JP2007019253A - Manufacturing method and manufacturing device for laminated electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a laminated electronic component avoiding a stress generated in a conductor as much as possible, in a process for obtaining a laminate by sequentially superposing a ceramic green sheet with the conductor as coping with the component. <P>SOLUTION: In lamination process, heat and pressure are applied locally on four places (hot press places HPP) of an outer peripheral area PA of the green sheets S1-S3 whereon the conductor is not formed whereby the sheets are connected to each other. In short, the heat and pressure will not be applied to the group of conductors IEL existing at the inside of the outer peripheral area PA upon connecting the sheets to each other, whereby the generation of stress in the conductor IEL by the heat and pressure is avoided as much as possible. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method and apparatus for manufacturing multilayer electronic components such as multilayer capacitors, multilayer inductors, multilayer varistors, multilayer thermistors, and multilayer substrates.

  In the manufacturing process of multilayer electronic components such as multilayer capacitors, multilayer inductors, multilayer varistors, multilayer thermistors, multilayer substrates, etc., ceramic green sheets (hereinafter simply referred to as green sheets) on which the corresponding conductors are formed are sequentially stacked. The step of obtaining a body is included.

In this laminating process, an apparatus including a laminating head with a built-in heater that can move at least vertically and horizontally and a table with a built-in heater are generally used. The stacking head has a flat lower surface with a large number of suction holes, and the green sheet held on the lower surface is pressed on the green sheet on the table or on the table to release the holding, thereby performing the desired stacking . Since the lamination head and the table are heated to a predetermined temperature, and the green sheet on the lamination head side is pressed to the green sheet on the table side with a predetermined pressure, the sheets are bonded to each other by heat and pressure (thermocompression bonding).
JP-A-4-282813

  Since the stacking head in the conventional apparatus uses the flat lower surface as the pressing surface, the green sheet on the stacking head side is pressed to the green sheet on the table side with a predetermined pressure, and the sheets are joined to each other. That is, since heat and pressure are applied not only to the green sheet but also to the conductor formed on the green sheet, it is difficult to avoid distortion that may occur in the conductor due to the heat and pressure.

  The present invention was created in view of the above circumstances, and its purpose is to avoid as much as possible distortion that may occur in the conductor in the process of sequentially stacking the ceramic green sheets on which the conductors corresponding to the components are formed to obtain a laminate. Another object of the present invention is to provide a method for manufacturing a multilayer electronic component and a manufacturing apparatus for a multilayer electronic component suitable for carrying out the manufacturing method.

  In order to achieve the above object, a method for manufacturing a multilayer electronic component according to the present invention is a method for manufacturing a multilayer electronic component including a step of sequentially stacking ceramic green sheets on which conductors corresponding to components are formed to obtain a multilayer body. In the lamination step, the sheets are bonded to each other by locally applying heat and pressure to a plurality of locations in the outer peripheral area of the ceramic green sheet where the conductor is not formed. According to this manufacturing method, since heat and pressure are not given to the conductor existing inside the outer peripheral area when the sheets are joined to each other, it is possible to prevent the conductor from being distorted by heat and pressure as much as possible.

  On the other hand, the multilayer electronic component manufacturing method according to the present invention is a multilayer electronic component manufacturing apparatus including a device that sequentially stacks ceramic green sheets on which component-corresponding conductors are formed to obtain a multilayer body. The apparatus includes a multilayer head having a plurality of pin guide holes corresponding to an outer peripheral area of the ceramic green sheet where the conductor is not formed, and a vertically movable ceramic head along each pin guide hole. It is characterized by comprising a plurality of hot press pins capable of pressing the sheet and a mechanism for moving the plurality of hot press pins up and down. According to this manufacturing apparatus, the above manufacturing method can be carried out accurately and stably.

  According to the present invention, a method for manufacturing a multilayer electronic component capable of avoiding as much distortion as possible in a conductor in a step of sequentially stacking ceramic green sheets on which conductors corresponding to components are formed to obtain a multilayer body, and the implementation of the manufacturing method An apparatus for manufacturing a suitable multilayer electronic component can be provided.

