JP2007301886A - Ink jet type print head and its manufacturing process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform a cost reduction of an electric wiring tape which is a comparatively expensive member and to apply cheaply a high-quality ink jet type head which has raised the encapsulation reliability of electric joint. <P>SOLUTION: It is characterized by preparing a notch which becomes smaller from an ink supply port side to an ink ejection port side in four corner sections of an HB chip. For the HB chip, an Si wafer which has a crystal orientation of a surface (100) as an Si substrate is used, an opening is formed simultaneously with an ink supply port by Si anisotropic etching, it is separating into each HB chip by machine cutting by a dicing method after that, the notch is formed in each of the four corner sections of the HB chip. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an ink jet print head and a method for manufacturing the same, and is applied to an ink jet print head in which a wiring board is connected to a recording element substrate and the connection portion is protected by a sealant.

  In the conventional ink jet print head, a Si (Si linear expansion coefficient: 4.2 × 10 −6) wafer is used as a substrate, and a Si wafer having a <100> plane or a <110> plane crystal orientation is used. In addition, an ejection port group for ejecting ink as a recording element substrate (hereinafter referred to as an HB chip), an ejection energy generating element for ejecting ink from the ejection port, an electrical pulse signal from a printer, etc., and an electrode for supplying power A large number of functional elements such as are formed. Thereafter, an ink supply port is formed by Si anisotropic etching.

  The formation of the ink supply port by Si anisotropic etching is performed from the opposite side of the surface on which the functional element of the liquid jet recording head is formed, and the Si anisotropic etching stop layer is formed. The HB chip is formed on the surface side where the functional elements are formed. Further, the Si anisotropic etching stop layer also serves as a protective functional layer for protecting the functional element (see, for example, Patent Document 1).

  A large number of HB chips are arranged on a Si wafer substrate, and these are machined by a dicing method generally used in a semiconductor manufacturing method (see, for example, Patent Document 2) and separated into individual HB chips. To do.

A support member (hereinafter referred to as a chip plate) to which the recording element substrate is attached is formed with a liquid supply path for communicating ink to the liquid chamber of the recording element substrate. A typical material is alumina (Al ₂ O ₃ linear expansion). Coefficient: 7.2 × 10 −6) is used.

  A wiring board (hereinafter referred to as an electric wiring tape) has an electrode terminal corresponding to an electrode of a recording element board and an external input terminal for receiving an electric pulse signal from a printer, etc., and includes a base film, an electric conductor layer, and an electric terminal. It consists of a laminate of a cover film that protects the conductor layer, and has an opening for exposing the recording element substrate. The base film has a smooth surface made of polyimide resin because a capping member such as a printer comes into contact therewith.

Alumina (Al ₂ O ₃ ) is also used as a material for a support plate (hereinafter referred to as “makura”) that is disposed between the electric wiring tape and the support member and holds and fixes the electric wiring tape. Both the macula and the chip plate are formed by compression molding of alumina (Al ₂ O ₃ ) powder.

  The macula is larger than the outer shape of the HB chip and has a single plate shape with an opening of approximately the same shape as the opening of the electrical wiring tape. The entire surface other than the opening is bonded and fixed to the chip plate with an adhesive. ing.

  The HB chip is bonded to the bonded body of the chip plate to which the macula is bonded, and the electric wiring tape is heated with a thermosetting adhesive or the like on the surface opposite the bonding surface of the chip plate and the electric tape. Thus, they are bonded and fixed (see, for example, Patent Document 3).

  After joining the chip board, HB chip and electrical wiring tape to the chip plate, the bumps previously provided on the electrode part of the HB chip and the electrode terminal of the electrical wiring tape are joined by single-point inner lead bonding (hereinafter referred to as ILB). is doing.

  In the recess formed in the gap between the side surface adjacent to the side surface where the opening part of the macula and the electrode part of the HB chip are not disposed, the outer peripheral side surface of the HB chip is not corroded by the accumulation of ink. A sufficient amount of the first sealant is filled so as not to decrease (see, for example, Patent Document 4).

  The ink droplets ejected from the HB chip or the ink droplets jumping up from the recording medium adhere to the electrode terminal of the HB chip electrode or the electric wiring tape and its joint part, and the electrode part, its base, the electrode terminal and its electric joint part are attached. Since it may corrode, it is covered with a second sealant.

  As the first sealant, one having high fluidity and high elasticity that does not give stress such as curing shrinkage after curing is selected. On the other hand, the second sealant considers wear resistance against wiper blades such as rubber for wiping off ink droplets adhering to the ejection port formation surface of the HB chip and preventing deformation of the electrical joint. The hard ones are selected.

