JP2006506278A5 - - Google Patents
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- JP2006506278A5 JP2006506278A5 JP2004546717A JP2004546717A JP2006506278A5 JP 2006506278 A5 JP2006506278 A5 JP 2006506278A5 JP 2004546717 A JP2004546717 A JP 2004546717A JP 2004546717 A JP2004546717 A JP 2004546717A JP 2006506278 A5 JP2006506278 A5 JP 2006506278A5
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- 230000005611 electricity Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Description
読み書きヘッドを製造し、それを電子部品に取り付けるために、複雑な組立ラインが一般的に用いられる。読み書きヘッドは、組立ラインにおけるヘッドの搬送および処理を容易にする特別な読み書きヘッドトレイの中に格納され搬送される。ほとんどの読み書きヘッドトレイは、いかなる静電気放電(ESD)も防がれねばならない。読み書きヘッドが載る表面を導電性表面内に製造することによって、トレイはESDに対して安全なものになる。導電性表面が静電気を逃がすので、静電気が表面上に蓄積することはない。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US40774902P | 2002-09-03 | 2002-09-03 | |
PCT/US2003/027562 WO2004038760A2 (en) | 2002-09-03 | 2003-09-03 | High temperature, high strength, colorable materials for use with electronics processing applications |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006506278A JP2006506278A (en) | 2006-02-23 |
JP2006506278A5 true JP2006506278A5 (en) | 2006-10-26 |
Family
ID=32176438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004546717A Withdrawn JP2006506278A (en) | 2002-09-03 | 2003-09-03 | High temperature high strength colorable materials for use in electronics processing applications |
Country Status (8)
Country | Link |
---|---|
US (1) | US20040126521A1 (en) |
EP (1) | EP1536943A4 (en) |
JP (1) | JP2006506278A (en) |
KR (1) | KR20050039871A (en) |
CN (1) | CN1694803A (en) |
AU (1) | AU2003296901A1 (en) |
TW (1) | TW200408693A (en) |
WO (1) | WO2004038760A2 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070026171A1 (en) * | 2002-09-03 | 2007-02-01 | Extrand Charles W | High temperature, high strength, colorable materials for use with electronics processing applications |
KR20050050122A (en) * | 2002-10-09 | 2005-05-27 | 엔테그리스, 아이엔씨. | High temperature, high strength, colorable materials for device processing systems |
US7250612B2 (en) * | 2005-09-28 | 2007-07-31 | General Electric Company | Devices and methods capable of authenticating batteries |
WO2008063709A2 (en) * | 2006-06-20 | 2008-05-29 | Polyone Corporation | Thermally conductive polymer compounds containing zinc sulfide |
US7476339B2 (en) * | 2006-08-18 | 2009-01-13 | Saint-Gobain Ceramics & Plastics, Inc. | Highly filled thermoplastic composites |
JP2013541181A (en) | 2010-08-18 | 2013-11-07 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Light emitting diode assembly and thermal control blanket and method related thereto |
US8853723B2 (en) | 2010-08-18 | 2014-10-07 | E. I. Du Pont De Nemours And Company | Light emitting diode assembly and thermal control blanket and methods relating thereto |
US8758860B1 (en) | 2012-11-07 | 2014-06-24 | Bayer Materialscience Llc | Process for incorporating an ion-conducting polymer into a polymeric article to achieve anti-static behavior |
EP2799940B1 (en) * | 2013-04-30 | 2019-07-17 | The Swatch Group Management Services AG | Packaging for hands of watches |
CN106496992B (en) * | 2016-10-26 | 2018-08-14 | 宁国市大荣电器有限公司 | A kind of heat-resistant, high strength degree capacitor plastic housing |
KR20200142622A (en) * | 2019-06-12 | 2020-12-23 | 삼성디스플레이 주식회사 | Substrate transferring apparatus and substrate transferring method using the same |
CN116554638A (en) * | 2023-06-13 | 2023-08-08 | 南京肯特复合材料股份有限公司 | Conductive indium-doped tin oxide and polyether-ether-ketone composite material and preparation method thereof |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
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US132232A (en) * | 1872-10-15 | Improvement in steam road-rollers | ||
US132136A (en) * | 1872-10-15 | Improvement in coffee cleaners and polishers | ||
US146218A (en) * | 1874-01-06 | Improvement in billiard-registers | ||
DE3416856A1 (en) * | 1984-05-08 | 1985-11-14 | Basf Ag, 6700 Ludwigshafen | THERMOPLASTIC MOLDS |
US4816556A (en) * | 1985-02-22 | 1989-03-28 | E. I. Du Pont De Nemours And Company | Ordered polyetherketones |
CA1262000A (en) * | 1985-02-27 | 1989-09-26 | Isaburo Fukawa | Process for preparing crystalline aromatic polyetherketones |
US4818437A (en) * | 1985-07-19 | 1989-04-04 | Acheson Industries, Inc. | Conductive coatings and foams for anti-static protection, energy absorption, and electromagnetic compatability |
