JP2007057502A - System for measuring profile of both sides of substrate - Google Patents

System for measuring profile of both sides of substrate Download PDF

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JP2007057502A
JP2007057502A JP2005246608A JP2005246608A JP2007057502A JP 2007057502 A JP2007057502 A JP 2007057502A JP 2005246608 A JP2005246608 A JP 2005246608A JP 2005246608 A JP2005246608 A JP 2005246608A JP 2007057502 A JP2007057502 A JP 2007057502A
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substrate
measured
displacement meter
double
reference plane
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Shigetaka Akiyama
重隆 秋山
Takanobu Akiyama
貴信 秋山
Tatsuichi Tanaka
辰一 田中
Katsunobu Ueda
勝宣 上田
Hiroyuki Terauchi
宏之 寺内
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Coorstek KK
Shibaura Machine Co Ltd
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Toshiba Machine Co Ltd
Toshiba Ceramics Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a system for measuring profile of both sides of a substrate capable of easily and precisely measuring the profile of the front and rear surfaces of a large and heavy substrate with superior operability. <P>SOLUTION: The system for measuring profile of both sides of substrate includes, as major component devices, a substrate profile measuring device 1, a substrate handling robot 2, and a computer 3. The substrate profile measuring device 1 includes a vertically arranged vertical surface plate 4, a substrate holding mechanism 5 for holding the substrate P to be measured parallel to it, and a displacement meter scanning column 6, and simultaneously measures the profile of both sides of the substrate P to be measured. The substrate handling robot 2 mounts an unmeasured substrate P to be measured in a vertical state to the substrate holding mechanism 5, or removes the measured substrate P from the substrate holding mechanism 5. The substrate profile measuring device 1 and the substrate handling robot 2 are collectively controlled by the computer 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、基板の両面形状が重要な要素となる被測定基板、例えば大型・重量化した液晶用フォトマスク等の基板の表面および裏面の両面形状を簡便にしかも高精度に測定する基板の両面形状測定システムに関する。   The present invention provides both sides of a substrate to be measured easily and with high accuracy, both on the front and back sides of a substrate to be measured, for example, a large and heavy liquid crystal photomask. The present invention relates to a shape measurement system.

液晶ディスプレイ基板のＴＦＴ（薄膜トランジスタ）アレイの製造においては、フォトマスク表面に形成された遮光膜からなるマスクパターンが、フォトリソグラフィ技術により露光投影され、上記液晶ディスプレイ基板となるマザーガラス上にパターン転写される。そして、このフォトリソグラフィ技術といわゆる加工技術とにより上記マザーガラス上にＴＦＴアレイが形成される。同様に、液晶ディスプレイ基板のカラーフィルターも染料含浸法と呼ばれるリソグラフィーを用いた方法により製造される。   In manufacturing a TFT (thin film transistor) array on a liquid crystal display substrate, a mask pattern made of a light-shielding film formed on the photomask surface is exposed and projected by a photolithography technique and transferred onto the mother glass that becomes the liquid crystal display substrate. The A TFT array is formed on the mother glass by this photolithography technique and so-called processing technique. Similarly, the color filter of the liquid crystal display substrate is also manufactured by a method using lithography called a dye impregnation method.

上記マザーガラスは、1枚から多数の液晶ディスプレイ基板を製造できるようにするために益々その大型化が図られており、例えば、第8世代のマザーガラスは、縦横寸法が２１６０ｍｍ×２４６０ｍｍ程度、第9世代のそれは２４００ｍｍ×２８００ｍｍ程度になるといわれる。そして、これに伴い、ＴＦＴアレイ側およびカラーフィルター側のいずれの製造においても、大型化し重量化したフォトマスクが必要になる。例えば、上記フォトマスクは、縦横寸法が１５００ｍｍ×１８００ｍｍ以上になり、その板厚が２０ｍｍ程度にもなる。また、高精度のパターン転写を実施するために、これ等の大型フォトマスクの材料は線膨張係数の小さい合成石英ガラスが主に用いられる。このために、その重量は２００ｋｇ以上に達するようになる。   The mother glass has been increasingly increased in size so that a large number of liquid crystal display substrates can be manufactured from one sheet. For example, the 8th generation mother glass has a vertical and horizontal dimension of about 2160 mm × 2460 mm, It is said that the 9th generation is about 2400mm x 2800mm. Along with this, in both the TFT array side and color filter side manufacturing, a photomask having a larger size and a higher weight is required. For example, the photomask has a vertical and horizontal dimension of 1500 mm × 1800 mm or more and a plate thickness of about 20 mm. Further, in order to carry out highly accurate pattern transfer, synthetic quartz glass having a small linear expansion coefficient is mainly used as a material for these large photomasks. For this reason, the weight reaches 200 kg or more.

上記大型フォトマスクでは、フォトマスク全面にわたって上記マスクパターンが形成される表面の平坦度が重要な要素となる。そして、フォトマスクの個々においてその表面の平坦度を測定し、規格範囲内のものを選択する厳重な品質管理が必須になる。そこで、上記大型フォトマスクの表面の平坦度を測定する装置として、これまで種々のものが提案された（例えば、特許文献１，２を参照）。そして、その一部は既に実用に供され上記大型フォトマスクのような被測定基板の平坦度の管理に用いられている。   In the large photomask, the flatness of the surface on which the mask pattern is formed over the entire photomask is an important factor. Strict quality control is required to measure the flatness of the surface of each photomask and select one within the standard range. Therefore, various devices have been proposed so far for measuring the flatness of the surface of the large photomask (see, for example, Patent Documents 1 and 2). Some of them are already put into practical use and are used for managing the flatness of a substrate to be measured such as the large photomask.

一方、上記液晶ディスプレイ基板は、ＶＧＡからＳＶＧＡ、ＸＧＡ、ＳＸＧＡ、ＵＸＧＡ、ＱＸＧＡと高精細化が益々進んできている。更には、低温ポリシリコンを用いて上記ＴＦＴを形成すると共に、ディスプレイの画素とは別にマザーガラスの外周部にドライバー用ＩＣを形成する方法が実用化されてきた。そして、これ等に伴って、ＴＦＴアレイ側のパターン転写の精度、特に上記パターンの露光投影における重ね合わせ精度の向上が益々要求されるようになってきている。   On the other hand, the liquid crystal display substrate has been increasingly refined from VGA to SVGA, XGA, SXGA, UXGA, QXGA. Furthermore, a method has been put into practical use in which the TFT is formed using low-temperature polysilicon and a driver IC is formed on the outer periphery of the mother glass separately from the display pixels. Along with this, there is an increasing demand for improvement in the accuracy of pattern transfer on the TFT array side, in particular, the overlay accuracy in exposure projection of the pattern.

上記フォトリソグラフィにおけるパターン転写の高精度化は、フォトマスク全面にわたる上記フォトマスク表面の平坦度と共に、その対向するフォトマスク面（フォトマスクの裏面という）の平坦度の厳重な品質管理も必要としてきている。これについて図9を参照して説明する。ここで、図9（ａ）は、フォトマスク１０１の表面１０２が凸形状になり、裏面１０３形状が比較的に平坦となる場合である。図9（ｂ）は、フォトマスク１０１の表面１０２形状が比較的に平坦であり、裏面１０３が凹形状になる場合である。
図9（ａ）に示すように、フォトマスク１０１表面に凸形状があると、フォトマスク１０１の裏面１０３側から入射する実線の露光光１０４は、その表面１０２の凸形状により曲折を起してマザーガラス１０５表面の感光膜（不図示）を露光する。この露光光１０４の曲折のために、パターン転写において転写位置にズレが生じるようになる。ここで、図中の点線は、上記凸形状が無く光が直進する理想の光路を示している。そこで、上述したようにフォトマスク表面の平坦度を上げ理想の光路に近づけるようにして、上記ＴＦＴアレイ側のパターン転写の精度を向上させている。 In order to improve the accuracy of pattern transfer in the photolithography, strict quality control of the flatness of the photomask surface (referred to as the backside of the photomask) opposite to the flatness of the photomask surface over the entire photomask is required. ing. This will be described with reference to FIG. Here, FIG. 9A shows a case where the front surface 102 of the photomask 101 has a convex shape and the back surface 103 has a relatively flat shape. FIG. 9B shows a case where the shape of the front surface 102 of the photomask 101 is relatively flat and the back surface 103 is concave.
As shown in FIG. 9A, when the photomask 101 has a convex shape, the solid line exposure light 104 incident from the back surface 103 side of the photomask 101 is bent due to the convex shape of the front surface 102. A photosensitive film (not shown) on the surface of the mother glass 105 is exposed. Due to the bending of the exposure light 104, the transfer position is shifted in pattern transfer. Here, a dotted line in the figure indicates an ideal optical path in which light goes straight without the convex shape. Thus, as described above, the flatness of the photomask surface is increased and brought closer to the ideal optical path, thereby improving the pattern transfer accuracy on the TFT array side.

また、図9（ｂ）の場合においても、その程度は小さいものの図9（ａ）の場合と同様のことが生じる。図9（ｂ）に示すように、露光光１０４が、凹形状を有する裏面１０３側から入射すると、その光路はそこで曲折して表面１０２に達する。そして、表面１０２において上記曲折の度合いが軽減されてマザーガラス１０５表面の感光膜（不図示）を露光する。このため、この場合においても上記パターン転写の転写位置のズレは、図9（ａ）の場合に比べて小さいけれども生じてしまう。
そして、上述した液晶ディスプレイの高精細化、あるいはドライバー用ＩＣの混載により上記パターン転写の高精度化が必要になってくると、フォトマスク裏面の凹凸形状によるパターン転写の位置ズレが問題として顕在化する。このために、理想の光路に近づけるようにフォトマスク裏面の平坦度を上げることが要求され、その平坦度の厳重な品質管理が必要になってきている。
特開平３−９０８０５号公報 特開２０００−５５６４１号公報 Also in the case of FIG. 9B, the same thing as in the case of FIG. As shown in FIG. 9B, when the exposure light 104 enters from the back surface 103 side having a concave shape, the optical path is bent there and reaches the front surface 102. Then, the degree of bending is reduced on the surface 102, and a photosensitive film (not shown) on the surface of the mother glass 105 is exposed. For this reason, even in this case, the shift of the transfer position of the pattern transfer occurs although it is smaller than that in the case of FIG.
When the above-mentioned pattern transfer needs to be highly precise due to the high definition of the liquid crystal display or the mixed mounting of the driver IC, the positional deviation of the pattern transfer due to the uneven shape on the back side of the photomask becomes a problem. To do. For this reason, it is required to increase the flatness of the back surface of the photomask so that it approaches the ideal optical path, and strict quality control of the flatness is required.
Japanese Patent Laid-Open No. 3-90805 JP 2000-55641 A

しかしながら、上記液晶用フォトマスクのように大型・重量化した基板の表面の形状および裏面の形状を、作業性に優れ簡便で高精度に測定できる基板の両面形状測定システムは未だ開発されていない。   However, a double-sided shape measurement system for a substrate that can measure the shape of the front surface and the back surface of a large and heavy substrate, such as the liquid crystal photomask, with excellent workability and high accuracy has not yet been developed.

