JP2007024518A - Method for testing magnetic sensor module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for testing magnetic sensor modules capable of reducing manufacturing costs of magnetic sensor modules. <P>SOLUTION: A plurality of magnetic sensor module each comprising a magnetic sensor and a digital signal processing part are formed on a wafer. A probe card having a coil for impressing the magnetic sensor with a magnetic field is brought into contact with any magnetic sensor module. Without separating the probe card from the magnetic sensor module, test signals are inputted to the digital signal processing part via the probe card. By acquiring response signals of the digital signal processing part to the test signals via the probe card, the digital signal processing part is tested. By acquiring response signals of the magnetic sensor module via the probe card as supplying a current to the coil, the magnetic sensor is tested. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for inspecting a magnetic sensor module, and more particularly to a method for inspecting a magnetic sensor module including a digital signal processing unit.

Patent Document 1 discloses a method for inspecting a magnetic sensor after packaging with an inspection apparatus having a Helmholtz coil. In this inspection method, the packaged magnetic sensor is tested by placing the packaged magnetic sensor in a magnetic field generated by a Helmholtz coil and measuring the output signal of the magnetic sensor.
On the other hand, Patent Document 2 discloses a method for inspecting a magnetic sensor in a wafer state by an inspection apparatus having a coil prober. In this inspection method, the magnetic sensor in the wafer state is inspected by measuring the output signal of the magnetic sensor while applying the magnetic field to the magnetic sensor by bringing the tip of the coil prober close to the magnetic sensor.

However, in the inspection of the magnetic sensor module having the magnetic sensor and the digital signal processing unit, the magnetic sensor module is inspected by attaching the magnetic sensor module to the inspection device described in Patent Document 1 or the inspection device described in Patent Document 2, It is necessary to inspect the digital signal processing unit by attaching a magnetic sensor module to an inspection device different from the inspection devices described in Patent Literature 1 and Patent Literature 2. Such a complicated inspection process increases the manufacturing cost of the magnetic sensor module.
Japanese Patent Laid-Open No. 9-50601 JP-A-62-55977

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a magnetic sensor module inspection method that can reduce the manufacturing cost of the magnetic sensor module.

(1) According to an electronic device inspection method for achieving the above object, a magnetic field is applied to any one of a plurality of magnetic sensor modules formed on a wafer having a magnetic sensor and a digital signal processing unit. The inspection signal is input to the digital signal processing unit via the probe card without contacting the probe card having a coil for making contact with the probe card and separating the probe card from the magnetic sensor module. By acquiring the response signal of the processing unit through the probe card, the digital signal processing unit is inspected, and the response signal of the magnetic sensor module is acquired through the probe card while supplying current to the coil. Thus, the magnetic sensor is inspected.
Inspection of the digital signal processing unit of the magnetic sensor module formed on the wafer without separating the probe card in contact with the magnetic sensor module from the magnetic sensor module, that is, by connecting the probe card to the magnetic sensor module once. Therefore, the inspection process of the magnetic sensor module can be simplified, and the manufacturing cost of the magnetic sensor module can be reduced.

(2) The probe card may be aligned with the magnetic sensor module with reference to a reference pattern formed on the wafer.
By aligning a probe card having a coil and a magnetic sensor module with reference to a reference pattern regularly and repeatedly formed on a wafer, the probe is made with reference to an alignment mark attached to the magnetic sensor module after dicing. Compared with the case where the card and the magnetic sensor module in the chip state are aligned, or when the magnetic sensor module after packaged is mounted in the socket and aligned with the coil, the exact position of the probe card and the magnetic sensor module Matching becomes possible. For example, the reference pattern is a pad or wiring pattern of an electronic device formed on a wafer, a scrub line, a terminal exposed after being covered with a resin, or the like. As a result, since the magnetic sensor can be inspected while applying a magnetic field in the correct direction by the coil of the probe card, the inspection accuracy of the magnetic sensor can be increased. The reference pattern is preferably not a pattern extending in one direction but a pattern extending in both the X direction and the Y direction. The reference pattern is preferably a long pattern. By using a long pattern extending in a plurality of directions as a reference pattern, it is possible to increase the accuracy of alignment between the probe card and the magnetic sensor module.

