JP2010016045A - Liquid cooling system, liquid cooling system component, and cooling method of electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress the reduction of the concentration of a corrosion inhibitor in cooling water and to prevent the corrosion of a liquid cooling system component for a long period of time, in a liquid cooling system, a liquid cooling system component, and a cooling method of an electronic device. <P>SOLUTION: The liquid cooling system is for cooling the electronic device 7 by the cooling water C, the absorption coating 15 of a first corrosion inhibitor is formed on the surface of the component at a part in contact with the cooling water C, and a second corrosion inhibitor different from the first corrosion inhibitor is added to the cooling water C. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a liquid cooling system, liquid cooling system components, and a method for cooling an electronic device.

  In electronic computers such as servers and personal computers, the integration density and mounting density of mounted LSIs are increasing, and the volume of processing data is gradually increasing. Along with this, the amount of heat generated by LSI also increases, and a method for efficiently cooling an electronic computer is desired.

  As a cooling method, the forced air cooling method that sends wind with a cooling fan has been used for many years, but it is difficult to cool the LSI below the allowable temperature with this method, so cooling with a liquid cooling method with good cooling efficiency is proposed Has been.

  In such a liquid cooling system, in order to increase the cooling efficiency of the LSI, a metallic cooling plate is provided on the upper surface of the LSI chip, and cooling water is passed through the cooling plate.

  However, if the cooling water is allowed to flow for a long period of time, the water quality changes due to the cooling water coming into contact with components such as the cooling plate and piping, which may erode the components and cause water leakage.

  Therefore, in order to prevent such erosion, a corrosion inhibitor called an inhibitor is added to the cooling water. By adding the inhibitor, a thin film is formed on the surface of the part, and the cooling water and the part are isolated by the film, and corrosion of the part can be prevented.

  However, the inhibitor film is not permanently formed on the surface of the component, and a part of the film may be peeled off while using the electronic device. In that case, a new film is formed at the location by the inhibitor in the cooling water, but the inhibitor concentration in the cooling water is reduced by the amount required for the formation of the film.

Therefore, in anticipation of a decrease in the inhibitor, it is necessary to add cooling water to a high concentration at the beginning of use of the electronic device. However, when draining the cooling water that is no longer necessary, the harmful inhibitor is made harmless or diluted. Waste liquid treatment is necessary to perform the process.
Japanese Patent Laid-Open No. 5-148672 JP-A-9-268386 JP-A-9-271156 Japanese Unexamined Patent Publication No. 63-50047

  In liquid cooling system, liquid cooling system component, and electronic device cooling method, it is intended to prevent the corrosion of liquid cooling system component in the long term by suppressing the concentration of corrosion inhibitor in cooling water from decreasing .

  According to one aspect of the disclosure below, a liquid cooling system that cools an electronic device with cooling water, the first corrosion inhibitor adsorption film is formed on the surface of a part in contact with the cooling water, A liquid cooling system is provided in which a second corrosion inhibitor different from the first corrosion inhibitor is added to the cooling water.

  According to another aspect of the disclosure, a liquid cooling system component that cools an electronic device with cooling water, the liquid having a corrosion inhibitor adsorption film formed on the surface of the portion in contact with the cooling water Cold system components are provided.

  Further, according to another aspect of the disclosure, an adsorption film of the first corrosion inhibitor is formed in advance on the surface of the part in contact with the cooling water, and a second different from the first corrosion inhibitor. An electronic device cooling method is provided in which cooling water to which a corrosion inhibitor is added is passed through the component to cool the electronic device.

  According to the present invention, the part from which the adsorption film of the first corrosion inhibitor is peeled is repaired by the precipitation film of the second corrosion inhibitor in the cooling water, so that the part surface is isolated from the cooling water by the precipitation film. It is possible to prevent the surface of the component from being corroded by the cooling water.

  In addition, since the concentration of the second corrosion inhibitor added to the cooling water is sufficient for the restoration of the adsorption film, it is compared with the case where the surface of the component is protected only by the precipitation film of the second corrosion inhibitor. The concentration can be reduced, and the waste water treatment of the cooling water can be omitted.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

(1) First Embodiment Inhibitors used in the liquid cooling system include a precipitation film type inhibitor and an adsorption film type inhibitor. The function of these inhibitors is described below.