本発明は、上述の事情に鑑みてなされたもので、基板の両面形状が重要な要素となる被測定基板、例えば大型・重量化した液晶用フォトマスクの表面および裏面の両面形状を、作業性に優れ簡便にしかも高精度に測定することができる基板の両面形状測定システムを提供することを主な目的とする。   The present invention has been made in view of the above-mentioned circumstances, and the double-sided shape of the front and back surfaces of a substrate to be measured in which the double-sided shape of the substrate is an important element, for example, a large and heavy liquid crystal photomask, The main object of the present invention is to provide a double-sided shape measurement system for a substrate that can be measured easily and easily with high accuracy.

上記目的を達成するために、本発明にかかる基板の両面形状測定システムは、定盤の基準平面がほぼ垂直状態となるように配置された定盤と、被測定基板の板面が前記基準平面にほぼ平行になるように被測定基板を保持する保持機構と、前記定盤の基準平面と、前記保持機構によって保持された前記被測定基板の板面の一面との間に配置され、垂直面内において走査可能であり前記走査と共に前記定盤の基準平面との距離を測定する第１の変位計および前記被測定基板の板面の一面との距離を測定する第２の変位計と、前記板面の一面に対向する他面側に配置され、垂直面内において走査可能であり前記走査と共に前記板面の他面との距離を測定する第３の変位計と、を備えた基板形状測定装置と、前記基板形状測定装置の前記保持機構への被測定基板の装着および前記保持機構からの前記被測定基板の取り外しを行う基板着脱装置と、前記基板形状測定装置および前記基板着脱装置の動作を制御する処理制御装置と、を有する構成になっている。   In order to achieve the above-mentioned object, a double-sided shape measuring system for a substrate according to the present invention includes a surface plate disposed so that a reference plane of the surface plate is substantially vertical, and a plate surface of the substrate to be measured is the reference plane. Between the holding mechanism for holding the substrate to be measured so as to be substantially parallel to the plane, the reference plane of the surface plate, and one surface of the plate surface of the substrate to be measured held by the holding mechanism, and a vertical surface And a second displacement meter for measuring a distance from one surface of a plate surface of the substrate to be measured; and a first displacement meter for measuring a distance from a reference plane of the surface plate together with the scanning; A substrate shape measurement comprising: a third displacement meter disposed on the other surface opposite to one surface of the plate surface and capable of scanning in a vertical plane and measuring a distance from the other surface of the plate surface together with the scanning. To the holding mechanism of the apparatus and the substrate shape measuring apparatus A substrate attaching / detaching device that attaches a measurement substrate and removes the substrate to be measured from the holding mechanism, and a processing control device that controls operations of the substrate shape measuring device and the substrate attaching / detaching device are configured. .

上記発明において、前記基板着脱装置は、ハンドリング用ロボットのアーム先端に取り付けられたロボットハンドを有し、前記被測定基板を垂直状態にして前記保持機構への被測定基板の装着および前記保持機構からの前記被測定基板の取り外しを行う。そして、前記保持機構への被測定基板の装着および前記保持機構からの前記被測定基板の取り外しの操作は、前記基板形状測定装置に内臓の制御部と前記基板着脱装置に内臓の制御部との間の通信手段を通して行われる。   In the above invention, the substrate attaching / detaching device has a robot hand attached to the tip of an arm of a handling robot, and the substrate to be measured is placed in a vertical state and the substrate to be measured is mounted on the holding mechanism and the holding mechanism The substrate to be measured is removed. The operation of attaching the substrate to be measured to the holding mechanism and removing the substrate to be measured from the holding mechanism is performed by the internal control unit in the substrate shape measuring device and the internal control unit in the substrate attaching / detaching device. Between the communication means.

上記構成にすることで、基板の両面形状が重要な要素となる被測定基板、特に大型・重量化した液晶用フォトマスクの表面および裏面の両面形状を、作業性に優れ簡便にしかも高精度に測定することが可能になる。   With the above configuration, the double-sided shape of the substrate, especially the large and heavy liquid crystal photomask on the front and back surfaces, where the double-sided shape of the substrate is an important factor, is easy to operate and highly accurate. It becomes possible to measure.

上記発明において、前記処理制御装置は、前記基板形状測定装置の前記第１の変位計、第２の変位計および第３の変位計による測定結果に基づいて被測定基板の両面の表面形状を演算する演算手段を備えている。   In the above invention, the processing control device calculates the surface shapes of both surfaces of the substrate to be measured based on the measurement results of the first displacement meter, the second displacement meter, and the third displacement meter of the substrate shape measuring device. The calculating means to perform is provided.

そして、上記発明において、前記基準平面における垂直軸方向に移動可能な第１のＹ軸移動機構に前記第１の変位計と前記第２の変位計とが搭載され、前記第１のＹ軸移動機構とは独立に前記基準平面における垂直軸方向に移動可能な第２のＹ軸移動機構に前記第３の変位計が搭載され、前記第１のＹ軸移動機構と前記第２のＹ軸移動機構とが、前記基準平面における水平軸方向に移動可能なＺ軸移動機構に搭載されている。   And in the said invention, the said 1st displacement meter and the said 2nd displacement meter are mounted in the 1st Y-axis moving mechanism which can move to the perpendicular-axis direction in the said reference plane, The said 1st Y-axis movement The third displacement meter is mounted on a second Y-axis movement mechanism that can move in the vertical axis direction on the reference plane independently of the mechanism, and the first Y-axis movement mechanism and the second Y-axis movement The mechanism is mounted on a Z-axis moving mechanism that can move in the horizontal axis direction on the reference plane.

上記構成にすることで、上記Ｙ軸移動機構およびＺ軸移動機構の移動運動において非常に高い真直度と高い位置決め精度が得られるようになる。これに伴って、上記第１の変位計、第２の変位計および第３の変位計は、定盤の基準平面に対して高精度で正確な走査が可能になる。そして、上記基準平面を基準面として、被測定基板の一面および他面の両面形状を同時にしかも高精度に測定することが可能になり、被測定基板の平坦度あるいは板厚分布が短時間で高精度に測定される。   With the above-described configuration, very high straightness and high positioning accuracy can be obtained in the moving motion of the Y-axis moving mechanism and the Z-axis moving mechanism. Accordingly, the first displacement meter, the second displacement meter, and the third displacement meter can be scanned with high accuracy and accuracy with respect to the reference plane of the surface plate. Then, using the reference plane as a reference plane, it is possible to measure the shape of one side and the other side of the substrate to be measured simultaneously and with high accuracy, and the flatness or thickness distribution of the substrate to be measured can be increased in a short time. Measured with accuracy.

本発明の好適な一態様では、前記第１のＹ軸移動機構および前記第２のＹ軸移動機構はボールねじおよびそれに結合したスライドにより構成され、前記Ｚ軸移動機構はＶ−Ｖころがり案内あるいはＶ−Ｖすべり案内により構成される。前記スライドとして、エアスライドを採用することにより、ボールねじによる位置決め時の振動による精度の劣化を防止することができる。   In a preferred aspect of the present invention, the first Y-axis moving mechanism and the second Y-axis moving mechanism are constituted by a ball screw and a slide coupled thereto, and the Z-axis moving mechanism is a VV rolling guide or It is constituted by VV slip guidance. By adopting an air slide as the slide, it is possible to prevent deterioration in accuracy due to vibration during positioning by the ball screw.

また、本発明の好適な一態様では、前記第１の変位計、第２の変位計および第３の変位計は非接触レーザ変位計により構成される。   In a preferred aspect of the present invention, the first displacement meter, the second displacement meter, and the third displacement meter are configured by a non-contact laser displacement meter.

本発明により、大型・重量化した液晶用フォトマスクの表面および裏面の両面形状を、作業性に優れ簡便で高精度に測定する基板の両面形状測定システムを提供することができる。そして、基板の両面形状が重要な要素となる被測定基板において、その表面および裏面の両面形状を簡便に測定することができ、基板の両面の平坦度を短時間で高精度に測定することが可能になる。   According to the present invention, it is possible to provide a double-sided shape measurement system for a substrate that measures the double-sided shape of the front and back surfaces of a large-sized and heavy liquid crystal photomask with excellent workability and high accuracy. And in the substrate to be measured where the double-sided shape of the substrate is an important factor, the double-sided shape of the front and back surfaces can be easily measured, and the flatness of both sides of the substrate can be measured with high accuracy in a short time. It becomes possible.

本発明の好適な実施形態について図１ないし図８を参照して説明する。図１はこの実施形態の基板の両面形状測定システムの一例を示す全体構成図である。図１に示すように、上記両面形状測定システムは、主要な構成装置として、基板形状測定装置１、基板ハンドリング・ロボット２（基板着脱装置）およびコンピュータ３（処理制御装置）を備えている。   A preferred embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an overall configuration diagram showing an example of a double-sided shape measurement system for a substrate according to this embodiment. As shown in FIG. 1, the double-sided shape measuring system includes a substrate shape measuring device 1, a substrate handling robot 2 (substrate attaching / detaching device), and a computer 3 (processing control device) as main components.