  The above object and other objects, structural features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

  1 to 13 show an embodiment of the present invention.

  First, with reference to FIG.1 and FIG.2, the apparatus used at a lamination process is demonstrated. This apparatus includes a laminated head 11 and a table 21.

  The laminating head 11 has a flat lower surface in which a large number of suction holes (not shown) are formed, and has four pin guide holes 11a having a rectangular cross section that allows the vertical movement of a hot press pin 18 described later. The laminated head 11 is attached to the movable platen 13 through a plurality of support columns 12. The movable platen 13 is attached to a movable part of a drive mechanism (not shown), and the laminated head 11 is at least vertically movable and horizontally movable.

  Further, a support base 14 is provided on the upper surface of the laminated head 13, and a pin lift cylinder 15 is attached to the support base 14, and a lift plate 16 is attached to the rod 15 a of the cylinder 15. Furthermore, a total of four hot press pins 18 are attached to the lift plate 16 via support columns 17.

  Each of the hot press pins 18 has an L-shaped section in the lower part, and a heater for heating the hot press pin 18 to a predetermined temperature is built in the upper part. Moreover, the lower end shape of each hot press pin 18 comprises L shape, and the lower part is inserted in the pin guide hole 13a so that a vertical movement is possible. As can be seen from FIG. 2, each hot press pin 18 (each pin guide hole 13a) is arranged so that the directions of the adjacent hot press pins 18 differ by 90 degrees. Further, as shown in FIGS. 3 to 5, the positions of the respective hot press pins 18 (the respective pin guide holes 13a) are ceramic green sheets S1 to S3 (hereinafter simply referred to as green sheets S1 to S3). It is a position facing each of the four corners of the outer peripheral area PA. Incidentally, the part shown with the broken line in FIGS. 3-5 is the hot press location HPP of the four hot press pins 18 with respect to each green sheet S1-S3, and the lower end shape of the hot press pin 18 is L-shaped here. For this reason, the shape of the hot-pressed part HPP has an L shape corresponding to this.

  The table 21 has a flat upper surface that faces the flat lower surface of the laminated head 11 in parallel. A number of suction holes (not shown) are formed on the upper surface, and a base plate 22 for lamination is held on the upper surface.

  Next, the green sheets S1 to S3 to be stacked will be described with reference to FIGS. The green sheets S1 to S3 are for multilayer capacitors.

  As shown in FIG. 3, the green sheet S1 is a rectangular sheet having a predetermined size obtained by applying a slurry containing a dielectric powder, an organic binder, and an organic solvent to a film with a predetermined thickness and drying. It is a punched one.

  As shown in FIGS. 4 and 5, green sheets S2 and S3 are printed with a paste containing metal powder, an organic binder and an organic solvent in a predetermined shape, thickness and arrangement on the same belt-like sheet as described above, and dried. A conductor (internal electrode layer) IEL is formed, and a belt-like sheet is punched into a rectangular shape with a predetermined size so that the group of conductors IEL is included. The arrangement of the conductors IEL of the green sheet S2 and the arrangement of the conductors IEL of the green sheet S3 are different from each other as shown in FIGS. It comes to face each other.

  The green sheets S2 and S3 are provided with an outer peripheral area PA for hot pressing between a region surrounding the group of conductors IEL (see a two-dot chain line) and the outer peripheral edge, that is, an outer peripheral portion where no conductor is formed. A similar outer peripheral area PA for hot pressing is set for the green sheet S1 that does not have the conductor IEL.

  Next, a method of manufacturing a multilayer capacitor using the apparatus shown in FIGS. 1 and 2 and the green sheets S1 to S3 shown in FIGS. 3 to 5 will be described with reference to FIGS.

