JP2007053261A5 - - Google Patents

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Publication number
JP2007053261A5
JP2007053261A5 JP2005237860A JP2005237860A JP2007053261A5 JP 2007053261 A5 JP2007053261 A5 JP 2007053261A5 JP 2005237860 A JP2005237860 A JP 2005237860A JP 2005237860 A JP2005237860 A JP 2005237860A JP 2007053261 A5 JP2007053261 A5 JP 2007053261A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005237860A
Other versions
JP2007053261A (ja
JP4920214B2 (ja
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Application filed filed Critical
Priority to JP2005237860A priority Critical patent/JP4920214B2/ja
Priority claimed from JP2005237860A external-priority patent/JP4920214B2/ja
Publication of JP2007053261A publication Critical patent/JP2007053261A/ja
Publication of JP2007053261A5 publication Critical patent/JP2007053261A5/ja
Application granted granted Critical
Publication of JP4920214B2 publication Critical patent/JP4920214B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2005237860A 2005-08-18 2005-08-18 電子部品用パッケージとその製造方法 Expired - Fee Related JP4920214B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005237860A JP4920214B2 (ja) 2005-08-18 2005-08-18 電子部品用パッケージとその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005237860A JP4920214B2 (ja) 2005-08-18 2005-08-18 電子部品用パッケージとその製造方法

Publications (3)

Publication Number Publication Date
JP2007053261A JP2007053261A (ja) 2007-03-01
JP2007053261A5 true JP2007053261A5 (ja) 2008-09-18
JP4920214B2 JP4920214B2 (ja) 2012-04-18

Family

ID=37917499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005237860A Expired - Fee Related JP4920214B2 (ja) 2005-08-18 2005-08-18 電子部品用パッケージとその製造方法

Country Status (1)

Country Link
JP (1) JP4920214B2 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008021435A1 (de) * 2008-04-29 2009-11-19 Schott Ag Gehäuse für LEDs mit hoher Leistung
EP2472680A4 (en) * 2010-01-27 2016-04-27 Mitsubishi Electric Corp SEMICONDUCTOR LASER MODULE
JP6644745B2 (ja) * 2017-08-25 2020-02-12 エーディーワイ株式会社 紫外線光素子、紫外線光素子用パッケージ及び紫外線光素子に用いられる光学部材並びにその光学部材の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0338053A (ja) * 1989-07-05 1991-02-19 Goto Seisakusho:Kk 半導体装置及びその製造方法
JPH04303948A (ja) * 1991-03-30 1992-10-27 Shinko Electric Ind Co Ltd ガラスパッケージ
JP2002100691A (ja) * 2000-09-21 2002-04-05 Kyocera Corp 半導体受光素子収納用容器
JP2005072421A (ja) * 2003-08-27 2005-03-17 Kyocera Corp 電子部品収納用パッケージおよび電子装置

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