JP2006334889A - Method for manufacturing substrate for inkjet head, substrate for inkjet head, and inkjet head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To effectively prevent a contamination of an electrode pad in the manufacturing process of a substrate for an inkjet head to carry out excellent connection of a ball bump to the electrode pad without cleaning. <P>SOLUTION: The method for manufacturing a substrate for an inkjet head comprises a step for forming a layer (208), on the pad part (103) of an electrode wiring, for preventing contamination to occur in a substrate manufacturing process, and a step for removing the layer (208) prior to the connection between the pad part and the wiring member. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an ink-jet head substrate for recording by discharging ink, an ink-jet head substrate manufactured using the method, and an ink-jet head using the substrate, and more particularly to electrical wiring such as TAB tape. The present invention relates to an improvement of a bump electrode pad used for electrical connection.

  The ink jet head is manufactured through the following manufacturing process. That is, first, a recording element that generates energy used to eject ink (a heating element (heater) that generates thermal energy that causes film boiling in ink when energized), a matrix wiring for driving the recording element, and the like There is a step of forming a substrate by forming a driving IC or the like on a substrate. Next, there is a step of forming a head chip (hereinafter also simply referred to as “chip”) by bonding a nozzle forming member that forms an ink discharge port, an ink flow path pattern, or the like corresponding to the recording element to the substrate. Furthermore, there is a step of electrically connecting the chip to a TAB tape for electrical connection with the ink jet recording apparatus main body. This connection is usually performed by using heat and ultrasonic waves in combination with bumps provided on electrode pads on the chip and inner leads of a TAB (Tape Automated Bonding) tape.

As the bump, after forming and patterning a film such as SiO ₂ or SiN as a passivation film, 1-3 layers of barrier metal made of a material such as Ti, Cu, or W as an adhesion improving layer are usually provided on the Al electrode, Furthermore, a so-called plated bump is mainly used, in which a resist pattern is formed thereon by a photolithography process and then a gold layer is grown by electrolytic plating.

  However, in order to form plated bumps, vacuum film formation and exposure / development processes are required multiple times. In the case of plating bumps, since plating is formed by batch processing for each wafer, gold plating bumps are also formed on chips that have become defective in subsequent processing, which tends to increase costs. Furthermore, the cost per bump increases as the number of electrode pads per wafer decreases (that is, the number of bumps decreases).

  For these reasons, ball bumps have been used in recent years. Ball bumps are formed by applying a wire bonding method, and a ball is formed by arc discharge at the tip of a wire that is passed through a ceramic tube called a capillary. Then, heat and ultrasonic waves are jointly bonded to the ball portion, and then the capillary is raised, the wire is held by a cut clamper, and the wire is broken by a tensile stress, whereby only the ball portion is separated to form a bump. In addition, as a method of bonding the ball to the electrode pad, there is known a method using only heat in addition to the above-described method using both heat and ultrasonic waves.

  The ball bump does not require an expensive vacuum film formation apparatus or exposure apparatus that is necessary for forming the plating bump. Further, since no passivation film or barrier metal is required, particularly when the number of pads per wafer is small, it is advantageous in terms of cost compared to the plating bump.

  FIG. 14 is a perspective view showing a head chip configured by providing a nozzle forming member 13 made of a photosensitive resin material for forming ink discharge ports (nozzles) 12 and the like on the inkjet head substrate 11. As shown in FIG. 14, an electrode pad 110 is formed on an end portion of a substrate 11 with respect to a connection configuration for obtaining an electrical connection when supplying power and drive signals to the head chip from the apparatus main body side. Then, the connection of the TAB tape or the like to the electrode pad is performed via a ball bump.

  In the inkjet head substrate in which the nozzle as shown in FIG. 14 is formed on the substrate, a polyether is formed on the substrate 11 for the purpose of improving the adhesion between the substrate 11 and the nozzle forming member 13 with the electrode pad formed. A layer of amide resin is disposed. This resin is particularly preferable because it has excellent alkali etching resistance, good adhesion to an inorganic film such as silicon, and can be used as a protective film for an inkjet head. .