  First, as shown in FIG. 6, the stacking head 11 holding the first green sheet S <b> 1 is moved onto the table 21. Then, as shown in FIG. 7, the laminated head 11 is lowered to bring the lower surface of the green sheet S <b> 1 into contact with the upper surface of the base plate 22. The lowering stop position of the laminated head 11 is controlled by a predetermined mechanical movement amount, and is controlled based on a detection signal of at least one pressure sensor (not shown) arranged on the lower side of the base plate 22. Also good. The contact here means a state where no pressure is applied to the green sheet S1 to cause mutual pressure bonding.

  After contact, as shown in FIG. 8, the rod 15a of the cylinder 15 for raising and lowering the pins is lowered to move the four hot press pins 18 downward, and the lower end of each hot press pin 18 is the outer peripheral area of the green sheet S1. Press simultaneously at a predetermined pressure in each of the four corners of PA. Since each hot press pin 18 is heated to a predetermined temperature by a heater, as shown in FIG. 10, heat and pressure are locally applied only to each hot press location HPP in the outer peripheral area PA of the green sheet S1. The green sheet S1 is bonded (thermocompression bonding) to the base plate 22. In order to perform this bonding accurately, the temperature of each hot press pin 18 is preferably set to be equal to or higher than the glass transition point of the organic binder contained in the green sheet S1.

  Thereafter, as shown in FIG. 9, the four hot press pins 18 are raised and returned, and the holding is released and the laminated head 11 is raised and returned.

  Subsequently, the stacking head 11 holding the second green sheet S1 is moved onto the table 21 in the same manner as described above. Then, the stacking head 11 is lowered to bring the lower surface of the green sheet S1 into contact with the upper surface of the lower green sheet S1. The control of the descent stop position of the laminated head 11 is as described above, and the contact here means a state in which no pressure is applied to the green sheet S1 to cause mutual pressure bonding.

  After the contact, as described above, the rod 15a of the cylinder 15 for raising and lowering the pin is lowered to move the four hot press pins 18 downward, and the lower end of each hot press pin 18 is set to 4 in the outer peripheral area PA of the green sheet S1. Simultaneously press each corner with a predetermined pressure. Since each hot press pin 18 is heated to a predetermined temperature by a heater, as shown in FIG. 10, heat and pressure are locally applied only to each hot press location HPP in the outer peripheral area PA of the green sheet S1. The green sheet S1 is bonded (thermocompression bonding) to the lower green sheet S1. In order to perform this bonding accurately, the temperature of each hot press pin 18 is preferably set to be equal to or higher than the glass transition point of the organic binder contained in the green sheet S1.

  Thereafter, the green sheets S1 are repeatedly stacked, and a predetermined number of green sheets S1 are stacked.

  After the predetermined number of green sheets S1 are stacked, the stacking head 11 holding the first green sheet S2 is moved onto the table 21 in the same manner as described above. Then, the stacking head 11 is lowered to bring the lower surface of the green sheet S2 into contact with the upper surface of the lower green sheet S1. The control of the descent stop position of the laminated head 11 is as described above, and the contact here means a state in which no pressure is applied to the green sheet S2 that causes mutual pressure bonding.

  After the contact, the rod 15a of the cylinder 15 for raising and lowering the pin is lowered to move the four hot press pins 18 downward, and the lower end of each hot press pin 18 is set to 4 in the outer peripheral area PA of the green sheet S2 as described above. Simultaneously press each corner with a predetermined pressure. Since each hot press pin 18 is heated to a predetermined temperature by a heater, as shown in FIG. 11, heat and pressure are locally applied only to each hot press location HPP in the outer peripheral area PA of the green sheet S2. The green sheet S2 is bonded (thermocompression bonding) to the lower green sheet S1. In order to perform this bonding accurately, it is preferable to set the temperature of each hot press pin 18 to be equal to or higher than the glass transition point of the organic binder contained in the green sheet S2.

  Subsequently, the stacking head 11 holding the first green sheet S3 is moved onto the table 21 in the same manner as described above. Then, the stacking head 11 is lowered to bring the lower surface of the green sheet S3 into contact with the upper surface of the lower green sheet S2. The control of the descent stop position of the stacking head 11 is as described above, and the contact here means a state in which a pressure causing mutual pressure bonding is not applied to the green sheet S3.

