JP2010143116A - Recording head, inkjet recording device, and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To miniaturize a recording head by forming an electric connection part while suppressing the enlargement of a process, in a configuration for performing electric connection with the outside at the rear side of a substrate of the recording head. <P>SOLUTION: The electric connection between the top surface side and the rear surface side of the substrate 10 is established by forming a perforation 20 and arranging a projecting electrode 23 therein. By this, basically, only the process for forming the perforation 20 suffices for the electrode connection between the top and rear surface sides, and the substantial enlargement of a manufacturing process can be avoided compared with the case of installing an embedded electrode. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a recording head, an ink jet recording apparatus, and a semiconductor device, and more particularly to an electrode configuration for electrical connection between a substrate on which an ejection energy element or the like is formed in the recording head and an external wiring substrate. is there.

An ink jet recording apparatus performs recording by discharging ink from a recording head to a recording medium such as paper or a resin sheet. Such a recording head has a discharge port and a flow path forming member formed with an ink flow path communicating therewith, an energy generating element that generates energy for ink discharge, and a wiring for supplying electric power thereto. And a recording element substrate configured to include the formed substrate. Examples of the energy generating element include an element using an electrothermal conversion element such as a heating resistor and an element using an electromechanical conversion element such as a piezo element.
In the conventional recording element substrate, the electrode for electrical connection with the outside is generally formed on the surface side of the substrate on which the energy generating element is formed. That is, a connection portion with a wiring substrate that is connected to an external substrate or the like is disposed on the side of the recording element substrate where the discharge port is opened.

  The surface of the recording element substrate on which the discharge ports are opened (discharge port surface) is a surface facing the recording medium, and the interval between the discharge port surface and the recording medium greatly affects the recording quality. From this point of view, it is not preferable that the connecting portion for electrical connection with the outside has a certain amount of thickness on the discharge port surface side or is disposed on the discharge port surface side.

  Further, in recent years, the recording density and speed of the recording by the ink jet recording apparatus have been increased, and accordingly, the recording head has also been increased in the density of the discharge ports and the number of nozzles. The size of the recording element substrate depends on the number of ejection openings, that is, the number of energy generating elements, and the size of the recording element substrate increases as the number of nozzles increases. In order to support full-color recording, the recording head needs to have a plurality of recording element substrates corresponding to the color of ink to be ejected. For this reason, the recording element substrate is required to be downsized in other structures while ensuring the necessary dimensions in the arrangement direction of the discharge ports. In addition, the recording element substrate is required to be downsized from the viewpoint of improving the use efficiency of various materials to be configured so that the recording element substrate can be configured with a minimum required material.

  From the above points, it can be considered to use the back side of the substrate having a wider arrangement area than the front surface of the substrate, and Patent Documents 1 and 2 describe a configuration in which an electrical connection portion is arranged on the back side.

  Patent Document 1 describes that a wire bonding portion serving as an electrical connection portion is disposed on the back surface of the element substrate on the side opposite to the discharge port surface. According to this configuration, since the electrical connection portion is not disposed on the discharge port surface side, it is possible to avoid the problem that the distance between the recording head and the recording medium has to be a certain distance or more by the electrical connection portion. However, in order to provide the electrical connection portion on the back side of the substrate, wiring for connecting the electrical connection portion and electrode wiring for supplying power to the energy generating element on the front side of the substrate is arranged so as to wrap around the edge of the substrate. It is necessary to install. Such wraparound wiring may hinder downsizing of the recording element substrate and high density arrangement.

