JP2007037101A5 - - Google Patents

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JP2007037101A5
JP2007037101A5 JP2006158732A JP2006158732A JP2007037101A5 JP 2007037101 A5 JP2007037101 A5 JP 2007037101A5 JP 2006158732 A JP2006158732 A JP 2006158732A JP 2006158732 A JP2006158732 A JP 2006158732A JP 2007037101 A5 JP2007037101 A5 JP 2007037101A5
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integrated circuit
package
antenna
ofdm
signal
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JP2006158732A
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JP4732959B2 (en
JP2007037101A (en
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Priority claimed from US11/157,286 external-priority patent/US20060285480A1/en
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Claims (16)

第１の直交周波数分割多重（ＯＦＤＭ：ｏｒｔｈｏｇｏｎａｌ ｆｒｅｑｕｅｎｃｙ−ｄｉｖｉｓｉｏｎ ｍｕｌｔｉｐｌｅｘｉｎｇ）信号に基づいて第１のデジタルデータを生成するためのＯＦＤＭデモジュレータ、および、第２のデジタルデータに基づいて第２のＯＦＤＭ信号を生成するためのＯＦＤＭモジュレータを有する無線通信回路を備える少なくとも一つの集積回路と、
前記少なくとも一つの集積回路、および前記第１のＯＦＤＭ信号を受信し、かつ前記第２のＯＦＤＭ信号を送信するためのアンテナに電気的に結合されているパッケージ基板であって、該アンテナが前記無線通信回路に電気的に結合されている、該パッケージ基板と、
を備え、
前記アンテナが、プリント回路板、および前記パッケージ基板を密封するヒートシンク、のうち少なくともいずれか一方内に形成されている集積回路パッケージ。 An OFDM demodulator for generating first digital data based on a first orthogonal frequency-division multiplexing (OFDM) signal, and a second OFDM signal based on the second digital data At least one integrated circuit comprising a wireless communication circuit having an OFDM modulator for generating;
The at least one integrated circuit, and receiving the first OFDM signals, and an antenna on a package substrate are electrically coupled to transmit the second OFDM signals, the antenna is the radio The package substrate electrically coupled to a communication circuit;
Equipped with a,
An integrated circuit package in which the antenna is formed in at least one of a printed circuit board and a heat sink that seals the package substrate . 前記パッケージ基板が、導電性バンプを介して前記少なくとも一つの集積回路の表面に電気的に結合される請求項１に記載の集積回路パッケージ。   The integrated circuit package of claim 1, wherein the package substrate is electrically coupled to a surface of the at least one integrated circuit through conductive bumps. 請求項２の集積回路パッケージを備えるフリップチップボールグリッドアレイパッケージ。 A flip chip ball grid array package comprising the integrated circuit package of claim 2 . 前記少なくとも一つの集積回路が、
メディアアクセスコントローラおよびベースバンド回路を有する第１の集積回路と、
物理層デバイスを有する第２の集積回路と、
を備える請求項１に記載の集積回路パッケージ。 The at least one integrated circuit comprises:
A first integrated circuit having a media access controller and a baseband circuit;
A second integrated circuit having a physical layer device;
The integrated circuit package of claim 1 comprising: 前記無線通信回路が、
前記アンテナによって受信された第１のＲＦ信号に基づいて第１のベースバンド信号を生成するための受信回路と、
第２のベースバンド信号に基づいて第２のＲＦ信号を生成するための送信回路であって、前記第２のＲＦ信号が前記アンテナによって送信される、該送信回路と、
を備える請求項１に記載の集積回路パッケージ。 The wireless communication circuit is
A receiving circuit for generating a first baseband signal based on a first RF signal received by the antenna;
A transmission circuit for generating a second RF signal based on a second baseband signal, wherein the second RF signal is transmitted by the antenna;
The integrated circuit package of claim 1 comprising: 前記第１のベースバンド信号が、第１のデジタルデータを含み、
前記第２のベースバンド信号が、第２のデジタルデータを含む、
請求項５に記載の集積回路パッケージ。 The first baseband signal includes first digital data;
The second baseband signal includes second digital data;
The integrated circuit package according to claim 5. 前記アンテナが、前記第１および第２のＲＦ信号の波長の常分数である長さを有する請求項５に記載の集積回路パッケージ。   6. The integrated circuit package of claim 5, wherein the antenna has a length that is a fraction of the wavelength of the first and second RF signals. 前記無線通信回路が、ＩＥＥＥ規格８０２．１１、８０２．１１ａ、８０２．１１ｂ、８０２．１１ｇ、８０２．１１ｎ、８０２．１６、および８０２．２０から構成されるグループから選択された少なくとも一つの規格に準拠している請求項１に記載の集積回路パッケージ。   The wireless communication circuit conforms to at least one standard selected from the group consisting of IEEE standards 802.11, 802.11a, 802.11b, 802.11g, 802.11n, 802.16, and 802.20. The integrated circuit package of claim 1 that is compliant. 第１の直交周波数分割多重（ＯＦＤＭ：ｏｒｔｈｏｇｏｎａｌ ｆｒｅｑｕｅｎｃｙ−ｄｉｖｉｓｉｏｎ ｍｕｌｔｉｐｌｅｘｉｎｇ）信号に基づいて第１のデジタルデータを生成するためのＯＦＤＭデモジュレータ、および、第２のデジタルデータに基づいて第２のＯＦＤＭ信号を生成するためのＯＦＤＭモジュレータを有する無線通信回路を備える少なくとも一つの集積回路と、
前記第１のＯＦＤＭ信号を受信するための、および前記第２のＯＦＤＭ信号を送信するためのアンテナであって、前記無線通信回路に電気的に結合されている該アンテナを有するケースと、
を備え、