  FIG. 1 is a schematic diagram showing the function of a precipitation film type inhibitor, and corresponds to a cross-sectional view of a pipe 10 through which cooling water is passed.

  The precipitation film type inhibitor 13 is used by being dissolved in pure water, and precipitates while circulating in the pipe 10 to form a precipitation film 11 on the inner surface of the pipe 10.

  The precipitate film 11 isolates the inner surface of the pipe 10 from the pure water and prevents the inner surface from being corroded by the pure water. Furthermore, even if a part of the precipitation film 11 is peeled off, the inhibitor 13 in the pure water is deposited at the peeled portion and the precipitation film 11 is automatically repaired, so that the corrosion preventing effect can be maintained.

  However, in that case, the inhibitor concentration in pure water will decrease by the amount required to repair the precipitate film 11.

  FIG. 2 is a schematic view showing the function of the adsorption film type inhibitor and corresponds to the cross-sectional view of the pipe 10.

  The adsorption film type inhibitor is insoluble in pure water. In use, before passing pure water, an adsorption film type inhibitor is applied in advance to the inner surface of the pipe 10 to form an adsorption film 15 in which molecules in the inhibitor are adsorbed on the pipe 10.

  The adsorption coating 15 can isolate the inner surface of the pipe 10 from pure water and prevent the inner surface from being corroded by pure water. Further, the adsorbed film 15 has an advantage that the adhering film 15 is excellent in adhesion to the base such as the pipe 10 as compared with the precipitated film 11 of the precipitated film type inhibitor (see FIG. 1).

  However, once a part of the adsorbed film 15 is peeled off, the peeled part is not repaired as in the case of a precipitation film type inhibitor, and the inner surface of the pipe 10 is in contact with water and corrodes at that part. It will progress.

  As described above, the precipitation film type inhibitor and the adsorption film type inhibitor have merits and demerits, but by combining these, the disadvantages of each other can be compensated.

  FIGS. 3A and 3B are schematic views for explaining the advantages obtained by combining these inhibitors, and correspond to a cross-sectional view of the pipe 10.

  As shown in FIG. 3A, in this example, an adsorption film 15 of an adsorption film type inhibitor is applied to the inner surface of the pipe 10 in advance. Then, pure water in which the precipitation film type inhibitor 13 is dissolved is passed through the pipe 10.

  In this way, even if the adsorption film 15 peels off at a part R of the pipe 10, as shown in FIG. 3 (b), the precipitation film 11 of the precipitation film type inhibitor 13 is formed at the location, and the film The peeled portion is repaired.

  Furthermore, since the adsorbed film 15 has a higher adhesion to the pipe 10 than the precipitated film 11 and has less risk of peeling, the film is repaired as compared with the case where the pipe 10 is covered only with the precipitated film 11 as shown in FIG. The amount of the precipitation film type inhibitor required for the treatment is small.

  Therefore, as compared with the case where only the precipitation film type inhibitor is used as shown in FIG. 1, the concentration of the precipitation film type inhibitor added to the pure water can be reduced. The waste liquid treatment such as detoxification of the inhibitor becomes unnecessary.

  The materials of the precipitation film type inhibitor and the adsorption film type inhibitor are not particularly limited.

  As the precipitation film type inhibitor, benzotriazole (BTA) effective for preventing corrosion of copper and copper alloys can be used.

  On the other hand, as the adsorption film type inhibitor, an alkanethiol compound represented by the following general formula (1) can be used.

R (CH ₂ ) _n SH (1)
However, in formula (1), n represents a natural number.

  In the adsorption film 15 made of such an alkanethiol compound, the thiol group (—SH) is adsorbed to a metal material such as the pipe 10 and the terminal group R constitutes an interface with the cooling water.

  The thiol group (—SH) reacts strongly with the metal (M) in the aqueous medium to form a strong metal-sulfur (MS) covalent bond, and the adhesion between the adsorption film 15 and the pipe 10 is enhanced.