  On the other hand, Patent Document 2 describes a configuration in which an electrode is embedded in a hole penetrating the front surface and the back surface of an element substrate, thereby electrically connecting the substrate front surface side and the back surface side. FIG. 1 is a diagram showing a conventional configuration in which an electrode similar to that described in Patent Document 2 is embedded in a through hole. As shown in FIG. 1, a through-hole 27 is provided in a substrate 10 constituting a recording element substrate, and a through-electrode 19 is disposed in the through-hole, and upper and lower ends thereof constitute electrode portions 12 and 24, respectively. The lower end electrode 24 is connected to a wiring 21 from a substrate outside the recording element substrate 1. On the other hand, an electrode wiring 14 disposed on the substrate 10 of the recording element substrate is connected to the upper electrode 12. According to the above configuration, no wraparound wiring as described in Patent Document 1 is required, and there is no hindrance such as downsizing of the substrate.

JP 2002-67328 A JP 2006-27109 A

  However, as shown in FIG. 1, in the configuration in which electrical connection with the outside is made on the back surface of the recording element substrate by the through electrode, the electrode is fixed by being embedded in the through hole after plating. In this case, a seed layer and barrier layer formation process necessary for plating, a removal process after plating, and the like are necessary, which increases the number of processes and leads to an increase in cost. Patent Document 2 describes that after embedding an electrode, a step of thinning the substrate is required to expose the electrode on the back surface side.

  An object of the present invention is to form the above-described electrical connection portion while suppressing an increase in the number of steps in a configuration in which electrical connection with the outside is performed on the back side of the substrate, thereby using a downsized recording head and the recording head. Ink jet recording apparatus and semiconductor device.

  Therefore, in the present invention, a recording head including a substrate provided with an electrode portion for electrical connection with an external wiring, wherein the electrode portion is provided on one surface of the substrate, Has a through-hole penetrating from the one surface to the other surface at a position corresponding to the electrode portion, and the electrode portion includes the wiring disposed on the other surface side of the substrate and the penetrating hole. Electrical connection is made through a member arranged in the hole.

  In the ink jet recording apparatus, recording is performed using the recording head.

  Furthermore, it is a semiconductor device comprising a substrate provided with an electrode part for electrical connection with an external wiring, wherein the electrode part is provided on one surface of the substrate, and the electrode includes the electrode A through hole penetrating from the one surface to the other surface is formed at a position corresponding to the portion, and the electrode portion is disposed in the through hole and the wiring disposed on the other surface side of the substrate. It is characterized in that the electrical connection is made through the formed member.

  According to the above configuration, electrical connection between one surface side of the substrate and the other surface side can be performed by disposing a member such as a protruding electrode inside the through hole. Thus, for the electrode connection between the front and back surfaces, basically only the step of forming the through hole needs to be performed, and a significant increase in the manufacturing process can be avoided as in the case of providing the embedded electrode. .

  As a result, an increase in the number of steps can be suppressed to form the electrical connection portion, thereby obtaining a recording head that is reduced in size and reduced in manufacturing cost.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Embodiment 1)
FIG. 2 shows a recording element substrate constituting a recording head, which is an embodiment of the semiconductor device of the present invention, FIG. 2 (a) is a partial plan view thereof, and FIG. 2 (b) is FIG. 2 (a). It is a bb sectional view taken on the line.

  As shown in FIGS. 2A and 2B, the recording element substrate 1 is formed by providing a flow path forming member 15 on a substrate 10. On the surface side of the substrate 10, a drive circuit element (not shown), a logic circuit element (not shown), a plurality of heating resistors 13 constituting an energy generating element, and wiring for transmitting a power signal to the heating resistors 13. 14 etc. are provided. Furthermore, as will be described later, an electrode portion 12 for inputting a power signal from the outside is provided on the surface side of the substrate 10, and the electrode portion 12 and the wiring 14 are connected.

  As shown in FIG. 2A, the substrate 10 is formed of a silicon material, and the width direction (horizontal direction in the figure) is centered along the longitudinal direction (vertical direction in the figure) of the substrate 10. An extending slit-shaped ink supply port 11 is formed. The ink supply port 11 passes through the front and back of the substrate 10 and communicates with a supply liquid chamber (not shown). Further, the heating resistors 13 provided on the substrate 10 are arranged on each side of the ink supply port 11, and each row is arranged so as to be shifted from each other by ½ pitch of the arrangement pitch. A discharge port (nozzle) 17 provided in the flow path forming member 15 is disposed corresponding to the heating resistor 13.

