value of the respective nozzle heights detected when the nozzle is lowered and raised. The height of the part can be accurately measured.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2A is a plan view of a transfer head of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. FIG. 3A is a front view of a transfer head of an electronic component mounting apparatus in one embodiment of the present invention, FIG. 3A is a configuration diagram of a sensor unit in one embodiment of the present invention, and FIG. FIG. 4 is a block diagram of a control system of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 5A is an embodiment of the present invention. FIG. 5 (b) is a graph showing the lifting speed of the nozzle according to the embodiment of the present invention, and FIG. 5 (c) is a sensor according to the embodiment of the present invention. Status of signals emitted from the control unit to the Z-axis encoder Illustration showing, FIG. 6 is a flowchart showing the operation of the electronic component mounting apparatus according to an embodiment of the present invention.

  First, the overall configuration of the electronic component mounting apparatus will be described with reference to FIGS. 1 and 2. In FIG. 1, a conveyance guide 2 is disposed substantially at the center on the base 1. The conveyance guide 2 is a substrate positioning unit that conveys a substrate 3 as a mounting target and positions the substrate 3 at a predetermined position. In the present invention, the conveyance direction of the substrate 3 is the X direction, and the direction orthogonal to the substrate 3 in the horizontal plane is the Y direction. On both sides in the Y direction of the transport guide 2, electronic component supply units 4 are arranged, and a plurality of parts feeders 5 are arranged side by side.

  A pair of Y tables 6 are disposed at both ends of the base 1 in the X direction. An X table 7 is installed on the Y table 6 and can be moved in the Y direction by driving the Y table 6. A transfer head 8 is mounted on the side of the X table 7 so that it can be moved in the X direction by driving the X table 7. That is, the Y table 6 and the X table 7 are horizontal moving means for horizontally moving the transfer head 8 on the base 1 in the X direction and the Y direction.

  In FIG. 2A, a plurality of nozzle units 10 are arranged in parallel on the transfer head 8 (in this embodiment, a nozzle unit row in which four nozzle units are arranged in the X direction is 2 in the Y direction). Column array). A nozzle 11 that sucks the electronic component P is attached to the lower end of each nozzle unit 10, and each nozzle 11 can be moved up and down in the Z direction and rotated in the XY plane.

  In FIG. 1, an electronic component recognition unit including a line camera 14 and the like is disposed between the conveyance guide 2 and the electronic component supply unit 4, and the electronic component P picked up by the nozzle 11 is picked up from below. recognize. A sensor unit 20 is disposed on the side of the line camera 14 and measures the height of the electronic component P picked up by being picked up by the nozzle 11.

  Next, the sensor unit 20 will be described with reference to FIGS. 3 (a) and 3 (b). 3A, the sensor unit 20 includes a projector 21 and a light receiver 22 that are spaced apart from each other, an amplifier 26 that is electrically connected to the projector 21 and the light receiver 22, and a sensor control unit 27. Is done. A light-projecting side orifice 21a serving as a light projecting spot and a light receiving side orifice 22a serving as a light receiving spot are provided on the opposing surfaces of the light projecting device 21 and the light receiving device 22, respectively. The laser light 25 projected horizontally is received by the light receiver 22 through the light receiving side orifice 22a.

  The light projector 21 and the light receiver 22 are provided with a light projector drive unit 23 and a light receiver drive unit 24, respectively. By driving the projector driving unit 23 and the receiver driving unit 24, the projector 21 and the receiver 22 are moved and rotated in the vertical and horizontal directions, respectively, so that the optical axes of the projector 21 and the receiver 22 are adjusted. It has become.

  The laser beam 25 received by the light receiver 22 is converted into a voltage by the photoelectric element, amplified by the amplification device 26, and output to the sensor control unit 27. Therefore, when the laser beam 25 is shielded and the amount of received light changes, even if this amount of change is small, the sensor control unit 27 can clearly detect the amount of change in the amplified voltage.

  The light emitting side orifice 21a and the light receiving side orifice 22a are provided on the opposing surfaces of the light projecting device 21 and the light receiving device 22, but in FIG. 3, for convenience of explanation, the light projecting side orifice 21a and the light receiving side orifice 22a are provided. The state where the provided surface is swung to the front is illustrated.

  3A and 3B, the sensor control unit 27 is electrically connected to the Z-axis encoder 12. The Z-axis encoder 12 is directly connected to the Z-axis drive unit 13 and detects the Z-axis displacement amount of the nozzle 11 that moves up and down by driving the Z-axis drive unit 13 as an encoder value by a pulse.

