JP2006514463A5

JP2006514463A5 -

Info

Publication number: JP2006514463A5
Application number: JP2004567957A
Authority: JP
Filing date: 2003-01-31
Publication date: 2007-03-22

Claims

A metal layer having at least one antenna electrical radiator element and a feed element;
A first thin carrier dielectric layer having a top surface and a bottom surface, wherein the metal layer is formed thereon;
A foam core layer having a top surface and a bottom surface, wherein the first thin carrier dielectric layer is formed on the top surface and the bottom surface of the carrier dielectric layer having the same surface area of the foam core layer;
An adhesive layer formed on the bottom surface of the foam core layer and bonded to a metal ground layer;
An antenna array having a plurality of layers comprising:

The antenna array of claim 1, wherein the metal layer is adhesively bonded to the first thin carrier dielectric layer.

The antenna array of claim 1, wherein the first thin carrier dielectric layer is adhesively bonded to the foam core layer.

The antenna array according to claim 1, wherein the metal ground layer is a thin metal layer.

The antenna array according to claim 4, further comprising a non-conductive radome cover that covers the antenna layers and supports the antenna layers.

The antenna array according to claim 1, wherein the layers of the antenna are adhesively bonded to each other.

The antenna array according to claim 1, further comprising a radome cover structure covering each layer of the antenna.

The antenna array according to claim 1, wherein at least a part of each layer of the plurality of antennas is formed on a curved ground layer.

9. The antenna array according to claim 8, wherein each of the plurality of antenna layers is formed of a flexible material adapted to the curved ground layer.

The antenna array according to claim 8, wherein the foam core layer is formed in a curved shape suitable for the curved ground layer.

The antenna array according to claim 1, wherein the metal ground layer is also a conductive tray that structurally supports the antenna array.

The antenna array according to claim 1, wherein the metal ground layer is flexible.

A metal layer having at least one antenna electrical radiator element and a feed element;
A first thin carrier dielectric layer having the metal layer formed thereon;
A foam core layer having a top surface and a bottom surface, the foam core layer having the first thin carrier dielectric layer formed on the top surface;
An adhesive layer formed on the bottom surface of the foam core layer and bonded to a metal ground layer;
At least a second dielectric layer formed on the metal layer and having at least one parasitic radiator element formed thereon and electrically coupled to a corresponding radiator element in the metal layer;
An antenna array having a plurality of layers comprising:

At least further including a plurality of parasitic radiator elements formed on an upper surface of a second thin carrier dielectric layer, wherein the second thin carrier dielectric layer is formed on the second dielectric layer. The antenna array according to claim 13.

The antenna array according to claim 13, wherein the layers are adhesively bonded to each other.

The antenna array according to claim 13, further comprising a radome cover structure covering each layer of the antenna.

The antenna array according to claim 13, wherein the metal ground layer is a thin metal ground layer.

The antenna array according to claim 17, further comprising a nonconductive radome cover structure that covers each antenna layer and supports each antenna layer.

The antenna array according to claim 13, wherein at least a part of each layer of the plurality of antennas is formed on a curved ground layer.

The antenna array according to claim 19, wherein each of the plurality of antenna layers is formed of a flexible material adapted to the curved ground layer.

The antenna array according to claim 19, wherein the foam core layer is formed in a curved shape so as to fit the curved ground layer.

The antenna array according to claim 13, wherein the metal ground layer is a substantially hard supporting metal layer.

A metal layer having at least one antenna electrical radiator element and a feed element;
A first thin carrier dielectric layer having the metal layer formed thereon;
A foam core layer having a top surface and a bottom surface, the first thin carrier dielectric layer formed on the top surface;
At least a second dielectric layer formed on the metal layer;
At least one parasitic element formed on the upper surface of the second dielectric layer;
An antenna array having a plurality of layers comprising:
The at least one parasitic radiator element is electrically coupled to a corresponding at least one radiator element in the metal layer, and the second thin carrier dielectric layer is formed on the second dielectric layer. These layers are bonded to each other to form a laminate, and an adhesive layer is formed on the bottom surface of the foam core layer of the laminate, and the laminate is joined to the metal ground layer by the adhesive layer. Antenna array.

The antenna array according to claim 23, further comprising a radome cover structure covering each layer of the antenna.

The antenna array according to claim 23, wherein the metal ground layer is a thin metal layer.

The antenna array according to claim 25, further comprising a non-conductive radome cover structure covering and supporting each layer of the antenna.

The antenna array according to claim 23, wherein at least a part of each of the plurality of antenna layers is formed on a curved ground layer.