  As shown in FIG. 2B, the first embodiment according to the electrode connection configuration of the present invention has a protruding shape arranged in the through hole of the substrate 10 on the bottom surface of the electrode 12 provided on the substrate 10. Electrical connection is made by contact of the electrode 23. Then, the bottom of the protruding electrode 23 is connected to the lead electrode 24 of the external wiring board 21 which is a TAB substrate, whereby power is supplied to the heating resistor 13 from the board outside the recording element board 1 via the wiring 14. can do.

  As described above, according to the present embodiment, the through hole 20 is formed and the protruding electrode 23 is disposed in the through hole 20, so that the space between the upper surface (one surface) side and the back surface (the other surface) side of the substrate 10 is set. Electrical connection is possible. Thus, for the electrode connection between the front and back surfaces, basically only the step of forming the through hole 20 needs to be performed, and the manufacturing process is greatly increased as in the case of providing the embedded electrode shown in FIG. Is not invited.

  Here, the electrode portion 12 of the present embodiment has a structure in which a plurality of materials are laminated, and is formed in a step of forming a wiring using a metal material having the same electrical resistance value as that of the wiring 14 as the lowermost layer. The material is, for example, aluminum (Al), gold (Au), or an aluminum alloy, such as Al—Cu or Al—Si. The through hole 20 is formed by forming a desired mask on the substrate 10 in a photolithography process corresponding to the position where the electrode portion 12 is disposed, and removing silicon by laser processing or dry etching. That is, the silicon thermal oxide film, various insulating films, and interlayer films (not shown) formed on the surface of the substrate 10 when wirings are formed on the substrate 10 are removed in advance by a photolithography process and an etching process. The electrode portion 12 is provided by a film forming process such as sputtering. Thereby, at least a part of the bottom of the electrode portion 12 is disposed on the surface of the substrate 10. When this portion of silicon is removed from the back side of the substrate to form a through hole, at least a part of the bottom of the electrode portion 12 disposed on the surface of the substrate 10 is viewed through the through hole 20 to the back side. It becomes composition.

  Moreover, the electrode part 12 needs to connect not only the electrical connection with an external wiring but the board | substrate 10 also mechanically. Therefore, in order to obtain mechanical connection strength, the electrode part 12 formed only with the same material as the wiring has insufficient strength. For this reason, bumps are formed using the electroplating method with the lowermost layer of the electrode part 12 described above, in this embodiment, Al or an Al alloy as a base. In this embodiment, the gold (Au) bump is an Au bump formed by photolithography and electrolytic plating.

  Further, the protruding electrode 23 is formed on the lead electrode 24 of the external wiring substrate 21 using a stud bump or a plating method. The tip of the protruding electrode 23 has an arc shape at the tip, so that mechanical strength is obtained in connection with the electrode portion 12 provided on the substrate 10. The protruding electrode 23 is connected to the electrode portion 12 whose bottom is exposed through a through hole 20 provided in the substrate 10.

  The external wiring substrate 21 and the recording element substrate 1 are positioned by reading an alignment mark provided on the recording element substrate 1, and the external wiring substrate 21 and the recording element substrate 1 are fixed at an accurate position. After the recording element substrate 1 and the partial wiring base 21 are fixed in an accurate position by such a method, the electrode portion 12 of the recording element substrate 1 and the protruding electrode 23 of the external wiring base 21 are connected. In this embodiment, since Au used as the material of the electrode portion 12 and the protruding electrode 23 has low rigidity, it is joined to some extent by the pressure applied when it is pressed, and a stronger connection is achieved by joining using thermocompression bonding. . Thereafter, the through hole 20 is sealed with a resin material. Through these series of connection steps, the recording element substrate 1 and the external wiring substrate 21 are connected with high electrical and mechanical strength.

