JP2007023326A5 - - Google Patents

Claims (14)

  A metal thin film forming apparatus for forming a layer made of a chemical for plating on a processing surface of a substrate to be processed on which a metal thin film is formed by an electroless plating method, and holding the substrate to be processed with the surface to be processed downward A metal thin film forming apparatus comprising: a holding mechanism for operation; and a discharge means for discharging the chemical solution disposed at an interval and opposite to the surface to be processed. . A chemical supply source for supplying the chemical to the discharge means;
The metal thin film forming apparatus according to claim 1, further comprising a moving unit configured to move the discharge unit relative to a processing surface of the substrate to be processed.   The metal thin film forming apparatus according to claim 1, wherein the discharge unit has an elongated discharge port.   4. The metal thin film forming apparatus according to claim 3, wherein the substrate to be processed has a width dimension, and the discharge port of the discharge means has a length dimension larger than the width dimension of the substrate to be processed.   5. The metal thin film forming apparatus according to claim 3, wherein the discharge port of the discharge means is divided into two or more in the longitudinal direction.   6. The apparatus according to claim 1, further comprising a plurality of other ejection units respectively used for ejecting a chemical liquid other than the chemical liquid, a cleaning liquid, and a gas to the surface to be processed of the substrate to be processed. The metal thin film forming apparatus described in 1. The source is
A plurality of tanks for storing different chemical solutions,
The metal thin film forming apparatus according to claim 2, further comprising switching means for switching supply of the chemical solution from the tank.   The substrate to be processed and the substrate to be processed so that the distance between the surface to be processed and the discharge port of the discharge means provided below the surface to be processed is within the discharge distance of the electroless plating chemical without contact. 2. The metal thin film forming apparatus according to claim 1, further comprising an alignment mechanism for aligning an ejection port position of the ejection means.   A chemical solution is supplied to the discharge means such that the processing surface of the substrate to be processed and the discharge port of the discharge means provided below the processing surface are within the discharge distance of the electroless plating chemical solution without contact. 2. The metal thin film forming apparatus according to claim 1, further comprising a discharge force control mechanism for controlling the discharge force of the metal thin film. The chemical solution for the plating process is discharged from the elongated discharge port of the discharge means disposed below the surface to be processed of the substrate to be processed on which the metal film is formed by the electroless plating method so as to be opposed to and spaced from the surface. , A step of storing the chemical liquid in the discharge port;
Bringing the chemical stored in the discharge port of the discharge means into contact with the surface of the substrate to be processed;
A step of moving the substrate to be processed or the discharging means while bringing the chemical solution into contact with the surface to be processed of the substrate to be processed, thereby forming a layer made of the chemical on the surface to be processed of the substrate to be processed; A method for forming a metal thin film, comprising:   A liquid other than the chemical liquid is discharged from the discharge means toward the surface to be processed of the substrate to be processed for pre-processing or subsequent post-processing prior to forming the chemical layer on the surface to be processed of the substrate to be processed. The method for forming a metal thin film according to claim 10, wherein:   For pre-processing prior to the formation of the chemical solution layer on the surface to be processed of the substrate to be processed or subsequent post-processing, from the discharge means other than the discharge means toward the surface to be processed of the substrate to be processed other than the chemical liquid The metal thin film forming method according to claim 10, wherein a liquid is discharged. Providing the substrate surface to be processed facing downward;
A step of setting a distance between a discharge nozzle for discharging a chemical for applying to the surface to be processed and the surface to be processed within a discharge distance of the chemical,
A method of forming a metal thin film, comprising: a step of relatively moving the discharge nozzle and the surface to be processed in a state where a chemical is discharged from the discharge nozzle. A step of providing the plating target surface of the substrate to be processed above the discharge port of the discharge means provided so as to discharge the electroless plating solution upward and within the discharge distance;
And a step of relatively moving the substrate to be processed and the discharge means and discharging a chemical solution for electroless plating upward from the discharge port.