In the portion where the second sealant is located on the first sealant and the deformation due to curing shrinkage of the first sealant is large, the first sealant and the second sealant Cracks may occur in the vicinity of the interface, and ink may stagnate from the cracked parts, which may corrode the electrical joints. Moreover, although the shape which provided the overhang | projection part in the four corners of opening of an electrical wiring tape is proposed (for example, refer patent document 5), when this is applied, on both sides where the electrode terminal of the electrical wiring tape was arranged, The electric wiring tape is extended so as to cover the gap portion between the HB chip and the opening of the macula, and the electric joint portion is covered with the second sealant and is also applied onto the core protruding portion. However, when the first sealant is cured and contracted, the protruding portion provided in the opening portion of the electric wiring tape also moves to the bonding surface side of the HB chip and the chip plate depending on the hardness and thickness of the electric wiring tape. Deforms to be drawn. Since the second sealing agent is hard, it cannot follow the deformation of the adhesive, and there is a possibility that the sealing reliability is impaired.
JP-A-10-157149 JP-A-2-212162 JP 2002-019120 A JP 2001-130001 A JP 2002-187273 A

In the present invention,
・ It is possible to reduce the thickness of the conductor layer and the base film, which are the cost reduction factors for electrical wiring tape, which is a relatively expensive member,
And,
-It is an object to supply a high-quality inkjet print head with improved sealing reliability of electrical connection parts at low cost.

  Since reducing the thickness of the conductor layer and the base film, which is an element for reducing the cost of the electrical wiring tape, reduces the rigidity of the electrical wiring tape, the overhangs provided at the four corners of the electrical wiring tape opening However, it becomes easy to follow the deformation due to the curing shrinkage of the first sealant, and the second sealant on the first sealant may peel from the electrical wiring tape via the electrical wiring tape.

  The width of the recess (hereinafter referred to as the sealing groove) formed in the gap between the opening of the macula adjacent to one side where the electrode part of the HB chip, which is the first sealing agent application area, is not disposed, and the HB chip. By narrowing, the pull-in of TAB due to the curing shrinkage of the first sealant can be reduced, but it becomes difficult for the first sealant to wrap around the entire outer periphery of the HB chip, This is accompanied by problems such as an increase in coating tact time, and a sealing agent adhering to the electric wiring tape clogging the nozzle portion due to wiping of a printer or the like and causing a printing defect.

  Therefore, the deformation of the electrical wiring tape due to the curing shrinkage of the first sealant is suppressed, the first sealant is wrapped around the entire outer periphery of the HB chip without extending the coating tact of the first sealant, and It is an object of the present invention to provide an inkjet print head with improved sealing reliability of an electrode portion of an HB chip, an electrode terminal of an electric wiring tape, and a joint portion thereof by a second sealant at a low cost.

The first aspect of the present invention is:
The four corners of the HB chip are provided with notches that become smaller from the ink supply port side to the ink discharge port side, and integral protrusions for receiving the second sealant at the opening of the macula. It is what.

  For the HB chip, a Si wafer having a <100> plane crystal orientation is used as the Si substrate, an opening is formed simultaneously with the ink supply port by Si anisotropic etching, and then each HB chip is mechanically cut by a dicing method. By separating into chips, notches are formed at the four corners of the HB chip.

  In more detail, the present invention can solve the above problems by the following configuration.

(1) A group of ejection ports for ejecting ink, an ejection energy generating element for ejecting ink from the ejection port, an electric pulse signal for driving the ejection energy generating element, and an electrode portion for receiving power supply and the ejection port A recording element substrate having an ink supply port on the opposite surface of the group;
A support member to which the recording element substrate is attached, and a liquid supply path that communicates ink with the liquid chamber of the recording element substrate;
An opening for incorporating the recording element substrate; a flexible wiring substrate for applying an electric pulse signal and electric power for ejecting ink to the recording element substrate;
A support plate that has an opening for the recording element substrate to contact the support member, is disposed between the support member and the wiring substrate, and holds and fixes the wiring substrate;
A first sealant for sealing the periphery of the recording element substrate disposed in the opening of the support plate;
In an ink jet print head provided with a second sealant that seals the electrical connection portion between the recording element substrate and the wiring substrate,
An ink jet print head comprising: a notch structure that decreases in size from an ink supply port side to an ink discharge port side and a member that receives a second sealant at four corners of the recording element substrate.

  (2) The ink jet print head according to (1), wherein a member that receives the second sealant is integrally provided as a protruding portion at an opening of the support plate.

