JP2006505457A - Carrier having an adhesive surface - Google Patents

Abstract

A carrier for handling and holding a plurality of small components. This carrier has a surface energy between about 20 dynes / cm and about 100 dynes / cm, a hardness between about Shore A15 and Shore D75, and about 1 × 10 ⁴ ohms / square to 1 × 10 ¹² ohms / square. Having an elastomer component contact surface formed from a thermoplastic elastomer material having a surface electrical resistance between.

Description

The present invention relates to a carrier for handling small components. More particularly, the present invention relates to a carrier tray for handling small electronic components such as semiconductor chips and devices.

BACKGROUND OF THE INVENTION The processing of semiconductor devices involves a number of processing steps. These devices are susceptible to physical and electrical damage and must be handled carefully when transporting between processing steps. Also, robots are often used to handle devices during processing. In order for robots to efficiently align and engage the device, these robots must align the device accurately. For this reason, special carriers have been developed to facilitate the transport of devices between processing steps.

  One type of conventional carrier, known as a film frame tray, generally has a frame portion that surrounds a thin film. An adhesive layer is disposed on the upper surface of the thin film. And a several device is arranged in the desired location on an adhesive agent. The adhesive serves to fix the position of the device. An example of such a film frame carrier is disclosed in US Pat. No. 5,833,073. This patent is hereby incorporated by reference in its entirety.

  Other carrier tray designs have also been developed that use a physical structure in the form of a pocket to secure multiple devices on the surface of the tray. An example of a pocket matrix tray is disclosed in US Pat. No. 5,481,438. Some of these matrix tray designs, such as Japanese Patent Publication No. 05-335787, also have multiple layers of adhesive material at the bottom of the pocket to secure the position of the device.

  A problem with conventional carriers using common adhesive materials is that such adhesives deposit contaminants in the form of particles that can damage the device. These contaminants are difficult to remove from the tray by cleaning without degrading the adhesive. In addition, the adhesive itself may contain solvents or other undesirable chemicals that can contaminate the device or process. Also, the adhesive itself may change depending on the surrounding conditions, and the adhesiveness may become too strong and interfere with the work of the device handling process by the robot. It may be impossible to fix to.

  Conventional carrier trays with pockets or other physical structures for holding devices can also cause problems. Devices such as bare chips and leadless chips do not have protrusions on the device, and thus are not easily grasped in the physical structure. Also, the device may become out of physical restraint during handling, resulting in damage to the device or improper alignment for handling by the robot.

There is a need in the industry for an improved carrier for handling semiconductor devices and other small components.
U.S. Patent No. 5,833,073 U.S. Pat.No. 5,481,438 JP-A-5-335787

SUMMARY OF THE INVENTION The present invention relates to an electrostatic discharge (ESD) safety carrier for handling and holding a plurality of small components. Here, the component is held by adhesion between the surface of the component and the contact surface of the carrier. The contact surface is formed from a relatively soft thermoplastic elastomer material having a medium or higher surface energy and a surface electrical resistance between about 1 × 10 ⁴ ohm / square and 1 × 10 ¹² ohm / square. The component is held in place only by adhesion to the thermoplastic contact surface without the use of other physical retaining structures or separate adhesives.

  The contact layer of the carrier is overmolded by injection molding on the rigid body part. This is preferably formed from a rigid thermoplastic material. The contact surface and the rigid body portion are held together with a polar bond formed during the injection molding process. The relative amount of adhesion provided by the contact surface can be adjusted by formulating or mixing the thermoplastic elastomer material with a blend of impact modifying polymer or other thermoplastic elastomer. In addition, the relative adhesion and electrical properties of the contact surface are determined by the fact that thermoplastic elastomers are inherently static dissipative or conductive polymers, organic fibers such as carbon fibers, carbon powders, metal materials or ceramic materials or filler materials. It can be modified by blending with the filler. In addition, small depressions or protrusions arranged in a random or regular matrix pattern can be provided on the contact layer to change the surface area and thus the degree of adhesion available for contact with the component being held.