(3) The probe card is brought into contact with a plurality of the magnetic sensor modules at a time,
A magnetic field generated by supplying a current to the coil may be applied to the magnetic sensors of a plurality of the magnetic sensor modules when the magnetic sensor is inspected.
A probe card is brought into contact with a plurality of magnetic sensor modules at a time, and a magnetic field generated by supplying a current to the coil is applied to the plurality of magnetic sensor modules. The digital signal processing unit and the magnetic sensor of the sensor module can be inspected. As a result, since the number of connection of the probe card per magnetic sensor module necessary for inspecting the magnetic sensor module to the magnetic sensor module can be reduced, the inspection time per magnetic sensor module can be shortened.

(4) By inputting the correction value of the magnetic sensor according to the inspection result of the magnetic sensor to the magnetic sensor module via the probe card, the correction value is stored in the storage unit of the magnetic sensor module. Also good.
In order to input the correction value of the magnetic sensor to the magnetic sensor module via the probe card, in addition to the inspection of the digital signal processing unit and the inspection of the magnetic sensor by one connection to the magnetic sensor module of the probe card, the magnetic sensor The correction value of the magnetic sensor can be stored in the storage unit of the module.

  It should be noted that the order of each operation of the method described in the claims is not limited to the order of description as long as there is no technical obstruction factor, and may be executed in any order, or may be executed simultaneously. Also good.

Hereinafter, embodiments of the present invention will be described based on a plurality of examples. In each of the embodiments, the component having the same reference sign corresponds to the component of the other embodiment having the reference sign.
(First Example)
FIG. 2 is a schematic diagram showing an inspection system according to the first embodiment of the present invention.
An inspection system 1 according to the first embodiment of the present invention includes a prober 100, a tester 200, and the like, and inspects a magnetic sensor module formed on a wafer 30.

FIG. 3 is a schematic diagram for explaining a magnetic sensor module which is an inspection target of the inspection system according to the first embodiment.
The magnetic sensor module 300 includes a magnetic sensor 302, a magnetic sensor 304, an analog / digital converter (hereinafter referred to as A / D converter) 320, a memory 330, a digital signal processing unit 340, a power supply unit 350, and the like.
The magnetic sensor 302 and the magnetic sensor 304 output analog signals corresponding to the external magnetic field, and their sensitivity directions are orthogonal to each other. The magnetic sensor module 300 may include one magnetic sensor, or may include three or more magnetic sensors. Hereinafter, when both the magnetic sensor 302 and the magnetic sensor 304 are shown, they are referred to as “magnetic sensors”.

The A / D converter 320 converts an analog signal output from the magnetic sensor into a digital signal. The magnetic sensor module 300 to be inspected may convert an analog signal output from the magnetic sensor into a digital signal.
The memory 330 as a storage unit is a non-volatile memory in which various data such as a magnetic sensor correction value and a temperature compensation value are stored.

The digital signal processing unit 340 performs various signal processing in synchronization with a clock signal input to the terminal 360. For example, the digital signal processing unit 340 generates a signal indicating the direction of the external magnetic field (hereinafter referred to as an angle signal) from the output of the magnetic sensor, the correction value stored in the memory 330, the temperature compensation value, and the like, and is applied to the terminal 362. An angle signal is output, various data is written to the memory 330, and various data is read from the memory 330.
The power supply unit 350 uses the voltage applied to the terminal 364 as an input and supplies power to each unit of the magnetic sensor module 300. Hereinafter, the term “terminal” refers to all terminals including terminals other than the terminal 360 to the terminal 364.

  As shown in FIG. 2, a wafer 30 is disposed on the prober 100. Specifically, for example, the wafer 30 is attached to a test stage (not shown) of the prober 100. The tester 200 includes a tester main body 210, a test station 220, and the like. The test station 220 is installed on the test stage of the prober 100 and is connected to the tester main body 210. A probe card (to be described later) is attached to the test station 220.

FIG. 4 is an enlarged view of the vicinity of the probe card at the time of inspection. FIG. 5 is a plan view of the probe card.
As shown in FIG. 4, the prober 100 moves relative to the test station 220 in the direction in which the wafer 30 approaches the probe card 130 and the direction in which the wafer 30 moves away from the probe card 130. In the following description, it is assumed that the test stage of the prober 100 moves up and down with respect to the test station 220 (see arrow Z).