  As shown in FIG. 2A, the flow path forming member 15 generates a bubble in the ink by supplying power to the heating resistor 13 to generate heat, and a flow for discharging the ink with the pressure of the bubble. It has a road structure. An ejection port 17 that is opened at a position facing each heating resistor 13 and an ink flow path 16 that connects the ink supply port 11 and each ejection port 17 through the heating resistor 13 are formed. . The flow path forming member 15 can be formed of a resin material, for example. In the present embodiment, the flow path forming member 15 is also formed on the upper part of the electrode portion 12 formed on the substrate 10 and plays a role of supplementing the strength required when connecting to the external wiring substrate. The flow path forming member 15 is formed on the surface of the substrate 10 to constitute the recording element substrate 1.

  A recording head using the recording element substrate 1 having the above-described configuration is configured as follows. The recording element substrate 1 is mounted on a base plate 22 together with an external wiring base 21 provided with a circuit and other elements for supplying power to the heating resistor 13 based on a recording signal input from the recording apparatus main body, This constitutes a recording head. In the present embodiment, the external wiring substrate 21 is a TAB (Tape Automated Bonding) substrate in which a copper wiring 106 is applied to a polyimide film and the lead electrode 24 is connected to the copper wiring.

  Mounted on the base plate 22 are the recording element substrate 1 and the external wiring substrate 21 connected as described above. In the recording head of the present embodiment, the base plate 22 is provided with an ink outlet port (not shown) communicating with an ink containing portion (not shown) that contains and holds ink at a position corresponding to the ink supply port 11. ing. The ink supplied from the ink container to the ink supply port 11 is maintained in a state where the ink flow path 16 is filled and a meniscus is formed at the discharge port 17 by capillary force. In this state, the heating resistor 13 generates heat, causes film boiling in the ink on the heating resistor 13, and applies pressure to the ink by bubbles generated by the film boiling, so that ink is discharged from the discharge port 17.

  FIGS. 3A to 3F are views for explaining the manufacturing procedure of the substrate 10 constituting the recording element substrate 1 of the present embodiment.

  First, as shown in FIG. 3A, a drive circuit (not shown) and a logic circuit (not shown) are formed on a silicon base material 101 as a base of the substrate 10 through a semiconductor process such as thermal oxidation or ion implantation. To do. Next, as shown in FIG. 3B, the silicon thermal oxide film 102 and the interlayer film (not shown) used as the field oxide film of the drive circuit and logic circuit are patterned. At this time, in addition to the patterning necessary for the circuit, the portion to be the through hole 20 is also patterned and removed.

  Further, as shown in FIG. 3C, a metal material to be the first layer of the electrode portion 12 is formed. Thereafter, the metal material is patterned by dry etching to form the electrode portion 12. In this embodiment, Al—Si, which is an aluminum alloy, is formed as a first layer of the electrode unit 12 by a sputtering method. Then, using a dry etching apparatus, etching is performed using a mixed gas of chlorine triboride (BCl3) and chlorine (Cl2) as an etchant gas.

  Next, as shown in FIG. 3D, after the interlayer insulating film 103 is formed by plasma chemical vapor deposition (plasma CVD method), the contact portion (not shown) of the drive circuit and the electrode portion 12 are formed. The interlayer insulating film 103 is patterned. And as shown in FIG.3 (e), TaSiN which is a material of a heating resistor, and Al-Cu which is wiring material are formed into a film by sputtering method. Thereafter, the heating resistor 13 and the wiring 14 made of a TaSiN film are formed by photolithography, dry etching, and wet etching processes. Further, through this series of steps, the electrode portion 12, the heating resistor 13 and the wiring 14 are electrically connected.