In the arrangement, after applying a polyetheramide resin, it is processed into a desired pattern. For patterning the polyetheramide resin, a dry etching method using a reactive gas is used. At this time, O ₂ gas is used as a reactive gas, and RIE (reactive ion etching) or plasma ashing can be used. However, recently, from the correlation between the gas composition and the etching rate, it is Tokari be significantly improved etch rate by adding CF _4, to perform the etching gas with the addition of CF ₄ become common Yes. Regarding the gas composition, the amount of CF ₄ added can be arbitrarily changed, but from the viewpoint of etching rate and residue reduction, it is preferable to add 2% or more to the O ₂ flow rate.

Japanese Patent Laid-Open No. 2002-19122

However, as a new problem caused by dry etching with addition of CF ₄ , the surface of the electrode pad to be bonded is contaminated with a fluoride material composed of CF ₄ after the patterning process of the adhesion improving layer, and the ball bumps are damaged. It has been found that bonding can lead to poor bonding.

  In addition, when the contamination state is severe, there arises a disadvantage that the bonding strength (generally evaluated by the strength measured by a shear tester) is weakened. Omission "may occur. Therefore, in order to solve the problem, it is conceivable to increase the ultrasonic wave at the time of joining the ball part, but there is a problem that a crack occurs in the pad part of the substrate.

  Therefore, in order to cope with these problems, in a general semiconductor manufacturing process, the electrode pad portion may be cleaned by heat treatment, plasma treatment or the like before the ball bump process.

  However, it is not preferable in the head chip manufacturing process to perform cleaning for removing contaminants on the electrode pad surface. When heat treatment or plasma cleaning is performed on a substrate or head chip on which a fine nozzle is formed, the nozzle formed of a photosensitive resin material is deformed or a water repellent film applied to the outermost surface of the nozzle This is because deterioration occurs. Therefore, it is impossible to apply the cleaning performed in the general semiconductor manufacturing process to the head chip manufacturing process.

Note that the above-described problem is conspicuously caused by contamination when dry etching to which CF ₄ is added is applied, but is also caused by pad contamination due to other factors in the substrate manufacturing process.

  The present invention has been made in view of such a problem, and effectively prevents contamination of the electrode pad in the substrate manufacturing process, thereby making it possible to satisfactorily bond the ball bump to the electrode pad without requiring cleaning. The purpose is to make it.

Therefore, the present invention is a method for manufacturing a substrate for an inkjet head having a recording element that generates energy used to eject ink in response to energization,
A pad portion to which a wiring member for electrical connection with the outside is connected, and forming an electrode wiring for energizing the recording element;
Forming a layer for preventing contamination generated in a substrate manufacturing process on the pad portion;
Removing the layer prior to connection between the pad portion and the wiring member;
It is characterized by comprising.

  The present invention also resides in an ink jet recording head substrate manufactured by such a manufacturing method.

Further, the present invention is an inkjet head substrate having a recording element that generates energy used to eject ink in response to energization,
An electrode wiring having a pad portion to which a wiring member for electrical connection with the outside is connected, and having a wiring portion for energizing the recording element;
A protective layer disposed on a portion excluding the pad portion of the electrode wiring;
A hillock suppressing layer disposed between the protective layer and the portion of the electrode wiring;
It is characterized by comprising.

  In the above, the contamination prevention layer or hillock suppression layer may be formed of TiW.

Furthermore, the present invention provides any of the above inkjet head substrates,
An ink discharge port forming member bonded to the substrate;
A wiring member connected to the pad portion and electrically connected to the outside;
It is characterized by comprising.

  According to the present invention, the contamination of the pad portion that occurs in the manufacturing process of the substrate for the ink jet head, for example, the surface contamination of the pad portion due to the fluoride substance at the time of patterning the adhesion improving layer is appropriately prevented. It will be done well. As a result, the bonding of the ball bumps can be stabilized, and the ball bumps can be eliminated.

