JP2006272756A5 - - Google Patents

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Publication number
JP2006272756A5
JP2006272756A5 JP2005095386A JP2005095386A JP2006272756A5 JP 2006272756 A5 JP2006272756 A5 JP 2006272756A5 JP 2005095386 A JP2005095386 A JP 2005095386A JP 2005095386 A JP2005095386 A JP 2005095386A JP 2006272756 A5 JP2006272756 A5 JP 2006272756A5
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JP
Japan
Prior art keywords
semiconductor block
holding device
slice base
adhesion region
region
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Application number
JP2005095386A
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Japanese (ja)
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JP2006272756A (en
JP4721743B2 (en
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Priority to JP2005095386A priority Critical patent/JP4721743B2/en
Priority claimed from JP2005095386A external-priority patent/JP4721743B2/en
Publication of JP2006272756A publication Critical patent/JP2006272756A/en
Publication of JP2006272756A5 publication Critical patent/JP2006272756A5/ja
Application granted granted Critical
Publication of JP4721743B2 publication Critical patent/JP4721743B2/en
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Claims (8)

半導体ブロックが接着剤により接着される第1の面を有するスライスベースを備え、Comprising a slice base having a first surface to which the semiconductor block is bonded by an adhesive;
前記スライスベースの前記第1の面が、前記半導体ブロックと接着される領域の端部に凹部を有することを特徴とする半導体ブロックの保持装置。The holding device for a semiconductor block, wherein the first surface of the slice base has a recess at an end portion of a region bonded to the semiconductor block. 前記スライスベースの前記第１の面と前記半導体ブロックとの前記接着領域が四角形状を有し、The adhesion region between the first surface of the slice base and the semiconductor block has a quadrangular shape;
前記スライスベースの前記凹部は、前記スライスベースの前記第1の面と前記半導体ブロックとの前記接着領域の対角線に沿って形成されていることを特徴とする請求項１に記載の半導体ブロックの保持装置。2. The semiconductor block holding device according to claim 1, wherein the concave portion of the slice base is formed along a diagonal line of the adhesion region between the first surface of the slice base and the semiconductor block. 3. apparatus. 前記凹部は、前記スライスベースの前記半導体ブロックと接着される領域の中央部と外周部との間に形成されていることを特徴とする請求項１または２に記載の半導体ブロックの保持装置。3. The semiconductor block holding device according to claim 1, wherein the concave portion is formed between a central portion and an outer peripheral portion of a region bonded to the semiconductor block of the slice base. 前記凹部は、前記接着領域に面した開口部の面積が、前記接着領域の５％以上１０％以下であることを特徴とする請求項１〜３のいずれかに記載の半導体ブロックの保持装置。The holding device for a semiconductor block according to any one of claims 1 to 3, wherein an area of the opening facing the adhesion region is 5% or more and 10% or less of the adhesion region. 前記凹部は、前記接着領域の外周部から中央部に向かって横断面の幅が狭くなるように変化することを特徴とする請求項１〜４のいずれかに記載の半導体ブロックの保持装置。5. The semiconductor block holding device according to claim 1, wherein the concave portion changes such that a width of a cross section becomes narrower from an outer peripheral portion to a central portion of the adhesion region. 前記スライスベースは、前記半導体ブロックより大きいことを特徴とする請求項１〜５のいずれかに記載の半導体ブロックの保持装置。The semiconductor block holding device according to claim 1, wherein the slice base is larger than the semiconductor block. 前記凹部は、前記スライスベースの前記第1の面と前記半導体ブロックとの前記接着領域の外周にさらに形成されていることを特徴とする請求項６に記載の半導体ブロックの保持装置。7. The semiconductor block holding device according to claim 6, wherein the recess is further formed on an outer periphery of the adhesion region between the first surface of the slice base and the semiconductor block. 前記凹部は溝状に形成されていることを特徴とする請求項１〜７のいずれかに記載の半導体ブロックの保持装置。The semiconductor block holding device according to claim 1, wherein the recess is formed in a groove shape.
JP2005095386A 2005-03-29 2005-03-29 Semiconductor block holding device Active JP4721743B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005095386A JP4721743B2 (en) 2005-03-29 2005-03-29 Semiconductor block holding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005095386A JP4721743B2 (en) 2005-03-29 2005-03-29 Semiconductor block holding device

Publications (3)

Publication Number Publication Date
JP2006272756A JP2006272756A (en) 2006-10-12
JP2006272756A5 true JP2006272756A5 (en) 2008-02-07
JP4721743B2 JP4721743B2 (en) 2011-07-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005095386A Active JP4721743B2 (en) 2005-03-29 2005-03-29 Semiconductor block holding device

Country Status (1)

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JP (1) JP4721743B2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100884246B1 (en) * 2007-08-24 2009-02-17 주식회사 다우빔 Supporting plate for slicing silicon ingot
JP2009090416A (en) * 2007-10-10 2009-04-30 Dainippon Printing Co Ltd Method of manufacturing membrane structure
JP5117880B2 (en) * 2008-02-21 2013-01-16 セイコーインスツル株式会社 Wafer fabrication method
ES2363862T3 (en) * 2008-04-23 2011-08-18 Applied Materials Switzerland Sa ASSEMBLY PLATE FOR A THREAD SAWING DEVICE, THREAD SAWING DEVICE THAT INCLUDES THE SAME AND SAWING PROCEDURE BY THREAD CARRIED OUT THROUGH THE DEVICE.
JP5196604B2 (en) * 2008-06-19 2013-05-15 信濃電気製錬株式会社 Method of cutting ingot using fret bar for ingot slicing and ingot with sticking the fret bar
JP5348746B2 (en) * 2008-11-17 2013-11-20 株式会社パイロットコーポレーション Orthodontic bracket
KR101078178B1 (en) 2008-12-10 2011-10-28 주식회사 엘지실트론 Support unit and ingot cutting apparatus having same
JP5495981B2 (en) * 2010-06-29 2014-05-21 京セラ株式会社 Manufacturing method of semiconductor substrate
KR200464626Y1 (en) * 2011-01-21 2013-01-21 주식회사 넥솔론 Apparatus for fixing substrate block
US10731016B2 (en) 2016-07-18 2020-08-04 Conopco, Inc. Method of modifying the dispensing properties of a container

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4819387A (en) * 1987-12-16 1989-04-11 Motorola, Inc. Method of slicing semiconductor crystal
JP3351053B2 (en) * 1993-10-19 2002-11-25 株式会社豊田自動織機 Electronic components
JPH09155855A (en) * 1995-12-06 1997-06-17 Sony Corp Bonding stand for processing single crystal and processing of single crystal
JP4325889B2 (en) * 1999-07-13 2009-09-02 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Semiconductor wafer stacking jig and semiconductor wafer manufacturing method
JP4361658B2 (en) * 2000-02-14 2009-11-11 富士通マイクロエレクトロニクス株式会社 Mounting board and mounting method
JP2004082282A (en) * 2002-08-27 2004-03-18 Kyocera Corp Method for slicing semiconductor block
JP2004114503A (en) * 2002-09-26 2004-04-15 Kyocera Corp Ingot cutting method
JP4388362B2 (en) * 2003-12-22 2009-12-24 京セラ株式会社 Cutting method of semiconductor ingot

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