  Next, as shown in FIG. 3F, bumps 18 are formed on the upper portions of the electrode portions 12. A photoresist is applied, and the upper portion of the electrode portion 12 is removed by photolithography, and then a bump 18 is formed by a plating method. In this embodiment, the bump is a gold (Au) bump. Then, a protective film (not shown) that protects the heating resistor 13, the wiring 14, and the electrode portion 12 from ink is formed by the plasma CVD method, and the substrate 10 is manufactured. Here, the material of the protective film is a silicon nitride film that is corrosive to ink and has adhesion to a flow path forming member formed on the substrate 10 in the subsequent process.

  In this embodiment, a silicon substrate 101 having a thickness of 625 μm is used. The size of the heating resistor 13 was 30 μm × 30 μm. If necessary, an anti-cavitation layer (not shown) made of a metal film may be provided on the heating resistor 13 to prevent the heating resistor 13 from being destroyed by cavitation that occurs when the ink is defoamed.

  Then, the manufacturing process of the flow path formation member formed in the upper part of the board | substrate 10 is demonstrated. The flow path forming member 15 is formed on the surface of the substrate 10 manufactured in the manufacturing process described above by a photolithography process such as application of a resin material and exposure.

  4A to 4D are cross-sectional views taken along the line cc of the recording element substrate shown in FIG. 2 and are diagrams for explaining a flow path forming member forming process. As shown in FIG. 4A, a positive resist is applied to the surface of the substrate 10 on which the heating resistor 13 and the wiring 14 are formed to a thickness of 15 μm, and the resist becomes an ink flow path by exposure and development. The flow path pattern material 104 is formed by patterning into a shape. Then, as shown in FIG. 4B, a photosensitive negative epoxy resin 105 is applied to a thickness of 30 μm so as to cover the flow path pattern material 104.

  Next, as shown in FIG. 4C, the discharge port 17 is exposed and developed at a position of the epoxy resin 105 covering the flow path pattern material 104 facing the heating resistor 13 across the flow path pattern material 104. Form. In this embodiment, the discharge port 17 has a diameter of 25 μm.

  Next, a protective material layer (not shown) is formed by applying a resin to the surface of the epoxy resin 105. As shown in FIG. 4D, a through hole 20 (not shown) is formed on the substrate 10 so that an ink supply port 11 that penetrates the front and back of the substrate 10 and an electrode portion 12 provided on the surface of the substrate 10 appear. ). The ink supply port 11 and the through hole 20 can be formed, for example, as follows. First, an etching mask material is formed on the back surface of the substrate 10 and patterned into the shapes of the ink supply port 11 and the through hole 20. Thereafter, the ink supply port 11 and the through hole 20 are formed by dry etching, and finally the mask material is removed.

  Finally, the protective material layer and the flow path pattern material 104 are removed, and the ink flow path 16 is formed. Through this series of steps, the flow path forming member 15 is formed on the surface of the substrate 10.

  The recording element substrate 1 is manufactured through the above steps. In the recording element substrate 1 manufactured as described above, the electrode portion 12 formed on the surface of the substrate 10 is connected to the back surface side of the substrate 10 by the protruding electrode 23 disposed in the through hole 20 formed in the substrate 10. The part can be formed. Thereby, the electrical connection between the recording element substrate 1 and the external wiring base 21 can be performed on the back side of the recording element substrate 1, and the arrangement of the electrode portions 12 can be determined relatively freely. As a result, for example, the discharge ports 17 formed on the surface of the recording element substrate 1 can be arranged with higher density. Further, since the element protruding to the surface side of the recording element substrate 1 can be eliminated, the dimension between the recording medium and the ejection port 17 is made smaller than that in the case where electrical connection is made on the surface side of the recording element substrate. can do. Since the size between the recording medium and the ejection port 17 can be reduced, the landing position accuracy of the ejected ink droplets can be improved, and the recording quality can be improved.

(Embodiment 2)
In the first embodiment described above, the electrode portion 12 is formed on the surface of the substrate 10 where the silicon thermal oxide film, insulating film, and interlayer film are removed. In the second embodiment of the present invention, as shown in FIG. 5, the electrode portion 12 is formed on these surfaces without removing the silicon oxide film, the insulating film, and the interlayer film. The subsequent bump formation process and flow path forming member 15 are the same as those described in the first embodiment.