  Furthermore, the material for the contamination prevention layer is appropriately selected (for example, TiW), and in the formation process, the layer is formed in addition to the pad portion of the electrode wiring, and a protective layer is formed on the electrode wiring after the formation. If this step is performed, the layer can be used as a hillock suppressing layer for electrode wiring such as Al in the protective layer forming step, and it becomes possible to eliminate electrical defects due to hillocks.

  Hereinafter, the present invention will be described in detail with reference to the drawings.

(Embodiment of Inkjet Head Substrate)
FIG. 1 is a schematic cross-sectional view mainly showing film configurations of a heater section 101, a through hole section 102, and an electrode pad section 103 in an inkjet head substrate according to an embodiment of the present invention. In particular, the film configuration of the electrode pad portion 103 is shown as a cross section AA in FIG.

  As shown in FIG. 1, a heat storage layer 201 is disposed on the base 110. Then, the first electric wiring film 202, the interlayer insulating film 203, the heating resistor layer 204, the second electric wiring film 205, the hillock suppressing layer 208, the protective film 206, the wear resistant film 207, and the polyetheramide resin are formed thereon. The ink-jet head substrate 11 is configured by appropriately arranging the adhesion improving layer 209 consisting of Then, the substrate 11 is bonded to the nozzle forming member 13 (FIG. 14) to produce a head chip, but the adhesion improving layer 209 made of polyetheramide resin is interposed, thereby improving the adhesion between them. To do.

  Here, the first electrical wiring layer 202 is for configuring a common power supply wiring or a common ground wiring for supplying power from the electrode pad 103 to, for example, the plurality of heater units 101 in common. On the other hand, the second electrode wiring layer 205 is connected to the first electrode wiring layer 202 in the through-hole portion 102 and supplies power to each heater portion 101. The power supply wiring or ground wiring for each heater is used. It is for comprising. In the heater unit 101, a part of the second electrode wiring layer 205 on the heating resistor layer 204 is removed to expose the part of the heating resistor layer, thereby forming a heating part. The second electrode wiring layer 205 is connected to the first electric wiring layer 202 in the electrode pad portion 103 and constitutes the electrode pad 110.

  Here, the heating resistor layer 204 is formed of a material having a high electric resistance value, and is a non-existing portion of the second electrode wiring layer 205 by flowing a current from the outside through the electrode wiring layers 202 and 205. The heat generating part generates thermal energy and causes the ink to foam. In addition, as a material for forming the electrode wiring layers 202 and 205, Al or an alloy material containing Al is mainly used.

  The interlayer insulating film 203 is disposed at a site requiring electrical insulation. The protective film 206 is made of SiO, SiN, or the like, and is disposed at a required portion in order to protect from ink. The wear-resistant film 207 is disposed mainly to protect the heat generating portion from cavitation accompanying ink boiling, and is made of a metal (Ta or the like) having high mechanical stability.

In disposing the adhesion improving layer 209 on the substrate 11 having the above-described configuration, it is processed into a desired pattern after applying a polyetheramide resin. In this patterning, an etching rate or a patterning rate can be improved by applying a dry etching method using O ₂ gas added with CF ₄ .

However, as described above, when such a patterning process is performed, the surface of the electrode pad to be bonded is contaminated with a fluorinated material composed of CF ₄ , which may cause poor bonding when performing ball bumps. Further, it is not preferable to perform cleaning for removing contaminants in the manufacturing process of the ink jet head.

  Therefore, in the present invention, a contamination prevention layer is formed on the electrode pad 103 and then subjected to patterning of the adhesion improving layer, and then the contamination prevention layer is removed. The main feature of this embodiment is that it is also used to suppress the occurrence of hillocks in the electrode wiring layer by appropriately selecting the material of the contamination prevention layer.

  Here, in the case of Al or Al alloy generally used for the electrode wiring layer, generation of hillocks becomes significant when the temperature applied during the formation of the protective film 206 is 400 ° C. or higher. As a result, the step coverage is reduced, and an electrical failure is caused. For this reason, sufficient thickness will be needed for the protective layer for protecting this.