(3) After the recording element substrate is formed on the Si wafer having a <100> plane crystal orientation, the ejection openings, the ejection energy generating elements, and the electrode portions are formed for a plurality of recording element substrates,
An ink supply port is formed by Si anisotropic etching from the side opposite to the surface on which the ink discharge port is formed,
At the same time, openings are formed at the four corners of the recording element substrate by Si anisotropic etching,
Then, the recording element substrate is separated and divided to form the notch structures at the four corners of the recording element substrate.

  According to the present invention, protrusions are provided at the four corners of the opening of the macula for supporting and fixing the protrusions provided at the four corners of the opening of the electric wiring tape, and the first sealant applied to the sealing groove is an HB chip. Through the notches provided at the four corners, the fluidity toward the side surface on which the electrode of the HB chip is provided is wrapped and sealed without deterioration. The width of the recess formed in the gap between the opening of the macula and the HB chip is not narrow except for the protruding portion of the macula, and the opening of the electric wiring tape is not changed, so the first sealant is placed on the electric wiring tape. It does not protrude or the coating tact time does not increase.

  By providing notches that become smaller as the ink supply port side becomes closer to the ink discharge port side at the four corners of the HB chip, the electric wiring tape in the region where the second sealant is applied is provided on the protruding portion provided on the macula The electric wiring tape will not be deformed to the chip plate side even if the first sealant is cured and shrunk. Therefore, since the positional relationship between the second sealant and the electric wiring tape does not change from that during application, the sealing reliability of the joint portion between the HB chip and the electric wiring tape is improved.

  In addition, it is possible to incorporate components that reduce component costs such as reducing the thickness of the base film, cover film, and copper foil that make up the electrical wiring tape. It became possible to supply with.

  The HB chip uses a Si wafer having a <100> plane crystal orientation as the Si substrate, and an opening is formed at the same time as the ink supply port by Si anisotropic etching. By separating into individual HB chips by cutting and forming notches at the four corners of the HB chip, the ink supply port side is changed to the ink discharge port side at the four corners of the HB chip without adding a new process. Accordingly, a notch portion that becomes smaller can be formed, and an ink jet print head can be supplied without an increase in cost.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to examples.

  An ink jet print head according to the present invention will be described with reference to FIGS.

  FIG. 2 is an exploded view of the ink jet print head in this embodiment.

  FIG. 3 is an external view of the ink jet print head in this embodiment.

  The print head 1 communicates ink to an HB chip and a liquid chamber of the HB chip that include an ejection port group that ejects ink and an electrothermal conversion element that generates ejection energy for ejecting ink from the ejection port. A chip plate unit 2 including a chip plate in which a liquid supply path is formed; a chip tank unit 3 including an ink tank mounting portion (hereinafter referred to as a chip tank) for storing ink to be supplied to the HB chip; Consists of The print head 1 is a bubble jet (registered trademark) side shooter type that performs recording using an electrothermal transducer that generates thermal energy for causing film boiling in ink in response to an electric pulse signal. Print head.

  FIG. 7 is a schematic cross-sectional view (cross-section A-A ′ in FIG. 4) showing each step of the method for manufacturing the HB chip used in the ink jet print head of the present invention.

  In the single HB chip 201 shown in FIG. 1, the Si substrate 4001 uses a Si wafer having a crystal orientation of <100> plane as the substrate, and the notches 4009 are formed at the four corners of the HB chip by Si anisotropic etching. It is a single HB chip having In the substrate 4001, the ink supply port 4002 is formed by Si anisotropic etching, and at the same time, an opening 8002 that becomes a notch 4009 is formed. In order to improve the functional life of the electro-thermal conversion element 4003 for generating ejection energy for ejecting ink, the electrode portion 4004 for transmitting signals for driving them, and the durability of the substrate 4001 on one surface. In addition, an ink channel 4005 and an ejection port 4007 are formed in the protective film 9002.

  In the method of manufacturing an ink jet print head of the present invention, a large number of single HB chips having such a structure are formed on a Si wafer having a <100> plane crystal orientation as a substrate, and then a dicing process is performed. Then, they are individually separated and divided to form a single HB chip.

  Hereinafter, the method for manufacturing the HB chip of the present invention will be described in detail according to the steps shown in FIG.

  Using a Si wafer 8001 having a <100> plane crystal orientation as a substrate, a number of HB chips 201 having a desired size and shape are laid out in consideration of the size of the opening 8002.

As shown in FIG. 4, according to a desired layout, a predetermined number of functional elements each including an electrothermal conversion element 4003, an electrode portion 4004, and the like as each HB chip are arranged and formed. A protective film 9002 for improving the durability life is formed on the functional element. This protective film 9002 is preferably made of SiN or SiO ₂ as the material of the protective film in order to function as an etching stop layer when the Si substrate is etched by Si anisotropic etching described later.

