JP2006505457A5 - - Google Patents

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Publication number
JP2006505457A5
JP2006505457A5 JP2004536085A JP2004536085A JP2006505457A5 JP 2006505457 A5 JP2006505457 A5 JP 2006505457A5 JP 2004536085 A JP2004536085 A JP 2004536085A JP 2004536085 A JP2004536085 A JP 2004536085A JP 2006505457 A5 JP2006505457 A5 JP 2006505457A5
Authority
JP
Japan
Prior art keywords
body portion
carrier
component
rigid
contact surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004536085A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006505457A (ja
Filing date
Publication date
Priority claimed from US10/241,815 external-priority patent/US6926937B2/en
Priority claimed from US10/241,805 external-priority patent/US7108899B2/en
Application filed filed Critical
Priority claimed from PCT/US2003/027533 external-priority patent/WO2004024594A1/en
Publication of JP2006505457A publication Critical patent/JP2006505457A/ja
Publication of JP2006505457A5 publication Critical patent/JP2006505457A5/ja
Pending legal-status Critical Current

Links

JP2004536085A 2002-09-11 2003-09-04 粘着性表面を有するキャリア Pending JP2006505457A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/241,815 US6926937B2 (en) 2002-09-11 2002-09-11 Matrix tray with tacky surfaces
US10/241,805 US7108899B2 (en) 2002-09-11 2002-09-11 Chip tray with tacky surface
PCT/US2003/027533 WO2004024594A1 (en) 2002-09-11 2003-09-04 Carrier with tacky surfaces

Publications (2)

Publication Number Publication Date
JP2006505457A JP2006505457A (ja) 2006-02-16
JP2006505457A5 true JP2006505457A5 (zh) 2006-10-19

Family

ID=31996730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004536085A Pending JP2006505457A (ja) 2002-09-11 2003-09-04 粘着性表面を有するキャリア

Country Status (6)

Country Link
EP (1) EP1551730A4 (zh)
JP (1) JP2006505457A (zh)
KR (1) KR20050042186A (zh)
AU (1) AU2003270072A1 (zh)
TW (1) TWI290121B (zh)
WO (1) WO2004024594A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8081118B2 (en) * 2008-05-15 2011-12-20 The Boeing Company Phased array antenna radiator assembly and method of forming same
KR101043475B1 (ko) * 2009-06-02 2011-06-23 삼성전기주식회사 다층 세라믹 기판용 지그 및 이를 이용한 다층 세라믹 기판의 제조 방법
NL2005626C2 (nl) * 2010-11-04 2012-05-07 Fico Bv Drager voor gesepareerde elektronische componenten en werkwijze voor visuele inspectie van gesepareerde elektronische componenten.
KR20170100353A (ko) * 2016-02-25 2017-09-04 (주)코스탯아이앤씨 반도체 수납 트레이 및 반도체 수납 트레이용 커버
JP7002302B2 (ja) * 2016-12-13 2022-02-10 芝浦メカトロニクス株式会社 成膜装置
JP7377426B2 (ja) * 2019-01-29 2023-11-10 キョーラク株式会社 二重容器
JP6730493B1 (ja) * 2019-06-14 2020-07-29 アァルピィ東プラ株式会社 積層体及び搬送部材

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4395451A (en) * 1980-07-14 1983-07-26 Althouse Victor E Semiconductor wafer and die handling method and means
US4778326A (en) * 1983-05-24 1988-10-18 Vichem Corporation Method and means for handling semiconductor and similar electronic devices
US4875581A (en) * 1985-03-19 1989-10-24 Robert B. Ray Static dissipative elastomeric coating for electronic packaging components
US5769237A (en) * 1996-07-15 1998-06-23 Vichem Corporation Tape carrier for electronic and electrical parts
JP2002002871A (ja) * 2000-04-20 2002-01-09 Hitachi Ltd 半導体装置の製造方法およびそれに用いられるトレイ

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