  When the nozzle 11 is moved up and down between the projector 21 and the light receiver 22 by driving the Z-axis drive unit 13, the electronic component P adsorbed on the lower end portion of the nozzle 11 and the lower end portion of the nozzle 11 intersects the laser beam 25. As a result, the laser beam 25 is shielded and the amount of light received by the light receiver 22 changes. When the amount of received light reaches a certain threshold value, an on / off signal is issued from the sensor control unit 27 to the Z-axis encoder 12, and the encoder value at that time is acquired and transmitted to the data processing unit 40.

  In FIG. 3B, the nozzle 11 shown on the left side is located at the first height, and the lower end of the nozzle 11 in a state where the electronic component P is not sucked intersects the laser beam 25 and It shows the time when the amount of received light reaches a predetermined threshold. Further, the nozzle 11 shown on the right side is located at the second height, and the electronic component P adsorbed on the lower end portion of the nozzle 11 intersects the laser beam 25 and the received light amount of the light receiver is determined in advance. Indicates the point in time. The first height and the second height of the nozzle 11 are detected as encoder values by the Z-axis encoder 12, and the Z-axis displacement amount of the nozzle 11 corresponding to the height h of the electronic component P is determined from the difference between the two encoder values. The height h of the electronic component P can be measured by calculating w.

  That is, the Z-axis encoder 12 is the first nozzle 11 at the time when the lower end of the nozzle 11 intersects the laser beam 25 due to the rise and fall of the nozzle 11 and the amount of light received by the light receiver 22 reaches a predetermined threshold. The electronic component P attracted to the lower end of the nozzle 11 by crossing the laser beam 25 due to the rising and lowering of the nozzle 11 crosses the laser beam 25 and the light receiving amount of the light receiver 22 reaches a predetermined threshold value. This is detection means for detecting the second height of the nozzle 11 at the time. Further, the Z-axis drive unit 13 serves as nozzle drive means for moving the nozzle 11 up and down between the projector 21 and the light receiver 22.

  Next, a control system of the electronic component mounting apparatus will be described with reference to FIG. The control unit 30 is connected to the conveyance guide 2, the parts feeder 5, the Y table 6, the X table 7, the nozzle unit 10, the line camera 14, and the sensor unit 20 via the bus 31, and drives these based on the NC program 34. To control. The NC program 34 is stored in advance in the database unit 32. In addition, the database unit 32 stores a component library 33, substrate data 35, nozzle data 36, and received light amount threshold value data 37. A predetermined threshold value is stored in the received light amount threshold value data 37.

  Further, the control unit 30 is connected to the data processing unit 40, and the data processing unit 40 calculates the height of the electronic component from the encoder value acquired in the sensor unit 20, and also stores various kinds of information stored in the component library 33. Compared with the dimensional data of the electronic parts, the product type is verified, and the suction posture of the electronic parts is confirmed.

  The operation / input unit 41 includes input means such as a keyboard and a data drive, manually controls the operation of the electronic component mounting apparatus, and inputs data to the database unit 32 in advance. The display unit 42 includes a display unit such as a liquid crystal panel or a CRT, and visually displays various information related to the operation of the mounting apparatus.

  Next, nozzle height detection by the sensor unit 20 will be described with reference to FIGS. 5 (a), 5 (b), and 5 (c). FIG. 5A and FIG. 5B show the relationship between the Z-axis displacement of the nozzle 11 and the Z-axis speed in the one-cycle lifting operation of the nozzle 11. The nozzle 11 descends from the top dead center P1 with an acceleration a, and when it reaches an inflection point P2 approximately in the middle of the lifting / lowering process, the nozzle 11 descends to the bottom dead center P3 while decelerating at the acceleration a. When it reaches the bottom dead center P3, it rises at the acceleration a, and when it reaches the inflection point P2, it rises to the top dead center P1 while decelerating at the acceleration a.

