CN1736000A - Low-cost antenna array - Google Patents
Low-cost antenna array Download PDFInfo
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- CN1736000A CN1736000A CN03825885.4A CN03825885A CN1736000A CN 1736000 A CN1736000 A CN 1736000A CN 03825885 A CN03825885 A CN 03825885A CN 1736000 A CN1736000 A CN 1736000A
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Details Of Aerials (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
A low-cost antenna array and method of manufacturing the array, in a planar form or in a structurally flexible or curved array structure are shown. The antenna array has a plurality of metallic antenna electrical and radiator elements formed on a foam core layer bonded onto a metallic ground layer. The radiator elements preferably are formed on a thin dielectric carrier layer bonded to the foam core layer. The array can include one or more additional dielectric layers, each with a plurality of parasitic radiator elements formed thereon, mounted on top of the electrical elements. Manufacturing the array preferably includes bonding the layers to one another. The electrical and radiator elements are formed, preferably by etching, before the foam core layer is bonded to the ground layer. The additional dielectric layer and the parasitic radiators then are bonded to the already formed electrical elements on the ground layer.
Description
Technical field
The present invention relates to aerial array, more specifically at low-cost antenna array with make the method for this aerial array, this aerial array has the plane in fact and surface curved surface, can be applicable to communication.
Background technology
The manufacturing of aerial array has wide range of forms, and many different application are arranged in the communications field.A kind of concrete application scenario is to have high volume and focus on aerial array cheaply, they are used in the base stations in mobile communication system, such as the cellular transmission system that works in about 800MHz of the U.S. with work in the base station of Personal Communications Services (PCS) system of about 1900MHz, and be used in worldwide other wireless and mobile communication application.
Base-station antenna array in form, adopting extensively various structure, they are having notable difference aspect size, cost and the reliability.Common base-station antenna arrays typically comprises: two or more each other radiator; A transmission network distributes the radio-frequency power from the antennal interface end between each radiator; A mechanical structure guarantees that all unit constitute an assembly; And radome.A kind of basic type of base-station antenna array is made up of known cylinder dipole array.This type of aerial array usually has a large amount of parts, manufacturing cost height on the structure, and physical size is big, and weight ratio is higher.Another kind of basic type of base-station antenna array uses the sheet metal doublet radiator to form, and forms little band power distributing network by the sheet metal that discrete dielectric isolation sheet supports.Each metal parts is struck out by the aluminium thin slice usually, relies on high-intensity work to be assembled then.Another kind of conventional base-station antenna array uses printed circuit board (PCB) (PCB) to constitute power distributing circuit, uses coaxial cable to connect metal dipole or distribution radiator.
Another conventional type of base-station antenna array uses PCB to constitute power distributing network, and uses discrete PCB to constitute doublet radiator.For the antenna for base station with high-gain values and 8 above radiators, the PCB material that needs usually to use based on high-performance poly tetrafluoroethene (PTFE) constitutes power distributing network, to keep low via net loss, avoids signal attenuation.The PCB material cost of the other types that compare based on the PCB material of high-performance PTFE is much higher.With regard to the bigger circuit complexity of tool of production cost, processing, property easy to assembly and favourable realization, use the antenna for base station that constitutes as power distributing network and radiator by PCB, its advantage that provides surpasses the similar antenna that the applied metal thin slice constitutes.
The planar antenna array of various structures has been proposed, so as to lowering manufacturing cost, reducing physical size and alleviate total aerial array weight.These antenna array has the structure of various samples on forming, utilize various sandwich type to arrange, and utilize various material as antenna radiator and circuit.Usually, adopt screen printing method or physics cutting metal layer method when forming planar antenna array, the method that stamps out radiator patches or cutting metal layer such as dependence forms the radiator patches in the metal level, and relies on etch metal layers to form required pattern.Include the one or more circuit and the radiator that are formed on thin metal layer very or the sheet metal in the antenna of these types, they support or are installed on the usually more solid various medium bottoms, such as plastics, foamed material, Styrofoam
TM, basalis such as polyvinyl chloride resin, glass fibre, polypropylene, polyester, acrylic acid or polyethylene.Though these conventional array structures have improved some characteristic of aerial array, little and in light weight such as the number of parts, at electrical property, the improvement of still needing of manufacturing process cost and total mechanical structure aspect.
Therefore, need a kind of aerial array for example to supply the base station applications, can be made with the cost that reduces.Also wish when reaching the required array cost of reduction, to keep the electrical property of acceptable aerial array.Further, wish to form a kind of flexible antenna array, can make curved-surface structure and be applied to certain occasion.
Summary of the invention
The present invention is directed to the method for aerial array and this type of array of manufacturing of low price, for communications applications, such as being used as antenna for base station.Can be designed to plane form again or structure is flexibly arranged according to aerial array of the present invention, or the curved array structure of wishing in some application.
Aerial array according to the embodiment of the invention is made up of multilayer, and is preferably bonded to each other between each layer.Include a plurality of metallic radiator elements that on two or more dielectric layers, form in the aerial array, and dielectric layer is bonded on the metallic substrate layer in turn.The thickness of dielectric layer is chosen as the interval that can provide required and supplies the radiator elements job applications.Radiator elements preferably is formed on the soft medium carrier layer, and carrier layer can be bonded on the medium foam core layer, the medium core layer can be soft, perhaps can for molding or cut into flat shape or molded non-planar.Can comprise one or more dielectric layers in the array, can form many parasitic elements on the dielectric layer, wherein, dielectric layer preferably is bonded in the top of metallic radiator elements.Dielectric layer and basalis are enclosed in the structure that comprises radome, and the protection of environment to external world is provided, and the convenient antenna module that makes can be installed on other structures under safety and solid state.
In the array manufacturing method according to the embodiment of the invention, comprise that to make each layer bonded to each other.In the formation of radiator elements, preferably be to make before the core foam dielectric layer is bonded on the basalis first etch metal layers.Then, the dielectric layer that has parasitic elements is bonded on the radiator elements that has formed.As required, basalis can be partly or is integrally crooked.
On the low-cost antenna array design according to the embodiment of the invention, used the various low price parts of suitable printed circuit board (PCB) manufacturing technology, they can be assembled together at short notice, and the assembling back only needs to adjust in a small amount or need not adjust just to obtain desired properties.
Therefore, the invention provides a kind of aerial array with sandwich construction, it comprises: metal level is formed with many antenna radiator unit and feed element that power up above; The first thin carrier dielectric layer, metal level are formed on this described first thin carrier dielectric layer; Foam core layer, it has top surface and lower surface, and wherein, the first thin carrier dielectric layer is formed at the top surface of foam core layer, and adhesive layer is formed at the lower surface of foam core layer, and wherein, adhesive layer is bonded on the metallic substrate layer.