The probe card 130 includes a probe head 140, a printed wiring board 150, coils 161 to 164 (see FIG. 5), and the like.
The printed wiring board 150 is fixed to the test station 220 and is electrically connected to the tester main body 210 via the test station 220.
The probe head 140 has a base 142 and a plurality of probes 144, and is fixed to the printed wiring board 150. The probe 144 is disposed near the center of the base 142 and protrudes from the base 142. When the magnetic sensor module 300 is inspected, the tip of the probe 144 contacts the terminal of the magnetic sensor module 300. The probe 144 may be arranged so as to be shifted from the vicinity of the center of the base portion 142.

  The coils 161 to 164 are fixed to the probe head 140. Specifically, for example, the coils 161 to 164 are fitted into four recesses 142 a each penetrating the printed wiring board 150 and having a bottom formed on the base 142. As shown in FIG. 5, the coils 161 to 164 are arranged at positions that are rotated 90 degrees with respect to the center of the base 142. Hereinafter, when all of the coils 161 to 164 are shown, they are referred to as “coils”. The direction from the coil 161 to the coil 162 is referred to as “X direction” (see arrow X), and the direction from the coil 163 to coil 164 is referred to as “Y direction” (see arrow Y).

  The coil 161 and the coil 162 are electrically connected so that opposite magnetic fields are generated inside the coil. Therefore, when a current is supplied to the coil 161 and the coil 162, a magnetic field SF1 in the X direction or the −X direction (the direction opposite to the X direction) is generated. On the other hand, the coils 163 and 164 are electrically connected so that opposite magnetic fields are generated inside the coil. Therefore, when a current is supplied to the coils 163 and 164, a magnetic field SF2 in the Y direction or -Y direction (the direction opposite to the Y direction) is generated. As a result, a combined magnetic field CF1 by the magnetic field SF1 and the magnetic field SF2 can be formed near the tip of the probe 144. The magnitude and direction of the combined magnetic field CF1 are determined by the magnitude and direction of the magnetic field SF1 and the magnetic field SF2. Therefore, by controlling the current supplied from the coil 161 to the coil 164, a combined magnetic field CF1 having an arbitrary magnitude and an arbitrary direction can be generated near the tip of the probe 144.

  As shown in FIG. 6, for example, in order to generate a combined magnetic field CF1 (see FIG. 6A) having a magnitude m in which the direction of the magnetic field near the tip of the probe 144 forms an angle θ with the X direction, If the current I1 shown in 1) (see FIG. 6B) is supplied to the coils 161 and 162, and the current I2 shown in the following equation (2) (see FIG. 6C) is supplied to the coils 163 and 164, Good.

I1 = aCOSθ (1)
I2 = aSINθ (2)

  Here, in the following expressions (1) and (2), the absolute values of I1 and I2 are the magnitudes of the currents I1 and I2 supplied to the coils 161, 162, 163, and 164, respectively. Represents The signs I1 and I2 indicate the directions of the currents I1 and I2 supplied to the coils 161, 162, 163, and 164, respectively. Hereinafter, the direction of the synthetic magnetic field CF1 is represented by an angle θ that makes the X direction. The magnitude m of the composite magnetic field CF1 correlates with the maximum current value a of the current I1 and the current I2, and the relationship is determined by the number of windings from the coil 161 to the coil 164 and the like.

  The tester 200 inputs an inspection signal to the magnetic sensor module 300 via the probe card 130, generates a magnetic field from the coil 161 to the coil 164 of the probe card 130, or probes the response signal of the magnetic sensor module 300 to the inspection signal. By acquiring through the card 130, the magnetic sensor module 300 is inspected.

  FIG. 1 is a flowchart for explaining wafer inspection of the magnetic sensor module 300 by the inspection system 1. This flowchart shows the flow of inspection of any one of the plurality of magnetic sensor modules 300 formed on the wafer 30.

  First, the tester 200 performs zero magnetic field adjustment (see step S100). Specifically, the tester 200 acquires a supply current value (hereinafter referred to as a zero magnetic field correction value) to the coil necessary to cancel the noise magnetic field applied to the magnetic sensor module 300 by the magnetic field SF1 and the magnetic field SF2. . Here, the noise magnetic field is a magnetic field generated by geomagnetism or electrical equipment.