  5A and 5C, when the nozzle 11 is positioned at the sensor switching positions s1 and s3, the amount of received light reaches a threshold value, and an on / off signal is generated from the sensor control unit 27 to the Z-axis encoder 12. When this on / off signal reaches the Z-axis encoder 12, the encoder value at that time is acquired. However, there is a slight response delay of the response time Δt between the time when the on / off signal is sent from the sensor control unit 27 and the time when the encoder value is acquired by the Z-axis encoder 12. In FIG. 5C, an off signal is transmitted from the sensor control unit 27 to the Z-axis encoder 12 at time t1, but the encoder value at time t2 is acquired due to a response delay. Further, an on signal is transmitted from the sensor control unit 27 to the Z-axis encoder 12 at the time t3, but the encoder value at the time t4 is acquired due to a response delay.

  Due to this response delay, the actually acquired encoder value is not the one at the time when the nozzle 11 is positioned at s1 when the nozzle 11 is lowered, as shown in FIG. Thus, the encoder value at the time when the nozzle 11 is further lowered is not the one at the time when the nozzle 11 is located at s3, but at the time when the nozzle 11 is raised, the encoder value is located at s4 where the response time Δt has elapsed. Encoder value at the time. Accordingly, when the height of the electronic component P is measured using the encoder value acquired when the nozzle 11 is lowered or raised as it is, an error caused by a response delay is included, and thus the error is obtained when the nozzle 11 is lowered and raised. In other words, an average of both encoder values is taken to calculate an approximate encoder correction value Sc to cancel the error.

  Next, the encoder correction value Sc will be described using calculated values. In the following calculation, each encoder value is expressed as a distance from the bottom dead center P3. 5A and 5B, s1 to s4 indicate the distance from the bottom dead center P3 of the nozzle 11, and v1 to v4 are the nozzles 11 when the nozzle 11 passes through the s1 to s4. Shows the speed. Moreover, s1 and s3 are equidistant from the bottom dead center P3, and this distance is S.

Since v2 = v1−a · Δt, v4 = v3 + a · Δt, and v1 = v3, v4 = v1 + a · Δt. In addition, identification of the code | symbol in the raising / lowering direction of the nozzle 11 is not considered. Next, s2 = S− (v1 + v2) · Δt / 2, and s4 = S + (v3 + v4) · Δt / 2. Since the encoder correction value Sc = (s2 + s4) / 2, when calculated by substituting the above equation, Sc = S + (a · Δt ² ) / 2.

Here, in the present embodiment, since acceleration a = 2G (= 19.6 m / s ² ) and response time Δt = 300 μs, the encoder correction value Sc = S + 8.82 × 10 ⁻⁷ m, which is true The error from the encoder value S is about 0.9 μm. As described above, the encoder correction value Sc calculated approximately is very close to the true encoder value S. If s2 is calculated under the same conditions, s2 = S−4.11 × 10 ⁻⁵ m from s2 = S− (v1 + v2) · Δt / 2, and the error is 41.1 μm. In the case of a minute electronic component, for example, 0603 chip component, the vertical dimension is 0.6 mm, the horizontal dimension is 0.3 mm, and the height dimension is 0.3 mm. If there is an error of about 1/10 of these dimensions, the electronic component This has a large effect on the accuracy of the height measurement, and there is a risk of misidentifying the suction posture.

  The encoder correction value Sc is calculated for each of the nozzle 11 in a state where the electronic component P is not picked up and the nozzle 11 in a state where the electronic component P is picked up. That is, while calculating the first encoder correction value Sc1 from the average value of the encoder values of the first height of the nozzle 11 acquired when the nozzle 11 in the state in which the electronic component P is not picked up is lowered and lowered, The second encoder correction value Sc2 is calculated from the average value of the second height encoder values acquired when the nozzle 11 in the state where the electronic component P is sucked is raised and lowered. The electronic component P is calculated by calculating the Z-axis displacement amount w of the nozzle 11 corresponding to the height h of the electronic component P from the first encoder correction value Sc1 and the second encoder correction value Sc2 calculated in this way. Is measured (see FIG. 3B).

  The calculation of the first encoder correction value Sc1 and the second encoder correction value Sc2 and the measurement of the height h of the electronic component P are performed in the data processing unit 40 (see FIG. 4). The data processing unit 40 calculates the average value of the first heights of the nozzles 11 when the nozzles 11 are not picking up the electronic components P and when they are descending, and the nozzles are in a state where the electronic components P are picked up 11 is a first calculation means for calculating the average value of the second height of the nozzle 11 when the nozzle 11 is rising and descending, and the average value of the first height of the nozzle 11 and the first value of the nozzle 11 This is a second calculation means for calculating the height of the electronic component P attracted to the lower end portion of the nozzle 11 from the average value of the heights of two.