前記アンテナが前記ケース内に形成されている集積回路パッケージ。 An OFDM demodulator for generating first digital data based on a first orthogonal frequency-division multiplexing (OFDM) signal, and a second OFDM signal based on the second digital data At least one integrated circuit comprising a wireless communication circuit having an OFDM modulator for generating;
An antenna for receiving the first OFDM signal and for transmitting the second OFDM signal, the antenna having the antenna electrically coupled to the wireless communication circuit;
Equipped with a,
An integrated circuit package in which the antenna is formed in the case . 導電性バンプを介して前記少なくとも一つの集積回路の表面に電気的に結合されているパッケージ基板を更に備える請求項９に記載の集積回路パッケージ。   The integrated circuit package of claim 9, further comprising a package substrate electrically coupled to a surface of the at least one integrated circuit via conductive bumps. 請求項１０の集積回路パッケージを備えるフリップチップボールグリッドアレイパッケージ。   A flip chip ball grid array package comprising the integrated circuit package of claim 10. 前記少なくとも一つの集積回路が、
メディアアクセスコントローラおよびベースバンド回路を有する第１の集積回路と、
物理層デバイスを有する第２の集積回路と、
を備える請求項９に記載の集積回路パッケージ。 The at least one integrated circuit comprises:
A first integrated circuit having a media access controller and a baseband circuit;
A second integrated circuit having a physical layer device;
An integrated circuit package according to claim 9. 前記無線通信回路が、
前記アンテナによって受信された第１のＲＦ信号に基づいて第１のベースバンド信号を生成するための受信回路と、
第２のベースバンド信号に基づいて第２のＲＦ信号を生成するための送信回路であって、前記第２のＲＦ信号が前記アンテナによって送信される、該送信回路と、
を備える請求項９に記載の集積回路パッケージ。 The wireless communication circuit is
A receiving circuit for generating a first baseband signal based on a first RF signal received by the antenna;
A transmission circuit for generating a second RF signal based on a second baseband signal, wherein the second RF signal is transmitted by the antenna;
An integrated circuit package according to claim 9. 前記第１のベースバンド信号が、第１のデジタルデータを含み、
前記第２のベースバンド信号が、第２のデジタルデータを含む、
請求項１３に記載の集積回路パッケージ。 The first baseband signal includes first digital data;
The second baseband signal includes second digital data;
The integrated circuit package according to claim 13. 前記アンテナが、前記第１および第２のＲＦ信号の波長の常分数である長さを有する請求項１３に記載の集積回路パッケージ。   The integrated circuit package of claim 13, wherein the antenna has a length that is a fraction of the wavelength of the first and second RF signals. 前記無線通信回路が、ＩＥＥＥ規格８０２．１１、８０２．１１ａ、８０２．１１ｂ、８０２．１１ｇ、８０２．１１ｎ、８０２．１６、および８０２．２０から構成されるグループから選択された少なくとも一つの規格に準拠している請求項９に記載の集積回路パッケージ。   The wireless communication circuit conforms to at least one standard selected from the group consisting of IEEE standards 802.11, 802.11a, 802.11b, 802.11g, 802.11n, 802.16, and 802.20. The integrated circuit package of claim 9 that is compliant.
JP2006158732A 2005-06-21 2006-06-07 Wireless local area network communication module and integrated chip package Expired - Fee Related JP4732959B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/157286 2005-06-21
US11/157,286 US20060285480A1 (en) 2005-06-21 2005-06-21 Wireless local area network communications module and integrated chip package

Publications (3)

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JP2007037101A JP2007037101A (en) 2007-02-08
JP2007037101A5 true JP2007037101A5 (en) 2009-07-23
JP4732959B2 JP4732959B2 (en) 2011-07-27

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JP2006158725A Expired - Fee Related JP4660428B2 (en) 2005-06-21 2006-06-07 Wireless local area network communication module and integrated chip package
JP2006158710A Expired - Fee Related JP4728172B2 (en) 2005-06-21 2006-06-07 Wireless local area network communication module and integrated chip package
JP2006158715A Expired - Fee Related JP4704961B2 (en) 2005-06-21 2006-06-07 Wireless local area network communication module and integrated chip package

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JP2006158710A Expired - Fee Related JP4728172B2 (en) 2005-06-21 2006-06-07 Wireless local area network communication module and integrated chip package
JP2006158715A Expired - Fee Related JP4704961B2 (en) 2005-06-21 2006-06-07 Wireless local area network communication module and integrated chip package

Country Status (6)

Country Link
US (1) US20060285480A1 (en)
EP (4) EP1737065B1 (en)
JP (4) JP4732959B2 (en)
CN (4) CN1885804B (en)
SG (4) SG128566A1 (en)
TW (4) TWI495278B (en)

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