  After the contact, in the same manner as described above, the rod 15a of the cylinder 15 for raising and lowering the pins is lowered to move the four hot press pins 18 downward, and the lower end of each hot press pin 18 is set to 4 in the outer peripheral area PA of the green sheet S3. Simultaneously press each corner with a predetermined pressure. Since each hot press pin 18 is heated to a predetermined temperature by a heater, as shown in FIG. 12, heat and pressure are locally applied only to each hot press location HPP in the outer peripheral area PA of the green sheet S3. The green sheet S3 is bonded (thermocompression bonding) to the lower green sheet S2. In order to perform this bonding accurately, the temperature of each hot press pin 18 is preferably set to be equal to or higher than the glass transition point of the organic binder contained in the green sheet S3.

  Thereafter, the green sheets S2 and S3 are alternately stacked, and a predetermined number of green sheets S2 and S3 are stacked.

  After the predetermined number of green sheets S2 and S3 are stacked, the stacking head 11 holding the first green sheet S1 is moved onto the table 21. Then, the stacking head 11 is lowered to bring the lower surface of the green sheet S1 into contact with the upper surface of the lower green sheet S3. The control of the descent stop position of the laminated head 11 is as described above, and the contact here means a state in which no pressure is applied to the green sheet S1 to cause mutual pressure bonding.

  After the contact, as described above, the rod 15a of the cylinder 15 for raising and lowering the pin is lowered to move the four hot press pins 18 downward, and the lower end of each hot press pin 18 is set to 4 in the outer peripheral area PA of the green sheet S1. Simultaneously press each corner with a predetermined pressure. Since each hot press pin 18 is heated to a predetermined temperature by a heater, as shown in FIG. 13, heat and pressure are locally applied only to each hot press location HPP in the outer peripheral area PA of the green sheet S1. The green sheet S1 is bonded (thermocompression bonding) to the lower green sheet S1. In order to perform this bonding accurately, the temperature of each hot press pin 18 is preferably set to be equal to or higher than the glass transition point of the organic binder contained in the green sheet S1.

  Thereafter, the green sheets S1 are repeatedly stacked, and a predetermined number of green sheets S1 are stacked. This completes the lamination process.

  After the lamination process is completed, the laminated body obtained by the above-described stacking is taken out together with the base plate 22 from the table 21, and the laminated body is subjected to main pressure bonding by a mechanical press or an isostatic press. Subsequently, a dividing line for obtaining a laminated chip of unit size is set in a lattice shape in the laminated body after the main press using image processing technology, and after the main press along the set cutting line using a dicing apparatus or the like. A laminated chip is obtained by dividing the laminated body. The edges of the divided internal conductor IEL are alternately exposed at both end faces in the length direction of the multilayer chip. Subsequently, the multilayer chip is baked under conditions according to the material, and the paste similar to the above is applied to the both end surfaces in the length direction of the multilayer chip and the peripheral side surfaces after baking by a technique such as a dip method, and this is baked. A pair of external electrodes is formed.

  In the above-described manufacturing method, heat and pressure are locally applied to four locations (hot press locations HPP) of the outer peripheral area PA where the conductors of the green sheets S1 to S3 are not formed in the stacking process in a series of manufacturing processes. Its characteristic is that the sheets are connected to each other. That is, since heat and pressure are not applied to the group of conductors IEL existing inside the outer peripheral area PA when the sheets are joined to each other, it is possible to avoid distortion of the conductors IEL due to heat and pressure as much as possible.

  Further, the application of the heat and pressure is performed using the four hot press pins 18, and it is not necessary to heat the laminated head 11 and the table 21. It is possible to prevent the mechanical parallelism between the laminated head 11 and the table 21 from being out of order due to thermal expansion. In other words, since the mechanical parallelism between the laminated head 11 and the table 21 can be maintained, it is possible to obviate that biased pressure is applied to the green sheets S1 to S3 when the laminated head 11 is lowered. And the above stacking can be performed well.