  As described above, in the nozzle height detection of the electronic component mounting apparatus according to the present embodiment, the approximate encoder correction value calculated by averaging the encoder values acquired when the nozzle is lowered and when the nozzle is raised and lowered is used. The encoder value deviation caused by the response delay of the sensor unit is corrected so that the height of the electronic component can be accurately measured. In addition, by using the encoder correction value, it is not necessary to set a correction value corresponding to each condition such as the nozzle lowering speed and the height of the electronic component for correcting the deviation of the encoder value. Parts can also be handled.

  Next, the mounting operation of the electronic component mounting apparatus will be described with reference to the flowchart of FIG. 6 focusing on the nozzle height detection operation.

  When the mounting operation is started, in ST1, the nozzle 11 is lowered while intersecting the laser beam 25 of the sensor unit 20 (first lowering step), and the encoder value at the time of lowering is acquired (first detecting step). In ST2, the nozzle 11 lowered in ST1 is caused to intersect with the laser beam 25 of the sensor unit 20 and raised (first ascending step), and the ascending encoder value is acquired (second detecting step). In ST3, an average value of the descending encoder value and the ascending encoder value acquired in ST2 is calculated to calculate a first encoder correction value Sc1 (first calculation step).

  In ST4, the nozzle 11 is moved above the parts feeder 5 to suck and pick up the electronic component P. In ST5, the nozzle 11 that has attracted the electronic component P to the lower end is lowered while intersecting the laser beam 25 of the sensor unit 20 (second descending step), and the descending encoder value is acquired (third detecting step). ). In ST6, the nozzle 11 that has descended in ST5 is caused to intersect with the laser beam 25 of the sensor unit 20 (second ascending process), and the ascending encoder value is acquired (fourth detecting process). In ST7, an average value of the descending encoder value and the ascending encoder value obtained in ST6 is calculated to calculate a second encoder correction value Sc2 (second calculation step). In ST8, the height of the electronic component P is calculated by calculating the difference between the first encoder correction value Sc1 calculated in ST3 and the second encoder correction value Sc2 calculated in ST7 (third step). Calculation process). Thereby, the height of the electronic component P adsorbed by the nozzle 11 is measured.

  The calculated height of the electronic component P is collated with the height data of each type of electronic component stored in the component library 33 to determine whether or not a predetermined type of electronic component is picked up, To be judged. In addition, there may be a difference in height even if the product is of a predetermined type and is normally adsorbed. Therefore, it is necessary to reflect the amount of nozzle height control when mounting such electronic components at an appropriate pressure. It is pressed and mounted on the substrate (ST9). Thereafter, the operations of ST4 to ST9 are continuously performed, and the mounting operation is completed when the mounting of the electronic components is completed at all the mounting positions on the substrate.

  The calculation of the first encoder correction value Sc1 in ST1 to ST3 is performed once for each nozzle 11, and thereafter, the second encoder correction value Sc2 for each type of electronic component P calculated in ST7 is calculated. The height of the electronic component P can be measured by calculating the difference.

  In the above description, the sensor unit 20 is disposed on the base 1 and the nozzle height is detected by moving the nozzle 11 to the sensor unit 20. The unit 20 and the nozzle 11 may be moved relatively. For example, the same effect can be obtained by mounting the sensor unit 20 together with the nozzles 11 on the transfer head 8 and sequentially moving the sensor units 20 to the respective nozzles 11. With this configuration, the transfer head 8 moves between the electronic component supply unit 4 and the substrate 3 positioned on the conveyance guide 2 in order to pick up and mount the electronic component on the substrate 3. Since the height of the electronic component P adsorbed by the nozzle 11 can be measured, the mounting efficiency can be improved.

  According to the present invention, since the nozzle height detection error due to the response delay of the sensor is eliminated, there is an advantage that the height of the electronic component can be accurately measured, and the electronic component is picked up by the nozzle. Thus, it is useful in the field of mounting electronic components to be mounted on a substrate.