上記基板形状測定装置１は、その詳細はその動作機構のところで後述されるが、垂直状態の基準平面を有する縦型定盤４、被測定基板Ｐを垂直状態に取り付ける基板保持機構５、被測定基板Ｐの表面形状および裏面形状を計測するための変位計走査コラム６および形状測定制御部７を備えている。この形状測定制御部７は、コンピュータ３に接続されており、上記基板保持機構５および変位計走査コラム６の動作を制御する。更に、形状測定制御部７は、後述する基板ハンドリング・ロボット２の基板ハンドリング制御部と双方通信するようになっている。
ここで、基板保持機構５には、図１に示すように、被測定基板Ｐを垂直状態に固定保持する一対の基板下部支持台５ａ、５ｂと基板上部支持台５ｃが設けられている。更に、上記基板保持機構５には、基板ハンドリング・ロボット２により被処理基板Ｐを着脱する際に用いられる一対のガイド溝８（８ａ、８ｂ）が設けられている。 The details of the substrate shape measuring apparatus 1 will be described later in the description of its operation mechanism, but there are a vertical surface plate 4 having a vertical reference plane, a substrate holding mechanism 5 for mounting a substrate to be measured P in a vertical state, a device under measurement. A displacement meter scanning column 6 and a shape measurement control unit 7 for measuring the surface shape and the back surface shape of the substrate P are provided. The shape measurement control unit 7 is connected to the computer 3 and controls the operations of the substrate holding mechanism 5 and the displacement meter scanning column 6. Further, the shape measurement control unit 7 communicates with a substrate handling control unit of the substrate handling robot 2 described later.
Here, as shown in FIG. 1, the substrate holding mechanism 5 is provided with a pair of substrate lower support tables 5a and 5b and a substrate upper support table 5c for fixing and holding the substrate to be measured P in a vertical state. Further, the substrate holding mechanism 5 is provided with a pair of guide grooves 8 (8a, 8b) used when the substrate handling robot 2 attaches / detaches the substrate P to be processed.

基板ハンドリング・ロボット２は、例えばセラミックスから成る二本のフォーク状のロボットハンド９（９ａ、９ｂ）、該ロボットハンド９の自在な運動とフリーバランスを保証するロボットアーム１０、該ロボットアーム１０を支えるロボット本体１１、基板ハンドリング制御部１２および台座１３を備えている。ここで、ロボット本体１１および基板ハンドリング制御部１２は台座１３上に取り付けられ、台座１３と共に移動できるようになっている。ここで、ロボットハンド９の先端領域には、図１に示すように、例えばセラミックスから成る矩形枠状の支持部材１４が固定して取り付けられ、支持部材１４の上部および下部にはそれぞれ一対の基板把持用ツメ１５が設けられている。   The substrate handling robot 2 supports, for example, two fork-shaped robot hands 9 (9a, 9b) made of ceramics, a robot arm 10 that ensures free movement and free balance of the robot hand 9, and supports the robot arm 10. A robot body 11, a substrate handling control unit 12, and a pedestal 13 are provided. Here, the robot main body 11 and the substrate handling control unit 12 are mounted on a pedestal 13 and can move together with the pedestal 13. Here, as shown in FIG. 1, a rectangular frame-shaped support member 14 made of, for example, ceramics is fixedly attached to the distal end region of the robot hand 9, and a pair of substrates are respectively provided on the upper and lower portions of the support member 14. A gripping claw 15 is provided.

被測定基板Ｐは、この基板把持用ツメ１５により垂直状態にクランプでき、ロボットハンド９によりフリーバランスがとられ移送される。また、被測定基板Ｐは、このロボットハンド９により垂直状態にされ、基板形状測定装置１の基板保持機構５との間で被測定基板Ｐの着脱がなされる。その詳細は後述するが、ロボットハンド９ａおよび９ｂが、それぞれガイド溝８ａおよび８ｂに挿入され、被処理基板Ｐの着脱が、基板保持機構５の基板下部支持台５ａ、５ｂおよび基板上部支持台５ｃと基板ハンドリング・ロボット２との間において垂直状態のままでなされる。   The substrate to be measured P can be clamped in a vertical state by the substrate gripping claws 15, and free-balanced by the robot hand 9 and transferred. Further, the measured substrate P is brought into a vertical state by the robot hand 9, and the measured substrate P is attached to and detached from the substrate holding mechanism 5 of the substrate shape measuring apparatus 1. Although details will be described later, the robot hands 9a and 9b are inserted into the guide grooves 8a and 8b, respectively, and the substrate P to be processed is attached or detached by the substrate lower support bases 5a and 5b and the substrate upper support base 5c. And the substrate handling robot 2 in a vertical state.

コンピュータ３は、図１に示しているように、測定装置本体１に隣接して配置され、例えばイーサネット（登録商標）を構成するケーブル１６によって基板形状測定装置１の形状測定制御部７に接続されている。ここで、コンピュータ３は、プロセッサ（ＣＰＵ）、メモリ（ＲＡＭ）、プログラム格納装置（ＨＤＤ）、フロッピドライブあるいは光ディスクなどのディスクドライブ、およびキーボードやマウスなどの入力デバイスを備えている。あるいは、ネットワーク・インタフェースおよび周辺インタフェースを備えていてもよい。
コンピュータ３は、基板の両面形状測定システムの動作の全体を制御する中央制御部であり、ＨＤＤに格納されたプログラムに従って上記システムを作動させる。また、後述する基板形状測定装置１の変位計の走査から得られた種々のデータを演算処理し、被測定基板Ｐの両面の平坦度あるいは基板の板厚を含む表面形状を算出してもよい。そして、基板の両面形状測定システムの動作状態あるいは上記算出結果が出力デバイスであるディスプレイ１７またはプリンタ１８から出力される。 As shown in FIG. 1, the computer 3 is arranged adjacent to the measurement apparatus main body 1 and is connected to the shape measurement control unit 7 of the board shape measurement apparatus 1 by a cable 16 constituting, for example, Ethernet (registered trademark). ing. Here, the computer 3 includes a processor (CPU), a memory (RAM), a program storage device (HDD), a disk drive such as a floppy drive or an optical disk, and input devices such as a keyboard and a mouse. Alternatively, a network interface and a peripheral interface may be provided.
The computer 3 is a central control unit that controls the entire operation of the double-sided board shape measurement system, and operates the system according to a program stored in the HDD. Further, various data obtained from scanning of the displacement meter of the substrate shape measuring apparatus 1 to be described later may be arithmetically processed to calculate a surface shape including the flatness of both surfaces of the substrate to be measured P or the thickness of the substrate. . The operating state of the double-sided shape measurement system of the substrate or the calculation result is output from the display 17 or the printer 18 as an output device.

上記基板の両面形状測定システムにおいては、例えば液晶用フォトマスクのように大型・重量化した基板は垂直状態にされ、基板ハンドリング・ロボット２により、基板形状測定装置１の基板保持機構５との間でその着脱が極めて容易になされる。また、基板の表面と裏面の形状は同時に短時間でしかも高精度に測定され、それ等の結果は、中央制御部であるコンピュータ３の出力デバイスにより表示される。   In the above-described double-sided shape measurement system for substrates, for example, a large and heavy substrate such as a liquid crystal photomask is placed in a vertical state, and the substrate handling robot 2 is connected to the substrate holding mechanism 5 of the substrate shape measuring apparatus 1. The attachment and detachment is very easy. Further, the shapes of the front and back surfaces of the substrate are simultaneously measured in a short time and with high accuracy, and the results are displayed by the output device of the computer 3 which is a central control unit.

次に、本実施形態における基板の両面形状測定システムを構成する基板形状測定装置１の詳細とその動作機構について説明する。図２は基板形状測定装置１の斜視図であり、図３は被測定基板Ｐの両面形状を測定する変位計の走査部を説明するための斜視図である。   Next, details of the board shape measuring apparatus 1 constituting the double-sided board shape measuring system of the present embodiment and its operation mechanism will be described. FIG. 2 is a perspective view of the substrate shape measuring apparatus 1, and FIG. 3 is a perspective view for explaining a scanning unit of a displacement meter that measures the double-sided shape of the substrate P to be measured.

図２に示すように、上述した基板形状測定装置１の縦型定盤４は、金属製のベッド２１上の一端部に配置されている。この縦型定盤４としては、鋳物により構成するのが好適である。そして、この縦型定盤４の垂直面は、すり合わせ加工あるいはラップ加工され、その表面がニッケルメッキされた基準平面４ａを有している。この基準平面４ａは平坦度４００ｎｍ以下の高精度な平面形状になっている。
なお、上記縦型定盤４は、その他に金属、セラミックスあるいは石定盤といわれる例えばグラナイト等、高精度な平坦加工が可能な材質を用いることができる。 As shown in FIG. 2, the vertical surface plate 4 of the substrate shape measuring apparatus 1 described above is disposed at one end on a metal bed 21. The vertical surface plate 4 is preferably made of a casting. The vertical surface of the vertical surface plate 4 has a reference plane 4a that is subjected to a rubbing process or a lapping process and whose surface is plated with nickel. The reference plane 4a has a highly accurate planar shape with a flatness of 400 nm or less.
The vertical surface plate 4 may be made of a material that can be flattened with high accuracy, such as granite, which is referred to as metal, ceramics, or stone surface plate.