  The through hole 20 is formed by opening the back surface of the substrate 10 in a desired shape and then opening it by dry etching or the like. As a result, the bottom portion of the electrode portion 12 looks into the through hole 20. That is, in the present embodiment, first, a silicon thermal oxide film, an insulating film, and an interlayer film constituting a circuit (not shown) disposed on the surface of the substrate 10 exist below the electrode portion 12. Therefore, when forming the through-hole, these films are also removed in the same process. The through hole 20 has a smaller dimension than the through hole 20 with respect to the width and length of the bump portion of the electrode portion 12.

(Embodiment 3)
In the first and second embodiments described above, the protruding electrode 23 provided on the lead electrode 24 of the external wiring body 21 that is a TAB is connected to the through hole 20 provided in the substrate 10 from the back side of the base 0. The recording element substrate 1 and the external wiring body 21 are electrically inserted and mechanically connected. In the third embodiment of the present invention, as shown in FIGS. 6A to 6C, the external wiring body 21 is inserted into the through-hole 20 by bending the external wiring body 21, so that the external wiring body The lead electrode 24 is directly connected to the electrode portion 12.

  Specifically, with respect to the recording element substrate 1 described in the first embodiment, the recording element substrate 1 and the external wiring substrate 21 so that the electrode portion 12 of the recording element substrate 1 and the lead electrode 24 provided on the external wiring body 21 can be joined. Are aligned accurately using alignment marks. Then, in a state where the surface of the external wiring body 21 is perpendicular to the surface of the recording element substrate 1, the extension portion of the external wiring body 21 is inserted into the through hole 20 and pressure-bonded (FIG. 6A). Further, the external wiring body 21 is bent using a jig so that the back surface of the recording element substrate 1 and the external wiring body 21 are in contact with each other (FIG. 6B). Thereafter, the through hole 20 is sealed with a resin material. With these series of connection methods, the recording element substrate 1 and the external wiring substrate 21 are connected with high electrical and mechanical strength (FIG. 6C).

(Other embodiments)
In the first and second embodiments described above, the electrode provided on the lead electrode 24 of the external wiring substrate 21 is a protruding electrode having a circular arc at the tip, but as shown in FIGS. 7A and 7B, The tip of the protruding electrode 23 may be needle-shaped. Moreover, it can also be set as the solder ball 26 instead of the rectangular parallelepiped lead electrode which concerns on 3rd Embodiment.

  In the first to third embodiments described above, the thickness of the silicon substrate 10 is set to 625 μm. However, the connection to the external wiring body 21 can be more easily performed by making the substrate 10 thinner than the back surface. Can do. The substrate is thinned by using processes such as polishing, etching, and back grinding.

  FIG. 8 is a diagram illustrating an example of an ink jet recording apparatus using the recording head described above. The ink jet recording apparatus shown in the figure is a serial type ink jet recording apparatus, and includes a carriage 2 provided so as to be reciprocally movable along a guide shaft 3 supported by a frame. In addition, an automatic paper feeding device 6 that stacks recording media to be recorded and feeds the stacked recording media one by one, and a transport roller and a paper discharge roller that transport the recording media sent from the automatic paper feeding device 6 are used. A transport mechanism configured. A portion of the timing belt 5 driven by the rotation of the carriage motor 4 is fixed to the carriage 2, and the carriage 2 reciprocates along the guide shaft 3 by rotating the carriage motor 4 forward and backward. can do. The carriage 2 has an inkjet cartridge 7 detachably mounted thereon. The ink jet cartridge 7 is obtained by integrating a recording head including the above-described recording element substrate 1 (see FIG. 2) and an ink tank filled or refilled with ink to be supplied to the recording head. This cartridge is mounted on the carriage 2 so that the recording head ejects ink downward. The recording head is mounted with one recording element substrate 1 for monochromatic recording, and with a plurality of recording element substrates 1 corresponding to the type of ink to be ejected for color recording. In the case of color recording, as many ink tanks as the number of types of ink to be ejected are provided.