A feature and advantage of the present invention is that the component is held on the carrier only by adhesion between the flat surface of the component and the thermoplastic elastomer contact surface of the carrier.
Another feature and advantage of the present invention is that the component is held in place on the carrier with sufficient force so that the carrier can be inverted without detachment of the component, and can also be used for normal transport. It can withstand the impact of handling.

Another feature and advantage of the present invention is that it does not use a lateral or vertical physical restraint structure to hold the component in place on the carrier other than the thermoplastic elastomer contact surface. .
Another feature and advantage of the present invention is that no separate adhesive material is used on the contact layer surface to adhere the component onto the contact surface, thus eliminating process contamination by solvents and other undesirable chemicals. The amount is reduced.

Another feature and advantage of the present invention is that the component contact surface and body portion of the carrier have ESD safety with respect to the components being held.
Another feature and advantage of the present invention is that the carrier is more easily recyclable than known carriers.
Another feature and advantage of the present invention is that the stack of carriers according to the present invention can be repositioned while holding the component in place, and it needs to contact or restrain the component laterally And what can be done without touching the top side of the component.

  Yet another feature and advantage of the present invention is suitable for individual applications by the relative amount of component attraction provided by the surface, by selection or modification of the materials used, or by changing the surface shape of the contact layer. So that it can be adjusted.

  Other objects, advantages and novel features of the invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art upon reading the following description. It will be understood by carrying out the invention. The objects and advantages of the invention will be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The accompanying drawings illustrate embodiments for the carrier of the present invention and its features and components. References to front and back, left and right, top and bottom, top and bottom, horizontal and vertical are for convenience of explanation and limit the invention or its components to a single positional or spatial arrangement. is not. The dimensions specified in the accompanying drawings and this specification may vary depending on the possible design and intended use of the embodiments of the invention without departing from the scope of the invention.

  As used herein, the term “about” means that dimensions, sizes, tolerances, formulations, parameters, shapes and other quantities and properties are not exact and need not be exact, and as required Is meant to be approximate and / or larger or smaller and represents tolerances, conversion factors, rounding, measurement errors, and other factors well known to those skilled in the art. In general, a dimension, size, formulation, parameter, shape or other quantity or characteristic is “about” or “approximate” whether or not so stated.

  In the microelectronics industry, many but not limited semiconductor chips, ferrite heads, magnetic resonance read heads, thin film heads, bare dies, bump dies, substrates, optical devices, laser diodes, preforms, and springs and lenses Carriers are used to store, transport, manufacture, and generally store small components such as parts.

  The present invention includes a carrier for handling semiconductor devices and other small components. In that case, the surface of the component can be placed in direct contact with the thermoplastic contact surface of the carrier having a moderate to high surface energy. This carrier is suitable for any type of component, including components that do not have protrusions or leads, such as bare chips and leadless chips, but can also be used in devices with leads, such as chip scale package (CSP) devices. it can. The device is held on the carrier without the use of a separate adhesive material and without the use of a lateral or vertical physical restraint separate from the thermoplastic contact surface itself.

The contact surface generally comprises a relatively soft thermoplastic material having a medium or higher surface energy. Adhesion between the flat surface of the device and the contact surface holds the device during tray movement and normal handling, while allowing the robot handling device to easily lift the device from the surface. The carrier also uses a material having a surface electrical resistance between about 1 × 10 ⁴ ohm / square and 1 × 10 ¹² ohm / square for either or both of the contact surface and the body portion, It is safe against ESD.