上記ベッド２１上における縦型定盤４の手前には、縦横の長さが例えば１６５０ｍｍ×１８５０ｍｍ程度で、板厚が２０ｍｍ程度の大型液晶用石英ガラス製フォトマスクなどの被測定基板Ｐを保持する基板保持機構５が配置されている。この基板保持機構５は金属製あるいはセラミックス製の保持部材２２を有している。この保持部材２２の一対の側柱２２ａの間には、それぞれモータ２２ｃによって駆動され上下に昇降可能に横架された横桁２２ｂが備えられており、この横桁２２ｂの上下動によって、被測定基板Ｐのサイズに合わせた支持調整ができるようになっている。
そして、被測定基板Ｐは、保持部材２２の下部の長手方向に離間して配置された一対の基板下部支持台５ａ、５ｂと、保持部材２２の上部の横桁２２ｂの長手方向のほぼ中央部に配置された基板上部支持台５ｃにより、垂直状態に保持される。ここで、これ等の基板支持台（５ａ、５ｂ、５ｃ）はサーボモータによって駆動され、サーボモータを駆動することによって上記基板支持台の位置制御がされ、被測定基板Ｐの板面を精度よく垂直状態に配置することができる。また、上記一対の基板下部支持部台５ａ、５ｂの離間距離は、被測定基板Ｐのサイズに合わせて自動あるいは手動で調整できるようになっている。 In front of the vertical surface plate 4 on the bed 21, a measurement substrate P such as a quartz glass photomask for large liquid crystal having a length and width of about 1650 mm × 1850 mm and a thickness of about 20 mm is held. A substrate holding mechanism 5 is arranged. The substrate holding mechanism 5 has a holding member 22 made of metal or ceramics. Between the pair of side pillars 22a of the holding member 22, there are provided horizontal beams 22b that are respectively driven by a motor 22c and are horizontally mounted so as to be vertically movable. The support can be adjusted according to the size of the substrate P.
The measured substrate P includes a pair of substrate lower support bases 5a and 5b that are spaced apart in the longitudinal direction of the lower portion of the holding member 22 and a substantially central portion in the longitudinal direction of the cross beam 22b on the upper portion of the holding member 22. Is held in a vertical state by the substrate upper support 5c. Here, these substrate support tables (5a, 5b, 5c) are driven by a servo motor, and the position of the substrate support table is controlled by driving the servo motor, so that the plate surface of the substrate P to be measured can be accurately measured. It can be arranged in a vertical state. Further, the distance between the pair of substrate lower support bases 5a and 5b can be adjusted automatically or manually according to the size of the substrate P to be measured.

そして、図２，３に示すように、ベッド２１上において、縦型定盤４の基準平面４ａにおけるＺ軸方向（水平軸方向）に移動する構造の変位計走査コラム６（Ｚ軸移動機構）が配置されている。この変位計走査コラム６は、ベッド２１の上面に設けた一対のＶ溝２３に沿って直線運動するＶ−Ｖころがり案内により、図３に記すＺ軸方向に高精度に移動できるようになっている。   As shown in FIGS. 2 and 3, a displacement meter scanning column 6 (Z-axis moving mechanism) having a structure that moves in the Z-axis direction (horizontal axis direction) on the reference plane 4 a of the vertical surface plate 4 on the bed 21. Is arranged. The displacement meter scanning column 6 can be moved with high accuracy in the Z-axis direction shown in FIG. 3 by a VV rolling guide that linearly moves along a pair of V grooves 23 provided on the upper surface of the bed 21. Yes.

上記変位計走査コラム６は、大きな重量となる例えば金属製のテーブル２４、該テーブル２４上に設けられた第１のエアスライド２５（第１のＹ軸移動機構）と第２のエアスライド２６（第２のＹ軸移動機構）を有する。ここで、第１のエアスライド２５は、テーブル２４上にほぼ垂直に取り付けられた案内レール２７とボールネジ２８有し、その上部において固定板２９に保持されている。そして、第１のエアスライド２５の第１のスライダ３０は、テーブル２４に内蔵のモータ駆動のボールネジ２８により、案内レール２７に沿い上記基準平面４ａにおけるＹ軸方向（垂直軸方向）に高精度に移動するようになっている。
同様にして、第２のエアスライド２６は、テーブル２４上に垂直に取り付けられ別の案内レール３１とボールネジ３２有し、その上部において固定板２９に保持されている。そして、第２のエアスライド２６の第２のスライダ３３は、テーブル２４に内蔵のモータ駆動のボールネジ３２により、案内レール３１に沿い上記基準平面４ａにおけるＹ軸方向に高精度に移動するようになっている。上記案内レール２７，３１および第１のスライダ３０および第２のスライダ３３の材質は、軽量で剛性率の高い例えばアルミニウムまたはセラミックスであると好適である。
ここで、図３に示すように、第１のスライダ３０および第２のスライダ３３は、ボールネジ２８，３２のそれぞれのナット３４，３５に一体になるように取り付けられている。このために、テーブル２４内蔵のモータ駆動によるボールネジ２８，３２の回転運動に伴いＹ軸方向にそれぞれ移動する。 The displacement meter scanning column 6 includes a heavy metal table 24, a first air slide 25 (first Y-axis moving mechanism) and a second air slide 26 (on the table 24). A second Y-axis moving mechanism). Here, the first air slide 25 has a guide rail 27 and a ball screw 28 mounted substantially vertically on the table 24, and is held by a fixed plate 29 at the upper part thereof. The first slider 30 of the first air slide 25 is accurately moved in the Y-axis direction (vertical axis direction) on the reference plane 4a along the guide rail 27 by a motor-driven ball screw 28 built in the table 24. It is supposed to move.
Similarly, the second air slide 26 is vertically mounted on the table 24, has another guide rail 31 and a ball screw 32, and is held by a fixing plate 29 at the upper part thereof. The second slider 33 of the second air slide 26 is moved along the guide rail 31 with high accuracy in the Y-axis direction on the reference plane 4a by a motor-driven ball screw 32 built in the table 24. ing. The material of the guide rails 27 and 31, the first slider 30 and the second slider 33 is preferably light weight and high rigidity such as aluminum or ceramics.
Here, as shown in FIG. 3, the first slider 30 and the second slider 33 are attached to the nuts 34 and 35 of the ball screws 28 and 32 so as to be integrated. For this purpose, the ball screws 28 and 32 are driven in the Y-axis direction by the motor driven in the table 24, respectively.

更に、図３に示すように、例えばアルミニウムあるいはセラミックスから成る一対の支柱３６が上記テーブル２４と固定板２９との間に垂直に取り付けられている。この一対の支柱３６は、変位計走査コラム６を補強するものでありその変形を防止する機能を有する。   Further, as shown in FIG. 3, a pair of support columns 36 made of, for example, aluminum or ceramics are vertically attached between the table 24 and the fixing plate 29. The pair of columns 36 reinforces the displacement meter scanning column 6 and has a function of preventing deformation thereof.

そして、図３に示すように、第１のスライダ３０は、それに固定して取り付けられた第１の変位計３７および第２の変位計３８を備えている。同様に、第２のスライダ３３は、それに固定して取り付けられた第３の変位計３９を備えている。ここで、上記第１の変位計３７、第２の変位計３８および第３の変位計３９は、例えばレーザダイオードを備えた非接触レーザ変位計により構成されると好適である。   As shown in FIG. 3, the first slider 30 includes a first displacement meter 37 and a second displacement meter 38 fixedly attached thereto. Similarly, the second slider 33 includes a third displacement meter 39 fixedly attached thereto. Here, it is preferable that the first displacement meter 37, the second displacement meter 38, and the third displacement meter 39 are constituted by, for example, a non-contact laser displacement meter provided with a laser diode.

ここで、上記エアスライドは、Ｖ−Ｖころがり案内の場合と同様に、高い真直度を有している。また、その位置決めも高精度にできる。このために、変位計走査コラム６に搭載された上記第１の変位計３７、第２の変位計３８および第３の変位計３９は、後述するように、ほぼ垂直面内を走査するようになる。   Here, the said air slide has high straightness similarly to the case of VV rolling guidance. Further, the positioning can be performed with high accuracy. For this purpose, the first displacement meter 37, the second displacement meter 38 and the third displacement meter 39 mounted on the displacement meter scanning column 6 scan substantially in the vertical plane, as will be described later. Become.

基板形状測定装置１の形状測定制御部７は、上述したようなＶ−Ｖころがり案内による変位計走査コラム６のＺ軸駆動機構、エアスライド案内による第１のスライダ３０のＹ軸駆動機構および第２のスライダ３３のＹ軸駆動機構を、それぞれ所定のシーケンスにしたがって駆動するように制御する。ここで、上記Ｚ軸駆動機構および上記２つのＹ軸駆動機構の駆動部は、ステッピングモータ、ＤＣサーボモータあるいはＡＣサーボモータ等を有している。
また、形状測定制御部７は、基板保持機構５の横桁２２ｂの上下動の制御、基板下部支持台５ａ、５ｂおよび基板上部支持台５ｃの位置制御、等を行い、被測定基板Ｐの垂直状態の調整を行う。これ等の形状測定制御部７の制御動作は、上述したようにコンピュータ３からの指令信号によってなされる。 The shape measurement control unit 7 of the substrate shape measuring apparatus 1 includes a Z-axis drive mechanism of the displacement meter scanning column 6 using the VV rolling guide as described above, a Y-axis drive mechanism of the first slider 30 using the air slide guide, The Y-axis drive mechanism of the second slider 33 is controlled to be driven according to a predetermined sequence. Here, the drive units of the Z-axis drive mechanism and the two Y-axis drive mechanisms have a stepping motor, a DC servo motor, an AC servo motor, or the like.
The shape measurement control unit 7 controls the vertical movement of the cross beam 22b of the substrate holding mechanism 5, controls the positions of the substrate lower support bases 5a and 5b, and the substrate upper support base 5c, etc. Adjust the state. These control operations of the shape measurement control unit 7 are performed by a command signal from the computer 3 as described above.

上記基板形状測定装置１の測定時における操作および動作は次のようになされる。図２において、被測定基板Ｐとして、例えば高さ１６５０ｍｍ（Ｈ）、幅１８５０ｍｍ（Ｗ）、板厚２０ｍｍの合成石英ガラス基板を基板保持機構５に装着する。ここで、被測定基板Ｐは、その下端縁を基板下部支持台５ａ、５ｂの所定の位置止めにのせて、その上端縁を基板上部支持台５ｃにおける所定の位置止めに当接させて、ほぼ垂直になるように立てかけられる。そして、形状測定制御部７からの制御信号に基づくサーボモータ駆動により上記横桁２２ｂを垂直下降させ、基板下部支持台５ａ、５ｂの二点と基板上部支持台５ｃの一点とにより、被測定基板Ｐは基板保持機構５に固定保持される。
そして、基板支持台（５ａ、５ｂ、５ｃ）の位置制御を行うことにより、被測定基板Ｐは、縦型定盤４の基準平面４ａと同様にほぼ垂直状態にされ、上記基準平面４ａとほぼ平行になるようにアライメント配置される。 Operations and operations during measurement of the substrate shape measuring apparatus 1 are performed as follows. In FIG. 2, a synthetic quartz glass substrate having a height of 1650 mm (H), a width of 1850 mm (W), and a plate thickness of 20 mm is mounted on the substrate holding mechanism 5 as the substrate to be measured P, for example. Here, the substrate to be measured P has its lower end edge placed on a predetermined position stop of the substrate lower support bases 5a and 5b, and its upper end edge is brought into contact with a predetermined position stop on the substrate upper support base 5c. Protruded to be vertical. Then, the horizontal girder 22b is vertically lowered by a servo motor drive based on a control signal from the shape measurement control unit 7, and a substrate to be measured is formed by two points of the substrate lower support 5a and 5b and one point of the substrate upper support 5c. P is fixedly held by the substrate holding mechanism 5.
Then, by controlling the position of the substrate support (5a, 5b, 5c), the substrate P to be measured is brought into a substantially vertical state like the reference plane 4a of the vertical surface plate 4, and is substantially the same as the reference plane 4a. The alignment is arranged to be parallel.