The top view of the electronic component mounting apparatus in one embodiment of this invention (A) Top view of the transfer head of the electronic component mounting apparatus in one embodiment of the present invention (b) Front view of the transfer head of the electronic component mounting apparatus in one embodiment of the present invention (A) Configuration diagram of sensor unit in one embodiment of the present invention (b) Explanatory diagram of a method for measuring the height of an electronic component in one embodiment of the present invention The block diagram of the control system of the electronic component mounting apparatus in one embodiment of this invention (A) Graph showing Z-axis displacement due to raising and lowering of nozzle in one embodiment of the present invention (b) Graph showing Z-axis speed in raising and lowering of nozzle in one embodiment of the present invention (c) One embodiment of the present invention Explanatory drawing which shows the state of the signal emitted to the Z-axis encoder from the sensor control part in the form of The flowchart which shows operation | movement of the electronic component mounting apparatus in one embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Nozzle 20 Sensor unit 21 Emitter 22 Light receiver 25 Laser beam 40 Data processing part P Electronic component

Claims (3)

An electronic component mounting apparatus that measures the height of an electronic component picked up by being picked up by a lower end of a nozzle and mounts it on a substrate,
A light receiver for receiving light projected from the light projector, nozzle driving means for moving the nozzle up and down with respect to light projected and received between the light projector and the light receiver, and a lower end of the nozzle by raising and lowering the nozzle The nozzle at the time of rising and lowering of the nozzle with the height of the nozzle when the light receiving amount of the light receiver reaches a predetermined threshold when the section intersects the light as the first height of the nozzle The first height of each of the electronic components is detected, and the electronic component adsorbed on the lower end of the nozzle by the raising and lowering of the nozzle intersects with the light, and the amount of light received by the light receiver reaches a predetermined threshold value. Detection means for detecting the second height of the nozzle when the nozzle is raised and lowered, with the height of the nozzle as the second height of the nozzle, respectively, and when the nozzle is raised and lowered A first calculating means for calculating an average value from the first height of the nozzle and calculating an average value from the second height of the nozzle at the time of ascent and descent; and a first height of the nozzle An electronic component comprising: a second computing means for calculating the height of the electronic component adsorbed on the lower end of the nozzle from the average value of the height and the average value of the second height of the nozzle Mounting device. The height of the nozzle mounted on the electronic component mounting device is detected by a light emitting / receiving photoelectric sensor, and the height of the electronic component picked up and picked up by the lower end of this nozzle is measured and mounted on the substrate. Electronic component mounting method,
A first lowering step of lowering the nozzle with respect to the photoelectric sensor, and a lower end portion of the nozzle intersects with light projected and received by the photoelectric sensor, so that a received light amount at the photoelectric sensor becomes a predetermined threshold value A first detecting step for detecting the height of the nozzle at the time of reaching as the first height when the nozzle is lowered, a first raising step for raising the lowered nozzle, and the first raising step A second detection step of detecting the height of the nozzle when the amount of light received by the photoelectric sensor again reaches a predetermined threshold as a first height when the nozzle is raised, and a second detection step when the nozzle is lowered A first calculation step of calculating an average value of the first height of the nozzle from the height of 1 and the first height when the nozzle is raised, and the nozzle having an electronic component adsorbed on the lower end thereof to the photoelectric sensor Lower 2 and the nozzle when the electronic component adsorbed on the lower end of the nozzle intersects the light projected and received by the photoelectric sensor and the amount of light received by the photoelectric sensor reaches a predetermined threshold value. A third detection step of detecting the height of the nozzle as a second height when the nozzle is lowered, a second raising step of raising the lowered nozzle, and light reception by the photoelectric sensor in the second raising step A fourth detection step of detecting the height of the nozzle when the amount reaches a predetermined threshold again as a second height when the nozzle is raised; the second height when the nozzle is lowered; and the nozzle A second calculation step of calculating an average value of the second height of the nozzle from the second height at the time of ascent; an average value of the first height of the nozzle and a second height of the nozzle; From the average value, it is adsorbed to the lower end of the nozzle. Electronic component mounting method which comprises a third calculation step of calculating the height of the electronic component. A nozzle height detection method for detecting the height of a nozzle provided in an electronic component mounting apparatus so as to be movable up and down by a light emitting / receiving photoelectric sensor,
A descent process in which the nozzle is lowered with respect to the photoelectric sensor, and a time point at which the lower end of the nozzle intersects light projected and received by the photoelectric sensor and the amount of light received by the photoelectric sensor reaches a predetermined threshold value A first detecting step for detecting the height of the nozzle, an ascending step for raising the lowered nozzle, and a time at which the amount of light received by the photoelectric sensor reaches a predetermined threshold again in the ascending step. A second detection step of detecting the height of the nozzle; and a step of calculating an average value of the height of the nozzle detected by the first detection step and the second detection step. Nozzle height detection method.

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