Further, the alkyl chain ((CH ₂ ) _n ) is easy to arrange neatly because there is no side chain, and the adsorbed film 15 composed of a dense monomolecular layer in which they are assembled together and self-assembled is formed. The film thickness of the monomolecular layer is typically about 1 to 2 nm. Thus, the thin adsorption film 15 hardly inhibits the heat exchange between the cooling water and the pipe 10, and is advantageous for improving the efficiency of the heat exchange.

The terminal group R is not particularly limited, and is a methyl group (—CH ₃ ), an amino group (—NH ₂ ), a carboxyl group (—COOH), a carboxylate group (—COO—), a hydroxyl group (—OH), an amide group. It can be selected from either (—CONH ₂ ) or a formyl group (—COH).

  Among these, when the terminal group R is a methyl group, the adsorption film 15 at the interface with the cooling water becomes hydrophobic. Therefore, it becomes difficult for cooling water to enter the adsorption film 15, and components such as the pipe 10 can be efficiently blocked from the cooling water.

Such a cooling water blocking effect is enhanced as the alkyl chain ((CH ₂ ) _n ) becomes longer and the film thickness of the adsorption film 15 increases. However, if the alkyl chain is too long, the alkyl chains cannot be associated with each other well, and a self-assembled monolayer may not be formed. From the viewpoint of not hindering the association between alkyl chains, n is preferably 21 or less, more preferably 18 or less.

  On the other hand, if the alkyl chain is short, the film thickness of the adsorption film 15 is reduced, and the cooling water blocking effect is lowered. Therefore, n is preferably 7 or more, more preferably 12 or more.

  Further, if the terminal group R is substituted with a functional group such as a hydroxyl group, an amino group, and a carboxyl group, the affinity of the interface between the adsorption film 15 and the cooling water can be changed as compared with the case of the methyl group. it can.

  In order to form the adsorption film 15 of the alkanethiol compound, the alkanethiol compound is dissolved in a solvent to prepare an alkanethiol solution, which is applied to the surface of the pipe 10 or the like.

  The solvent is preferably non-toxic, inexpensive and easy to handle. Such solvents include, for example, alcohol, glycol, acetone, toluene, ethyl acetate, hexane, pentane, heptane, octane, hexane, furan, tetrahydrofuran (THF), methylene chloride, ether, formic acid, formamide, N, N -Dimethylformamide, acetonitol, turpentine oil, benzene, butyl acetate, petroleum ester, xylene, carbon tetrachloride, and water, or mixtures thereof.

Among these, the solvent containing a straight chain hydrocarbon is easier to self-assemble the alkyl chain ((CH ₂ ) _n ) in the alkanethiol compound than the one containing a cyclic or branched hydrocarbon, and the alkanethiol compound It is advantageous in that it is easy to form a dense monomolecular layer. Examples of the solvent containing a linear hydrocarbon include alcohol, glycol, pentane, hexane, octane, and hexane.

  In addition, before apply | coating alkanethiol solution to components surfaces, such as piping 10, you may apply | coat the solvent of this solution to components surfaces previously. In this way, the part surface can be easily adapted to the alkanethiol solution.

  Furthermore, after applying the alkanethiol solution, the parts such as the pipe 10 may be immersed in the solvent of the solution to remove the alkanethiol that has not contributed to the formation of the adsorption film from the surface of the part.

  The concentration of the alkanethiol solution is preferably a minimum concentration required for forming an adsorption film composed of a monomolecular layer of alkanethiol, for example, 1 ppm or more, more preferably 20 ppm or more. On the other hand, if the concentration is higher than necessary, the alkanethiol compound that does not contribute to the formation of the adsorption film 15 is wasted, resulting in an increase in cost. From the viewpoint of cost reduction, the concentration of the alkanethiol solution should be 5000 ppm or less, more preferably 500 ppm or less.