そして、図２，３に示すように、上述した変位計走査コラム６は、その第１のエアスライド２５と第２のエアスライド２６の間に上記基板保持機構５を挟んだまま、一対のＶ溝２３に沿ってＺ軸方向（水平軸方向）に一定速度で直線運動する。また、それと共に、第１のスライダ３０および第２のスライダ３３を、それぞれ案内レール２７，３１に沿ってＹ軸方向（垂直軸方向）に一定速度で直線運動させる。また、第１のスライダ３０および第２のスライダ３３は互いに独立に直線運動してもよいし、同期した直線運動になるようにしてもよい。   As shown in FIGS. 2 and 3, the displacement meter scanning column 6 described above has a pair of Vs while the substrate holding mechanism 5 is sandwiched between the first air slide 25 and the second air slide 26. A linear motion is made along the groove 23 in the Z-axis direction (horizontal axis direction) at a constant speed. At the same time, the first slider 30 and the second slider 33 are linearly moved at a constant speed in the Y-axis direction (vertical axis direction) along the guide rails 27 and 31, respectively. Further, the first slider 30 and the second slider 33 may be linearly moved independently of each other or may be synchronized with each other.

ここで、上記Ｚ軸方向およびＹ軸方向の移動制御は、コンピュータ３により入力したプログラムに基づく形状測定制御部７からの制御信号を通し、変位計走査コラム６のＺ軸駆動機構、第１のスライダ３０のＹ軸駆動機構および第２のスライダ３３のＹ軸駆動機構を制御することによって行われる。そして、このＺ軸方向およびＹ軸方向により構成されるほぼ垂直面内において走査移動する、上記第１のスライダ３０および第２のスライダ３３に取り付けた第１の変位計３７、第２の変位計３８および第３の変位計３９による後述するような縦型定盤４の基準平面４ａからの図３に示すＸ軸方向の距離の計測を通して、被測定基板Ｐ全面に亘りその両面における表面形状および板厚分布を測定する。   Here, the movement control in the Z-axis direction and the Y-axis direction is performed by passing a control signal from the shape measurement control unit 7 based on the program input by the computer 3, the Z-axis drive mechanism of the displacement meter scanning column 6, This is performed by controlling the Y-axis drive mechanism of the slider 30 and the Y-axis drive mechanism of the second slider 33. Then, the first displacement meter 37 and the second displacement meter attached to the first slider 30 and the second slider 33 are scanned and moved in a substantially vertical plane constituted by the Z-axis direction and the Y-axis direction. Through the measurement of the distance in the X-axis direction shown in FIG. 3 from the reference plane 4a of the vertical surface plate 4 as will be described later by the 38 and the third displacement meter 39, the surface shape on both sides of the substrate P to be measured and Measure plate thickness distribution.

次に、基板の両面形状測定方法について図４、図５を参照して説明する。ここで、図２および図３で説明したのと同一または類似の部分には共通の符号を付している。
図４は、例えば上述した第１のスライダ３０に互いに一体に取り付けられた一対の第１の変位計３７と第２の変位計３８、および第２のスライダ３３に取り付けられた第３の変位計３９によって、板面がほぼ垂直状態に設定された被測定基板Ｐの両面の表面形状を測定する実施形態の主要部を示している。ここで、第１の変位計３７は非接触レーザ変位計であり、これは第１のスライダ３７において縦型定盤４に対向し、縦型定盤４の基準平面４ａとの距離Ｌ１を測定する。また、第２の変位計３８も非接触レーザ変位計であり、第１のスライダ３０において被測定基板Ｐの第１の板面Ｓ１（例えば表面）に対向し、被測定基板Ｐの第１の板面Ｓ１との距離Ｌ２を測定する。そして、第３の変位計３９は非接触レーザ変位計であり、第２のスライダ３３において被測定基板Ｐの第２の板面Ｓ２（例えば裏面）に対向し、被測定基板Ｐの第２の板面Ｓ２との距離Ｌ３を測定する。 Next, a method for measuring the shape of both sides of the substrate will be described with reference to FIGS. Here, the same or similar parts as those described in FIG. 2 and FIG.
FIG. 4 shows, for example, a pair of a first displacement meter 37 and a second displacement meter 38 that are integrally attached to the first slider 30 described above, and a third displacement meter attached to the second slider 33. 39 shows a main part of the embodiment for measuring the surface shapes of both surfaces of the substrate to be measured P whose plate surface is set in a substantially vertical state. Here, the first displacement gauge 37 is a non-contact laser displacement meter, which is opposed to the vertical plate 4 in the first slider 37, the distance L 1 between the reference plane 4a of the vertical plate 4 taking measurement. The second displacement meter 38 is also a non-contact laser displacement meter, and faces the first plate surface S1 (for example, the surface) of the substrate to be measured P in the first slider 30, and the first displacement of the substrate to be measured P is measured. measuring the distance L 2 between the plate surface S1. The third displacement meter 39 is a non-contact laser displacement meter, and faces the second plate surface S2 (for example, the back surface) of the substrate to be measured P in the second slider 33, so that the second displacement of the substrate to be measured P is second. measuring a distance L 3 between the plate surface S2.

そして、第１の変位計３７および第２の変位計３８を、基準平面４ａにおけるＹ軸方向およびＺ軸方向により構成されるところのほぼ垂直面内を走査し、被測定基板Ｐの第１の板面Ｓ１の各部における上記距離ＬＩおよびＬ２を計測していく。同時に、第３の変位計３９を上記第１の変位計３７および第２の変位計３８に同期して走査し、被測定基板Ｐの第２の板面Ｓ２の各部における上記距離Ｌ３を計測する。そして、被測定基板Ｐの各部における上記距離データはコンピュータ３において蓄積される。 Then, the first displacement meter 37 and the second displacement meter 38 are scanned in a substantially vertical plane constituted by the Y-axis direction and the Z-axis direction on the reference plane 4a, and the first substrate of the substrate P to be measured P is scanned. The distances L I and L 2 at each part of the plate surface S1 are measured. At the same time, the third displacement gauge 39 scans in synchronism with the first displacement gauge 37 and the second displacement gauge 38, measured the distance L 3 in each part of the second plate surface S2 of the measured substrate P To do. Then, the distance data in each part of the measured substrate P is accumulated in the computer 3.

図４において、第１および第２の変位計３７，３８は、共に第１のスライダ３０に一体に搭載されており、したがって上記変位計間の距離Ｌ０は一定となる。このために、図４に示す状態において、縦型定盤４の基準平面４ａと、被測定基板Ｐの第１の板面Ｓ１の各部との距離をＲ１とすると、距離をＲ１は、Ｒ１＝Ｌ０＋Ｌ１＋Ｌ２の計算により求めることができる。このようにして、図５に示すように、縦型定盤４の基準平面４ａを基準面にして距離Ｒ１を計測／算出し、この距離Ｒ１データはコンピュータ３に蓄積される。そして、被測定基板Ｐの第１の板面Ｓ１の表面形状、平坦度が算出される。 4, the first and second displacement gauges 37, 38 are mounted integrally together with the first slider 30, thus the distance L 0 between the displacement gauge is constant. Therefore, in the state shown in FIG. 4, the reference plane 4a of the vertical plate 4, and the distance between the respective portions of the first plate surface S1 of the measured substrate P and R 1, distance R 1 is It can be obtained by calculating R 1 = L 0 + L 1 + L 2 . In this way, as shown in FIG. 5, the distance R 1 is measured / calculated using the reference plane 4 a of the vertical surface plate 4 as the reference plane, and this distance R 1 data is stored in the computer 3. Then, the surface shape and flatness of the first plate surface S1 of the substrate to be measured P are calculated.

図４において、縦型定盤４の基準平面４ａから第３の変位計３９までの距離Ａ０は、基板の両面測定装置の機械構造により決まっている。このため、この距離Ａ０を初めに全面に亘り一度計測しておき、それ以降の基板の両面測定においては上記距離Ａ０値をそのまま使用する。そして、基準平面４ａからの上記距離Ａ０のなす基準面は、図５に示したような仮想基準面ＳＰを構成する。
そして、上記距離Ａ０データおよび距離Ｌ３データから、図５に示すように、Ｒ２＝Ａ０−Ｌ３として、縦型定盤４の基準平面４ａを基準面にした距離Ｒ２の計測／算出をし、この距離Ｒ２データはコンピュータ３に蓄積される。そして、被測定基板Ｐの第２の板面Ｓ２の表面形状、平坦度が算出される。
更に、図５において、被測定基板Ｐの板厚ｔは、ｔ＝Ａ０−Ｌ３−Ｒ１＝Ｒ２−Ｒ１の計算により求めることができる。そして、被測定基板Ｐにおける板厚ｔの分布を算出し、板厚ｔのデータはコンピュータ３に蓄積される。 4, the distance A 0 of the reference plane 4a to the third displacement gauge 39 of the vertical plate 4 is determined by the mechanical structure of the double-sided measuring device of the substrate. Therefore, this distance leave once measured over the entire surface initially A 0, it uses the distance A 0 value in its both surfaces subsequent measurements of the substrate. Then, eggplant reference surface of the distance A 0 of the reference plane 4a constitutes the virtual reference plane SP as shown in FIG.
Then, from the distance A 0 data and the distance L 3 data, as shown in FIG. 5, R 2 = A 0 -L 3 and measurement of the distance R 2 using the reference plane 4a of the vertical surface plate 4 as the reference plane. This distance R 2 data is stored in the computer 3. Then, the surface shape and flatness of the second plate surface S2 of the substrate to be measured P are calculated.
Further, in FIG. 5, the thickness t of the substrate P to be measured can be obtained by calculation of t = A 0 −L 3 −R 1 = R 2 −R 1 . Then, the distribution of the plate thickness t on the measured substrate P is calculated, and the plate thickness t data is stored in the computer 3.