  1 and 2 show an embodiment of a carrier according to the invention having the form of a matrix tray 100. FIG. The tray 100 has a rigid body portion 110 in which the body portion 110 is arranged in a matrix in a plane defined by the “x” axis and the “y” axis as shown. A pocket 102 is formed for receiving a plurality of individual components. Each pocket 102 has a "z" axial orientation depth dimension and has at least one component contact surface 120 for engaging and holding a single component. The body portion 110 has a peripheral boundary region 112 that protrudes outwardly beyond the edge 122 of the matrix portion 116. A skirt 114 extending downward is provided on the main body portion 110. The skirt 114 is aligned to engage the peripheral boundary region 112 of the tray that is positioned immediately below when a plurality of trays are stacked as shown in FIG. As an alternative to the skirt 114, other structures such as downwardly extending legs or posts may be used to facilitate stacking of multiple trays. Although the pocket 102 is integrally formed in the rigid body portion 110 in the drawing, other arrangements in which a pocket or other structure for receiving components is formed are contemplated and within the scope of the invention. For example, the pockets forming the cross member 132 may be formed as separate grid-like workpieces and attached to the rest of the rigid body portion 110 using adhesives, fasteners or other means.

  7 and 8 show another embodiment for a carrier 300 according to the present invention. In this embodiment without pockets, the carrier 300 has a rigid body 302 that lies in a plane defined by the “x” and “y” axes as shown. A contact layer 120 is overlaid on the rigid body 302. The rigid body 302 preferably has a peripheral boundary region 304 that protrudes laterally beyond the edge 306 of the contact layer 120. The body portion 302 has a skirt 308 that extends downward. The skirt 308 is aligned to engage a peripheral boundary region 304 of another carrier 300 positioned just below when a plurality of carriers 300 are stacked, as shown in FIG. Yes. As an alternative to the skirt 308, other structures such as legs and posts may be used as well to facilitate stacking of multiple carriers 300. Skirt 308 has a sufficient length so that component 200 disposed on contact layer 120 does not contact any portion of tray 300 stacked immediately above. Although not necessarily required for effective component retention, a separate grid member 310 is attached over the contact layer 120 to form individual component retention regions 312 as shown in FIGS. May be.

  In the present invention, the contact layer 120 is formed from a polymeric elastomeric material having moderate or higher surface energy, a relatively soft surface, and ESD safety. Although other polymers can be used, thermoplastic materials are preferred because they are easy to recycle, have the general advantage of low process contamination producing sol-fractions, and low cost. Currently, the preferred material for contact layer 120 is a relatively soft thermoplastic elastomer. For example, urethane (UR), polybutylene terephthalate (PBT), polyolefin (PO), polyethylene etherephthalate (PET), styrenic block co-polymers (for example, Kraton (trade name)), Examples include styrene butadiene rubber, and nylon elastomer variants in the form of polyether block polyamide (PEBA). Also, thermoplastic vulcanizate materials such as polypropylene / crosslinked EDPM rubber, such as Santoprene (trade name) manufactured by Advanced Elastomer Systems of Akron, Ohio ) Etc. can also be used. The surface energy of the material is preferably 20 dynes / cm to 100 dynes / cm, more preferably about 30 dynes / cm to 45 dynes / cm, and about 40 dynes / cm. Most preferred. Preferably, the material has a durometer hardness value less than about Shore D75 and greater than about Shore A15.

The contact surface is ESD safe and preferably has a surface electrical resistance value of about 1 × 10 ⁴ ohm / square to 1 × 10 ¹² ohm / square. In order to obtain the desired surface electrical resistance, inherently static dissipative polymers are formulated or mixed with the contact surface material. In addition, intrinsically conductive polymers such as doped polyaniline, polypyrrole, polythiophene, polyisothianaphthene, polyparaphenyline, polyparaphenylinylene, polyheptadiyne or polyacetylene can be used as the mixed polymer. Carbon fibers, carbon powder, metal particles, ceramic particles, or other conductive fillers may be added to the material. Use organic filler materials such as quaternary ammonium salts, sulfonium salts, alkyl sulfonates, alkyl sulfates, alkyl phosphates, ethanolamides, ethanolamines or fatty amines to change the surface resistance of the materials You can also. Of course, other methods or materials that provide the necessary electrical properties along with the desired physical properties of surface energy, relative hardness and purity can be used.