  The reciprocating direction of the carriage 2 is such that the recording medium fed from the automatic paper feeder 6 passes over the platen 8 disposed in the area facing the recording head mounted on the ink jet cartridge 7 by the transport mechanism. It is conveyed in the direction that intersects. The operation of the automatic paper feeder 6 and the operation of the transport mechanism are performed by a feed motor 9. Along with this conveyance, ink droplets are ejected from the recording head while reciprocating the carriage 2 to perform recording on the recording medium. At this time, recording is performed on the entire recording medium by intermittently feeding the recording medium at a predetermined pitch every time the carriage 2 moves in one direction or every reciprocal movement. Here, an example in which the recording head and the ink tank are integrated as the ink jet cartridge 7 is shown. However, it is of course possible to configure such that the two can be separated from each other so that only the ink tank can be replaced when the ink in the ink tank runs out.

  In the above-described embodiment, the example in which the present invention is applied to the recording element substrate constituting the recording head has been described. However, the application of the present invention is not limited to such a semiconductor device. For example, any type of semiconductor device having an electrical connection part to the outside, such as a recording head other than an ink jet system, and a substrate on which elements and circuits are formed by a semiconductor manufacturing process is provided. Also good.

It is sectional drawing which shows the recording element board | substrate in the inkjet recording head which concerns on one prior art example. FIG. 2A is a plan view of the recording element substrate in the inkjet recording head according to the first embodiment of the present invention, and FIG. 2B is a cross-sectional view taken along the line bb in FIG. 2A. FIG. (A)-(f) is a figure explaining the manufacturing procedure of a board | substrate among the recording element substrates shown in FIG. (A)-(d) is a figure explaining the manufacturing procedure of a flow-path formation member among the recording element substrates shown in FIG. FIG. 5 is a cross-sectional view mainly showing a recording element substrate in an ink jet recording head according to a second embodiment of the present invention. (A)-(c) is sectional drawing which mainly shows the recording element board | substrate in the inkjet recording head which concerns on 3rd Embodiment of this invention. (A) And (b) is a figure which shows the shape of the electrode provided in the external wiring base | substrate of the inkjet recording head by other embodiment of this invention. 1 is a perspective view illustrating an example of an ink jet recording apparatus using a recording head according to an embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Recording element board | substrate 10 Substrate 11 Ink supply port 12 Electrode part 13 Heating resistor 14 Wiring 15 Flow path forming member 16 Ink flow path 17 Discharge port 18 Bump 19 Through-electrode 20 Through-hole 21 External wiring body 22 Base plate 23 Protruding electrode 24 Lead electrode 25 Jig 26 Solder ball

Claims (6)

A recording head comprising a substrate provided with an electrode part for electrical connection with wiring from outside,
The electrode portion is provided on one surface of the substrate,
In the substrate, a through-hole penetrating from the one surface to the other surface is formed at a position corresponding to the electrode portion,
The recording head according to claim 1, wherein the electrode portion is electrically connected to the wiring disposed on the other surface side of the substrate through a member disposed in the through hole.   The recording head according to claim 1, wherein the member is a protruding electrode.   The recording head according to claim 1, wherein the member is an extension of the wiring.   4. A recording head according to claim 1, wherein the wiring is a TAB substrate.   An ink jet recording apparatus that performs recording using the recording head according to claim 1. A semiconductor device comprising a substrate provided with an electrode part for electrical connection with wiring from outside,
The electrode portion is provided on one surface of the substrate,
In the substrate, a through-hole penetrating from the one surface to the other surface is formed at a position corresponding to the electrode portion,
The semiconductor device, wherein the electrode portion is electrically connected to the wiring disposed on the other surface side of the substrate via a member disposed in the through hole.

Images