JP2007035917A5 - - Google Patents
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- Publication number
- JP2007035917A5 JP2007035917A5 JP2005216923A JP2005216923A JP2007035917A5 JP 2007035917 A5 JP2007035917 A5 JP 2007035917A5 JP 2005216923 A JP2005216923 A JP 2005216923A JP 2005216923 A JP2005216923 A JP 2005216923A JP 2007035917 A5 JP2007035917 A5 JP 2007035917A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing pad
- polishing
- pad according
- grinding
- center line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Claims (5)
5. A polishing machine for polishing a silicon wafer using the polishing pad according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005216923A JP4681970B2 (en) | 2005-07-27 | 2005-07-27 | Polishing pad and polishing machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005216923A JP4681970B2 (en) | 2005-07-27 | 2005-07-27 | Polishing pad and polishing machine |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007035917A JP2007035917A (en) | 2007-02-08 |
JP2007035917A5 true JP2007035917A5 (en) | 2007-04-05 |
JP4681970B2 JP4681970B2 (en) | 2011-05-11 |
Family
ID=37794806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005216923A Active JP4681970B2 (en) | 2005-07-27 | 2005-07-27 | Polishing pad and polishing machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4681970B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5893479B2 (en) * | 2011-04-21 | 2016-03-23 | 東洋ゴム工業株式会社 | Laminated polishing pad |
TWI812936B (en) * | 2021-04-01 | 2023-08-21 | 智勝科技股份有限公司 | Polishing pad and polishing method |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10128674A (en) * | 1996-10-28 | 1998-05-19 | Rooder Nitta Kk | Polishing pad |
US6117000A (en) * | 1998-07-10 | 2000-09-12 | Cabot Corporation | Polishing pad for a semiconductor substrate |
JP2000349054A (en) * | 1999-06-07 | 2000-12-15 | Asahi Chem Ind Co Ltd | Polishing pad for metal film |
DE19928950A1 (en) * | 1999-06-24 | 2000-12-07 | Wacker Siltronic Halbleitermat | Semiconductor disc surface polishing method has perpendicular oscillating movement superimposed on relative displacement of rotary polishing tool and rotating semiconductor disc |
JP3558273B2 (en) * | 1999-09-22 | 2004-08-25 | 東洋ゴム工業株式会社 | Method for producing polyurethane foam and polishing sheet |
JP3649385B2 (en) * | 2000-01-12 | 2005-05-18 | 東洋ゴム工業株式会社 | Thermoplastic elastomer microporous foam, method for producing the same, and abrasive sheet |
AU2001262716A1 (en) * | 2000-06-13 | 2001-12-24 | Toyo Boseki Kabushiki Kaisha | Process for producing polyurethane foam, polyurethane foam, and abrasive sheet |
-
2005
- 2005-07-27 JP JP2005216923A patent/JP4681970B2/en active Active
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