  The method for applying the alkanethiol solution is not particularly limited. The alkanethiol solution can be applied to the surface of the component such as the pipe 10 by any of dipping, spraying, painting, roll coating, and flow coating (flow coating). Of these, dipping is advantageous in that it does not mechanically disturb the alkanethiol solution, so that a self-assembled monolayer of the alkanethiol compound can be easily formed on the part surface.

  In the case of application by immersion, the adsorption film 15 made of a monomolecular layer of an alkanethiol compound is formed on the entire surface of the component with a short immersion time of about 1 to 5 minutes to a thickness of 1 to 2 nm.

  Moreover, it is preferable to dry the solvent component in the adsorption film 15 in room temperature atmosphere or a heating atmosphere after application | coating. In the case of a heated atmosphere, if the temperature is too high, the alkanethiol compound will be decomposed, so it is preferable to dry the adsorbed film by controlling the temperature of the adsorption film to room temperature (20 ° C.) to 180 ° C.

  Further, in order to promote the drying, the surface of the adsorption film 15 may be exposed to an air stream of air or nitrogen.

  There are no particular limitations on the material of the part to which the alkanethiol solution is applied. Examples of such materials include iron, steel, aluminum, copper, zinc, tin, gold, and silver. Moreover, the form of components is not particularly limited, and the alkanethiol solution can be applied to plate-like members such as metal substrates, hot-rolled steel plates, acid-washed steel plates, and cold-rolled steel plates, and metal foils.

  Furthermore, you may apply | coat to the metal-coated steel plate by fusion | melting or electrolytic plating. The metal coating includes, for example, one or more layers of any material of lead, lead alloy, nickel, nickel alloy, zinc, tin, and tin alloy. Or you may apply to the steel plate in which the phosphate chemical conversion coating or the resin coating was given.

  Here, when impurities such as oxides, greases, and oils are present on the surface of a component such as the pipe 10, the adhesion between the surface and the monomolecular layer of the alkanethiol compound decreases. Therefore, it is preferable to clean the surface of the component with ethanol or the like before applying the alkanethiol solution.

  Next, examples and comparative examples using an adsorption film of an alkanethiol compound will be described.

In these examples, dodecanethiol (CH ₃ (CH ₂ ) ₁₁ SH) is used as the alkanethiol compound.
In this example, an adsorption film of dodecanethiol was prepared on a copper plate according to the following procedure.

  (Step 1) First, a copper plate having a size of 50 mm × 30 mm × 3 mm (= length × width × thickness) is prepared. And as pre-processing with respect to this copper plate, the copper plate was grind | polished using the sand paper of the 500th and the sand paper of the 100th in this order. Thereafter, ultrasonic cleaning of the copper plate was performed in water for 5 minutes.

(Step 2) The copper plate was immersed in a 7 mol / liter HNO ₃ aqueous solution for 30 seconds for etching to remove impurities such as oxides on the surface of the copper plate.

(Step 3) The copper plate was washed with water, and the HNO ₃ aqueous solution on the surface was washed away. Washing with water was performed twice, and each washing time was set to 1 to 2 seconds.

  (Step 4) The copper plate was immersed twice in ethanol. Each immersion time is 1-2 seconds. This step eliminates water from the copper plate surface.

  (Step 5) The copper plate was immersed in the dodecanethiol solution for 3 minutes. The dodecanethiol solution is obtained by dissolving dodecanethiol in ethanol at a concentration of 100 ppm. Since the copper plate was previously immersed in ethanol in step 4, the copper plate surface can be easily adapted to the dodecanethiol solution.

  By this step, an adsorption film of dodecanethiol is formed on the copper plate surface.

  (Step 6) A copper plate was immersed overnight in ethanol, and dodecanethiol that did not contribute to the adsorption film was dissolved in ethanol.

  (Step 7) Drying was performed by spraying nitrogen gas on the surface of the copper plate.

  Thereafter, a copper plate was put in a container, and cooling water in which benzotriazole (BTA) was dissolved was circulated between the container and the circulation pump. The concentration of benzotriazole in the cooling water was 100 ppm.

Example 2
In this example, Steps 1 to 7 were performed in this order in the same manner as Example 1. However, in Step 5, the concentration of the dodecanethiol solution was set to 500 ppm higher than that in Example 1.

