JP2006339457A5 - - Google Patents
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- Publication number
- JP2006339457A5 JP2006339457A5 JP2005163263A JP2005163263A JP2006339457A5 JP 2006339457 A5 JP2006339457 A5 JP 2006339457A5 JP 2005163263 A JP2005163263 A JP 2005163263A JP 2005163263 A JP2005163263 A JP 2005163263A JP 2006339457 A5 JP2006339457 A5 JP 2006339457A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005163263A JP4594800B2 (ja) | 2005-06-02 | 2005-06-02 | 基板処理方法、基板処理プログラム及び記憶媒体 |
US11/445,385 US7854821B2 (en) | 2005-06-02 | 2006-06-02 | Substrate processing apparatus |
CNB2006100885369A CN100419953C (zh) | 2005-06-02 | 2006-06-02 | 基板处理装置和基板处理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005163263A JP4594800B2 (ja) | 2005-06-02 | 2005-06-02 | 基板処理方法、基板処理プログラム及び記憶媒体 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006339457A JP2006339457A (ja) | 2006-12-14 |
JP2006339457A5 true JP2006339457A5 (fr) | 2008-07-17 |
JP4594800B2 JP4594800B2 (ja) | 2010-12-08 |
Family
ID=37484309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005163263A Expired - Fee Related JP4594800B2 (ja) | 2005-06-02 | 2005-06-02 | 基板処理方法、基板処理プログラム及び記憶媒体 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4594800B2 (fr) |
CN (1) | CN100419953C (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4985031B2 (ja) * | 2007-03-29 | 2012-07-25 | 東京エレクトロン株式会社 | 真空処理装置、真空処理装置の運転方法及び記憶媒体 |
TWI450047B (zh) * | 2007-07-13 | 2014-08-21 | Mapper Lithography Ip Bv | 微影系統、夾緊方法及晶圓台 |
US8705010B2 (en) | 2007-07-13 | 2014-04-22 | Mapper Lithography Ip B.V. | Lithography system, method of clamping and wafer table |
JP5238224B2 (ja) * | 2007-11-06 | 2013-07-17 | 東京エレクトロン株式会社 | 逆止弁およびそれを用いた基板処理装置 |
CN102364700B (zh) * | 2011-10-26 | 2013-03-27 | 常州天合光能有限公司 | 太阳能电池rie工艺温度补偿方法 |
JP6063803B2 (ja) * | 2013-04-15 | 2017-01-18 | 東京エレクトロン株式会社 | 真空装置及びバルブ制御方法 |
US10359769B2 (en) * | 2017-09-15 | 2019-07-23 | Applied Materials, Inc. | Substrate routing and throughput modeling |
CN109755163B (zh) * | 2017-11-06 | 2021-01-29 | 北京北方华创微电子装备有限公司 | 腔室装卸载基片的方法 |
US20210143037A1 (en) | 2018-04-12 | 2021-05-13 | Lam Research Corporation | Determining and controlling substrate temperature during substrate processing |
CN110571118B (zh) * | 2018-06-06 | 2022-03-22 | 北京北方华创微电子装备有限公司 | 流量阈值的确定方法、控制装置及半导体加工设备 |
JP7232651B2 (ja) * | 2019-01-25 | 2023-03-03 | 東京エレクトロン株式会社 | 熱媒体の制御方法および熱媒体制御装置 |
CN116475025B (zh) * | 2023-06-21 | 2023-08-18 | 深圳德森精密设备有限公司 | 一种加工轨迹的制定方法、加工系统、处理器和存储介质 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10240356A (ja) * | 1997-02-21 | 1998-09-11 | Anelva Corp | 基板処理装置の基板温度制御法と基板温度制御性判定法 |
US6320736B1 (en) * | 1999-05-17 | 2001-11-20 | Applied Materials, Inc. | Chuck having pressurized zones of heat transfer gas |
US20010016302A1 (en) * | 1999-12-28 | 2001-08-23 | Nikon Corporation | Wafer chucks allowing controlled reduction of substrate heating and rapid substrate exchange |
JP2000232098A (ja) * | 2000-01-25 | 2000-08-22 | Hitachi Ltd | 試料温度制御方法及び真空処理装置 |
-
2005
- 2005-06-02 JP JP2005163263A patent/JP4594800B2/ja not_active Expired - Fee Related
-
2006
- 2006-06-02 CN CNB2006100885369A patent/CN100419953C/zh not_active Expired - Fee Related
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