  In the above-described embodiment, the hot press pins 18 are mutually coupled by a single press operation. However, the press operation of each hot press pin 18 is 2 for one green sheet S1 to S3. Mutual coupling may be performed by performing more than once.

  Moreover, in the said embodiment, although heat and pressure are simultaneously given to each hot press location HPP by lowering each hot press pin 18 simultaneously, it is comprised so that each hot press pin 18 can be moved up and down independently. Alternatively, if it is configured to move up and down in groups, which will be described later, heat and pressure are applied to the two hot press locations HPP that face each other in the diagonal direction, and then heat and pressure are applied to the remaining two hot press locations HPP. Pressure can also be applied. That is, each hot press location HPP may be divided into a plurality of groups and heat and pressure may be applied separately for each group.

  Furthermore, in the said embodiment, although the rectangular-shaped hot press location HPP was set in four corners of the outer periphery area PA of green sheet S1-S3, if the shape and position of this hot press location are settled in the outer periphery area PA, It can be changed as appropriate. FIG. 14 shows a first modification of the shape, and the shape of the hot press location HPP1 here (the shape of the lower end of the hot press pin) is rectangular. FIG. 15 shows a second modification of the shape, and the shape of the hot press location HPP2 here (the lower end shape of the hot press pin) is circular. FIG. 16 shows a first modification of the position. Here, two rectangular hot press locations HPP3 are set at portions (four side portions) excluding the corners of the outer peripheral area PA of the green sheets S1 to S3. is there. FIG. 17 shows a second modification of the position. Here, two circular hot press portions HPP4 are set in the portion (four side portions) excluding the corners of the outer peripheral area PA of the green sheets S1 to S3. is there. Of course, the shape and position of the hot press location can be changed in addition to these. In addition, the number of hot-pressed portions is not limited to the point where the bonding is performed if there are at least two, but depending on the size of the green sheets S1 to S3, five or more hot-pressed portions are set. Also good.

  Furthermore, in the said embodiment, what provided the heat press pin 18 in the lamination | stacking head 11 which has an adsorption | suction function (sheet | seat holding function) was shown as an apparatus, However, the adsorption | suction function (sheet | seat holding function) is excluded from the lamination | stacking head 11, The green sheets S1 to S3 may be transported and placed by another head.

  Further, in the above-described embodiment, an example in which the present invention is applied to the manufacture of a multilayer capacitor has been described. However, a multilayer type including a process of sequentially stacking ceramic green sheets on which conductors corresponding to components are formed to obtain a multilayer body as a manufacturing process. If it is an electronic component, it is applicable not only to a multilayer capacitor but also to other multilayer electronic components such as a multilayer inductor, a multilayer varistor, a multilayer thermistor, a multilayer substrate, etc., and the same effect as described above can be obtained.

It is a side view of the apparatus used at a lamination process. It is the sectional view on the aa line of FIG. It is a top view of green sheet S1. It is a top view of green sheet S2. It is a top view of green sheet S3. It is explanatory drawing of the process of accumulating green sheets S1-S3 sequentially, and obtaining a laminated body. It is explanatory drawing of the process of accumulating green sheets S1-S3 sequentially and obtaining a laminated body. It is explanatory drawing of the process of accumulating green sheets S1-S3 sequentially and obtaining a laminated body. It is explanatory drawing of the process of accumulating green sheets S1-S3 sequentially and obtaining a laminated body. It is explanatory drawing of the process of accumulating green sheets S1-S3 sequentially and obtaining a laminated body. It is explanatory drawing of the process of accumulating green sheets S1-S3 sequentially and obtaining a laminated body. It is explanatory drawing of the process of accumulating green sheets S1-S3 sequentially and obtaining a laminated body. It is explanatory drawing of the process of accumulating green sheets S1-S3 sequentially and obtaining a laminated body. It is a top view which shows the 1st modification of the shape of a hot press location. It is a top view which shows the 2nd modification of the shape of a hot press location. It is a top view which shows the 1st modification of the position of a hot press location. It is a top view which shows the 2nd modification of the position of a hot press location.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Laminated head, 11a ... Pin guide hole, 18 ... Hot press pin, 21 ... Table, S1, S2, S3 ... Green sheet, IEL ... Conductor, PA ... Outer peripheral area, HPP, HPP1, HPP2, HPP3, HPP4 ... Heat Press location.