  For example, the zero magnetic field adjustment is performed as follows. First, a wafer 30 on which a magnetic sensor module 300 having a known output in a state where an external magnetic field is removed (hereinafter referred to as a zero magnetic field state) is formed is attached to a test stage of the prober 100. The tester 200 reads the supply current value when the response signal of the magnetic sensor module 300 indicates the zero magnetic field state as the zero magnetic field correction value while changing the supply current value from the coil 161 to the coil 164. The tester 200 stores the zero magnetic field correction value in a storage device of the inspection system 1, for example, a memory (not shown) mounted on the tester 200. Here, the measurement of the response signal of the magnetic sensor module 300 by the tester 200 is performed by the tester 200 reading the output of the magnetic sensor module 300 via the probe card 130 brought into contact with the magnetic sensor module 300. Details of the response signal measurement method will be described later. The zero magnetic field adjustment need not always be performed, and may be performed, for example, every predetermined number of inspections. The zero magnetic field adjustment may be performed by arranging a magnetic field measuring device such as a gauss meter in the vicinity of the tip of the probe 144 and measuring an external magnetic field by the magnetic field measuring device.

  In step S <b> 101, the prober 100 aligns the magnetic sensor module 300 with the probe card 130. Specifically, for example, when the prober 100 moves the test stage, the X direction of the probe card 130 and the design sensitivity direction of the magnetic sensor 302 become parallel, and the Y direction of the probe card 130 and the magnetic sensor 304 become parallel. The wafer 30 is positioned with respect to the probe card 130 so that the sensitivity direction in the design is parallel. At this time, the magnetic sensor module 300 may be aligned with the probe card 130 based on the dicing line 32 (see FIG. 3) formed on the wafer 30. By aligning the magnetic sensor module 300 with respect to the probe card 130 with reference to the dicing line as a reference line, for example, the probe card 130 and the chip with reference to an alignment mark attached to the magnetic sensor module 300 after dicing. Compared with the case where the magnetic sensor module 300 in a state is aligned, or the magnetic sensor module 300 after the package is mounted on the socket and aligned with the coil for applying a magnetic field to the magnetic sensor module 300, the coil The probe card 130 having the magnetic sensor module 300 can be accurately aligned. As a result, the magnetic sensor can be inspected while applying the combined magnetic field CF1 in the correct direction by the coil of the probe card 130, and the inspection accuracy of the magnetic sensor can be increased.

  Next, the probe card 130 is brought into contact with the magnetic sensor module 300 (see step S102). Specifically, the prober 100 raises the test stage to bring the probe 144 of the probe card 130 into contact with the terminal of the magnetic sensor module 300. As a result, the tester 200 is electrically connected to the magnetic sensor module 300.

Next, the magnetic sensor module 300 is inspected without applying the synthetic magnetic field CF1 to the magnetic sensor module 300 (see step S104).
FIG. 7 is a flowchart showing a flow of inspection in step S104.
First, the tester 200 performs an open / short test (see step S200). In the open / short test, the tester 200 inspects whether there is an open or short-circuited wiring in the magnetic sensor module 300 by an existing inspection method. The existing inspection method is, for example, a method for determining electrical continuity between terminals by supplying current to predetermined terminals (including inspection terminals other than input / output terminals), and an inspection method such as a boundary scan.

  Next, the tester 200 performs a leak current test (see step S202). In the leak current test, the tester 200 measures the leak current by applying a voltage to predetermined terminals (including inspection terminals other than the input / output terminals) of the magnetic sensor module 300 via the probe card 130. Whether the magnetic sensor module 300 is normal or abnormal is determined based on the result.

Next, the tester 200 performs a function test (see step S204). In the function test, the tester 200 checks whether the digital signal processing unit 340 of the magnetic sensor module 300 is operating as specified.
Specifically, for example, the function test is performed as follows. The inspection system 1 stores a plurality of patterns of inspection signals and a response signal (hereinafter referred to as a normal response signal) output when the inspection signals are input to the normal digital signal processing unit 340 in the storage device described above. I am letting. The tester 200 applies a power supply voltage to the terminal 364 of the magnetic sensor module 300 via the probe card 130, inputs a clock signal to the terminal 360, and inputs an inspection signal to the terminal 362. As a result, the digital signal processing unit 340 outputs a response signal corresponding to the inspection signal to the terminal 362. The tester 200 reads this response signal via the probe card 130. Then, the tester 200 determines whether the digital signal processing unit 340 is normal or abnormal by comparing the response signal output from the digital signal processing unit 340 with the normal response signal. The tester 200 inspects a plurality of functions of the digital signal processing unit 340 by repeating the series of processes described above using a plurality of patterns of inspection signals stored in the storage device and the corresponding response signals at normal times. . In the inspection process of step S104, the tester 200 may inspect the digital signal processing unit 340 that can be performed without applying the composite magnetic field CF1 to the magnetic sensor module 300. The illustrated open / short test, leakage current, etc. Tests and function tests are not necessarily performed.