  And the copper plate was put in the container similarly to Example 1, and the cooling water to which benzotriazole was added at a concentration of 100 ppm was circulated.

-1st comparative example In this comparative example, in order not to form the adsorption film of dodecanethiol on the copper plate surface, step 5 of Example 1 was abbreviate | omitted and steps 1-4, 6, and 7 were performed.

  And the copper plate was put in the container similarly to Example 1, and the cooling water to which benzotriazole was added at a concentration of 100 ppm was circulated.

-2nd comparative example In this comparative example, according to the same procedure as Example 1, the adsorption film of dodecanethiol was formed in the copper plate surface.

  Then, the copper plate was put in the container and the cooling water was circulated between the container and the circulation pump. However, unlike Example 1, the concentration of benzotriazole in the cooling water was 0 ppm.

  The following Table 1 is a table showing the test results of the degree of erosion of the copper plate, the BTA concentration in the cooling water, and the conductivity of the cooling water in Examples 1 and 2 and Comparative Examples 1 and 2 described above.

なお、試験中における冷却水の温度は６０℃とし、試験期間は３０日と６０日にした。

The temperature of the cooling water during the test was 60 ° C., and the test period was 30 days and 60 days.

  Moreover, about the copper plate after a test, after removing the corrosion product on the surface, it wash | cleaned with methanol and acetone, and measured the weight.

The degree of erosion in Table 1 was calculated using the degree of corrosion W. Corrosion degree W is the number of mg of corrosion weight loss per day with respect to 1 dm ² of copper plate surface area, and its unit is mdd as defined by the following equation.

W = (M ₁ −M ₂ ) / (S × T)
The meaning of each parameter in this equation is as follows.

W: Corrosion degree (mdd)
M ₁ : Weight of copper plate before test (mg)
M ₂ : Weight of copper plate after test (mg)
S: Copper plate surface area (dm ² )
T: Test days Here, the weight M ₁ before the test of the copper plate in Examples 1 and 2 and Comparative Example 2 is the state in which the dodecanethiol adsorption film is formed on the copper plate surface before circulating the cooling water. It is weight. Then, the weight M ₁ of the previous test of the copper plate in Comparative Example 1 is the weight before the copper circulating cooling water.

  Using the corrosion degree W, the erosion degree P is calculated as follows.

P = W × 365 × 10 ⁻⁴ / d
The meaning of each parameter in the formula is as follows.

P: Degree of erosion (mm / y)
W: Corrosion degree (mdd)
D: Density of copper plate (g / cm ³ )
The erosion degree P defined in this way is the erosion depth per year expressed in mm, and its unit is mm / y.

  In addition, the BTA density | concentration in Table 1 was measured with the ultraviolet spectrophotometer (Hitachi Ltd. U-1100). The conductivity of the cooling water was measured with a desktop conductivity meter (S30 manufactured by METTLER TRADE).

  As shown in Table 1, when Example 1 in which an adsorbed film of dodecanethiol was formed and Comparative Example 1 in which the adsorbed film was not formed were compared, Example 1 had benzotriazole (BTA ) The decrease in density is small. This is because, in Example 1, a benzotriazole precipitation film is formed only on the portion where the dodecanethiol adsorption film is peeled off, and the consumption amount of benzotriazole is larger than that in Comparative Example 1 in which the precipitation film is formed on the entire surface of the copper plate. This is probably because there are few.

  Further, in Example 1 and Comparative Example 1, the increase in the conductivity of the cooling water in Example 1 is suppressed. The conductivity of the cooling water is considered to increase as the eroded copper dissolves into the cooling water. Therefore, it became clear from this result that the effect of preventing corrosion of the copper plate can be enhanced by forming the dodecanethiol adsorption film as in Example 1. This is also understood from the fact that the erosion degree of Example 1 is smaller than that of Comparative Example 1.

  Furthermore, when Example 1 and Example 2 are compared, in Example 2, where the concentration of the dodecanethiol solution is high, an increase in the degree of erosion with the passage of the test period is suppressed, and the concentration of the dodecanethiol solution is high. It can be seen that conversion is effective in preventing erosion.