  The degree of adhesion provided by the contact surface 120 can be adjusted depending on the particular application that holds the component having specific physical properties. This adjustment can be made by selecting or changing the material used for the contact surface 120 or by changing the shape and dimensions of the surface itself. In general, for example, a material with a surface energy at the upper end of the range will hold the component stronger than a material at the lower end of the range. Also, a material having a hardness value at the soft end point in range will generally hold the component stronger than a hard material. In order to change the surface energy or relative hardness of the base material, the above-mentioned mixed materials or filler materials may be formulated or mixed with the base material. Blends of impact modifying polymers and other thermoplastic elastomers can also be used as admixtures to achieve the desired relative hardness characteristics. In general, the surface layer 120 provides the component with an adhesion force per component area that is at least greater than the gravity per component area of the component, so that the component can be held even when the tray is inverted. Is preferred. In general, the degree of adhesion is most preferably sufficient to hold the component under the impact and vibration loads experienced during transport and handling operations.

  The degree of adhesion can also be reduced by selectively changing the shape of the component contact area of the contact surface 120 and the resulting amount of contact area. For clarity, this is accomplished by forming a number of regular recesses 180 or protrusions 182 in the contact surface 120, as shown in a highly exaggerated manner in FIGS. 5C or 5D, respectively. be able to. The recesses 180 or protrusions 182 can be arranged on the contact surface 120 randomly or in a regular matrix pattern. As necessary to achieve the desired degree of adhesion, the recess 180 or protrusion 182 has a depth or height of about 0.000040 inches (0.001 mm) to about 0.10 inches (2.54 mm), respectively, and about 0.000040 inches. (0.001 mm) is about 0.30 inches (7.6 mm) apart. Features can be formed on contact surface 120 by imprinting with a mold that has been processed with a negative pattern having the desired features. In general, the mold can be processed using known processing techniques. The mold may be processed using photolithography to form regular features on the smaller side of the range. Alternatively, a mold having fine and randomly distributed features can be produced by sandblasting, glass beads, or shot peening the mold surface.

  One embodiment of a matrix tray suitable for bare or leadless devices is shown in FIG. 2A. The contact surface 120 is shaped as a continuous layer on the bottom 104 of each pocket 102. As can be seen, the device 208 has a surface 209 that is in direct contact with the contact surface 120. Device 208 is held in position only by adhesion between surface 209 and contact surface 120. As shown, the body portion 110 is not in direct contact with the device 208 and does not bind the device. Another embodiment shown in FIG. 2B has a contact surface 120 formed as part of a raised structure 106 provided within the pocket 102. As shown, this structure is particularly suitable for components 210 of the type having protruding leads 212. It will be appreciated that the present invention has an arbitrary pocket shape or structure and is provided with a thermoplastic elastomer contact surface having the required properties so that it can be placed in contact with the surface of the device. . For example, as shown in FIG. 6, the tray has a matrix of platform structures 158 raised above the surface of the body portion 110 of the tray 110 instead of a recessed pocket. A contact surface 120 is provided on top of each structure 158.

  It is currently most preferred that contact surface 120 be overmolded using standard injection molding techniques. The material of the surface layer 120 and the body portion 110 is preferably such that a polar bond is formed during the injection molding process. These two layers may be fixed together mechanically, or may be fixed by combining several methods. Also, as best shown in FIG. 5B, a mechanical coupling structure 160 is provided on the body portion 110 to improve the coupling effect. Further, as shown in FIG. 5E, an intermediate or bonding layer 170 may be used between the two materials to improve the bonding effect. As with the contact portion 120, it is preferred to use a thermoplastic polymer for the body portion 110. This is because thermoplastic materials are generally easy to recycle and have the advantages of high purity and low cost due to low process contamination that produces sol fractions. The body portion 110 can be made ESD safe using the same materials and methods as described for the contact portion 120. A rigid thermosetting polymer suitable for the body portion may be used, but is less preferred.