  On the other hand, in the present embodiment, by forming a film that becomes the hillock suppressing layer 208 on the electrode wiring, the generation of hillocks can be suppressed even when the temperature applied when forming the protective layer is 400 ° C. or higher. . That is, in the present embodiment, the hillock suppression layer 208 is formed on the second electrode wiring 205, and after patterning the adhesion improving layer, the hillock suppression layer 208 is removed only in the region where the ball bump is bonded in the electrode pad portion 103. Then, the second electric wiring layer 205 is exposed. As a result, the contamination of the electrode pad 103 due to the patterning process of the adhesion improving layer is prevented, and the ball bump can be bonded well while suppressing the hillock of the electrode wiring while the cleaning process is unnecessary. Is.

(Inkjet head substrate manufacturing process)
With reference to FIGS. 2 to 10, an embodiment of a method of manufacturing the ink jet head substrate shown in FIG. 1 will be described. In these drawings, the film structure of the electrode pad portion 103 in each step is schematically shown. However, the film structure in all of the substrates such as the heater portion 101 and the through hole portion 102 shown in FIG. Of course, it can be formed simultaneously by several steps shown.

  First, as shown in FIG. 2, an SiO film is formed on a Si substrate 120 (hereinafter not shown) by a CVD film forming apparatus, resist coating / exposure is performed, and then etching is performed by a dry etching apparatus. To obtain a heat storage layer 201 having a desired planar shape. Here, as the base 120, a drive circuit made of a semiconductor element such as a switching transistor for selectively driving the heat generating portion can be preliminarily built in the Si base.

  Next, as shown in FIG. 3, an Al or Al alloy film is formed by a sputtering film forming apparatus, and after resist application / exposure, etching is performed by a wet etching apparatus to perform patterning, thereby forming a desired plane. A first electric wiring layer 202 having a shape was formed.

  Next, as shown in FIG. 4, a SiO film is formed by a CVD film forming apparatus, resist application / exposure is performed, and etching is performed by a wet etching apparatus to form an interlayer insulating film 203 having a desired planar shape. .

  Next, as shown in FIG. 5, a TaSiN film was formed by a sputtering film forming apparatus, resist application / exposure was performed, and etching was performed by a dry etching apparatus to obtain a heater layer 204 having a desired planar shape.

  Next, as shown in FIG. 6, a TaSiN film and an Al or Al alloy film are formed by a sputtering film forming apparatus, and after resist coating / exposure, etching is performed by a dry etching apparatus to obtain a desired planar shape. The heater layer 204 and the second electric wiring layer 205 were used. In addition, the process of forming a heater is inserted on the heater part 101 after this process.

  Next, a TiW film was formed by a sputtering film forming apparatus, resist application / exposure was performed, and etching was performed by a dry etching apparatus to form a hillock suppressing layer 208 having a desired planar shape. At this time, as shown in FIG. 7, the TiW film is also formed on the entire second electric wiring layer 205, that is, on the upper portion of the electrode pad portion 103.

  Next, as shown in FIG. 8, a SiN film was formed by a CVD film forming apparatus, and after resist application / exposure, etching was performed by a dry etching apparatus to form a protective layer 206 having a desired planar shape. Through this process, since the second electric wiring layer 205 including the electrode pad portion is covered with the hillock suppressing layer, generation of hillock is suppressed. In addition, the process of forming the abrasion-resistant layer 207 on the heater part 101 is inserted after this process.

Next, as shown in FIG. 9, the nozzle forming member 13 is applied by applying a polyether amide resin between the substrate 11 and the nozzle forming member 13 and applying a dry etching method using O ₂ gas added with CF _4. Thus, the adhesion improving layer 209 having an appropriate planar shape for improving the adhesion to the substrate is obtained.

