JP2007014944A5 - - Google Patents

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Publication number
JP2007014944A5
JP2007014944A5 JP2006141909A JP2006141909A JP2007014944A5 JP 2007014944 A5 JP2007014944 A5 JP 2007014944A5 JP 2006141909 A JP2006141909 A JP 2006141909A JP 2006141909 A JP2006141909 A JP 2006141909A JP 2007014944 A5 JP2007014944 A5 JP 2007014944A5
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Japan
Prior art keywords
substrate
nozzles
solution
held
support base
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JP2006141909A
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Japanese (ja)
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JP4954610B2 (en
JP2007014944A (en
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Priority to JP2006141909A priority Critical patent/JP4954610B2/en
Priority claimed from JP2006141909A external-priority patent/JP4954610B2/en
Publication of JP2007014944A publication Critical patent/JP2007014944A/en
Publication of JP2007014944A5 publication Critical patent/JP2007014944A5/ja
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Publication of JP4954610B2 publication Critical patent/JP4954610B2/en
Expired - Fee Related legal-status Critical Current
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Claims (11)

基板を保持する回転支持台と、
前記回転支持台に保持された前記基板と対向して設けられ、前記基板に溶液を吐出する複数のノズルと、
前記複数のノズルを各々自在に移動させる駆動機構とを有することを特徴とする塗布装置。
A rotating support for holding the substrate;
The rotating support base provided the substrate and a counter which is held, a plurality of nozzles for discharging the solution into the substrate,
Coated cloth device; and a driving mechanism for moving each freely said plurality of nozzles.
基板を保持する回転支持台と、
前記回転支持台に保持された前記基板と対向して設けられ、前記基板に溶液を吐出する複数のノズルと、
前記複数のノズルを各々自在に移動させる駆動機構と
溶液を収納するタンクと、
前記タンクに配管を介して連結され、前記複数のノズルから吐出する溶液量を制御する制御部とを有することを特徴とする塗布装置。
A rotating support for holding the substrate;
The rotating support base provided the substrate and a counter which is held, a plurality of nozzles for discharging the solution into the substrate,
A drive mechanism for freely moving each of the plurality of nozzles ;
A tank for storing the previous Symbol solution,
The tank is connected via a pipe, coated fabric device you; and a control unit for controlling the amount of solution to be discharged from the plurality of nozzles.
基板を保持する回転支持台と、A rotating support for holding the substrate;
前記回転支持台に保持された前記基板と対向してマトリクス状に設けられたガイドレールと、Guide rails provided in a matrix so as to face the substrate held on the rotation support base,
前記ガイドレールに保持され、前記基板に溶液を吐出する複数のノズルとを有し、A plurality of nozzles that are held by the guide rail and discharge the solution to the substrate;
前記複数のノズルは、ガイドレールに沿って各々自在に移動可能であることを特徴とする塗布装置。The coating device, wherein the plurality of nozzles are freely movable along guide rails.
基板を保持する回転支持台と、
前記回転支持台に保持された前記基板と対向してマトリクス状に設けられたガイドレールと、
前記ガイドレールに保持され、前記基板に溶液を吐出する複数のノズルと、
前記溶液を収納するタンクと、
前記タンクに配管を介して連結され、前記複数のノズルから吐出する溶液量を制御する制御部とを有し、
前記複数のノズルは、ガイドレールに沿って各々自在に移動可能であることを特徴とする塗布装置。
A rotating support for holding the substrate;
A guide rail provided in a matrix in the substrate and a counter which is held on the rotating support base,
The held in the guide rail, a plurality of nozzles for discharging the solution into the substrate,
A tank for storing the solution ;
A controller connected to the tank via a pipe and controlling the amount of solution discharged from the plurality of nozzles;
Wherein the plurality of nozzles, the coating fabric device you characterized in that along the guide rails are each freely movable.
請求項2又は4において、前記制御部は、前記複数のノズルの各ノズルごとに設けられていることを特徴とする塗布装置。5. The coating apparatus according to claim 2, wherein the control unit is provided for each of the plurality of nozzles. 請求項1乃至5のいずれか一において、前記回転支持台を移動させる駆動機構を有することを特徴とする塗布装置。6. The coating apparatus according to claim 1, further comprising a drive mechanism that moves the rotation support base. 請求項1乃至6のいずれか一において、前記複数のノズルは、前記回転支持台に対し垂直方向に各々自在に移動可能であることを特徴とする塗布装置。The coating apparatus according to claim 1, wherein the plurality of nozzles are freely movable in a vertical direction with respect to the rotation support base. 基板を保持する回転支持台と、A rotating support for holding the substrate;
前記回転支持台に保持された基板と対向してマトリクス状に設けられたガイドレールと、Guide rails provided in a matrix so as to face the substrate held on the rotation support table,
前記ガイドレールに保持され、前記基板に溶液を吐出する複数のノズルとを有する塗布装置を用いた塗布方法であって、A coating method using a coating apparatus having a plurality of nozzles that are held by the guide rail and discharge a solution to the substrate,
前記ガイドレールに沿って前記複数のノズルを各々自在に移動させて所定の位置に配置し、A plurality of the nozzles are freely moved along the guide rails and arranged at predetermined positions,
前記複数のノズルから前記回転支持台上に保持された基板に溶液を吐出し、Discharging the solution from the plurality of nozzles onto the substrate held on the rotating support base;
前記回転支持台を回転することを特徴とする塗布方法。An application method comprising rotating the rotation support base.
基板を保持する回転支持台と、
前記回転支持台に保持された基板と対向してマトリクス状に設けられたガイドレールと、
前記ガイドレールに保持され、前記基板に溶液を吐出する複数のノズルと、
前記溶液を収納するタンクと、
前記タンクに配管を介して連結され、前記複数のノズルから吐出する溶液量を制御する制御部とを有する塗布装置を用いた塗布方法であって
前記ガイドレールに沿って前記複数のノズルを各々自在に移動させて所定の位置に配置し、
前記複数のノズルから前記回転支持台上に保持された基板に溶液を吐出し、
前記回転支持台を回転することを特徴とする塗布方法。
A rotating support for holding the substrate;
Guide rails provided in a matrix so as to face the substrate held on the rotation support table ,
The held in the guide rail, a plurality of nozzles for discharging the solution into the substrate,
A tank for storing the solution ;
The tank is connected via a pipe, I coated fabric method der using the coating cloth device that having a control unit for controlling the amount of solution to be discharged from the plurality of nozzles,
A plurality of the nozzles are freely moved along the guide rails and arranged at predetermined positions,
Discharging the solution from the plurality of nozzles onto the substrate held on the rotating support base ;
Coated cloth how to characterized by rotating the rotating support base.
基板を保持する回転支持台と、A rotating support for holding the substrate;
前記回転支持台に保持された基板と対向してマトリクス状に設けられたガイドレールと、Guide rails provided in a matrix so as to face the substrate held on the rotation support table,
前記ガイドレールに保持され、前記基板に溶液を吐出する複数のノズルとを有する塗布装置を用いた塗布方法であって、A coating method using a coating apparatus having a plurality of nozzles that are held by the guide rail and discharge a solution to the substrate,
前記ガイドレールに沿って前記複数のノズルを各々自在に移動させて少なくとも基板の四隅端の位置に配置し、The plurality of nozzles are freely moved along the guide rails, and are arranged at least at the four corner ends of the substrate,
前記複数のノズルから前記回転支持台上に保持された基板に溶液を吐出し、Discharging the solution from the plurality of nozzles onto the substrate held on the rotating support base;
前記回転支持台を回転することを特徴とする塗布方法。An application method comprising rotating the rotation support base.
基板を保持する回転支持台と、A rotating support for holding the substrate;
前記回転支持台に保持された基板と対向してマトリクス状に設けられたガイドレールと、Guide rails provided in a matrix so as to face the substrate held on the rotation support table,
前記ガイドレールに保持され、前記基板に溶液を吐出する複数のノズルと、A plurality of nozzles that are held by the guide rail and that discharge the solution to the substrate;
前記溶液を収納するタンクと、A tank for storing the solution;
前記タンクに配管を介して連結され、前記複数のノズルから吐出する溶液量を制御する制御部とを有する塗布装置を用いた塗布方法であって、A coating method using a coating apparatus connected to the tank via a pipe and having a control unit for controlling the amount of solution discharged from the plurality of nozzles;
前記ガイドレールに沿って前記複数のノズルを各々自在に移動させて少なくとも基板の四隅端の位置に配置し、The plurality of nozzles are freely moved along the guide rails, and are arranged at least at the four corner ends of the substrate,
前記複数のノズルから前記回転支持台上に保持された基板に溶液を吐出し、Discharging the solution from the plurality of nozzles onto the substrate held on the rotating support base;
前記回転支持台を回転することを特徴とする塗布方法。An application method comprising rotating the rotation support base.
JP2006141909A 2005-06-10 2006-05-22 Coating apparatus, coating method, and manufacturing method of semiconductor device Expired - Fee Related JP4954610B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006141909A JP4954610B2 (en) 2005-06-10 2006-05-22 Coating apparatus, coating method, and manufacturing method of semiconductor device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005170921 2005-06-10
JP2005170921 2005-06-10
JP2006141909A JP4954610B2 (en) 2005-06-10 2006-05-22 Coating apparatus, coating method, and manufacturing method of semiconductor device