Read following detailed description in conjunction with the accompanying drawings, understand other characteristics of the present invention and advantage easily.
Description of drawings
Fig. 1 shows the bright aerial array of using according to the embodiment of the invention in base-station environment;
The perspective view of Fig. 2 for decomposing shows bright aerial array according to the embodiment of the invention;
The perspective view of Fig. 3 for decomposing shows bright aerial array with Fig. 2 of radome unit, forms complete antenna structure;
Fig. 4 is the decomposition diagram of amplification, partly shows the aerial array of bright Fig. 2;
Fig. 5 is the exploded view end-view of amplification, shows the aerial array of bright Fig. 2;
The aerial array of Fig. 2 of the perspective diagram oolemma radome of Fig. 6 forms completed antenna structure partly;
Fig. 7 is the top view of Fig. 6 top completed antenna structure;
Fig. 8 is the perspective view that decomposes, and shows bright aerial array according to another embodiment of the present invention;
The perspective view of Fig. 9 for decomposing shows that oolemma has the aerial array embodiment of Fig. 8 of radome unit, forms complete antenna structure;
Figure 10 is the perspective view of decomposition, partly shows the aerial array embodiment of bright Fig. 8;
Figure 11 is the exploded view end view of amplification, shows the aerial array embodiment of bright Fig. 8;
Figure 12 is the perspective view of part, shows that oolemma has the aerial array embodiment of Fig. 8 of radome unit, forms the completed antenna structure of part;
Figure 13 is the top view of Figure 12 top completed antenna structure;
Figure 14 A, 14B and 14C are respectively end view, bottom view and the top view that is installed in completed antenna array structure in the radome unit;
Figure 15 is the completed antenna array cut open along lines 15-15 among Figure 14 A and the sectional view of antenna cover structure;
Figure 16 is the perspective view of completed antenna array structure on Figure 15;
Figure 17 is the perspective view of curved antenna array embodiment of the present invention;
Figure 18 is the part perspective view that antenna array structure amplifies on Figure 17;
Figure 19 A and 19B are respectively perspective view and the top view of another curved antenna array embodiment of the present invention;
The schematic diagram of Figure 20 is bright uses curved antenna array of the present invention in base-station environment;
Figure 21 shows the processing step of a kind of aerial array embodiment of bright manufacturing the present invention;
Figure 22 shows the processing step of the another kind of aerial array embodiment of bright manufacturing the present invention;
The bright aerial array radome embodiment of the present invention of part perspective diagram of Figure 23 can support complete antenna structure;
Figure 24 is the end view or the end-view of radome on Figure 23, and complete antenna structure is installed above; And
The radome unit of bright Figure 23 of part perspective diagram of Figure 25 is equipped with antenna structure therein.
Embodiment
Now, referring to Fig. 1, base station or cell site 10 can comprise at least one and be generally a plurality of the present invention's aerial array 12 that their enforcement at length discloses on Fig. 2 to Figure 16.The equal reference numbers of indicating among these figure refers to same or similar parts in each accompanying drawing.Base-station antenna array 12 is included in the radome (being shown in Figure 14 to Figure 16) that assists in substantially sealing usually, and they are installed on the base station tower mast 14 more in a usual manner.As the operating position here, aerial array is the assembly with all antenna elements of certain size, interval and radiation sequence, the electric field that makes each radiators unify produces maximum intensity on specific direction, and electric field strength is minimum in the other direction.When describing this kind assembly, the term aerial array can use interchangeably with array antenna.
In such as one or more areas of coverage 16, in the base-station antenna array 12 each provides covering to the sub-district of mobile or fixed communications (not shown), allly provide covering for cellular transmission system on the about 800MHz of being operated in of the U.S. and Personal Communications Services (PCS) system that is operated on about 1900MHz in this way, or provide covering for other antenna communications with fixing or mobile subscriber system.Base-station antenna array of the present invention is illustrated as planar structure in aerial array 12, be illustrated as curved-surface structure (example of curved-surface structure at length is disclosed in Figure 17 to Figure 20) in curved surface antenna display 18.Curved antenna array 18 can be installed on the second base station tower mast 14 ', can make the communication of base station 10 cover the top that the place increases to the area of coverage 16, such as arriving on the hilltop or on the aircraft 19.
The first aerial array embodiment of the present invention is shown in Fig. 2 with exploded view, and each unit is not drawn by dimension scale among the figure.Aerial array embodiment 20 is a dual polarized antenna, comprises the linear polarization of two quadratures, shows bright with 16 each other radiators here.Skilled person in the present technique field knows, the present invention is not restricted to dual polarized antenna, also may be used on can also being applied on the number of each radiator that is different from illustrated embodiment on the antenna of single kind polarization characteristic, the radiator number can be less or some more in the array.Comprise in the array 20 that PCB piles up or interlayer 22, pile up comprise on 22 manyly be formed at (being shown among Fig. 5) on the metal level 60, along piling up radiator elements or the distribution 24 that 22 length directions are arranged, and in the usual way with all radiator elements 24 of required feed circuit 26 connections.Preferably, at first by means of making metal level 60 attachings such as adhesive layer 62 (being shown among Fig. 5) or being adhered on the relatively thinner carrier dielectric layer 27, then, such as forming many radiator elements or distribution 24 along the length direction that piles up 22, connect all radiator elements 24 with required feed circuit 26 by common chemical etching process.It will be appreciated that term is used for bonding routine techniques bonding can comprising, it includes, but are not limited to use adhesive or securing member engages.
Then, making PCB pile up 22 by adhesive layer 30 is adhered on the thicker core foam dielectric layer 28.The remainder of aerial array 20 preferably comprises gluing and release layer 32, and it at first is bonded on core foam dielectric layer 28 bottom sides, when each layer is bonded together, just finishes one and piles up or interlayer assembly 34.Such as by common chemical etching process, also can on assembly, form many radiator elements or the distribution 24 that have required feed circuit 26 this moment again.All radiator elements 24 pile up 34 with the conventional method finishing after feed circuit 26 forms as required.Then, that removes layer 32 releases off part (all polyester materials in this way or similarly strip off layer, not shown), relies on remaining adhesive to make again to pile up 34 to be adhered in basalis or the conduction holder 35.
