JP2006351708A - 発光ダイオードランプ及び光源装置 - Google Patents

発光ダイオードランプ及び光源装置 Download PDF

Info

Publication number
JP2006351708A
JP2006351708A JP2005173893A JP2005173893A JP2006351708A JP 2006351708 A JP2006351708 A JP 2006351708A JP 2005173893 A JP2005173893 A JP 2005173893A JP 2005173893 A JP2005173893 A JP 2005173893A JP 2006351708 A JP2006351708 A JP 2006351708A
Authority
JP
Japan
Prior art keywords
light
emitting diode
case
light emitting
diode lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005173893A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006351708A5 (enExample
Inventor
Tadayuki Ogata
忠之 尾形
Hitoshi Omori
仁 大森
Hideaki Kato
英昭 加藤
Takao Haruna
貴雄 春名
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2005173893A priority Critical patent/JP2006351708A/ja
Publication of JP2006351708A publication Critical patent/JP2006351708A/ja
Publication of JP2006351708A5 publication Critical patent/JP2006351708A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/49105Connecting at different heights
    • H01L2224/49107Connecting at different heights on the semiconductor or solid-state body

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2005173893A 2005-06-14 2005-06-14 発光ダイオードランプ及び光源装置 Pending JP2006351708A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005173893A JP2006351708A (ja) 2005-06-14 2005-06-14 発光ダイオードランプ及び光源装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005173893A JP2006351708A (ja) 2005-06-14 2005-06-14 発光ダイオードランプ及び光源装置

Publications (2)

Publication Number Publication Date
JP2006351708A true JP2006351708A (ja) 2006-12-28
JP2006351708A5 JP2006351708A5 (enExample) 2007-09-13

Family

ID=37647251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005173893A Pending JP2006351708A (ja) 2005-06-14 2005-06-14 発光ダイオードランプ及び光源装置

Country Status (1)

Country Link
JP (1) JP2006351708A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008227412A (ja) * 2007-03-15 2008-09-25 Sharp Corp 発光装置およびその製造方法
JP2009290244A (ja) * 2009-09-14 2009-12-10 Sharp Corp 発光装置およびその製造方法
JP2011049245A (ja) * 2009-08-25 2011-03-10 Toyoda Gosei Co Ltd サイドビュータイプの発光装置及びその製造方法
CN102162627A (zh) * 2010-02-12 2011-08-24 东芝照明技术株式会社 发光装置以及照明装置
WO2011111399A1 (ja) * 2010-03-11 2011-09-15 パナソニック株式会社 発光モジュール、光源装置、液晶表示装置および発光モジュールの製造方法
EP2584618A2 (en) 2011-10-19 2013-04-24 Stanley Electric Co., Ltd. Semiconductor light emitting device and vehicle lamp
US8616732B2 (en) 2010-02-12 2013-12-31 Toshiba Lighting & Technology Corporation Light-emitting device and illumination device
US8632212B2 (en) 2010-02-12 2014-01-21 Toshiba Lighting & Technology Corporation Light-emitting device and illumination device
JP2016143847A (ja) * 2015-02-05 2016-08-08 日亜化学工業株式会社 発光装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274572A (ja) * 1998-03-23 1999-10-08 Nec Corp Led表示素子および表示装置
JP2004207688A (ja) * 2002-12-09 2004-07-22 Nichia Chem Ind Ltd 発光装置およびそれを用いた面状光源
JP2004363537A (ja) * 2002-09-05 2004-12-24 Nichia Chem Ind Ltd 半導体装置およびその製造方法、並びにその半導体装置を用いた光学装置
JP2005033122A (ja) * 2003-07-11 2005-02-03 Rohm Co Ltd 光半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274572A (ja) * 1998-03-23 1999-10-08 Nec Corp Led表示素子および表示装置
JP2004363537A (ja) * 2002-09-05 2004-12-24 Nichia Chem Ind Ltd 半導体装置およびその製造方法、並びにその半導体装置を用いた光学装置
JP2004207688A (ja) * 2002-12-09 2004-07-22 Nichia Chem Ind Ltd 発光装置およびそれを用いた面状光源
JP2005033122A (ja) * 2003-07-11 2005-02-03 Rohm Co Ltd 光半導体装置