  Further, in Comparative Example 2, the increase in the erosion degree and the conductivity with the progress of the test period is more significant than in Examples 1 and 2. In Comparative Example 2, only the dodecanethiol adsorption film was formed on the surface of the copper plate, and benzotriazole was not added to the cooling water. Therefore, the portion where the dodecanethiol adsorption film was peeled off was not repaired by the benzotriazole precipitation film. This is probably because the copper plate surface of the portion was directly exposed to cooling water.

  Based on the above results, parts that come into contact with cooling water by forming an adsorption film of an adsorption film type inhibitor such as an alkanethiol compound on the surface of the part and adding a precipitation film type inhibitor such as benzotriazole to the cooling water It became clear that it was effective in preventing corrosion.

  Furthermore, it has been clarified that the concentration of the precipitation film type inhibitor in the cooling water can be suppressed from decreasing with the passage of the use period. As a result, the concentration of the precipitation film type inhibitor added to the cooling water at the beginning of use can be reduced, and the waste liquid treatment for detoxifying or diluting the precipitation film type inhibitor can be omitted.

(2) Second Embodiment In this embodiment, a liquid cooling system for an electronic device will be described.

  FIG. 4 is a configuration diagram of the liquid cooling system according to the present embodiment.

  In the liquid cooling system 1, the cooling water C is circulated through the circulation pipe 2 by the driving force of the circulation pump 17, and the electronic device 7 such as an electronic computer is cooled by the cooling unit 3. The material of the circulation pipe 2 is not particularly limited, but is preferably copper or a copper alloy having high thermal conductivity and excellent corrosion resistance as compared with other metals.

  The cooling unit 3 includes a manifold 4 for diverting the coolant C in the electronic device 7, a branch pipe 5 and a cooling plate 6 through which the coolant C discharged from the manifold 4 flows. The cooling plate 6 is provided for each semiconductor device such as an LSI mounted on the electronic device 7, and each semiconductor device is individually cooled by the cooling plate.

  As the material of the cooling plate 6, like the circulation pipe 2, it is preferable to use copper or a copper alloy that has high thermal conductivity and can efficiently exchange heat with the semiconductor device. The material of the manifold 4 and the branch pipe 5 is also preferably copper or a copper alloy because it has excellent corrosion resistance against the cooling water C.

  The cooling water C warmed by taking the heat of the electronic device 7 enters the heat exchanger 8 provided in the circulation pipe 2 downstream of the cooling unit 3. In the heat exchanger 8, the cooling liquid C is air-cooled by a fan, and the heat of the cooling liquid C is radiated to the outside. It is preferable to use a copper or copper alloy material for the heat exchanger 8 in contact with the coolant C in order to facilitate heat exchange.

  The coolant C exiting the heat exchanger 8 is temporarily stored in the tank 9 and then circulated through the circulation pipe 2 by the pump 17 again.

  In such a liquid cooling system 1, copper or a copper alloy having excellent thermal conductivity is used for a part in contact with the cooling liquid C. However, the surface of a metal such as copper corrodes due to contact with the coolant C while the liquid cooling system 1 is used for a long period of time.

  Therefore, in the present embodiment, as described in the first embodiment, an adsorption film of an adsorption film type inhibitor is formed in advance on the surface of the component in contact with the cooling liquid C, and the precipitated film is formed in the cooling water C. Add type of inhibitor.

  The parts on which the adsorption film of the adsorption film type inhibitor is formed include a metallic circulation pipe 2, a manifold 4, a branch pipe 5, and a cooling plate 6. And the adsorption | suction film | membrane can be formed by immersing these components in alkanethiol solutions, such as dodecane thiol, as demonstrated in 1st Embodiment.

  On the other hand, as a precipitation type inhibitor added to the cooling water C, there is benzotriazole useful for preventing corrosion of copper and copper alloys.

  In this way, by using different types of inhibitors together, even if the adsorption film of the adsorption film type inhibitor formed on the surface of the component is lost, the defective part is repaired by the precipitation film of the precipitation film type inhibitor.