  When the inspection in step S104 described above is completed, the tester 200 inspects the magnetic sensor of the magnetic sensor module 300 (see step S106 in FIG. 1). In the inspection of the magnetic sensor, the composite magnetic field CF1 is applied to the magnetic sensor module 300 in a state where the power supply voltage and the clock signal are supplied to the magnetic sensor module 300 following the function test.

FIG. 8 is a flowchart showing a flow of inspection of the magnetic sensor.
In step S300 to step S302, the tester 200 performs a sensitivity test. Specifically, for example, the tester 200 applies an external magnetic field having a sensitivity range lower limit to the magnetic sensor (see step S300). More specifically, the tester 200 supplies a current including a zero magnetic field correction value from the coil 161 to the coil 164 so that an external magnetic field having a lower sensitivity range is applied to the magnetic sensor. CF1 is generated. Next, the tester 200 reads the response signal of the magnetic sensor module 300 via the probe card 130, and determines whether or not the read response signal is a response signal corresponding to the external magnetic field being applied. Check the sensitivity of the sensor. Then, the tester 200 stores the inspection result of the sensitivity test in the storage device of the inspection system 1 (see step S302).

  In steps S304 to S308, the tester 200 performs an orthogonality test. Specifically, for example, the tester 200 applies an external magnetic field of 0 degrees to the magnetic sensor (see step S304). More specifically, the tester 200 generates a combined magnetic field CF1 in which an external magnetic field of 0 degrees is applied to the magnetic sensor by supplying a current including a zero magnetic field correction value from the coil 161 to the coil 164. Next, the tester 200 causes the digital signal processing unit 340 to output a response signal indicating the output of the magnetic sensor 302 and a response signal indicating the output of the magnetic sensor 304, and reads the response signals via the probe card 130. (See step S306). Next, the tester 200 identifies the orthogonality between the output of the magnetic sensor 302 and the output of the magnetic sensor 304 from the read response signal. The tester 200 stores the orthogonality between the output of the magnetic sensor 302 and the output of the magnetic sensor 304 in the storage device of the inspection system 1 (see step S308). The direction of the external magnetic field applied in the orthogonality test may be a direction other than 0 degrees. Further, the orthogonality between the output of the magnetic sensor 302 and the output of the magnetic sensor 304 may be determined from response signals to external magnetic fields applied in a plurality of directions.

In steps S310 to S318, the tester 200 applies an external magnetic field in a range of 360 degrees at a predetermined interval, and each time an external magnetic field in a different direction is applied to the magnetic sensor module 300, the tester 200 responds to the external magnetic field. Read the angle signal as a signal. In this test, an output azimuth circle is obtained from the read angle signal, for example, in the X-direction and Y-direction coordinate planes. Then, it is confirmed whether the center of the azimuth circle is not deviated from the center of the ideal azimuth circle, whether the azimuth circle is closed, or whether the azimuth circle is an ellipse. Hereinafter, the processing from step S308 to step S318 is referred to as a detection angle test.
First, the tester 200 applies an external magnetic field in an unmeasured direction to the magnetic sensor module 300 (see step S310). For example, when the tester 200 measures a response signal to an external magnetic field in a range of 360 degrees at intervals of 22.5 degrees, the external of 0 degree, 22.5 degrees, 45.0 degrees, ..., 337.5 degrees Magnetic fields are generated in this order.