Next, as shown in FIG. 10, wet etching using an etchant containing hydrogen peroxide or dry etching using a gas containing Cl ₂ is performed to form a TiW film (hillock suppressing layer 208) on the electrode pad portion 103. The second electric wiring layer 205 is exposed at the portion, that is, the ball bump bonding portion. The use of TiW as a contamination prevention layer is preferable because it can be removed by such etching, and the etching does not substantially damage other components, and this is also used as a hillock suppression layer on the wiring. Since it is possible, it is preferable.

  Next, a nozzle having a desired shape and arrangement is formed by appropriately joining a nozzle forming member 13 such as a photosensitive resin material to the substrate 11 manufactured through the above steps. Further, the substrate to which the nozzle forming member 13 is bonded can be separated and cut with a dicing saw or the like to obtain a head chip as shown in FIG.

(Embodiment of inkjet head and recording apparatus)
Next, an ink jet head configured using the head chip will be described.
FIG. 11 and FIG. 12 are perspective views showing an example of an ink jet head configured using the head chip.

  The inkjet head H1000 generally includes a recording element unit H1002, an ink supply unit H1003, and a tank holder H2000. Here, as shown in FIG. 3, the recording element unit H1002 includes a first (for example, black ink discharge) recording element substrate H1100 and a second (for example, cyan) which are in the form of a head chip formed through the above manufacturing process. Recording element substrate H1101 for discharging magenta and yellow ink), first plate H1200 as a base, electric wiring member H1300 such as a TAB tape as a flexible wiring member, electric contact substrate H2200, and recording element substrate The second plate H1400, which is an accommodating portion, is assembled together and attached to the ink supply unit H1300. The ink supply unit H1003 is provided with various members constituting an ink supply path from each color ink tank that is detachably attached to the tank holder H2000. Further, the ink supply unit H1003 is connected to the recording element unit H1002 via a joint seal member H2300. Fluid communication. The ink supply unit H1003 is stored in the tank holder H2000.

The recording element unit H1002 is generally manufactured through the following steps. That is,
-Formation of a plate assembly by joining the first plate H1200 and the second plate H1400,
Mounting two recording element substrates H1100 and H1101 to the plate assembly,
Alignment and ball bump connection between the electrode terminal H1302 of the electric wiring member H1300 and the electrode pad portion 110 of each recording element substrate (head chip), bonding of the electric wiring member to the plate assembly,
The connection between the electrode terminal H1302 of the electric wiring tape H1300 and the electrode portion of each recording element substrate, and
-Sealing of the electrical connection part.
It is.

  The ink jet head H1100 assembled using such a recording element unit H1102 can be mounted on apparatuses such as a printer, a copying machine, a facsimile having a communication system, a word processor having a printer unit, and combined with various processing apparatuses. It can also be installed in other industrial recording devices.

  FIG. 13 is a schematic perspective view showing a configuration example of an ink jet recording apparatus using the ink jet head.

  In the illustrated apparatus, the carriage 500 is fixed to an endless belt 501 and is movable along a guide shaft 502. Endless belt 501 is wound around pulleys 503 and 504, and a drive shaft of carriage drive motor 504 is coupled to pulley 503. Accordingly, the carriage 500 is main-scanned in the reciprocating direction (A direction) along the guide shaft 502 as the motor 504 is driven to rotate. On the carriage 500, the ink jet head H1000 in the form of a cartridge is mounted, and the number of ink tanks 404 corresponding to the ink color to be used is mounted.

  The illustrated apparatus is provided with a linear encoder 506 for the purpose of detecting the movement position of the carriage in the main scanning direction. One component of the linear encoder 506 is a linear scale 507 provided along the moving direction of the carriage 500. The linear scale 507 is formed with slits at a predetermined density and at equal intervals. On the other hand, the carriage 500 is provided with, for example, a slit detection system 508 having a light emitting unit and a light receiving sensor and a signal processing circuit as the other components of the linear encoder 506. Accordingly, the linear encoder 506 outputs an ejection timing signal for defining ink ejection timing and carriage position information as the carriage 500 moves.