28. The antenna array according to claim 27, wherein each of the plurality of antenna layers is formed of a flexible material adapted to the curved ground layer.

28. The antenna array according to claim 27, wherein the foam core layer is formed in a curved shape that matches the curved ground layer.

24. The antenna array according to claim 23, wherein the metal ground layer is a substantially hard supporting metal layer.

Forming a foam core layer having a top surface and a bottom surface;
Bonding a metal layer onto a first thin carrier dielectric layer having a top surface and a bottom surface, and bonding the first thin carrier dielectric layer to the top surface of the foam core layer, the foam The upper surface of the core layer and the first thin carrier dielectric layer have the same surface area;
Providing an adhesive layer on the bottom surface of the foam core layer;
Etching and forming at least one radiator element and a feed element in the metal layer;
Forming a metal ground layer and bonding the adhesive layer to the metal ground layer together with the foam core layer, the first thin carrier dielectric layer and the metal layer;
An antenna array manufacturing method including:

32. The method of claim 31, further comprising covering each layer of the antenna with a radome cover.

32. The method of claim 31, further comprising forming the metal ground layer with a thin metal layer.

34. The method of claim 33, wherein a non-conductive radome cover structure that supports the antenna layers is formed and the radome cover structure covers and supports the antenna layers.

32. The method of claim 31, comprising forming at least a portion of each layer of the plurality of antennas on a curved ground layer.

36. The method of claim 35, comprising forming each of the plurality of antenna layers from a flexible material, and matching the antenna layers to the curved ground layer.

36. The method of claim 35, comprising forming the foam core layer into a curved shape that matches the curved ground layer.

32. The method of claim 31, comprising forming the metal ground layer with a substantially rigid supporting metal layer for each layer of the antenna.

Forming a foam core layer having a top surface and a bottom surface;
Bonding a metal layer over a first thin carrier dielectric layer and bonding the first thin carrier dielectric layer to the surface of the foam core layer;
Providing an adhesive layer on the bottom surface of the foam core layer;
Etching and forming at least one radiator element and a feed element in the metal layer;
Forming a metal ground layer and bonding the adhesive layer to the metal ground layer together with the foam core layer, the first thin carrier dielectric layer and the metal layer;
Bonding at least a second dielectric layer onto the metal layer;
Forming at least one parasitic radiator element on the upper surface of the second dielectric layer to couple with at least one corresponding radiator element formed in the metal layer;
An antenna array manufacturing method including:

Forming the at least one parasitic radiator element on an upper surface of a second thin carrier dielectric layer and bonding the second thin carrier dielectric layer to the second dielectric layer. 40. The method according to 39.

40. The method of claim 39, further comprising covering each layer of the antenna with a radome cover structure.

40. The method of claim 39, comprising forming at least a portion of each layer of the plurality of antennas on a curved ground layer.

43. The method of claim 42, further comprising: forming each of the plurality of antenna layers from a flexible material and aligning the antenna layers with the curved ground layer.

43. The method of claim 42, comprising forming the foam core layer into a curved shape to match the curved ground layer.

40. The method of claim 39, comprising forming the metal ground layer with a support metal layer that is substantially rigid relative to the antenna layer.

Forming a foam core layer having a top surface and a bottom surface;
Bonding a metal layer over a first thin carrier dielectric layer and bonding the first thin carrier dielectric layer to the top surface of the foam core layer;
Providing an adhesive layer on the bottom surface of the foam core layer;
Etching and forming at least one radiator element and a feed element in the metal layer;
Forming a metal ground layer and bonding the adhesive layer to the metal ground layer together with the foam core layer, the first thin carrier dielectric layer and the metal layer;
Bonding at least a second dielectric layer on the metal layer radiator element and the feed element;
Forming at least one parasitic radiator element on the top surface of the second dielectric layer;
An antenna array manufacturing method including:

47. The method of claim 46, further comprising covering each layer of the antenna with a radome cover.

The method of claim 46, further comprising forming the metal ground layer with a thin metal layer.

47. The method of claim 46, further comprising forming a non-conductive radome cover structure and supporting and covering each layer of the antenna with the radome cover structure.

47. The method of claim 46, comprising forming at least a portion of each layer of the plurality of antennas on a curved ground layer.

51. The method of claim 50, comprising forming each of the plurality of antenna layers from a flexible material, and matching the antenna layers to the curved ground layer.

51. The method of claim 50, comprising forming the foam core layer into a curved shape to match the curved ground layer.

47. The method of claim 46, comprising forming the metal ground layer with a support metal layer that is substantially rigid relative to the antenna layer.