Next, the tester 200 reads the response signal of the magnetic sensor module 300 via the probe card 130 (see step S312).
Next, the tester 200 determines whether or not a response signal is output from the magnetic sensor module 300 (see step S314). If there is an output from the magnetic sensor module 300, the tester 200 proceeds to the inspection process in step S316. When there is no output from the magnetic sensor module 300, the tester 200 considers that the magnetic sensor module 300 has failed. In that case, the tester 200 stops the measurement of the magnetic sensor module 300 even if there is an external magnetic field in an unmeasured direction. Note that the tester 200 may continue the measurement even if there is no output from the magnetic sensor module 300.

In step S316, the tester 200 stores the read response signal in the storage device of the inspection system 1.
Next, the tester 200 determines whether or not a response signal for an external magnetic field in all directions has been measured (see step S318). If it is determined that there is an external magnetic field in an unmeasured direction, the tester 200 returns to the inspection process in step S310. If it is determined that the measurement has been made with respect to the omnidirectional external magnetic field, the tester 200 removes the combined magnetic field CF1 by stopping the current supply from the coil 161 to the coil 164 (see step S320). The timing for removing the composite magnetic field CF1 may be any time after the response signal to the omnidirectional external magnetic field is measured.

  In step S322, the tester 200 determines whether or not the magnetic sensor has output an appropriate signal with respect to the omnidirectional external magnetic field, and the determination result is stored in the storage device of the inspection system 1 as the inspection result of the detection angle test. Store. Specifically, for example, the tester 200 considers the orthogonality test result, and based on the error between the measured response signal and the ideal response signal for the applied external magnetic field, Evaluate the output signal for the magnetic field.

When the detection angle inspection described above is completed, the tester 200 proceeds to the inspection process in step S108 shown in FIG.
In step S <b> 108, the tester 200 writes the correction value of the magnetic sensor according to the inspection results of various tests in the memory 330 of the magnetic sensor module 300.
In step S110, the tester 200 inspects the power supply current. Specifically, for example, the tester 200 measures the current consumption of the magnetic sensor module 300 during a predetermined operation. The predetermined operation time is, for example, when the magnetic sensor module 300 is not operated or when an angle signal is read. The tester 200 determines whether the power supply current is normal or abnormal by comparing the measured current consumption with the current consumption of the normal magnetic sensor module 300.
In step S <b> 112, the prober 100 separates the magnetic sensor module 300 from the probe card 130. Specifically, the prober 100 moves the test stage downward to separate the probe 144 of the probe card 130 from the terminal 360 of the magnetic sensor module 300 from the terminal 364.

  As described above, in the wafer inspection of the magnetic sensor module 300 by the inspection system 1, the inspection of the digital signal processing unit 340, the inspection of the magnetic sensor, and the magnetic sensor can be performed by connecting the probe card 130 to the magnetic sensor module 300 once. This correction value can be written to the memory 330. Thus, since the inspection process of the magnetic sensor module 300 can be simplified, the manufacturing cost of the magnetic sensor module 300 can be reduced.

In addition, when the inspection result in each test of the wafer inspection according to the first embodiment indicates a failure, the tester 200 may move to the inspection of the uninspected magnetic sensor module 300 without performing the inspection after the test.
Further, the tester 200 may not determine the inspection result for each test.

(Second embodiment)
The components of the inspection system according to the second embodiment are substantially the same as the corresponding components of the inspection system 1 according to the first embodiment except for the probe card.
FIG. 9 is a plan view of a probe card according to the second embodiment. FIG. 10 is an enlarged view of the vicinity of the probe card at the time of inspection.
A probe card 430 according to the second embodiment includes a probe head 440, a printed wiring board 450, coils 461 to 468, and the like. The printed wiring board 450 is substantially the same as the printed wiring board 150 according to the first embodiment.

  The probe head 440 has a base 442 and a plurality of probe groups 445. The plurality of probe groups 445 are arranged in a lattice pattern near the center of the base portion 442, and each probe group 445 includes a plurality of probes 444 that are substantially the same as the probes 144 according to the first embodiment. . The probe card 430 can contact a plurality of magnetic sensor modules 300 formed on the wafer 30 by a plurality of probe groups 445. The number of probe groups 445 is not limited to the four illustrated, and may be two, three, or five or more. Further, since the arrangement of the probe group 445 is determined according to the arrangement of the magnetic sensor module 300 formed on the wafer 30, the probe group 445 may be arranged in any manner on the base 442.