図４で説明した基板の両面形状測定方法は、第１の変位計３７および第２の変位計３８と第３の変位計３９の走査を同期させるものであった。この両面形状測定では、上記第３の変位計３９の走査を第１の変位計３７および第２の変位計３８の走査と非同期に行ってもよい。この場合、第１の変位計３７および第２の変位計３８の走査と距離計測により、図５に示したように被測定基板Ｐの第１の板面Ｓ１の縦型定盤４の基準平面４ａからの距離Ｒ１の分布を求める。同様にして、第３の変位計３９の走査と距離計測により、図５に示したように被測定基板Ｐの第２の板面Ｓ２の縦型定盤４の基準平面４ａからの距離Ｒ２の分布を求める。 The method for measuring the shape of both sides of the substrate described with reference to FIG. 4 synchronizes the scanning of the first displacement meter 37, the second displacement meter 38, and the third displacement meter 39. In this double-sided shape measurement, the scanning of the third displacement meter 39 may be performed asynchronously with the scanning of the first displacement meter 37 and the second displacement meter 38. In this case, the reference plane of the vertical surface plate 4 on the first plate surface S1 of the substrate P to be measured is obtained by scanning the first displacement meter 37 and the second displacement meter 38 and measuring the distance, as shown in FIG. obtaining the distribution of the distance R 1 from 4a. Similarly, the distance R 2 from the reference plane 4a of the vertical surface plate 4 of the second plate surface S2 of the measured substrate P as shown in FIG. 5 by the scanning and distance measurement of the third displacement meter 39. Find the distribution of.

次に、基板の両面形状測定システムを構成する基板ハンドリング・ロボット２を用いた被測定基板Ｐの着脱動作について図６，７，８を参照して説明する。図６は上記システムにおける主要な制御系統を示す図である。そして、図７は基板ハンドリング・ロボット２を用いた被測定基板Ｐの着脱を説明するための動作説明図である。また、図８は基板形状測定装置１の基板保持機構５に被測定基板Ｐを装着する動作説明図である。ここで、互いに同一または類似の部分には共通の符号を付している。   Next, the attaching / detaching operation of the substrate to be measured P using the substrate handling robot 2 constituting the double-sided shape measuring system of the substrate will be described with reference to FIGS. FIG. 6 is a diagram showing a main control system in the system. FIG. 7 is an operation explanatory diagram for explaining attachment / detachment of the substrate P to be measured using the substrate handling robot 2. FIG. 8 is an operation explanatory diagram for mounting the substrate to be measured P on the substrate holding mechanism 5 of the substrate shape measuring apparatus 1. Here, the same or similar parts are denoted by common reference numerals.

図６に示すように、中央制御部であるコンピュータ３が、基板形状測定装置１の形状測定制御部７および基板ハンドリング・ロボット２の基板ハンドリング制御部１２を一括制御する構成になっている。これ等の制御は、コンピュータ３と形状測定制御部７と基板ハンドリング制御部１２を、例えばイーサネット（登録商標）に接続して行うと好適である。
形状測定制御部７は、コンピュータ３からの指令に従って、上述したように、被測定基板Ｐの表面形状を測定する場合に、制御対象である基板保持機構５と変位計走査コラム６の上述したような制御を行い、被測定基板Ｐの着脱の際には、基板保持機構５における基板支持台（５ａ、５ｂ、５ｃ）および保持部材２２の横桁２２ｂの上下動の制御を行う。
基板ハンドリング制御部１２は、コンピュータ３からの指令に従って、被測定基板Ｐの着脱の際に、制御対象である後述するロボット位置決め機構とロボットハンド作動機構の制御を行う。
更に、図６に示したように、上記形状測定制御部７および基板ハンドリング制御部１２は、コンピュータ３を介さないで、例えば上記イーサネット（登録商標）を通した通信手段により直接に双方通信するようにもなっている。 As shown in FIG. 6, the computer 3 as a central control unit is configured to collectively control the shape measurement control unit 7 of the substrate shape measuring apparatus 1 and the substrate handling control unit 12 of the substrate handling / robot 2. These controls are preferably performed by connecting the computer 3, the shape measurement control unit 7 and the substrate handling control unit 12 to, for example, Ethernet (registered trademark).
As described above, when the shape measurement control unit 7 measures the surface shape of the substrate P to be measured in accordance with a command from the computer 3, as described above, the substrate holding mechanism 5 and the displacement meter scanning column 6 that are controlled objects. When the substrate to be measured P is attached or detached, the vertical movement of the substrate support bases (5a, 5b, 5c) and the cross beam 22b of the holding member 22 is controlled.
The substrate handling control unit 12 controls a robot positioning mechanism and a robot hand operating mechanism, which will be described later, as control targets when the substrate to be measured P is attached / detached in accordance with a command from the computer 3.
Further, as shown in FIG. 6, the shape measurement control unit 7 and the substrate handling control unit 12 communicate with each other directly by the communication means through the Ethernet (registered trademark), for example, without using the computer 3. It is also.

図７に示すように、被測定基板Ｐの装着の動作では、破線で示した基板ハンドリング・ロボット２は、カセット４０に保管されている中から未測定の被測定基板Ｐを取り出し、その旋回動作と移動動作により基板形状測定装置１まで移送する。ここで、基板ハンドリング・ロボット２の台座１３には、上記ロボット位置決め機構である旋回機構と移動機構（不図示）が具備されており、基板ハンドリング・ロボット２は、このロボット位置決め機構により基板形状測定装置１の前の所定の決められた場所に位置決めされる。
そして、基板ハンドリング・ロボット２のロボット本体１１に内蔵するロボットハンド作動機構により、ロボットハンド９の適切な動作が行われる。このロボットハンド９の動作により、その上の支持部材１４の基板把持用ツメ１５で垂直状態にクランプされた被測定基板Ｐが、基板表面測定装置１の基板保持機構５の基板支持台（５ａ、５ｂ、５ｃ）に装着される。 As shown in FIG. 7, in the operation of mounting the measured substrate P, the substrate handling robot 2 indicated by the broken line takes out the unmeasured measured substrate P from the one stored in the cassette 40 and rotates the substrate. Then, it is transferred to the substrate shape measuring apparatus 1 by the moving operation. Here, the base 13 of the substrate handling robot 2 is provided with a turning mechanism and a moving mechanism (not shown) which are the robot positioning mechanisms, and the substrate handling robot 2 measures the substrate shape by the robot positioning mechanism. It is positioned at a predetermined fixed location in front of the device 1.
Then, an appropriate operation of the robot hand 9 is performed by the robot hand operating mechanism built in the robot body 11 of the substrate handling robot 2. By the operation of the robot hand 9, the substrate to be measured P clamped in the vertical state by the substrate gripping claws 15 of the support member 14 thereon is moved to the substrate support (5 a, substrate support mechanism 5 of the substrate surface measuring apparatus 1). 5b, 5c).

上記被測定基板Ｐの装着において、図８に示すように、初めロボットハンド９およびその上の支持部材１４は垂直状態から少し傾斜した姿勢制御がとられるとよい。そして、ロボットハンド作動機構により基板保持機構５の正面の所定位置のところで、ロボットハンド９およびその上の支持部材１４を垂直状態の姿勢に制御し、基板把持用ツメ１５が被測定基板Ｐを垂直状態にクランプする。そして、基板保持機構５の横桁２２ｂの上昇状態において、ロボットハンド作動機構は、基板保持機構５に取り付けた位置センサ（不図示）を通した誘導によりロボットハンド９を所定位置までガイド溝８に挿入する。
なお、上記傾斜した姿勢制御は必ずしもしなくてよく、初めから支持部材１４を垂直状態にしても構わない。但し、この場合は、基板把持用ツメ１５による被測定基板Ｐのクランプを確実にし、被測定基板Ｐの脱落が生じないようにする。 In the mounting of the substrate to be measured P, as shown in FIG. 8, it is preferable that the robot hand 9 and the support member 14 on the robot be initially controlled to be slightly inclined from the vertical state. The robot hand actuating mechanism controls the robot hand 9 and the support member 14 thereon in a vertical position at a predetermined position in front of the substrate holding mechanism 5, and the substrate gripping claw 15 vertically moves the substrate P to be measured. Clamp to the state. When the cross beam 22b of the substrate holding mechanism 5 is raised, the robot hand operating mechanism moves the robot hand 9 to the guide groove 8 to a predetermined position by guidance through a position sensor (not shown) attached to the substrate holding mechanism 5. insert.
Note that the tilted posture control is not necessarily performed, and the support member 14 may be in a vertical state from the beginning. However, in this case, the substrate to be measured P is securely clamped by the substrate gripping claws 15 so that the substrate to be measured P does not fall off.