Pile up 22, dielectric layer 28 and conduction holder 35 each respectively comprise paired sets of central apertures 36, they intermesh, and are applied to the feed circuit 26 that PCB piles up on 22 is realized that radiofrequency signals connect.Along pile up 22, the edge of dielectric layer 28 and conduction holder 35 is formed with other a plurality of engagement aperture set 38, these aperture set 38 are applied to make installation bracket 48 to be installed in the conduction holder 35 (as shown in Figure 3).Hold by the aperture set 38 in the conduction holder 35 and to receive bolt or screw or similar device (not shown), by pile up 22 and dielectric layer 28 on also be that the footpath is organized 38 and provided the tolerance clearance that is used for bolt head.
Pile up 34 and conduction holder 35 part that back together forms antenna structure 40 is installed, these components illustrated are on Fig. 3.On antenna structure 40, form the valve jacket of aerial array 20, be subjected to the influence of ambient conditions with the protection antenna, such as rain, hail, snowfall, dust and blow etc.Although aerial array 20 is installed on the exposure position place on the base station usually, under other application scenarios, during installing, aerial array 20 can have or not have the protection or the valve jacket of other types.Comprise radome cover member 42 in the antenna structure 40, it can be mounted in the conduction holder 35 of bottom.The two ends of radome covering 42 are sealed by a pair of end cap 44, and they are affixed to basalis 35 by the securing member such as the screw (not shown) or radome covers on 42, constitute the complete antenna structure of sealing 40.
Radome covers 42 can carry out mold pressing with the plastic material of suitable outdoor grade on making, should guarantee suitable radio-frequency performance for loss, and have proper dielectric constant.Plastic material also should have suitable dimensional stability, can not become fragile at low temperatures.Radome material preferably adopts the polyvinyl chloride (PVC) of outdoor grade, and it includes the stabiliser materials of uvioresistant (UV), can keep durability under outdoor environment.Employing PVC material is a kind of good selection, and is verified, can be used as the radome of base station.
Comprise paired sets of central apertures 36 in the basalis 35, can the aperture set in each layer 36 engage with other.Aperture set 36 is used for a pair of radio frequency connector 46, makes radio-frequency power be transferred to PCB and piles up feed circuit 26 on 22.Interface port or port connector that radio frequency connector 46 forms for antenna structure 40 usefulness.Because directly in the RF signal path, the contact of only metal to metal is the solder joint connection at radio frequency connector 46 places in the antenna structure 20 or 40, so the last antenna structure 20 or 40 that forms can provide good passive intermodulation (PIM) performance.When testing with two carrier wave single-tones of every single-tone 20W, PIM is usually less than-150.
Pile up 34 and basalis 35 bright with the part perspective diagram of amplifying in Fig. 4.It shows that more clearly oolemma has the PCB of radiator elements 24 and feed circuit 26 to pile up 22.In addition, each of dielectric layer 28 and basalis 35 all comprises a pair of aperture 50 at least, and end cap 44 is installed on them.Manufacturing piles up 34 and when being installed in the conduction holder 35, the aperture to 50 can also be applied to pile up 22, the aligning of each layer 22,28,30 and 32 (when needing, their each layers respectively comprise the aperture to 50).Usually, can in each layer that piles up, all form the aperture, so as to guaranteeing tolerance clearance or the protruding feature around the securing member, otherwise, in different piling up, have local protrusion.
Piling up 34 illustrates bright with looking closely of amplification with conduction holder 35 again in Fig. 5.Similarly, each unit does not show bright by dimension scale.In addition, relatively thinner carrier dielectric layer 27 is spaced apart on the position with metal level 60, and pattern on having made on the metal level 60 or will having made is to form radiator 24 and feed circuit 26.Rely on adhesive layer 62 to make on the metal level 60 adhesive carrier dielectric layers 27, form and pile up 22.Conduction holder 35 preferably comprises a pair of relative groove crack, vertical edge again, is used for making radome cover 42 and slips in advance before end cap 44 being mounted in the conduction holder 35.
Though concrete material and each layer thickness are very not strict, below outline some typical dimensions and material.In the preferred embodiment, metal level 60 is thin Copper Foil, forms unit 24 and 26 through etching.Copper Foil 60 is preferably for electrolytic deposition (ED) type Copper Foil, for carrier dielectric layer 27 on the Copper Foil of adhesive layer 62 surperficial touching positions, can carry out chemical treatment, this processing is commonly referred to reverse side and handles Copper Foil.Metal level 60 every square feet of areas weigh 1 ounce, about 0.0014 inch of corresponding thickness.Also other Copper Foils be can use, general more expensive rolling Copper Foil and the ED Copper Foil that on adhesive surface, has the surface section that reduces comprised.Copper Foil has various weight, such as the Copper Foil that can use every square feet heavy 0.5 or 2 ounce.The cost and the signal code capacity that use from antenna for base station, 1 ounce copper foil is desirable.Carrier dielectric layer 27 can be low-loss polyester film, thickness is approximately 0.003 to 0.005 inch, also has thick in 0.010 inch.Metal level 60 and relatively thinner carrier dielectric layer 27 can be together bonding with relatively thinner adhesive layer 62.Adhesive layer 62 can be applied between metal level 60 and the carrier dielectric layer 27 in conjunction with wet coated technique, solidifies the back and forms accessible thin slice, is processed into whole assembly subsequently and promptly piles up 22.The thin slice assembly that obtains or promptly pile up 22 normally softly can be made crooked shape at least in a plane.
The dielectric constant of foam core layer 28 depends on density and the dielectric constant that forms the used bulking meterial of foam core layer 28.The rigid low density foam of making under molding mode such as expanded polystyrene (EPS), typical density are every cubic feet heavy 1.25 to 2.5 pounds.The dielectric constant of this type of low density foam is 1.02 to 1.04, near the dielectric constant of air.This expanded polystyrene foam, the polystyrene foam of extrusion molding is more desirable, because the little interstitial channels that can take place when utilizing foam beads to be configured to the expanded type foam has reduced, moisture sucks thereupon and reduces.However, the moisture suction of EPS was still enough low this used concerning certain.The extrusion pressing type cross-bond polyethylene of every cubic feet heavy 6 pounds of density, the representative value of dielectric constant is 2.3.The dielectric constant values of the expanded expanded polyolefin of other cross-bonds is 1.35.Applicable a kind of foam core layer 28 thickness are approximately 0.090 inch among the present invention.The density of plastic material is low, and hour normally its loss factor is also low for dielectric constant values.