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9966504B2 (en) 2007-03-15 2018-05-08 Sharp Kabushiki Kaisha Light emitting device and method for manufacturing the same
US8841838B2 (en) 2007-03-15 2014-09-23 Sharp Kabushiki Kaisha Light emitting device and method for manufacturing the same
US7843131B2 (en) 2007-03-15 2010-11-30 Sharp Kabushiki Kaisha Light emitting device and method for manufacturing the same
US9478716B2 (en) 2007-03-15 2016-10-25 Sharp Kabushiki Kaisha Light emitting device and method for manufacturing the same
US9755115B2 (en) 2007-03-15 2017-09-05 Sharp Kabushiki Kaisha Light emitting device and method for manufacturing the same
US9484502B2 (en) 2007-03-15 2016-11-01 Sharp Kabushiki Kaisha Light emitting device and method for manufacturing the same
JP2008227412A (ja) * 2007-03-15 2008-09-25 Sharp Corp 発光装置およびその製造方法
US8427048B2 (en) 2007-03-15 2013-04-23 Sharp Kabushiki Kaisha Light emitting device and method for manufacturing the same
JP2011049245A (ja) * 2009-08-25 2011-03-10 Toyoda Gosei Co Ltd サイドビュータイプの発光装置及びその製造方法
JP2009290244A (ja) * 2009-09-14 2009-12-10 Sharp Corp 発光装置およびその製造方法
US8616732B2 (en) 2010-02-12 2013-12-31 Toshiba Lighting & Technology Corporation Light-emitting device and illumination device
US8632212B2 (en) 2010-02-12 2014-01-21 Toshiba Lighting & Technology Corporation Light-emitting device and illumination device
CN102162627A (zh) * 2010-02-12 2011-08-24 东芝照明技术株式会社 发光装置以及照明装置
JP4932064B2 (ja) * 2010-03-11 2012-05-16 パナソニック株式会社 発光モジュール、光源装置、液晶表示装置および発光モジュールの製造方法
US9261246B2 (en) 2010-03-11 2016-02-16 Panasonic Intellectual Property Management Co., Ltd. Light-emitting module, light source device, liquid crystal display device, and method of manufacturing light-emitting module
WO2011111399A1 (ja) * 2010-03-11 2011-09-15 パナソニック株式会社 発光モジュール、光源装置、液晶表示装置および発光モジュールの製造方法
EP2584618A2 (en) 2011-10-19 2013-04-24 Stanley Electric Co., Ltd. Semiconductor light emitting device and vehicle lamp
US9246067B2 (en) 2011-10-19 2016-01-26 Stanley Electric Co., Ltd. Semiconductor light emitting device and vehicle lamp
JP2016143847A (ja) * 2015-02-05 2016-08-08 日亜化学工業株式会社 発光装置

Similar Documents

Publication Publication Date Title
JP5284006B2 (ja) 発光装置
US7791092B2 (en) Multiple component solid state white light
JP5083205B2 (ja) 発光装置
US8237350B2 (en) Light-emitting device
JP4823300B2 (ja) 半導体発光装置
US20110089815A1 (en) Light-emitting device
JP2007123438A (ja) 蛍光体板及びこれを備えた発光装置
JP2009302339A (ja) 半導体発光装置
KR20110003586A (ko) 발광 장치
JP2013120812A (ja) 発光装置
JP2015176960A (ja) 発光装置
US7592640B2 (en) Light emitting semiconductor apparatus
US20070138932A1 (en) Light emitting device
JP2011238802A (ja) 発光モジュール及びこれを備えた照明装置
US20130242532A1 (en) Luminaire
KR102360957B1 (ko) 발광 다이오드 패키지
US8040039B2 (en) Device and method for emitting composite output light using multiple wavelength-conversion mechanisms
JP2005332951A (ja) 発光装置
JP2006351708A (ja) 発光ダイオードランプ及び光源装置
JP2009010013A (ja) 白色光源
KR101493708B1 (ko) 백색 발광 장치
JP6583673B2 (ja) 発光装置、及び照明装置
JP2008077888A (ja) 照明装置
JP2007005549A (ja) 白色発光ledランプ
CN101022102A (zh) 一种可发白光的led灯

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070727

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070827

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100427

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101109

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101228

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110308