  The recording paper P as a recording medium is intermittently conveyed in the direction of arrow B perpendicular to the scanning direction of the carriage 500. The recording paper P is supported by a pair of roller units 509 and 510 on the upstream side in the conveyance direction and a pair of downstream roller units 511 and 512, and is given a certain tension to be flat with respect to the discharge port forming surface of the recording element unit H1102. It is transported in a state in which it is secured. The driving force for each roller unit is transmitted from a paper transport motor (not shown).

  With the configuration as described above, printing on the entire paper P is performed while alternately repeating printing with a width corresponding to the array width of the ejection ports of the inkjet head and conveyance of the paper P as the carriage 500 moves.

  The carriage 500 stops at the home position as necessary at the start of printing or during printing. At this home position, a cap member 513 is provided for capping the surface (discharge port surface) provided with the discharge port of each inkjet head 410. The cap member 513 forcibly sucks ink from the discharge port. A suction recovery means (not shown) for preventing clogging of the discharge port is connected. Further, a wiping member 550 for wiping the discharge port forming surface of the recording element unit H1102 is provided so as to be movable up and down.

(Other)
In the above-described embodiment, the hillock suppression layer is formed on the electrode wiring layer using the formation process of the contamination prevention layer on the electrode pad. However, the purpose is only to prevent the contamination on the electrode pad. The form which forms and removes a film | membrane may be sufficient. However, as in the above-described embodiment, appropriately selecting the material for forming the anti-contamination film, that is, using TiW, can be removed by wet etching using an etchant containing hydrogen peroxide. Is preferable because it does not substantially damage other components and can also be used as a hillock suppressing layer.

  Further, in the above-described embodiment, the description has been mainly given of preventing the electrode pad from being contaminated in the dry etching process of the adhesion improving film made of the polyetheramide resin film. However, the present invention is not limited to this, and it is of course effective to prevent general contamination on the electrode pad that occurs in the manufacturing process of the substrate or the head and to improve the bondability in the ball bump process. It is. That is, the present invention does not require the formation of the adhesion improving layer or the patterning using the dry etching process, and is widely applied to prevent general contamination on the electrode pad generated in the substrate manufacturing process. It can be done.

  Furthermore, in the above example, the electrode wiring layer has a two-layer configuration in which the electrode wiring layers are connected via the through-hole portion. One (lower layer) constitutes a common power supply wiring or common ground wiring for a plurality of heater sections, and the other (upper layer) constitutes an individual power supply wiring or individual ground wiring for each heater section. However, the configuration of the electrode wiring from the electrode pad portion to the heater portion is not limited to this and can be determined as appropriate.

It is a typical sectional view showing film composition of a substrate for ink jet heads by one embodiment of the present invention. FIG. 2 is a schematic cross-sectional view for explaining the embodiment of the method for manufacturing the ink jet head substrate shown in FIG. 1, particularly focusing on the film structure in the electrode pad portion. FIG. 2 is a schematic cross-sectional view for explaining the embodiment of the method for manufacturing the ink jet head substrate shown in FIG. 1, particularly focusing on the film structure in the electrode pad portion. FIG. 2 is a schematic cross-sectional view for explaining the embodiment of the method for manufacturing the ink jet head substrate shown in FIG. 1, particularly focusing on the film structure in the electrode pad portion. FIG. 2 is a schematic cross-sectional view for explaining the embodiment of the method for manufacturing the ink jet head substrate shown in FIG. 1, particularly focusing on the film structure in the electrode pad portion. FIG. 2 is a schematic cross-sectional view for explaining the embodiment of the method for manufacturing the ink jet head substrate shown in FIG. 1, particularly focusing on the film structure in the electrode pad portion. FIG. 2 is a schematic cross-sectional view for explaining the embodiment of the method for manufacturing the ink jet head substrate shown in FIG. 1, particularly focusing on the film structure in the electrode pad portion. FIG. 2 is a schematic cross-sectional view for explaining the embodiment of the method for manufacturing the ink jet head substrate shown in FIG. 1, particularly focusing on the film structure in the electrode pad portion. FIG. 2 is a schematic cross-sectional view for explaining the embodiment of the method for manufacturing the ink jet head substrate shown in FIG. 1, particularly focusing on the film structure in the electrode pad portion. FIG. 2 is a schematic cross-sectional view for explaining the embodiment of the method for manufacturing the ink jet head substrate shown in FIG. 1, particularly focusing on the film structure in the electrode pad portion. It is a perspective view which shows an example of the inkjet head comprised using the board | substrate thru | or the head chip manufactured through the process of FIGS. FIG. 12 is an exploded perspective view illustrating a recording element unit, an ink supply unit, and a tank holder, which are main components of the ink jet head of FIG. 11. It is a typical perspective view which shows one structural example of the inkjet recording device using the inkjet head shown in FIG.11 and FIG.12. It is a perspective view which shows the general structure of the head chip comprised by providing a nozzle formation member in the board | substrate for inkjet heads.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Board | substrate 12 Ink discharge port 13 Nozzle formation member 101 Heater part 102 Through-hole part 103 Electrode pad part 110 Electrode pad 201 Heat storage layer 202 1st electric wiring layer 203 Interlayer insulation film 204 Heating resistor 205 2nd electric wiring layer 206 Protective layer 207 Abrasion resistant film 208 Hillock suppression layer 209 Adhesion improving layer H1000 Inkjet head H1002 Recording element unit H1003 Ink supply unit H1100, H1101 Recording element substrate (head chip)
H1300 Electric wiring member (TAB tape)
H2000 Tank holder H2200 Electrical contact board