The rigid foamed material that can be applicable to core foam dielectric layer 28 has the Rohacell of Ritchie,England (Norwich) city EMKAY plastics Co., Ltd manufacturing
TMRohacell
TMBe the rigid foam of a kind of polymethyl ester (PMI), do not have CFC, bromine and halogen, it is said it is 100% density unit and isotropic.Rohacell
TMFoam has good mechanical performance, and high dimensional stability is at high temperature arranged, and anti-solvent, the coefficient of heat conduction are low especially.Their intensity levels and modulus of elasticity and modulus of shearing do not have the foamed plastics of any other identical gross weight density can surpass it so far.This Rohacell
TMFoam can have various sample density, comprises that every cubic feet is 2,3.25,4.68 and 6.87 pounds.Under identical density, Rohacell
TMThe dielectric constant of foam is usually less than the dielectric constant of soft polyolefin family foam.For example, 4.68 pounds every cubic inch Rohacell
TMThe dielectric constant of foam is approximately 1.08 on 2GHz.Rohacell
TMFoam can become thermoelastic.So, under 170 ℃ of-190 ℃ of temperature, can be shaped.Required deformation temperature depends on shaping degree and density.Under some occasion, under heating, mechanically or mode of texturing, can obtain the foam shape of curved surface.
Comprise among Fig. 5 by what metal level 60, adhesive layer 62 and relatively thinner carrier dielectric layer 27 constituted and pile up an embodiment of 22, can obtain from the Arlon engineering thin slice and the public portion of coating of Rhode Island, city, Providence, U.S. east, referring to the description of product of its deposited copper polyester sheet (CPL).Adhesive layer 62 in the Arlon CPL product is the gluing systems of a kind of patented Arlon hot forming urethanes.Piling up of metallization conduction 22 can obtain from a large amount of suppliers in the flexible circuit industry there, and relatively Bao carrier dielectric layer 27 is the product of polyimide material, the known Kapton that E.I.Du Pont Company is arranged
TMFilm.Arlon CPL product is because its lower dielectric constant and much lower water absorption, than the thin slice based on polyimide film more desirable.
Relatively Bao mounting medium is 27 to be not restricted to polyester material, can use and have lower moisture and the absorbefacient any suitable low price plastic material of radio-frequency (RF) energy, they work to stop the polymer membrane of infiltration in fact between foam core layer 28 and Copper Foil 60.Plastic material should also provide smooth surface to be applied to printing and etching, and further plays the barrier layer, prevents to penetrate in the typical chemical treatment in the PCB industry surface of foam core layer 28.Using relatively thinner carrier dielectric layer 27 is the key factors of constructing in the low-cost antenna, it helps in making required feed circuit 26 be connected to carry out on the radiator elements 24 that conductive pattern is made, but the PCB technology of application standard, and be easy to use conventional polypropylene adhesive system and be adhered on the foam core layer 28.Foam core layer 28 can be soft, perhaps can make required plane or nonplanar structure with molding or patterning method.
Fig. 6 and Fig. 7 show two views of line structure 40 part assemblies tomorrow, and what comprise assembling piles up 22 and 34 and each layer 28,30 and 32 bonded to each other, and they are installed on the basalis 35, but do not add that radome covers 42.
Among second aerial array embodiment 70 of the present invention, include and identical in fact with first aerial array embodiment 20 pile up 34, show the exploded view of bright embodiment 70 among Fig. 8.Except piling up each layer of 34, above-mentioned aerial array 70 include be similar to pile up 22 pile up 71, pile up that radiator elements passive on 71 or distribution group 72 preferably are formed at or be bonded on the thin carrier dielectric layer 74 and (be shown among Figure 11) by adhesive layer.Parasitic elements or distribution group 72 can be encouraged by radiator elements or distribution group 24, compare with the similar antenna array design that does not have parasitic elements or distribution group 72, and it can increase the bandwidth of operation of aerial array 20.Thin carrier dielectric layer 74 can be identical with thin carrier dielectric layer 27.Radiator elements 72 is carried out passive coupling with corresponding radiator elements 24.Radiator elements 72 does not comprise any feed circuit, and rely on another dielectric layer 76 to make radiator elements 72 and pile up 22 spaced apart predetermined distances, the preset distance of required passive coupling between the radiator elements 24 and 72 that the thickness of dielectric layer 76 equals to be correlated with.Dielectric layer 76 connects or is adhered to by adhesive layer 78 and piles up on 71.Radiator elements 72 with can be directly connected on the dielectric layer 76, without dielectric layer 74 and adhesive layer 78.Dielectric layer 76 can be formed by common expanded polystyrene material, and is mouldable or cut into required size.The preferred embodiment of dielectric layer is the closed cell foaming structure of one piece, has smaller density value and homogeneous thickness value in fact.Then, dielectric layer 76 is engaged to by means of adhesive layer 80 and piles up 22 top.What wherein comprise additional carrier dielectric layer 74 and top radiator elements 72 thereof and dielectric layer 76 piles up 71, forms another multiple layer combination body or piles up 82 with piling up 34, makes it to be installed to as previously described in the conduction holder 35.
Be positioned at piling up in the conduction holder 35 and 82 be fit into antenna structure 40 again as illustrated in fig. 9, it includes previous for those identical parts shown in Figure 3.Except additional two- layer 74 and 76, two antenna structures 20 can be identical with 70.
Bright the piling up or sandwich 82 of part perspective diagram of the amplification among Figure 10.Together with piling up 71 and medium 76, show that more clearly oolemma has the conductive stack 22 of radiator elements 24 and feed circuit 26.Each comprises a pair of aperture 50 again foam core layer 28 and basalis 35, above end cap 44 is installed on.When making sandwich 82 and be installed to it in the conduction holder 35, the aperture can be used to again each layer is aligned with each other to 50.
Pile up 82 so that the diagram oolemma has a conduction holder 35 looking closely of amplifying again among Figure 11.Similarly, each layer do not show bright by dimension scale.In addition, figure medium layer 74 is isolated with parasitic elements group 72, and the latter or will produce the pattern (not shown) by metal level.The radiators 72 of metal level or formation relies on adhesive layer 73 to join on the carrier dielectric layer 74.In the preferred embodiment, conductive layer 72 can be the thin copper foil that is analogous to metal level 60.Carrier dielectric layer 74 is analogous to carrier dielectric layer 27, also can be relatively thinner low-loss polyester material, and thickness is approximately the 0.003-0.005 inch.Dielectric layer 76 can be the polystyrene of closed cell, and loss is low, and dielectric constant is little, about 0.375 inch of thickness.Adhesive layer 73,78 and 80 similarly is common pressure-sensitive adhesive, and thickness is approximately the 0.002-0.005 inch.In the additional embodiments, conductive layer 72 can be aluminium, brass or the red copper thin slice of laser cutting or die cut, and thickness is 0.05 inch magnitude.Then, each radiator patches 72 can be each other pieces of sheet, is reengaged on the carrier dielectric layer 74, there can be directly bonding with dielectric layer 76.When forming each other distribution, radiator patches group 72 can form with any suitable gauge by the needs of specific antenna applications.