上記ロボットハンド９の挿入において、形状測定制御７と基板ハンドリング制御部１２の間における直接の双方通信を通し、ロボットハンド９およびガイド溝８相互間の迅速で精確な位置決め制御がなされる。そして、基板下部支持台５ａ、５ｂの所定の位置止め４１ａおよび４１ｂに被測定基板Ｐをのせ、形状測定制御部７からの制御信号に基づくサーボモータ駆動により上記横桁２２ｂを垂直下降させて、基板上部支持台５ｃの所定の位置止め４１ｃで被処理基板Ｐの上端縁を押圧する。そして、所定の押圧（例えば１ｋｇ圧力の印加）の時点でサーボモータ駆動を停止し、基板下部支持台５ａ、５ｂの二点と基板上部支持台５ｃの一点とにより、被測定基板Ｐを基板保持機構５に固定保持する。
このようにした後に、ロボットハンド作動機構が基板把持用ツメ１５のクランプを解除しロボットハンド９を基板保持機構５から後退させる。この基板把持用ツメ１５のクランプ解除においても、形状測定制御７と基板ハンドリング制御部１２の間における直接の双方通信がなされ、基板保持機構５による被測定基板Ｐの固定保持とのタイミング制御がなされる。
以上のようにして、大型・重量化した被測定基板Ｐが自動制御の下に簡便に基板保持機構５に装着される。 In the insertion of the robot hand 9, a quick and accurate positioning control between the robot hand 9 and the guide groove 8 is performed through direct two-way communication between the shape measurement control 7 and the substrate handling control unit 12. Then, the substrate to be measured P is placed on the predetermined positioning stoppers 41a and 41b of the substrate lower support bases 5a and 5b, and the horizontal girder 22b is vertically lowered by a servo motor drive based on a control signal from the shape measurement control unit 7, The upper end edge of the substrate to be processed P is pressed by a predetermined positioning stop 41c of the substrate upper support 5c. Then, the servo motor drive is stopped at the time of a predetermined pressure (for example, application of 1 kg pressure), and the substrate to be measured P is held by the two points of the lower substrate support 5a and 5b and one point of the upper substrate support 5c. The mechanism 5 is fixedly held.
After this, the robot hand operating mechanism releases the clamp of the substrate gripping claw 15 and retracts the robot hand 9 from the substrate holding mechanism 5. In releasing the clamp of the substrate gripping claw 15, both direct communication is performed between the shape measurement control 7 and the substrate handling control unit 12, and timing control is performed with respect to the fixed holding of the substrate P to be measured by the substrate holding mechanism 5. The
As described above, the large and heavy substrate P to be measured is easily mounted on the substrate holding mechanism 5 under automatic control.

また、その説明は省略するが、基板形状測定装置１により測定された被測定基板Ｐは、上記装着と全く逆過程を経て基板保持機構５から取り外される。そして、基板把持用ツメ１５によりクランプされた測定済みの被測定基板Ｐは、基板ハンドリング・ロボット２により移送され、測定済み用の別のカセットに格納される。   Further, although description thereof is omitted, the measurement target substrate P measured by the substrate shape measuring apparatus 1 is removed from the substrate holding mechanism 5 through a process completely opposite to the above mounting. Then, the measured substrate P to be measured clamped by the substrate gripping claw 15 is transferred by the substrate handling robot 2 and stored in another cassette for measurement.

上記実施形態における基板の両面形状測定システムを構成する基板形状測定装置１は、ベッド２１上の一端部にほぼ垂直状態に配置した縦型定盤４の基準平面４ａと、それにほぼ平行に被測定基板Ｐを保持する基板保持機構５と、変位計走査コラム６とを有する。ここで、変位計走査コラム６は、第１の変位計３７と第２の変位計３８が搭載された第１のエアスライド２５、第３の変位計３９が搭載された第２のエアスライド２６および一対の支柱３６を一体構造になるように備えており、上記ベッド２１上において一対のＶ溝２３に沿って上記基準平面４ａにおける水平軸方向に移動できるようになっている。また、変位計走査コラム６上において第１のエアスライド２５および第２のエアスライド２６は上記基準平面４ａにおける垂直軸方向に移動するようになっている。
このために、変位計走査コラム６の水平軸方向の直線運動において非常に高い真直度と位置決め精度が得られるようになる。同様に、第１のエアスライド２５および第２のエアスライド２６の垂直軸方向の直線運動において非常に高い真直度と高い位置決め精度が得られるようになる。
そして、これに伴い、上記第１のエアスライド２５に搭載した第１の変位計３７と第２の変位計３８および第２のエアスライド２６に搭載した第３の変位計３９は、上記基準平面４ａに対して高精度で正確な走査が可能になる。
そして、第１の変位計３７と第２の変位計３８により、上記縦型定盤４の基準平面４ａを基準面とし被測定基板Ｐの板面の一面の表面形状を精密に測定することができる。同時に、第３の変位計３９により、上記基準平面４ａを基準面とし被測定基板Ｐの板面の他面の表面形状を精密に測定することができる。そして、これ等の表面形状の測定精度は１μｍ以下になる。 The substrate shape measuring apparatus 1 that constitutes the double-sided shape measuring system for a substrate in the above embodiment includes a reference plane 4a of a vertical surface plate 4 arranged in a substantially vertical state at one end on a bed 21, and a measurement target substantially parallel to the reference plane 4a. A substrate holding mechanism 5 for holding the substrate P and a displacement meter scanning column 6 are provided. Here, the displacement meter scanning column 6 includes a first air slide 25 on which a first displacement meter 37 and a second displacement meter 38 are mounted, and a second air slide 26 on which a third displacement meter 39 is mounted. A pair of support columns 36 are provided so as to be integrated, and can be moved in the horizontal axis direction on the reference plane 4a along the pair of V grooves 23 on the bed 21. On the displacement meter scanning column 6, the first air slide 25 and the second air slide 26 move in the vertical axis direction on the reference plane 4a.
For this reason, very high straightness and positioning accuracy can be obtained in the linear motion of the displacement meter scanning column 6 in the horizontal axis direction. Similarly, very high straightness and high positioning accuracy can be obtained in the linear motion of the first air slide 25 and the second air slide 26 in the vertical axis direction.
Along with this, the first displacement meter 37, the second displacement meter 38 and the third displacement meter 39 mounted on the second air slide 26 are mounted on the reference plane. 4a can be scanned with high accuracy and accuracy.
Then, by using the first displacement meter 37 and the second displacement meter 38, the surface shape of one surface of the substrate P to be measured can be accurately measured using the reference plane 4a of the vertical surface plate 4 as a reference plane. it can. At the same time, the third displacement meter 39 can measure the surface shape of the other surface of the substrate P to be measured with the reference plane 4a as a reference plane. And the measurement accuracy of these surface shapes will be 1 micrometer or less.

また、上記実施形態における基板の両面形状測定システムを構成する基板ハンドリング・ロボット２は、上記基板形状測定装置１に対する大型・重量化した被測定基板Ｐの着脱と、大型・重量化した被測定基板Ｐの移送を自動的に行う。   Further, the substrate handling robot 2 constituting the double-sided shape measurement system for a substrate in the above embodiment includes the attachment and detachment of the large and heavy measured substrate P to the substrate shape measuring apparatus 1 and the large and heavy measured substrate. P is automatically transferred.

そして、上記実施形態における基板の両面形状測定システムを構成するコンピュータ３は、上記基板形状測定装置１と基板ハンドリング・ロボット２を一括制御する。また、上記基板ハンドリング・ロボット２による大型・重量化した被測定基板Ｐの着脱においては、基板形状測定装置１に備えられた形状測定制御部７と基板ハンドリング・ロボット２に備えられた基板ハンドリング制御部１２間で直接の双方通信が行われる。これにより、上記被測定基板Ｐの迅速で精確な装着とその極めて安全な取り外しとが可能になる。   And the computer 3 which comprises the board | substrate double-sided shape measuring system in the said embodiment controls the said board | substrate shape measuring apparatus 1 and the board | substrate handling robot 2 collectively. In addition, when the substrate handling robot 2 attaches / detaches the large and heavy substrate P to be measured, the shape measurement control unit 7 provided in the substrate shape measuring apparatus 1 and the substrate handling control provided in the substrate handling robot 2. Direct two-way communication is performed between the units 12. As a result, the substrate to be measured P can be quickly and accurately mounted and removed very safely.

このように、上記実施形態における基板の両面形状測定システムは、大型・重量化した基板である例えば液晶用フォトマスクのような被測定基板Ｐの両面形状を、作業性に優れ簡便で高精度に測定することができる。そして、基板の両面形状が重要な要素となる被測定基板においても、その表面および裏面の両面形状を簡便に測定することができ、基板の両面の平坦度を短時間で高精度に測定することができる。   As described above, the double-sided shape measurement system for a substrate in the above embodiment has a large and heavy substrate, for example, a double-sided shape of a substrate P to be measured such as a photomask for liquid crystal. Can be measured. And even on the substrate to be measured where the double-sided shape of the substrate is an important element, the double-sided shape of the front and back surfaces can be easily measured, and the flatness of both sides of the substrate can be measured with high accuracy in a short time Can do.

本発明は、上記実施形態に限定されるものでなく、発明の趣旨を逸脱しない範囲でいろいろの変形を採ることができる。例えば、被測定基板Ｐをロボットハンド９に載置し支持部材１４の基板把持用ツメ１５にクランプする代わりに、被測定基板Ｐの縁端部を吸着パッドに真空吸着させる構成であってもよい。
また、ベッド２１上において、縦型定盤４の基準平面４ａにおける水平軸方向に移動する構造の変位計走査コラム６は、Ｖ−Ｖすべり案内により移動できる構成になっていてもよい。
また、テーブル２４上に設けられる第１のエアスライド２５と第２のエアスライド２６はリニアモータにより垂直軸方向に移動できる構成になっていてもよい。
また、被測定基板Ｐの平坦度あるいはその板厚を含む表面形状の算出は、上記実施形態のようなコンピュータ３の他にも形状測定制御部７で行える構成にしてもよい。
また、本発明では、被処理基板Ｐの縦横寸法は自在に変更でき、その最小寸法が１００ｍｍ×３００ｍｍまで可能となるようにすることもできる。そして、上記液晶用石英ガラス製フォトマスク以外にも、基板の両面形状が重要な要素となる被測定基板には同様に適用できるものである。例えば、被処理基板として半導体ウェーハの両面形状測定においても効果的に適用できる。
また、上記変位計としては、他にエアースケールセンサ方式、渦電流方式あるいは静電容量方式等も知られており、これ等は被測定基板を構成する物質に応じて適宜選択することができる。 The present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the invention. For example, instead of placing the substrate to be measured P on the robot hand 9 and clamping it to the substrate gripping claw 15 of the support member 14, the edge of the substrate to be measured P may be vacuum-sucked to the suction pad. .
Further, the displacement meter scanning column 6 structured to move in the horizontal axis direction on the reference plane 4a of the vertical surface plate 4 on the bed 21 may be configured to be movable by VV sliding guide.
Further, the first air slide 25 and the second air slide 26 provided on the table 24 may be configured to be movable in the vertical axis direction by a linear motor.
Further, the surface shape including the flatness or thickness of the substrate to be measured P may be calculated by the shape measurement control unit 7 in addition to the computer 3 as in the above embodiment.
In the present invention, the vertical and horizontal dimensions of the substrate to be processed P can be freely changed, and the minimum dimension can be up to 100 mm × 300 mm. In addition to the quartz glass photomask for liquid crystal, the present invention can be similarly applied to a substrate to be measured in which the double-sided shape of the substrate is an important factor. For example, the present invention can be effectively applied to measurement of both-side shapes of a semiconductor wafer as a substrate to be processed.
As the displacement meter, an air scale sensor method, an eddy current method, a capacitance method, or the like is also known, and these can be appropriately selected depending on the substance constituting the substrate to be measured.