  Body portion 110 provides rigidity and mechanical strength to the tray. It must therefore be manufactured from a suitable rigid material and have an appropriate thickness to withstand the mechanical loads expected when using and handling the tray. Although any suitable polymer material having the desired quality of rigidity, mechanical strength and chemical compatibility can be used, the first column of the table shown in FIG. Several polar polymer materials are listed. Although surface treatments can be used to improve the bonding effect, the listed “Group A” thermoplastic materials are listed in the second column of this table without the need to surface treat the body material. It can be molded with any of the materials of the contact portion. The body material listed in “Group B” is generally a non-polar polymer, and in order to achieve an appropriate polar bond with the contact portion 120, corona treatment, plasma treatment, chemical It is necessary to carry out a surface treatment in the form of treatment or flame treatment. In addition, the materials of “Group B” are mutually such as Bynel (trade name) manufactured by Du Pont Corporation and Tymor (trade name) manufactured by Nichimen Corporation. It is also possible to bond using another suitable intermediate bonding layer.

  When using the carrier, the individual components are placed with a significant portion of the component surface in contact with the contact surface 120. Due to the medium and higher surface energy and softness of the contact surface 120, the component is effectively retained on the contact surface 120 by an adhesion between the thermoplastic contact surface 120 and the surface of the device. It is not necessary to use an agent or a physical holding structure. Because the contact surface, the rigid body portion, or both materials have ESD-safe electrostatic dissipation properties, the devices stored therein are electrically protected. Due to the thermoplastic structure of the tray, the amount of process contamination by the tray is reduced. Furthermore, thermoplastic components are more easily and completely recycled, reducing the environmental burden.

  The stacking features of the present invention are best understood with reference to FIGS. 2, 2A and 4. FIG. In the stack of trays 101 shown in FIG. 4, each device 208 is in direct contact with and is held by the contact surface 120. Device 208 is disposed within pocket 102 and does not extend above upper surface 124 of cross member 132. When the trays 100 are stacked, the skirt 114 protruding downward from each tray contacts the peripheral boundary region 112 of the tray immediately below and rests thereon. The skirt 114 is sufficiently high so that the lower surface 126 of the tray is spaced from the upper surface 124 of the tray immediately below. The device 208 is held in position only by adhesion with the contact surface 120. Device 208 is not constrained laterally within the pocket by body portion 110 and is not constrained by contact with lower surface 126 of the tray immediately above in the vertical direction. The stack of trays 101 can be repositioned and flipped without removing the device 208 and without contacting the device with other trays or other parts of the same tray.

  Although the above description includes many specificities, they do not limit the scope of the invention, but merely show some of the embodiments of the invention. Accordingly, the scope of the invention should be determined not by the embodiments herein, but by the appended claims and their legal equivalents.

It is a perspective view of embodiment with respect to the carrier of this invention. It is sectional drawing of the carrier of FIG. FIG. 3 is a partially enlarged view of FIG. 2. FIG. 3 is a partially enlarged view of FIG. 2 showing another embodiment. Fig. 4 is a table listing various materials used for the carrier contact surface and body. It is sectional drawing of the some carrier in the state piled up. FIG. 2A is a partially enlarged view of FIG. FIG. 2B is a partially enlarged view of FIG. 2A showing a mechanical coupling structure for securing a contact layer of a component to a rigid body portion. FIG. 2B is a partially enlarged view of FIG. 2A showing a bonding layer for securing a contact layer of a component to a rigid body portion. FIG. 2B is a partially enlarged view of FIG. 2A showing a number of recesses provided in the component contact layer to reduce adhesion. It is the elements on larger scale of Drawing 2A, and shows many convex parts provided in the component contact layer in order to reduce adhesiveness. It is sectional drawing of another embodiment with respect to this invention. FIG. 6 is a perspective view of another embodiment for a carrier according to the present invention. FIG. 8 is a cross-sectional view of the carrier depicted in FIG. FIG. 8 is a cross-sectional view of a plurality of carriers as depicted in FIG. 7 in a stacked state. FIG. 8 is a partially exploded perspective view of the carrier of FIG. 7 having a separate grid structure forming individual component holding regions. FIG. 11 is a cross-sectional view of the carrier depicted in FIG.