Figure 12 and Figure 13 show two views of the assembled antenna structure 70 of bright part, and what comprise assembling piles up 82 and each layer 22,28,74 and 76 of engaging one another, and they are installed on the basalis 35, but do not have radome to cover 42.
Figure 14 A, 14B, 14C, 15 and 16 show bright in forming aerial array 70 in the radome of antenna structure 40, assembling pile up each view of 82.
Figure 17 to Figure 20 shows that bright aerial array embodiment is a non-planar, and the each several part of aerial array all is a non-planar shaped.In the enforcement of these designs, preferably adopt soft or can be by the hot formed material of plane lamina for foam core layer 28.
Figure 17 shows the perspective view of bright curved antenna array embodiment of the present invention 90. Dielectric layer 27 and 28 can be formed by flexible material, such as compressible and adaptable foamed material, or can or be cut into by molding as previously described.As the example of an aerial array, aerial array 90 is formed on cylindrical substrate or the basalis 92, comprises two and piles up 34, and they form a pair of antenna 20 with many radiator elements 24.By form antenna 20 on cylindrical or curved substrate 92, antenna 20 can provide 360 ° covering in fact.Antenna cover structure is analogous to the such (not shown) in the antenna structure 40, can be installed on the aerial array 90 to form a kind of antenna structure, and it has size and the weight that reduces, and is more satisfactory on aesthetic angle.Then, aerial array 90 can be installed by required, such as being installed on above the cell tower 14 or its top (not shown).
Figure 18 is the part perspective view that aerial array 90 amplifies, and comprises the part of one of antenna 20 among Figure 17.Aerial array 90 in use also can not add radome, but if specific have needs in application, can comprise a covering of protecting overlay or other patterns.
On Figure 17 and Figure 18 in the illustrated embodiment, the bending direction of antenna 20 on the cylinder 92 is along in the cross-directional on aerial array 90 planes on the cylinder length direction.Aerial array 90 is as the crow flies along the major dimension of aerial array.In the embodiment of this aerial array 90 concrete, that have curved surface, each aerial array radiator elements 24 be oriented to same direction.This being arranged in when estimating the far-field radiation pattern characteristic can provide a kind of condition, and the contribution of each other radiator and the contribution of aerial array can be distinguished.In this class specific embodiment of Figure 17 and Figure 18, reaching of curved surface purpose is to form a kind of pattern in the cross section of array plane, with the compact Layout that provides a plurality of aerial arrays around central mounting structure.For two or more aerial arrays, the signaling interface that is used for each array can be independently, covers to provide the sector; Perhaps, can further make up corresponding to the signal of each array, broad sector covers or omnirange covers to provide.
Figure 19 A and 19B show the perspective view of bright aerial array 100 along the array direction bending.Figure 19 A shows among the bright embodiment 100, the shape 102 of aerial array compliant cylinder substrate.Figure 19 B shows among the bright embodiment 100 ' that with respect to the cylindrical substrate 102 of above-mentioned even curvature, its array has uneven curvature.In this certain embodiments, each each other array radiator elements 24 refers to toward different directions.This general status is of value to covering or omnirange that wide sector is provided and covers.The pattern of formed thereby can be accomplished signal is distributed to each other radiator elements 24 with inhomogenous range value and/or relative phase value.
Figure 20 roughly shows the bright a pair of curved antenna array 110 of the present invention of using in base-station environment.Figure 20 shows bright two arrays 110, and each array has a nonplanar part 112.Embodiment 110 provides is covered with the two side areas that overweights mounting structure, simultaneously, provides part energy to point to the top of mounting structure.Cover the above-mentioned this way particular importance that seems at the ripple that shaping is provided, communicate with aircraft from ground because often wish, at this moment require maximum antenna directivity almost horizontal direction, require on the zenith direction of mounting structure, to provide simultaneously the continuous area of coverage again.Array 110 can be installed on the top of cell tower 14 ', comprises the upper end 112 of an arch, and the covering to cell tower 14 ' top target or eminence can be provided shown in the curved surface antenna 18 among Fig. 1.
Now, referring to Figure 21, show the bright a kind of method 120 that is used to make aerial array first embodiment of the present invention.With reference to figure 5, at first the embodiment of aerial array 20 is made in explanation.On the step 122, at first utilize adhesive layer 62 that metal level 60 is joined on the carrier dielectric layer 27.Then, on step 124, utilize adhesive layer 30 that carrier dielectric layer 27 is joined on the core foam dielectric layer 28.Dielectric layer 27 a normally thin carrier layer is used for metal level 60, and provides required medium interval or thickness by dielectric layer 28, so that radiator elements 24 is normally worked.
Then, in step 126, adhesive layer 32 is joined on the dielectric layer 28 pile up or sandwich 34 with formation.Adhesive layer 32 preferably is a kind of double side dielectric band, is release layer (not shown) at the reverse side of adhesive layer 28.Then, on step 128,, preferably make on metal level 60 to form antenna to add electric unit be radiator elements 24 and feed circuit 26 by etching required radiator pattern.On the technology, usually be included in after the etching step finishing in a usual manner and pile up 34.Then, on step 130, by removing release layer, utilizing adhesive layer to form piling up of radiator elements 24 and feed circuit 26 above making 34 to join on the basalis 35.Radio frequency connector 46 usefulness mechanical means are attached in the conduction holder 35, are welded to again on the metal level 60, so that they have normal electrical connection.As shown in Figure 3, add when needing that remaining machine assembly is to finish last protection covering or radome sub-assembly 40, so can add upward optional step 132.If desired, unit 24 that powers up and circuit 26 also can form after step 122.
Now, referring to Figure 22, show that bright a kind of method is used to make another aerial array of the present invention embodiment.With reference to Figure 11, the embodiment that makes aerial array 70 is described.In PROCESS FOR TREATMENT 140, but at first the step 122 in the repetition methods 120 to step 130.On step 142, utilize adhesive layer 62 that metal level 60 is joined on the carrier dielectric layer 27.Then, on step 144, utilize adhesive layer 30 that carrier dielectric layer 27 is joined on the core foam dielectric layer 28.Then, on step 146, adhesive layer 32 can be joined on the core foam dielectric layer 28, pile up 34 with formation.Similarly, adhesive layer 32 preferably is the double side dielectric band, has the release layer (not shown) at the reverse side of foam core layer 28.Then, on step 148, by etching required radiator pattern, making antenna conductive element is that radiator elements 24 and feed circuit 26 are formed on the metal level 60; But, also can after step 142, form antenna radiator unit 24 and the feed circuit 26 that powers up.Then, on step 150, utilize adhesive layer 32 to form piling up of radiator elements 24 and feed circuit 26 above can making and 34 join in the conduction holder 35.