  The coils 461 to 468 are fixed to the probe head 440 similarly to the coils 161 to 164 according to the first embodiment. The coils 461 and 462 are disposed on both sides of the probe group 445 and are connected in the same manner as the connection of the coils 161 and 162 according to the first embodiment. The coil 461 and the coil 462 generate a magnetic field MF1 near the tip of the probe group 445 by supplying current. The coil 463 and the coil 464 are arranged and connected on both sides of the probe group 445 so that the magnetic field MF2 in the same direction as the magnetic field MF1 is generated in the vicinity of the tip of the probe group 445.

  The coil 465 and the coil 466 are arranged and connected on both sides of the probe group 445 so that the magnetic field MF3 orthogonal to the magnetic field MF1 and the magnetic field MF2 is generated in the vicinity of the tip of the probe group 445. Coil 467 and coil 468 are arranged and connected on both sides of probe group 445 so that magnetic field MF4 in the same direction as magnetic field MF3 is generated in the vicinity of the tip of probe group 445. Hereinafter, the direction from the coil 461 toward the coil 462 is referred to as the X2 direction (see arrow X2), and the direction from the coil 465 toward the coil 466 is referred to as the Y2 direction (see arrow Y2).

  Thus, by arranging two coils on both sides of the probe group 445, a uniform magnetic field in the X2 direction by the magnetic field MF1 and the magnetic field MF2 can be applied near the tip of the probe group 445, and a plurality of probes can be applied. A uniform magnetic field in the Y2 direction by the magnetic field MF3 and the magnetic field MF4 can be applied near the tip of the group 445. Three or more coils may be arranged on both sides of the probe group 445.

Each step of the wafer inspection of the magnetic sensor module 300 by the inspection system of the second embodiment is the same as the magnetic sensor by the inspection system 1 of the first embodiment except that a plurality of magnetic sensor modules 300 are inspected in each step. This is substantially the same as the wafer inspection of the module 300.
In the wafer inspection of the magnetic sensor module 300 of the second embodiment, the digital signal processing units and magnetic sensors of the plurality of magnetic sensor modules 300 are inspected by one connection of the probe card 430 to the magnetic sensor module 300. The number of connection of the probe card 430 to the magnetic sensor module 300 per magnetic sensor module 300 necessary for inspecting the magnetic sensor module 300 can be reduced. As a result, since the inspection time per magnetic sensor module 300 can be shortened, the manufacturing cost of the magnetic sensor module 300 can be reduced.

(Third embodiment)
In the wafer inspection according to the first embodiment, the digital signal processing unit 340 and the magnetic sensor are connected to the magnetic sensor module 300 of the probe card 130 once by electrically writing the correction value of the magnetic sensor in the memory 330. At the same time, the correction value of the magnetic sensor is written into the memory 330. However, when the magnetic sensor module does not include an electrically writable storage unit (for example, the memory 330 according to the first embodiment) for writing the correction value of the magnetic sensor, the wafer inspection inspection according to the first embodiment is performed. The method cannot be applied as it is. Therefore, in the third embodiment, an inspection method for reducing the manufacturing cost of a magnetic sensor module that does not include an electrically writable storage unit for storing a correction value of the magnetic sensor will be described.

  The magnetic sensor module according to the third embodiment has a laser writing type memory instead of the memory 330 of the magnetic sensor module 300 according to the first embodiment. The inspection system according to the third embodiment includes a laser irradiation device for writing a correction value of a magnetic sensor in a laser writing type memory in addition to substantially the same components as the inspection system 1 according to the first embodiment. Yes.

FIG. 11 is a flowchart showing a flow of inspection of the magnetic sensor module by the inspection system of the third embodiment. In the flowchart shown in FIG. 11, the zero magnetic field adjustment step is omitted.
First, the prober 100 aligns an uninspected magnetic sensor module formed on the wafer 30 with the probe card 130 in the same manner as in step S101 of wafer inspection according to the first embodiment (see step S400).
In step S <b> 402, the prober 100 brings the probe card 130 into contact with an uninspected magnetic sensor module formed on the wafer 30.