本発明にかかる基板の両面形状測定システムを示す構成図。The block diagram which shows the double-sided shape measurement system of the board | substrate concerning this invention. 同システムを構成する基板形状測定装置の斜視図。The perspective view of the board | substrate shape measuring apparatus which comprises the system. 図２に示した基板形状測定装置の変位計走査部を示す斜視図。The perspective view which shows the displacement meter scanning part of the board | substrate shape measuring apparatus shown in FIG. 被測定基板の両面形状を測定する主要部を示した模式図。The schematic diagram which showed the principal part which measures the double-sided shape of a to-be-measured substrate. 被測定基板の両面形状測定および板厚測定を示す模式図。The schematic diagram which shows the double-sided shape measurement and board thickness measurement of a to-be-measured board | substrate. 本発明にかかる基板の両面形状測定システムの制御系統図。The control system figure of the double-sided shape measurement system of the board | substrate concerning this invention. 本発明にかかる基板の両面形状測定システムにおける基板ハンドリング・ロボットを用いた被測定基板の着脱を説明するための動作説明図。FIG. 5 is an operation explanatory view for explaining attachment / detachment of a substrate to be measured using a substrate handling robot in the double-sided shape measurement system for substrates according to the present invention. 本発明にかかる基板の両面形状測定システムにおける基板形状測定装置への被測定基板の装着を示す動作説明図。Operation | movement explanatory drawing which shows mounting | wearing of the to-be-measured board | substrate to the board | substrate shape measuring apparatus in the double-sided shape measuring system of the board | substrate concerning this invention. フォトマスクに露光した場合の光路を説明するための模式図。The schematic diagram for demonstrating the optical path at the time of exposing to a photomask.

符号の説明Explanation of symbols

１ 基板形状測定装置
２ 基板ハンドリング・ロボット
３ コンピュータ
４ 縦型定盤
４ａ 基準平面
５ 基板保持機構
５ａ、５ｂ 基板下部支持台
５ｃ 基板上部支持台
６ 変位計走査コラム
７ 形状測定制御部
８（８ａ、８ｂ） ガイド溝
９（９ａ、９ｂ） ロボットハンド
１０ ロボットアーム
１１ ロボット本体
１２ 基板ハンドリング制御部
１３ 台座
１４ 支持部材
１５ 基板把持用ツメ
１６ ケーブル
１７ ディスプレイ
１８ プリンタ
２１ ベッド
２２ 保持部材
２２ａ 側柱
２２ｂ 横桁
２２ｃ モータ
２３ Ｖ溝
２４ テーブル
２５ 第１のエアスライド
２６ 第２のエアスライド
２７，３１ 案内レール
２８，３２ ボールネジ
２９ 固定板
３０ 第１のスライダ
３３ 第２のスライダ
３４，３５ ナット
３６ 支柱
３７ 第１の変位計
３８ 第２の変位計
３９ 第３の変位計
４０ カセット
４１ａ、４１ｂ、４１ｃ 位置止め DESCRIPTION OF SYMBOLS 1 Substrate shape measuring apparatus 2 Substrate handling robot 3 Computer 4 Vertical surface plate 4a Reference plane 5 Substrate holding mechanism 5a, 5b Substrate lower support stand 5c Substrate upper support stand 6 Displacement meter scanning column 7 Shape measurement control unit 8 (8a, 8b) Guide groove 9 (9a, 9b) Robot hand 10 Robot arm 11 Robot body 12 Substrate handling control unit 13 Base 14 Support member 15 Claw for holding substrate 16 Cable 17 Display 18 Printer 21 Bed 22 Holding member 22a Side pillar 22b Horizontal girder 22c motor 23 V-groove 24 table 25 first air slide 26 second air slide 27, 31 guide rail 28, 32 ball screw 29 fixing plate 30 first slider 33 second slider 34, 35 nut 36 post 37 first The displacement gauge 38 Displacement meter 39 third displacement meter 40 cassettes 41a, 41b, 41c position stop of

Claims (8)

定盤の基準平面がほぼ垂直状態となるように配置された定盤と、被測定基板の板面が前記基準平面にほぼ平行になるように被測定基板を保持する保持機構と、前記定盤の基準平面と、前記保持機構によって保持された前記被測定基板の板面の一面との間に配置され、垂直面内において走査可能であり前記走査と共に前記定盤の基準平面との距離を測定する第１の変位計および前記被測定基板の板面の一面との距離を測定する第２の変位計と、前記板面の一面に対向する他面側に配置され、垂直面内において走査可能であり前記走査と共に前記板面の他面との距離を測定する第３の変位計と、を備えた基板形状測定装置と、
前記基板形状測定装置の前記保持機構への被測定基板の装着および前記保持機構からの前記被測定基板の取り外しを行う基板着脱装置と、
前記基板形状測定装置および前記基板着脱装置の動作を制御する処理制御装置と、
を有することを特徴とする基板の両面形状測定システム。 A surface plate arranged so that a reference plane of the surface plate is substantially vertical, a holding mechanism for holding the substrate to be measured so that a plate surface of the substrate to be measured is substantially parallel to the reference plane, and the surface plate Between the reference plane of the surface plate and one surface of the plate surface of the substrate to be measured held by the holding mechanism, can be scanned in a vertical plane, and measures the distance from the reference plane of the surface plate together with the scanning. The first displacement meter to be measured and the second displacement meter for measuring the distance from one surface of the plate surface of the substrate to be measured are arranged on the other surface side facing the one surface of the plate surface, and can be scanned in a vertical plane. And a third displacement meter for measuring a distance from the other surface of the plate surface together with the scanning, and a substrate shape measuring device comprising:
A substrate attaching / detaching device that attaches the substrate to be measured to the holding mechanism of the substrate shape measuring device and removes the substrate to be measured from the holding mechanism;
A processing control device for controlling operations of the substrate shape measuring device and the substrate attaching / detaching device;
A double-sided shape measurement system for a substrate, comprising: 前記基板着脱装置は、ハンドリング用ロボットのアーム先端に取り付けられたロボットハンドを有し、前記被測定基板を垂直状態にして前記保持機構への被測定基板の装着および前記保持機構からの前記被測定基板の取り外しを行うことを特徴とする請求項１に記載の基板の両面形状測定システム。   The substrate attaching / detaching device has a robot hand attached to the tip of an arm of a handling robot, the substrate to be measured is placed in a vertical state, and the substrate to be measured is mounted on the holding mechanism and the measured from the holding mechanism. The double-sided shape measurement system for a substrate according to claim 1, wherein the substrate is removed. 前記保持機構への被測定基板の装着および前記保持機構からの前記被測定基板の取り外しの操作は、前記基板形状測定装置に内臓の制御部と前記基板着脱装置に内臓の制御部との間の通信手段を通して行われることを特徴とする請求項１又は２に記載の基板の両面形状測定システム。   The operation of mounting the substrate to be measured on the holding mechanism and detaching the substrate to be measured from the holding mechanism is performed between the internal control unit of the substrate shape measuring device and the internal control unit of the substrate attaching / detaching device. 3. The double-sided shape measurement system for a substrate according to claim 1, wherein the measurement is performed through communication means. 前記処理制御装置は、前記基板形状測定装置の前記第１の変位計、第２の変位計および第３の変位計による測定結果に基づいて被測定基板の両面の表面形状を演算する演算手段を備えていることを特徴とする請求項１、２又は３に記載の基板の両面形状測定システム。   The processing control device includes computing means for computing surface shapes of both surfaces of the substrate to be measured based on measurement results obtained by the first displacement meter, the second displacement meter, and the third displacement meter of the substrate shape measuring device. The double-sided shape measurement system for a substrate according to claim 1, 2 or 3, further comprising: 前記基準平面における垂直軸方向に移動可能な第１のＹ軸移動機構に前記第１の変位計と前記第２の変位計とが搭載され、
前記第１のＹ軸移動機構とは独立に前記基準平面における垂直軸方向に移動可能な第２のＹ軸移動機構に前記第３の変位計が搭載され、
前記第１のＹ軸移動機構と前記第２のＹ軸移動機構とが、前記基準平面における水平軸方向に移動可能なＺ軸移動機構に搭載されていることを特徴とする請求項１ないし４のいずれか一項に記載の基板の両面形状測定システム。 The first displacement meter and the second displacement meter are mounted on a first Y-axis movement mechanism that is movable in the vertical axis direction on the reference plane,
The third displacement meter is mounted on a second Y-axis moving mechanism that is movable in the vertical axis direction on the reference plane independently of the first Y-axis moving mechanism,
5. The first Y-axis movement mechanism and the second Y-axis movement mechanism are mounted on a Z-axis movement mechanism that is movable in a horizontal axis direction on the reference plane. The double-sided shape measurement system for a substrate according to any one of the above. 前記第１のＹ軸移動機構および前記第２のＹ軸移動機構がボールねじおよびそれに結合したスライドにより構成されていることを特徴とする請求項５に記載の基板の両面形状測定システム。   6. The double-sided shape measurement system for a substrate according to claim 5, wherein the first Y-axis moving mechanism and the second Y-axis moving mechanism are configured by a ball screw and a slide coupled thereto. 前記Ｚ軸移動機構がＶ−Ｖころがり案内あるいはＶ−Ｖすべり案内により構成されていることを特徴とする請求項５又は６に記載の基板の両面形状測定システム。   7. The double-sided shape measuring system for a substrate according to claim 5, wherein the Z-axis moving mechanism is constituted by a VV rolling guide or a VV sliding guide. 前記第１の変位計、第２の変位計および第３の変位計が非接触レーザ変位計であることを特徴とする請求項１ないし７のいずれか一項に記載の基板の両面形状測定システム。

8. The double-sided shape measurement system for a substrate according to claim 1, wherein the first displacement meter, the second displacement meter, and the third displacement meter are non-contact laser displacement meters. .

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