As first optional embodiment, on step 152, utilize adhesive layer 73 so that obtain into the metal level of parasitic elements 72 and join on the thin carrier dielectric layer 74, form and pile up 71.On the step 154, on metal level, etch parasitic element, to form each radiator patches 72.Then, on step 156, utilize adhesive layer 78, the carrier dielectric layer 74 of piling up in 71 is joined on the dielectric layer 76.Then, on step 158, utilize adhesive layer 80,, dielectric layer 76 is joined to pile up on 34 by joining dielectric layer 76 to pile up corresponding radiator elements 24 in 22 top.Similarly, radio frequency connector 46 usefulness mechanical means are attached in the conduction holder 35, are welded to again on the metal level 60, so that they have normal electrical connection.As top, when needs, add remaining machine assembly as illustrated in fig. 9 to finish last protection covering or radome sub-assembly 40, therefore, optional step 160 in the interpolation.
Among another optional embodiment, radiator elements 72 also can be directly bonded on the dielectric layer 76, and this is just without mounting medium amount 74 and etching step 154.Among this embodiment, after the step 150, in step 162, form each radiator elements with laser or die cut method.Then, on step 164, parasitic elements 72 is adhered on the dielectric layer 76 one by one.Then, all the other steps are same step 158 and optional steps 160 as the step that illustrates previously.
Above argumentation in, basalis resembles metal conducting layer 60 nothing but another sheet metal, it can substitute rigid conduction holder 35.Among this embodiment, shown on Figure 23 to Figure 25, have piling up of ground layer foil and 34 or 82 support by the electrical insulator such as radome 170.Radome 170 can make a plurality of component-assembled together by welding or mechanical system, perhaps can be the drawing unit of an integral body, or be formed by the whole piece material as shown in figure.In radome 170 forms, can use resemble radome cover 42 identical or materials similar.Though, can adopt the configuration of any amount to piling up 34 or 82 support, what adopt on the radome 170 is a pair of opposed slot crack 172 and 174 that forms on the opposing sidewalls 176 and 178 of radome 170.Sidewall 176 and 178 and top cover 186 is adjacent or form one with top cover 180.Top cover 180 is illustrated as the arched door shape in the drawings, but also can be flat shape or other shapes on demand.Sidewall 176 and 178 is again in abutting connection with bottom 182 or form one with it.Similarly, though bottom 182 is illustrated as flat shape, also can be other shapes on demand.Show brightly among the figure, pile up 82 and be installed in the groove crack 172 and 174 of radome 170.Preferably, pile up 34 or 82 and rely on sheet metal backboard 35 to slip in the radome 170 (being shown in Figure 25), then, cover with the two ends of the end cap (not shown) that is similar to end cap 44 with opening.When needing, can comprise one or more supports 184 on bottom 182, they form or are installed in the bottom 182 (being illustrated as a pair of support 184 among the figure), to help support stack 34 or 82.
As mentioned above, use the various low-cost parts that are suitable for the printed circuit board (PCB) manufacturing technology in the low-cost antenna array design of the present invention, they can be assembled together at short notice, and the assembling back only needs in a small amount or need not adjust just to obtain required performance.
Though, with several preferred embodiments the present invention being described, the skilled person in the present technique field understands easily, can make many modifications, augment and delete with disclosed the present invention what illustrate, but they is without departing from the spirit and scope of the present invention.For example, though, for aerial array 70, on radiator elements 72, only show bright once parasitic elements 76 can be added one or more groups parasitic elements to aerial array 70 when needing.Foam core layer 28 and froth bed 76 are illustrated as integral structure, but also can be multilayer or the laminations that forms with heating or ultrasonic technique and so on welding, together two or more foam core layers can be arranged.In addition, when combining with the curved surface basalis, foam core layer 28 and froth bed 76 can be assembled into blocks of linearity or plane stripping and slicing and meet shape or i.e. " curved surface " pattern, rather than the version of continuous bend.Therefore, for the basalis part of continuous bend in fact, foam core layer 28 and froth bed 76 can be made the splicing structure of little chip, linearity or planar shaped.
Claims (52)
1. aerial array with sandwich construction comprises:
Metal level has a plurality of antenna radiator unit that power up, and is formed with feed element therein;
The first thin carrier dielectric layer, described metal level are formed on the described first thin carrier dielectric layer;
Foam core layer has top surface and lower surface, and wherein, the described first thin carrier dielectric layer is formed on the described top surface of described foam core layer; And
Adhesive layer is formed on the described lower surface of described foam core layer, and wherein, described adhesive layer is adhered on the metallic substrate layer.
2. the aerial array in the claim 1, wherein, described metal level joins on the described first thin carrier dielectric layer with adhesive means.
3. the aerial array of claim 1, wherein, the described first thin carrier dielectric layer is adhered on the described foam core layer with adhesive means.
4. the aerial array of claim 1, wherein, described metallic substrate layer is a thin metal level.
5. the aerial array of claim 4 further comprises a nonconducting radome covered structure, seals each layer that antenna is stated in the residence, and described each layer provided support.
6. the aerial array of claim 1 comprises that further to make described each layer of antenna bonded to each other with adhesive means.
7. the aerial array of claim 1 further comprises a radome covered structure, seals each layer that antenna is stated in the residence.
8. the aerial array of claim 1, wherein, at least a portion is formed on the curved surface basalis in described a plurality of antenna stacks.
9. the aerial array of claim 8, wherein, each layer of described a plurality of antenna stacks is formed on the curved surface basalis.
10. the aerial array of claim 8, wherein, described foam core layer forms curve form, to be fit to described curved surface basalis.
11. the aerial array of claim 1, wherein, described metallic substrate layer comes down to the metal level of a rigid support.
12. the aerial array of claim 1, further comprise at least one second dielectric layer, be formed on the described metal level, there are a plurality of parasitic elements to be formed at the top surface of described second dielectric layer, wherein, between corresponding each radiator elements electric coupling is arranged in described each parasitic elements and the described metal level.
13. the aerial array of claim 12 further is included in the second thin carrier dielectric layer top surface and is formed with described a plurality of parasitic elements, is formed with the described second thin carrier dielectric layer on described second dielectric layer.