Claims (44)

A carrier used to handle and hold multiple small components,
A solid body part,
An elastomer contact surface provided on the rigid body portion for holding in contact with the component;
The contact surface has a surface energy between 20 dynes / cm and 100 dynes / cm, a hardness between about Shore A15 and Shore D75, and about 1 × 10 ⁴ ohms / square to 1 × 10 ¹² A carrier formed of a thermoplastic material having a surface electrical resistance between ohms / square.   The carrier of claim 1 wherein the elastomeric contact surface is formed from a thermoplastic elastomer material.   The carrier of claim 2 wherein said thermoplastic elastomer material is selected from the group of thermoplastic elastomers consisting of urethane, polybutylene terephthalate, polyolefin, polyethylene terephthalate, styrene block copolymer, styrene butadiene rubber and polyether block polyamide.   The carrier of claim 2 wherein the thermoplastic elastomer material is a thermoplastic sulfide.   The carrier of claim 2 wherein said thermoplastic elastomer material is inherently mixed with a static dissipative polymer or an inherently conductive polymer.   The carrier according to claim 2, wherein the thermoplastic elastomer material contains a filler material.   The carrier according to claim 6, wherein the filler material is an inorganic conductive material.   The carrier according to claim 7, wherein the inorganic conductive material is carbon fiber, carbon powder, metal particles, or ceramic particles.   The carrier according to claim 6, wherein the filler material is an organic material.   The carrier according to claim 9, wherein the organic material is a quaternary ammonium salt, a sulfonium salt, an alkyl sulfonate, an alkyl sulfate, an alkyl phosphate, ethanolamide, ethanolamine or an aliphatic amine.   2. A carrier according to claim 1, wherein each of said contact surfaces has a number of recesses or protrusions formed thereon to reduce its adhesion.   The body portion is made of rigid acrylonitrile butadiene styrene, polycarbonate, urethane, polyphenylene, sulfide, polystyrene, polymethyl methacrylate, polyether ketone, polyether ether ketone, polyether ketone ketone, polyether imide, polysulfone and styrene acrylonitrile. The carrier of claim 1 formed from a rigid thermoplastic material selected from the group of thermoplastic materials.   The carrier of claim 1 wherein the rigid body portion is formed from rigid polyethylene, polypropylene, fluoropolymer, polyolefin, polyamide or nylon.   The carrier of claim 1, further comprising a tie layer sandwiched between the body portion and the contact surface.   The carrier of claim 1, wherein the contact surface has a surface energy between about 30 dynes / cm and about 45 dynes / cm.   The carrier of claim 1, wherein the contact surface has a surface energy of about 40 dynes / cm.   The body portion has a peripheral boundary portion and a downwardly extending skirt portion, the skirt portion adapted to engage a peripheral boundary portion of another tray when the trays are stacked. The carrier according to 1. The carrier of claim 1, wherein the rigid body portion has a surface electrical resistance between about 1 × 10 ⁴ ohm / square and about 1 × 10 ¹² ohm / square.   The carrier of claim 1, wherein the rigid body portion is electrically conductive.   The carrier of claim 1, wherein the rigid body portion has a plurality of pockets formed therein.   The carrier of claim 1, further comprising a grid member disposed on the contact surface, wherein the grid member forms a plurality of component receiving areas on the contact surface. A method of manufacturing a carrier for handling and holding a plurality of small components comprising:
Forming a rigid body portion from a plastic material;
Forming a component contact surface on the rigid body portion;
And the component contact surface has a surface energy between about 20 dynes / cm and about 100 dynes / cm, a hardness between about Shore A15 and about Shore D75, and from about 1 × 10 ⁴ ohms / square Having a thermoplastic elastomer having a surface electrical resistance of between about 1 × 10 ¹² ohms / square and the component contact surface is sufficient to hold each of a plurality of components when the tray is inverted A method that has sex.   23. The method of claim 22, further comprising forming a plurality of mechanical joint structures on the rigid body portion.   The body portion is formed from rigid polyethylene, polypropylene or fluoropolymer, and further comprising the step of surface treating a portion of the body portion with a corona, plasma, flame or chemical treatment process. The method according to 22.   23. The method of claim 22, further comprising forming an intermediate bond layer between the body portion and the component contact surface.   23. The method of claim 22, further comprising forming a number of uniform recesses or protrusions on the component contact surface. A system combining a stackable carrier tray and a plurality of components held in the carrier tray,