  Therefore, the concentration of the precipitation film type inhibitor to be added to the cooling water C may be a concentration necessary for repairing the defective portion, and is lower than the case where the adsorption film of the adsorption film type inhibitor is not formed. As a result, when the cooling water C is subjected to waste liquid treatment, waste liquid treatment for detoxifying or diluting the inhibitor can be omitted.

  Further, as is apparent from the test results of the first embodiment, the erosion degree of the part surface with the passage of the use period is reduced as compared with the case where only one of the adsorption film type and the precipitation film type inhibitor is used. It is possible to effectively prevent a water leakage trouble in the cooling plate 6 and the like over a long period of time.

  The aspects of the present invention are summarized in the following supplementary notes.

(Appendix 1) A liquid cooling system for cooling an electronic device with cooling water,
An adsorption film of the first corrosion inhibitor is formed on the surface of the part in contact with the cooling water,
A liquid cooling system, wherein a second corrosion inhibitor different from the first corrosion inhibitor is added to the cooling water.

  (Supplementary note 2) The liquid cooling system according to supplementary note 1, wherein the first corrosion inhibitor is an alkanethiol compound.

  (Supplementary note 3) The liquid cooling system according to supplementary note 1 or supplementary note 2, wherein the adsorption film is composed of a monomolecular layer of the first corrosion inhibitor.

  (Supplementary note 4) The liquid cooling system according to any one of supplementary notes 1 to 3, wherein the second corrosion inhibitor is benzotriazole.

(Appendix 5) A component of a liquid cooling system for cooling an electronic device with cooling water,
A liquid cooling system component, wherein an adsorption film of a corrosion inhibitor is formed on a surface of a portion in contact with the cooling water.

(Appendix 6) An adsorption film of the first corrosion inhibitor is formed in advance on the surface of the part in contact with the cooling water,
A cooling method for an electronic device, wherein cooling water to which a second corrosion inhibitor different from the first corrosion inhibitor is added is passed through the component to cool the electronic device.

  (Additional remark 7) The said adsorption film is formed by apply | coating the solution which the said 1st corrosion inhibitor melt | dissolved to the said component, The cooling method of the electronic device of Additional remark 6 characterized by the above-mentioned.

FIG. 1 is a schematic diagram showing the function of a precipitation film type inhibitor. FIG. 2 is a schematic diagram showing the function of an adsorption film type inhibitor. FIGS. 3A and 3B are schematic diagrams for explaining the advantages obtained by combining a precipitation film type inhibitor and an adsorption film type inhibitor. FIG. 4 is a configuration diagram of the liquid cooling system according to the embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Liquid cooling system, 2 ... Circulation piping, 3 ... Cooling part, 4 ... Manifold, 5 ... Branch piping, 6 ... Cooling plate, 7 ... Electronic device, 8 ... Heat exchanger, 9 ... Tank, 10 ... Piping, 11 DESCRIPTION OF SYMBOLS Precipitation film, 13 ... Precipitation film type | mold inhibitor, 15 ... Adsorption film | membrane of an adsorption film type | mold inhibitor, 17 ... Circulation pump.

Claims (5)

A liquid cooling system for cooling an electronic device with cooling water,
An adsorption film of the first corrosion inhibitor is formed on the surface of the part in contact with the cooling water,
A liquid cooling system, wherein a second corrosion inhibitor different from the first corrosion inhibitor is added to the cooling water.   The liquid cooling system according to claim 1, wherein the first corrosion inhibitor is an alkanethiol compound.   The liquid cooling system according to claim 1, wherein the adsorption film is formed of a monomolecular layer of the first corrosion inhibitor. A component of a liquid cooling system for cooling an electronic device with cooling water,
A liquid cooling system component, wherein an adsorption film of a corrosion inhibitor is formed on a surface of a portion in contact with the cooling water. An adsorption film of the first corrosion inhibitor is formed in advance on the surface of the part in contact with the cooling water,
A cooling method for an electronic device, wherein cooling water to which a second corrosion inhibitor different from the first corrosion inhibitor is added is passed through the component to cool the electronic device.

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