14. the aerial array of claim 12 comprises that further to make described each layer bonded to each other with adhesive means.
15. the aerial array of claim 12 further comprises the radome covered structure, seals each layer that antenna is stated in the residence.
16. the aerial array of claim 12, wherein, described metallic substrate layer is a thin metal level.
17. the aerial array of claim 16 further comprises nonconducting radome covered structure, seals each layer that antenna is stated in the residence, and the support to described each layer of antenna is provided.
18. the aerial array of claim 12, wherein, at least a portion is formed on the curved surface basalis in described a plurality of antenna stacks.
19. the aerial array of claim 18, wherein, each layer of described a plurality of antenna stacks is formed by flexible material, to conform to described curved surface basalis.
20. the aerial array of claim 18, wherein, described foam core layer forms curve form, to be fit to described curved surface basalis.
21. the aerial array of claim 12, wherein, described metallic substrate layer comes down to the metal level of a rigid support.
22. the aerial array with a plurality of layers comprises:
Metal level has a plurality of antenna radiator unit that power up, and is formed with feed element therein;
The first thin carrier dielectric layer, described metal level are formed on the described first thin carrier dielectric layer;
Foam core layer has top surface and lower surface, and wherein, the described first thin carrier dielectric layer is formed on the described top surface of described foam core layer;
At least one second dielectric layer is formed on the described metal level; And
A plurality of parasitic elements, be formed at the top surface of the second thin carrier dielectric layer, wherein, between corresponding each radiator elements electric coupling is arranged in described a plurality of parasitic elements and the described metal level, the described second thin carrier dielectric layer is formed on described second dielectric layer, and wherein, described each layer is bonded to each other and form and pile up, adhesive layer is formed on the lower surface of the described foam core layer in described the piling up, and wherein by adhesive layer described piling up is adhered on the metallic substrate layer.
23. the aerial array of claim 22 further comprises the radome covered structure, seals each layer that antenna is stated in the residence.
24. the aerial array of claim 22, wherein, described metallic substrate layer is a thin metal level.
25. the aerial array of claim 24 further comprises nonconducting radome covered structure, seals each layer that antenna is stated in the residence, and the support to described each layer of antenna is provided.
26. the aerial array of claim 22, wherein, at least a portion is formed on the curved surface basalis in described a plurality of antenna stacks.
27. the aerial array of claim 26, wherein, each layer of described a plurality of antenna stacks is formed by flexible material, to conform to described curved surface basalis.
28. the aerial array of claim 26, wherein, described foam core layer forms curve form, with suitable described curved surface basalis.
29. the aerial array of claim 22, wherein, described metallic substrate layer comes down to the metal level of a rigid support.
30. a method of making aerial array comprises step:
Form a foam core layer with top and lower surface;
A bonding metal level on the first thin carrier dielectric layer, and the described first thin carrier dielectric layer is adhered on the described top surface of described foam core layer;
On the described lower surface of described foam core layer, apply adhesive layer;
On described metal level, etch a plurality of radiator elements and feed element; And
Form metallic substrate layer, utilize described adhesive layer to make described foam core layer, the described first thin carrier dielectric layer and described metal level and described metallic substrate layer are bonding.
31. the method for claim 30 further comprises step, and described each layer of antenna is encapsulated in the radome covering.
32. the method for claim 30 further comprises step, makes a thin metal level form described metallic substrate layer.
33. the method for claim 32 further comprises step, forms a nonconducting radome covered structure so that the support to described each layer of antenna to be provided, and described each layer of antenna sealed and be supported in the described radome covered structure.
34. the method for claim 30, include make in these a plurality of antenna stacks at least a portion be formed at a step on the curved surface basalis.
35. the method for claim 34, include make described a plurality of antenna stack each layer formation from a kind of flexible material and make described each layer of antenna accord with the step of described curved surface basalis shape.
36. the method for claim 34 includes and makes described foam core layer form curve form to be fit to the step of described curved surface basalis.
37. the method for claim 30 includes and makes described metallic substrate layer form the metal level of rigid in fact support to be used for the step of described each layer of antenna.
38. the method for claim 30, further comprise step, at least one second dielectric layer is adhered on the described metal level, and form a plurality of parasitic elements at the top surface of described second dielectric layer, they and be formed in the described metal level and between each corresponding radiator elements electric coupling arranged.
39. the method for claim 38 further comprises step, forms described a plurality of parasitic elements at second top surface that approaches carrier dielectric layer, and the described second thin carrier dielectric layer is adhered on described second dielectric layer.
40. the method for claim 38 further comprises making described each layer of antenna be encapsulated into the interior step of radome covered structure.
41. the method for claim 38 includes and makes that at least a portion is formed at a step on the curved surface basalis in described a plurality of antenna stack.
42. the method for claim 41, include make described a plurality of antenna stack each layer formation from a kind of flexible material and make described each layer of antenna accord with the step of described curved surface basalis shape.
43. the method for claim 41 includes and makes described foam core layer form curve form to be fit to the step of described curved surface substrate sheet.
44. the method for claim 38 includes and makes described metallic substrate layer form the metal level of rigid in fact support to be used for the step of described each layer of antenna.
45. a method of making aerial array comprises step:
Form a foam core layer with top and lower surface;
A bonding metal level on the first thin carrier dielectric layer, and the described first thin carrier dielectric layer is adhered on the described top surface of described foam core layer;
On the described lower surface of described foam core layer, apply adhesive layer;
On described metal level, etch a plurality of radiator elements and feed element;
Form metallic substrate layer, utilize described adhesive layer to make described foam core layer, the described first thin carrier dielectric layer and described metal level and described metallic substrate layer are bonding;
At least one second dielectric layer is adhered on described metal level radiator elements and the feed element; And
Top surface at described second dielectric layer forms a plurality of parasitic elements.
46. the method for claim 45 further comprises step, and described aerial array is encapsulated in the radome covering.
47. the method for claim 45 further comprises step, described metallic substrate layer forms from a thin metal level.
48. the method for claim 45 further comprises step, forms nonconducting radome covered structure, in order to support and to seal each layer of described antenna in the described radome covered structure.
49. the method for claim 45 includes and makes that at least a portion is formed at a step on the curved surface basalis in described a plurality of antenna stack.
50. the method for claim 49 includes each layer formation of making described a plurality of antenna stack from a kind of flexible material and make each layer of described antenna comply with the step of described curved surface basalis shape.
51. the method for claim 49 includes and makes described foam core layer form the step of the suitable described curved surface basalis of curve form.
