JP2006339457A5 - - Google Patents

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Publication number
JP2006339457A5
JP2006339457A5 JP2005163263A JP2005163263A JP2006339457A5 JP 2006339457 A5 JP2006339457 A5 JP 2006339457A5 JP 2005163263 A JP2005163263 A JP 2005163263A JP 2005163263 A JP2005163263 A JP 2005163263A JP 2006339457 A5 JP2006339457 A5 JP 2006339457A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005163263A
Other languages
Japanese (ja)
Other versions
JP4594800B2 (ja
JP2006339457A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005163263A priority Critical patent/JP4594800B2/ja
Priority claimed from JP2005163263A external-priority patent/JP4594800B2/ja
Priority to US11/445,385 priority patent/US7854821B2/en
Priority to CNB2006100885369A priority patent/CN100419953C/zh
Publication of JP2006339457A publication Critical patent/JP2006339457A/ja
Publication of JP2006339457A5 publication Critical patent/JP2006339457A5/ja
Application granted granted Critical
Publication of JP4594800B2 publication Critical patent/JP4594800B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2005163263A 2005-06-02 2005-06-02 基板処理方法、基板処理プログラム及び記憶媒体 Expired - Fee Related JP4594800B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005163263A JP4594800B2 (ja) 2005-06-02 2005-06-02 基板処理方法、基板処理プログラム及び記憶媒体
US11/445,385 US7854821B2 (en) 2005-06-02 2006-06-02 Substrate processing apparatus
CNB2006100885369A CN100419953C (zh) 2005-06-02 2006-06-02 基板处理装置和基板处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005163263A JP4594800B2 (ja) 2005-06-02 2005-06-02 基板処理方法、基板処理プログラム及び記憶媒体

Publications (3)

Publication Number Publication Date
JP2006339457A JP2006339457A (ja) 2006-12-14
JP2006339457A5 true JP2006339457A5 (fr) 2008-07-17
JP4594800B2 JP4594800B2 (ja) 2010-12-08

Family

ID=37484309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005163263A Expired - Fee Related JP4594800B2 (ja) 2005-06-02 2005-06-02 基板処理方法、基板処理プログラム及び記憶媒体

Country Status (2)

Country Link
JP (1) JP4594800B2 (fr)
CN (1) CN100419953C (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4985031B2 (ja) * 2007-03-29 2012-07-25 東京エレクトロン株式会社 真空処理装置、真空処理装置の運転方法及び記憶媒体
TWI450047B (zh) * 2007-07-13 2014-08-21 Mapper Lithography Ip Bv 微影系統、夾緊方法及晶圓台
US8705010B2 (en) 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
JP5238224B2 (ja) * 2007-11-06 2013-07-17 東京エレクトロン株式会社 逆止弁およびそれを用いた基板処理装置
CN102364700B (zh) * 2011-10-26 2013-03-27 常州天合光能有限公司 太阳能电池rie工艺温度补偿方法
JP6063803B2 (ja) * 2013-04-15 2017-01-18 東京エレクトロン株式会社 真空装置及びバルブ制御方法
US10359769B2 (en) * 2017-09-15 2019-07-23 Applied Materials, Inc. Substrate routing and throughput modeling
CN109755163B (zh) * 2017-11-06 2021-01-29 北京北方华创微电子装备有限公司 腔室装卸载基片的方法
US20210143037A1 (en) 2018-04-12 2021-05-13 Lam Research Corporation Determining and controlling substrate temperature during substrate processing
CN110571118B (zh) * 2018-06-06 2022-03-22 北京北方华创微电子装备有限公司 流量阈值的确定方法、控制装置及半导体加工设备
JP7232651B2 (ja) * 2019-01-25 2023-03-03 東京エレクトロン株式会社 熱媒体の制御方法および熱媒体制御装置
CN116475025B (zh) * 2023-06-21 2023-08-18 深圳德森精密设备有限公司 一种加工轨迹的制定方法、加工系统、处理器和存储介质

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10240356A (ja) * 1997-02-21 1998-09-11 Anelva Corp 基板処理装置の基板温度制御法と基板温度制御性判定法
US6320736B1 (en) * 1999-05-17 2001-11-20 Applied Materials, Inc. Chuck having pressurized zones of heat transfer gas
US20010016302A1 (en) * 1999-12-28 2001-08-23 Nikon Corporation Wafer chucks allowing controlled reduction of substrate heating and rapid substrate exchange
JP2000232098A (ja) * 2000-01-25 2000-08-22 Hitachi Ltd 試料温度制御方法及び真空処理装置

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