JP2007031760A - Method for peeling gold-plated film - Google Patents

Method for peeling gold-plated film Download PDF

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Publication number
JP2007031760A
JP2007031760A JP2005215445A JP2005215445A JP2007031760A JP 2007031760 A JP2007031760 A JP 2007031760A JP 2005215445 A JP2005215445 A JP 2005215445A JP 2005215445 A JP2005215445 A JP 2005215445A JP 2007031760 A JP2007031760 A JP 2007031760A
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Japan
Prior art keywords
gold
resin
plated
collect
plated film
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JP2005215445A
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Japanese (ja)
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Toshiyuki Tanaka
俊行 田中
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Individual
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Individual
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Priority to JP2005215445A priority Critical patent/JP2007031760A/en
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

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  • Manufacture And Refinement Of Metals (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To simply and safely peel a gold-plated part at which gold is plated on a resin through a medium of a metallic underlayer, from the resin, collect the gold film, and recycle gold. <P>SOLUTION: This peeling method comprises the steps of: corroding the metallic underlayer 2 on the resin 3 with an etching agent such as an aqueous solution of ferric chloride to peel the gold-plated layer 1 from the resin; removing the separated resin; and filtering the gold-containing solution to collect only gold and recycle the gold. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、樹脂表面の金メッキを剥がす工法に関するものである。   The present invention relates to a method for removing gold plating on a resin surface.

樹脂表面から金メッキの金を回収するのに、熱を加えて溶かしたりで、回収していた。危険かつ公害等の環境問題を解消しなければならない。   In order to collect gold-plated gold from the resin surface, it was recovered by applying heat to dissolve it. Dangerous and environmental problems such as pollution must be resolved.

薬品、熱等で回収しようとすると環境問題など解決しなければならない問題で設備等巨大なものであった。   If you try to recover it with chemicals, heat, etc., you have to solve the environmental problems and the equipment was huge.

本発明は、このような従来の問題を解決しようとするもので、より簡単にしかも安全に樹脂表面のメッキを剥がす工法を提供することを目的とするものである。   The present invention is intended to solve such a conventional problem, and an object of the present invention is to provide a method for removing the plating on the resin surface more easily and safely.

本発明は、樹脂と金メッキの間にある金属膜を腐食させる事で金メッキを剥がす。   In the present invention, the gold plating is peeled off by corroding the metal film between the resin and the gold plating.

本発明によれば、金メッキされた樹脂を溶液に浸す事で、金のみを回収する事が出来る。   According to the present invention, only gold can be recovered by dipping a gold-plated resin in a solution.

本発明は約４０度に暖めた約２０パーセント塩化第二鉄水溶液を槽に入れ金メッキされた樹脂を槽に浸す、約３５分程で樹脂表面の金メッキが剥離する。   In the present invention, about 20 minutes of ferric chloride aqueous solution heated to about 40 ° C. is placed in a bath, and the gold-plated resin is immersed in the bath, and the gold plating on the resin surface peels off in about 35 minutes.

剥離した樹脂を取り除いて溶液と剥離された金をろ紙にてこして金のみを採取する。   Remove the peeled resin and rub the solution and the peeled gold with filter paper to collect only the gold.

次に原理を説明する。塩化第二鉄水溶液は一般に知られているエッチング剤で金属を腐食させる働きをする薬品である。   Next, the principle will be described. Ferric chloride aqueous solution is a chemical that works to corrode metals with a generally known etching agent.

樹脂表面の金メッキは２層で樹脂に銅メッキした上に金メッキを施すので、金メッキの下の層の銅メッキを塩化第二鉄水溶液で腐食させる事で金メッキを剥離する。   Since the gold plating on the resin surface is performed by copper plating on the resin in two layers and then gold plating, the gold plating is peeled off by corroding the copper plating below the gold plating with a ferric chloride aqueous solution.

上述の発明は、金メッキの金を簡単かつ安全に回収でき金のリサイクルを可能にするものである。   The above-described invention makes it possible to collect gold-plated gold easily and safely and to enable gold recycling.

樹脂金メッキの構造断面図Cross section of resin gold plating

符号の説明Explanation of symbols

１ 金メッキ
２ 銅メッキ
３ 樹脂 1 Gold plating 2 Copper plating 3 Resin

Claims (1)

樹脂と金メッキの間の金属を腐食させ金を回収する工法。 A method of recovering gold by corroding the metal between the resin and gold plating.
JP2005215445A 2005-07-26 2005-07-26 Method for peeling gold-plated film Pending JP2007031760A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005215445A JP2007031760A (en) 2005-07-26 2005-07-26 Method for peeling gold-plated film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005215445A JP2007031760A (en) 2005-07-26 2005-07-26 Method for peeling gold-plated film

Publications (1)

Publication Number Publication Date
JP2007031760A true JP2007031760A (en) 2007-02-08

Family

ID=37791369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005215445A Pending JP2007031760A (en) 2005-07-26 2005-07-26 Method for peeling gold-plated film

Country Status (1)

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JP (1) JP2007031760A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016074952A (en) * 2014-10-07 2016-05-12 株式会社アステック入江 Valuable metal recovery method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016074952A (en) * 2014-10-07 2016-05-12 株式会社アステック入江 Valuable metal recovery method

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