A plurality of components each having a surface;
Multiple carrier trays,
Each of the trays has a rigid body portion having an upper surface, wherein the rigid body portion is a peripheral boundary region and another one of the trays when the plurality of trays are stacked. At least one downwardly extending structure that engages two peripheral boundary regions, wherein the upper surface of the rigid body portion has a component contact surface, and the component contact surface is between about 20 dynes / cm and about 100 Heat having a surface energy between dyne / cm, a hardness between about Shore A15 to about Shore D75, and a surface electrical resistance between about 1 × 10 ⁴ ohm / square to about 1 × 10 ¹² ohm / square Formed of a plastic elastomer material, the surface of each component in the plurality of components is engageable with the component contact surface, and each component of the plurality of components is the component. Constrained in the lateral and vertical directions only by adhesion to the nint contact surface, which is sufficient to keep the component in place on the component contact surface when the tray is flipped. System.   28. The system of claim 27, wherein the thermoplastic elastomer material is selected from the group of thermoplastic elastomers consisting of urethane, polybutylene terephthalate, polyolefin, polyethylene terephthalate, styrene block copolymer, styrene butadiene rubber and polyether block polyamide.   28. The system of claim 27, wherein the thermoplastic elastomer material is a thermoplastic sulfide.   28. The system of claim 27, wherein the thermoplastic elastomer material is mixed with an inherently static dissipative polymer or an inherently conductive polymer.   28. The system of claim 27, wherein the thermoplastic elastomer material comprises a filler material.   32. The system of claim 31, wherein the filler material is an inorganic conductive material.   The system of claim 32, wherein the inorganic conductive material is carbon fiber, carbon powder, metal particles, or ceramic particles.   32. The system of claim 31, wherein the filler material is an organic material.   35. The system of claim 34, wherein the organic material is a quaternary ammonium salt, sulfonium salt, alkyl sulfonate, alkyl sulfate, alkyl phosphate, ethanolamide, ethanolamine, or aliphatic amine.   28. The system of claim 27, wherein the component contact surface has a number of recesses or protrusions formed thereon to reduce its adhesion.   The rigid body portion is composed of acrylonitrile butadiene styrene, polycarbonate, urethane, polyphenylene, sulfide, polystyrene, polymethyl methacrylate, polyether ketone, polyether ether ketone, polyether ketone ketone, polyether imide, polysulfone and styrene acrylonitrile. 28. The system of claim 27, wherein the system is formed from a rigid thermoplastic material selected from the group of rigid thermoplastic materials.   28. The system of claim 27, wherein the rigid body portion is formed from rigid polyethylene, polypropylene, fluoropolymer, polyolefin, polyamide or nylon.   28. The system of claim 27, further comprising a tie layer sandwiched between the body portion and the contact surface.   28. The system of claim 27, wherein the contact surface has a surface energy between about 30 dynes / cm and about 45 dynes / cm.   28. The system of claim 27, wherein each of the contact surfaces has a surface energy of about 40 dynes / cm.   The body portion has a peripheral boundary portion and a downwardly extending skirt portion, the skirt portion adapted to engage a peripheral boundary portion of another tray when the trays are stacked. 27. The system according to 27. 28. The system of claim 27, wherein the rigid body portion has a surface electrical resistance between about 1 × 10 ⁴ ohm / square and about 1 × 10 ¹² ohm / square. 28. The system of claim 27, wherein the rigid body portion is electrically conductive.

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