Claims (17)

A multilayer electronic component manufacturing method including a step of sequentially stacking ceramic green sheets on which conductors corresponding to components are formed to obtain a laminate,
In the laminating step, the sheets are bonded to each other by locally applying heat and pressure to a plurality of locations in the outer peripheral area of the ceramic green sheet where no conductor is formed.
A method for producing a multilayer electronic component, comprising: Giving localized heat and pressure to multiple locations with multiple hot press pins,
The method of manufacturing a multilayer electronic component according to claim 1. Simultaneous application of local heat and pressure to multiple locations,
The method of manufacturing a multilayer electronic component according to claim 1 or 2, Dividing a plurality of locations into a plurality of groups, and applying local heat and pressure to the plurality of locations separately for each group,
The method of manufacturing a multilayer electronic component according to claim 1 or 2, Applying heat and pressure to each of multiple locations more than once,
The method for manufacturing a multilayer electronic component according to claim 3 or 4, wherein: The ceramic green sheet has a rectangular shape, and a plurality of hot press points to which heat and pressure are applied are set at corners of the outer peripheral area of the ceramic green sheet.
The method for manufacturing a multilayer electronic component according to any one of claims 1 to 5, wherein: The ceramic green sheet has a rectangular shape, and a plurality of hot press locations to which heat and pressure are applied are set at portions other than the corners of the outer peripheral area of the ceramic green sheet.
The method for manufacturing a multilayer electronic component according to any one of claims 1 to 5, wherein: The shape of the hot press part to which heat and pressure are applied is a rectangle,
The method for manufacturing a multilayer electronic component according to claim 1, wherein: The shape of the hot press part to which heat and pressure are applied is L-shaped,
The method for manufacturing a multilayer electronic component according to claim 1, wherein: The shape of the hot press part to which heat and pressure are applied is circular,
The method for manufacturing a multilayer electronic component according to claim 1, wherein: A multilayer electronic component manufacturing apparatus including a device that sequentially stacks ceramic green sheets on which conductors corresponding to components are formed to obtain a multilayer body,
The apparatus includes a multilayer head having a plurality of pin guide holes corresponding to an outer peripheral area of the ceramic green sheet where conductors are not formed, and a vertically movable movable head along each pin guide hole. A plurality of hot press pins capable of pressing and a mechanism for moving the plurality of hot press pins up and down,
An apparatus for manufacturing a multilayer electronic component. Each hot press pin is provided with a heater for heating the hot press pin to a predetermined temperature.
The apparatus for manufacturing a multilayer electronic component according to claim 11. The ceramic green sheet has a rectangular shape, and a plurality of hot press pins are arranged at positions where the corners of the outer peripheral area of the ceramic green sheet can be pressed.
The apparatus for manufacturing a multilayer electronic component according to claim 11 or 12, wherein: The ceramic green sheet has a rectangular shape, and the plurality of hot press pins are arranged at a position where the portion excluding the corner of the outer peripheral area of the ceramic green sheet can be pressed.
The apparatus for manufacturing a multilayer electronic component according to claim 11 or 12, wherein: The lower end shape of the hot press pin is a rectangle,
The apparatus for manufacturing a multilayer electronic component according to any one of claims 11 to 14, wherein the apparatus is a multilayer electronic component. The lower end shape of the hot press pin is L-shaped,
The apparatus for manufacturing a multilayer electronic component according to any one of claims 11 to 14, wherein the apparatus is a multilayer electronic component. The bottom shape of the hot press pin is circular,
The apparatus for manufacturing a multilayer electronic component according to any one of claims 11 to 14, wherein the apparatus is a multilayer electronic component.

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