Claims (12)

A method of manufacturing an ink jet head substrate having an element that generates energy used to eject ink in response to energization,
A step of forming an electrode wiring for energizing the element, including a pad portion to which a wiring member for electrical connection with the outside is connected;
Forming a layer for preventing contamination generated in a substrate manufacturing process on the pad portion;
Removing the layer prior to connection between the pad portion and the wiring member;
A method of manufacturing an ink jet head substrate, comprising:   In order to improve the adhesion with the ink discharge port-shaped member made of a photosensitive resin bonded to the substrate, the method includes a step of applying and patterning an adhesion improving layer made of polyetheramide on the substrate, The method for producing a substrate for an ink jet head according to claim 1, wherein a forming step and a removing step of the layer are performed before and after the step, respectively. The patterning of the adhesion improving layer is a manufacturing method of a substrate for ink jet head according to claim 2, wherein a is performed by dry etching using O ₂ gas was added CF _4.   4. The method for manufacturing a substrate for an ink jet recording head according to claim 1, wherein the electrode wiring is formed of Al or an Al alloy. In the layer forming step, the layer is formed in addition to the pad portion of the electrode wiring,
5. The method according to claim 4, further comprising a step of forming a protective layer from the ink on the electrode wiring after the formation, and using the layer as a hillock suppressing layer of the electrode wiring in the protective layer forming step. A method for manufacturing an ink jet recording head substrate.   6. The method of manufacturing an ink jet head substrate according to claim 1, wherein the layer is made of TiW. The step of removing the said layer, method of manufacturing a substrate for an ink jet recording head according to claim 6, characterized in that it comprises a dry etching using a gas containing wet etching or Cl ₂ using an etchant containing hydrogen peroxide.   An ink jet recording head substrate manufactured by the manufacturing method according to claim 1. An inkjet head substrate having an element that generates energy used to eject ink in response to energization,
A pad portion to which a wiring member for electrical connection with the outside is connected, and electrode wiring for energizing the element;
A protective layer disposed on a portion of the electrode wiring excluding the pad portion;
A hillock suppressing layer disposed between the protective layer and the portion;
A substrate for an ink jet head, comprising:   The inkjet head substrate according to claim 9, wherein the hillock suppressing layer is made of TiW. An inkjet head substrate according to any one of claims 8 to 10,
An ink discharge port forming member bonded to the substrate;
A wiring member connected to the pad portion and electrically connected to the outside;
An inkjet head characterized by comprising: The inkjet head according to claim 11, wherein the pad portion and the wiring member are connected via ball bumps.

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