52. the method for claim 45 includes and makes described metallic substrate layer form the metal level of rigid in fact support to be used for the step of described each layer of antenna.
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| Application Number | Priority Date | Filing Date | Title |
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| PCT/US2003/002752 WO2004070878A1 (en) | 2003-01-31 | 2003-01-31 | Low-cost antenna array |
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| CN1736000A true CN1736000A (en) | 2006-02-15 |
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| EP (1) | EP1588455A1 (en) |
| JP (1) | JP2006514463A (en) |
| CN (1) | CN1736000A (en) |
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| CN102509849A (en) * | 2011-12-01 | 2012-06-20 | 武汉滨湖电子有限责任公司 | Fixing structure for miniature phased-array radar antenna |
| CN102810769A (en) * | 2012-07-31 | 2012-12-05 | 深圳市远望谷信息技术股份有限公司 | Ultrahigh frequency broadband high-gain antenna |
| CN103427158A (en) * | 2012-05-23 | 2013-12-04 | 日立电线株式会社 | Antenna device |
| CN103490175A (en) * | 2013-09-23 | 2014-01-01 | 摩比天线技术（深圳）有限公司 | Integrated base station antenna |
| CN104112906A (en) * | 2014-07-23 | 2014-10-22 | 深圳市视晶无线技术有限公司 | MIMO (multiple input multiple output) antenna system and device |
| CN104134861A (en) * | 2014-07-23 | 2014-11-05 | 深圳市视晶无线技术有限公司 | Multi-input multi-output antenna system, approximately-omnidirectional antenna device and high-gain miniature antenna thereof |
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|---|---|---|---|---|
| CN101517827B (en) | 2006-09-28 | 2013-06-12 | 罗斯蒙德公司 | Wireless field device with antenna and radome for industrial locations |
| JP5168635B2 (en) * | 2008-03-26 | 2013-03-21 | 関西電力株式会社 | Directional antenna and antenna system |
| US8599072B2 (en) * | 2008-06-10 | 2013-12-03 | Apple Inc. | Antennas |
| US8362959B2 (en) | 2008-10-13 | 2013-01-29 | Rosemount Inc. | Wireless field device with rugged antenna and rotation stop |
| TWM361111U (en) * | 2009-02-13 | 2009-07-11 | Wistron Neweb Corp | Antenna structure |
| JP2010197080A (en) * | 2009-02-23 | 2010-09-09 | Sii Nanotechnology Inc | Induction coupling plasma analyzer |
| WO2012059122A1 (en) * | 2010-11-01 | 2012-05-10 | Telefonaktiebolaget L M Ericsson (Publ) | Compact multi-column antenna |
| KR101806556B1 (en) * | 2011-08-02 | 2018-01-10 | 엘지이노텍 주식회사 | Antenna and mobile device therefor |
| US9520643B2 (en) | 2013-04-10 | 2016-12-13 | Apple Inc. | Electronic device with foam antenna carrier |
| EP2814110B1 (en) * | 2013-06-14 | 2018-04-25 | Alcatel Lucent | A radio frequency filter, a method of radio frequency filtering and a method of constructing a radio frequency filter |
| WO2015113649A1 (en) * | 2014-01-30 | 2015-08-06 | Kildal Antenn Ab | Methods and apparatuses for testing wireless communication to vehicles |
| US9954273B2 (en) | 2015-04-01 | 2018-04-24 | Apple Inc. | Electronic device antennas with laser-activated plastic and foam carriers |
| JP6934230B2 (en) | 2018-02-21 | 2021-09-15 | 日本電業工作株式会社 | Antenna structure |
| CN110752444A (en) * | 2018-07-24 | 2020-02-04 | 康普技术有限责任公司 | Antenna shell |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4766444A (en) * | 1986-07-01 | 1988-08-23 | Litton Systems, Inc. | Conformal cavity-less interferometer array |
| JP2846081B2 (en) * | 1990-07-25 | 1999-01-13 | 日立化成工業株式会社 | Triplate type planar antenna |
| DE4239597C2 (en) * | 1991-11-26 | 1999-11-04 | Hitachi Chemical Co Ltd | Flat antenna with dual polarization |
| FR2757315B1 (en) * | 1996-12-17 | 1999-03-05 | Thomson Csf | BROADBAND PRINTED NETWORK ANTENNA |
| CN1481596A (en) * | 2000-12-21 | 2004-03-10 | 3 | Dual polarisation antenna |
-
2003
- 2003-01-31 EP EP03708900A patent/EP1588455A1/en not_active Withdrawn
- 2003-01-31 CN CN03825885.4A patent/CN1736000A/en active Pending
- 2003-01-31 BR BR0317194-9A patent/BR0317194A/en not_active IP Right Cessation
- 2003-01-31 AU AU2003212859A patent/AU2003212859A1/en not_active Abandoned
- 2003-01-31 JP JP2004567957A patent/JP2006514463A/en active Pending
- 2003-01-31 WO PCT/US2003/002752 patent/WO2004070878A1/en active Application Filing
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102509849A (en) * | 2011-12-01 | 2012-06-20 | 武汉滨湖电子有限责任公司 | Fixing structure for miniature phased-array radar antenna |
| CN103427158A (en) * | 2012-05-23 | 2013-12-04 | 日立电线株式会社 | Antenna device |
| CN102810769A (en) * | 2012-07-31 | 2012-12-05 | 深圳市远望谷信息技术股份有限公司 | Ultrahigh frequency broadband high-gain antenna |
| CN103490175A (en) * | 2013-09-23 | 2014-01-01 | 摩比天线技术（深圳）有限公司 | Integrated base station antenna |
| CN103490175B (en) * | 2013-09-23 | 2016-01-06 | 摩比天线技术（深圳）有限公司 | A kind of integrated base station antenna |
| CN104112906A (en) * | 2014-07-23 | 2014-10-22 | 深圳市视晶无线技术有限公司 | MIMO (multiple input multiple output) antenna system and device |
| CN104134861A (en) * | 2014-07-23 | 2014-11-05 | 深圳市视晶无线技术有限公司 | Multi-input multi-output antenna system, approximately-omnidirectional antenna device and high-gain miniature antenna thereof |
| CN111146558A (en) * | 2019-11-06 | 2020-05-12 | 上海交通大学 | Terahertz narrow-beam transmission array antenna based on thin film technology and implementation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| BR0317194A (en) | 2005-11-29 |
| EP1588455A1 (en) | 2005-10-26 |
| JP2006514463A (en) | 2006-04-27 |
| WO2004070878A1 (en) | 2004-08-19 |
| AU2003212859A1 (en) | 2004-08-30 |
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