JPH0714744B2 (en) * | 1988-12-15 | 1995-02-22 | 旭有機材工業株式会社 | Tray for integrated circuits |
JP2816864B2 (en) * | 1989-07-07 | 1998-10-27 | 大塚化学株式会社 | Transfer wafer basket and storage case |
JP2794850B2 (en) * | 1989-12-01 | 1998-09-10 | 住友化学工業株式会社 | Aromatic polysulfone resin composition |
US5890599A (en) * | 1990-09-25 | 1999-04-06 | R.H. Murphy Company | Tray for integrated circuits |
US5338334A (en) * | 1992-01-16 | 1994-08-16 | Institute Of Gas Technology | Process for preparing submicron/nanosize ceramic powders from precursors incorporated within a polymeric foam |
US5749469A (en) * | 1992-05-15 | 1998-05-12 | Fluoroware, Inc. | Wafer carrier |
JPH0752661B2 (en) * | 1992-12-01 | 1995-06-05 | 山一電機株式会社 | IC carrier |
US5447708A (en) * | 1993-01-21 | 1995-09-05 | Physical Sciences, Inc. | Apparatus for producing nanoscale ceramic powders |
JP2959928B2 (en) * | 1993-06-23 | 1999-10-06 | チタン工業株式会社 | White conductive resin composition |
US5827907A (en) * | 1993-08-30 | 1998-10-27 | Ibm Corporation | Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin |
US5348151A (en) * | 1993-12-20 | 1994-09-20 | Empak, Inc. | Low profile disk carrier |
US5538675A (en) * | 1994-04-14 | 1996-07-23 | The Dow Chemical Company | Method for producing silicon nitride/silicon carbide composite |
WO1995029956A1 (en) * | 1994-04-28 | 1995-11-09 | Daikin Industries, Ltd. | Thermoplastic resin composition |
JP2688664B2 (en) * | 1994-09-07 | 1997-12-10 | シノン電気産業株式会社 | Tray for semiconductor device |
WO1997000340A1 (en) * | 1995-06-14 | 1997-01-03 | Otsuka Kagaku Kabushiki Kaisha | Titanate whisker and process for the production thereof |
JPH09111135A (en) * | 1995-10-23 | 1997-04-28 | Mitsubishi Materials Corp | Conductive polymer composition |
JPH09172059A (en) * | 1995-12-18 | 1997-06-30 | Nippon Precision Circuits Kk | Chip tray for ic |
US5788082A (en) * | 1996-07-12 | 1998-08-04 | Fluoroware, Inc. | Wafer carrier |
DE19629675A1 (en) * | 1996-07-23 | 1998-01-29 | Merck Patent Gmbh | Laser-markable plastics |
US5921397A (en) * | 1996-12-10 | 1999-07-13 | Empak, Inc. | Disk cassette |
US5794783A (en) * | 1996-12-31 | 1998-08-18 | Intel Corporation | Die-level burn-in and test flipping tray |
US5791486A (en) * | 1997-01-07 | 1998-08-11 | Fluoroware, Inc. | Integrated circuit tray with self aligning pocket |
US6413489B1 (en) * | 1997-04-15 | 2002-07-02 | Massachusetts Institute Of Technology | Synthesis of nanometer-sized particles by reverse micelle mediated techniques |
US6105749A (en) * | 1997-11-25 | 2000-08-22 | International Business Machines Corporation | Enhanced matrix tray feeder |
JP4447165B2 (en) * | 1998-01-09 | 2010-04-07 | ポリ−フロー エンジニアリング エルエルシー | Container cleaning device |
US6202883B1 (en) * | 1998-02-06 | 2001-03-20 | Mitsubishi Engineering-Plastics Corp. | Tray for semiconductor integrated circuit devices |
US6227372B1 (en) * | 1998-04-30 | 2001-05-08 | Peak International, Inc. | Component carrier tray for high-temperature applications |
US6395149B1 (en) * | 1998-06-30 | 2002-05-28 | 3M Innovative Properties Company | Method of making light colored, electrically conductive coated particles |
US6329058B1 (en) * | 1998-07-30 | 2001-12-11 | 3M Innovative Properties Company | Nanosize metal oxide particles for producing transparent metal oxide colloids and ceramers |
US6079565A (en) * | 1998-12-28 | 2000-06-27 | Flouroware, Inc. | Clipless tray |
SG92640A1 (en) * | 1999-06-07 | 2002-11-19 | E Pak Resources S Pte Ltd | Stud and rider for use on matrix trays |
US6474477B1 (en) * | 2001-05-02 | 2002-11-05 | Ching T. Chang | Carrier assembly for semiconductor IC (integrated circuit) packages |
-
2003
- 2003-09-03 KR KR1020057003705A patent/KR20050039871A/en not_active Application Discontinuation
- 2003-09-03 US US10/654,584 patent/US20040126521A1/en not_active Abandoned
- 2003-09-03 EP EP03809512A patent/EP1536943A4/en not_active Withdrawn
- 2003-09-03 WO PCT/US2003/027562 patent/WO2004038760A2/en not_active Application Discontinuation
- 2003-09-03 CN CNA038249502A patent/CN1694803A/en active Pending
- 2003-09-03 AU AU2003296901A patent/AU2003296901A1/en not_active Abandoned
- 2003-09-03 JP JP2004546717A patent/JP2006506278A/en not_active Withdrawn
- 2003-09-03 TW TW092124310A patent/TW200408693A/en unknown
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