  In step S404, the tester 200 performs various inspections of the magnetic sensor module in the same manner as the wafer inspection steps S104 to S110 (see FIG. 1) according to the first embodiment. However, the tester 200 does not perform the process corresponding to step S108 (see FIG. 1) of the wafer inspection according to the first embodiment, that is, the process of writing the correction value of the magnetic sensor in the laser writing type memory, and the correction value is set. Store in the storage device of the inspection system. After all the magnetic sensor modules formed on the wafer 30 have been inspected, the tester 200 collectively writes the correction values stored in the magnetic sensor storage device into all the magnetic sensor modules determined to be non-defective. Details will be described later.

In step S <b> 406, the prober 100 separates the magnetic sensor module from the probe card 130.
In step S <b> 408, the tester 200 determines whether all the magnetic sensor modules formed on the wafer 30 have been inspected. If it is determined that there is an uninspected magnetic sensor module, the tester 200 returns to the step S400 and inspects the uninspected magnetic sensor module. If it is determined that all the magnetic sensor modules have been inspected, the tester 200 proceeds to step S410.

  In step S410, the tester 200 sets the corresponding correction value stored in the storage device of the inspection system in each memory of all the magnetic sensor modules determined to be non-defective among the magnetic sensor modules formed on the wafer 30. Write with a laser irradiation device. Specifically, the tester 200 irradiates a laser writing device with a laser beam to a laser writing type memory, and burns a part of the laser writing type memory circuit with the laser beam, so that the laser writing type memory has a magnetic sensor. Write the correction value.

In the wafer inspection according to the third embodiment described above, after all the magnetic sensor modules formed on the wafer 30 are inspected, the correction values of the magnetic sensors are collectively written in the memory. Accordingly, the wafer inspection process of the magnetic sensor module is simplified as compared with the case where the inspection of the magnetic sensor module 300 by the probe card 130 and the writing of the correction value of the magnetic sensor to the memory by the laser irradiation apparatus are alternately performed. Therefore, the manufacturing cost of the magnetic sensor module can be reduced.
The wafer inspection according to the third embodiment can also be applied to a magnetic sensor module including an electrically writable storage unit.

The flowchart which shows the flow of the wafer inspection which concerns on a 1st Example. The schematic diagram of the test | inspection system by a 1st Example. The schematic diagram for demonstrating the magnetic sensor module which concerns on a 1st Example. The enlarged view of the probe card vicinity of the inspection system by a 1st Example. The top view of the probe card which concerns on a 1st Example. The schematic diagram for demonstrating the relationship between a synthetic magnetic field and the electric current supplied to a coil. The flowchart which shows the flow of the test | inspection performed without applying a magnetic field. The flowchart which shows the flow of a test | inspection of the magnetic sensor performed while applying a magnetic field. The top view of the probe card which concerns on a 2nd Example. The enlarged view of the probe card vicinity of the inspection system by a 2nd Example. The flowchart which shows the flow of the wafer inspection which concerns on a 3rd Example.

Explanation of symbols

30 wafers, 32 dicing lines (reference patterns), 130, 430 probe cards, 161-164 coils, 300 magnetic sensor modules, 302, 304 magnetic sensors, 330 memories (storage units), 340 digital signal processing units, 461-468 coils

Claims (4)

A probe card having a coil for applying a magnetic field to the magnetic sensor is brought into contact with any one of the magnetic sensor modules having a magnetic sensor and a digital signal processor formed on the wafer,
Without separating the probe card from the magnetic sensor module,
By inspecting the digital signal processing unit by inputting the inspection signal to the digital signal processing unit through the probe card and obtaining the response signal of the digital signal processing unit with respect to the inspection signal through the probe card, Inspecting the magnetic sensor by obtaining a response signal of the magnetic sensor module through the probe card while supplying current to the coil.
Inspection method of magnetic sensor module.   The magnetic sensor module inspection method according to claim 1, wherein the probe card is aligned with the magnetic sensor module based on a reference pattern regularly and repeatedly formed on the wafer. Bringing the probe card into contact with a plurality of the magnetic sensor modules at once;
The magnetic sensor module inspection method according to claim 1, wherein a magnetic field generated by supplying current to the coil is applied to the magnetic sensors of the plurality of magnetic sensor modules when the magnetic sensor is inspected.   2. The correction value is stored in the storage unit of the magnetic sensor module by inputting the correction value of the magnetic sensor according to the inspection result of the magnetic sensor to the magnetic sensor module via the probe card. 4. The method for inspecting a magnetic sensor module according to claim 1.

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