Publications (3)

Publication Number Publication Date
JP2007014944A JP2007014944A (en) 2007-01-25
JP2007014944A5 true JP2007014944A5 (en) 2009-07-02
JP4954610B2 JP4954610B2 (en) 2012-06-20

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5521731B2 (en) * 2010-04-20 2014-06-18 凸版印刷株式会社 Development processing method and development processing apparatus
JP6203098B2 (en) * 2013-03-29 2017-09-27 芝浦メカトロニクス株式会社 Substrate processing apparatus and substrate processing method
JP6321699B2 (en) * 2016-02-23 2018-05-09 本田技研工業株式会社 Coating apparatus and coating method
CN116981182B (en) * 2018-04-04 2024-05-21 苏州康尼格电子科技股份有限公司 PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method

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* Cited by examiner, † Cited by third party
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JPH09160256A (en) * 1995-12-07 1997-06-20 Dainippon Screen Mfg Co Ltd Liquid discharger
JPH09319094A (en) * 1996-05-27 1997-12-12 Mitsubishi Electric Corp Spin coating method and spin coating device
JP3338804B2 (en) * 1999-08-31 2002-10-28 秋田日本電気株式会社 Resist coating apparatus and method
JP3754322B2 (en) * 2001-05-24 2006-03-08 東京エレクトロン株式会社 Coating film forming method and apparatus
JP4068437B2 (en) * 2001-11-26 2008-03-26 東京エレクトロン株式会社 Coating film forming device
JP2004237157A (en) * 2003-02-04 2004-08-26 Matsushita Electric Ind Co Ltd Rotary coating apparatus
JP2004275989A (en) * 2003-03-19 2004-10-07 Sumitomo Precision Prod Co Ltd Substrate processing apparatus
US7770535B2 (en) * 2005-06-10 2010-08-10 Semiconductor Energy Laboratory Co., Ltd. Chemical solution application apparatus and chemical solution application method

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