Then, opposite to the surface on which the functional element is not formed HB chip 201 (hereinafter, simply referred to as. "Back") and overall deposition similar SiN or SiO ² and the protective film 9002 in a film 9004 To do. Note that the film 9004 formed on the back surface is a metal film made of Cr, Mo, W, Au, Pt, or the like for functioning as an etching resistant mask at the time of Si anisotropic etching described later. However, as will be described later, it is preferable to use the same material as that of the protective film 9002 from the viewpoint of process management, and when SiN is used, the film is formed to have a thickness of about 1 μm.

  Next, the ink flow path and the discharge port forming portion 9003 of the HB chip are formed on the protective film 9002 (see FIG. 7A).

  These can be formed in the same manner as a conventional method using a normal photolithography technique.

  Next, using a photomask provided with a desired pattern, the SiN film formed on the back surface of the Si substrate is patterned by photolithography technology (resist coating, exposure, development), and similar to the pattern provided on the photomask. The resist pattern 9008 is formed (see FIGS. 7B to 7C). That is, a photoresist 9005 is applied to the back surface of the Si substrate (see FIG. 7B), and then an opening pattern for forming a desired ink supply port pattern and notches 4009 at the four corners of the HB chip is provided. Develop using an exposed photomask. Thus, a resist pattern 9008 having an ink supply port pattern 9007 and an opening pattern 9006 similar to the pattern provided on the photomask is formed (see FIG. 7C).

  Here, the width of the opening pattern of the photomask and the width Wm of the opening pattern 9006 of the resist pattern can be calculated based on a desired separation width Wo of the recording head as will be described later. In addition, it is necessary to accurately align the front surface and the back surface on which the functional element is formed at the time of exposure, and OFPR-800 (Tokyo Ohka Kogyo Co., Ltd.) is applied as a photoresist 9008 to form a functional element. Recognize the pattern on the surface and use an exposure device that can be aligned to align a predetermined photomask and perform UV exposure, and develop the resist with a dedicated developer using a predetermined method. It was.

Then, the SiN film 9004 is etched using the resist pattern 9008 formed in this way as an anti-etching mask (see FIG. 7D). This etching method can be performed by a known wet etching method or a dry etching method. In the present invention, an RIE (reactive ion etching) apparatus is used by using a mixed gas of CF ₄ and O ₂ as a reaction gas by the dry etching method. used.

  Although the resist used for patterning the SiN film is usually unnecessary and is removed in the next process, it is generally removed. However, when a positive resist is used, the resist is anisotropic in the next process. Since it can be removed at the same time as etching in the case of reactive etching, it is not particularly necessary to peel off.

  Next, Si anisotropic etching is performed using the patterned SiN film 9002 as an etching resistant mask. As an etching solution, a generally known alkaline etching solution such as TMAH, KOH, or NaOH is used, and the Si substrate is immersed in the heated bath solution. The concentration of the etching solution and the heating temperature can be set as appropriate to obtain the optimum etching rate and smoothness of the etched surface.

  Thus, the Si substrate subjected to Si anisotropic etching is etched from the back surface, and the etching is completed when the SiN film (protective film) 9002 on the front surface side is reached (see FIG. 7E). Here, when the surface side on which the ink flow path and the discharge port forming portion 9003 is formed is not resistant to the etching liquid for Si anisotropic etching, a protective layer for protecting the surface side is provided in advance. Or a suitable jig should be used.

  After the Si anisotropic etching is completed, the surface SiN film 9002 is etched from the back side by the dry etching method similar to the method used for the SiN patterning described above, so that each inkjet recording head has a predetermined separation width. A large number of ink jet recording heads separated and divided by Wo are obtained. At this time, the ink supply port 4002 is also etched at the same time and penetrates the ink flow path 4005 and the ejection port 4007.

  In connection with the etching of the SiN film 9002 on the front surface side, the film thickness of the SiN film 9004 on the back surface is made equal to the film thickness of the SiN film 9002 on the front surface side, or the film thickness of the SiN film 9004 on the back surface is slightly thicker. By forming the surface, the removal state of the SiN film 9004 on the back surface to be etched first is monitored to determine the removal state of the SiN film 9002 on the front surface exposed by anisotropic etching from the subsequent back surface side. This makes it possible to manage the process efficiently.

As for the width Wm of the opening pattern 9006 of the resist pattern and the width of the opening pattern of the photomask, when the width of the openings of the plurality of recording heads laid out on the Si wafer is Wo (for example, about 500 μm), The width Wm of the opening pattern 9006 of the resist pattern and the width of the opening pattern of the photomask can be appropriately calculated and calculated as follows. Since a Si wafer having a <100> plane crystal orientation has a V-shaped or inverted trapezoidal opening formed by anisotropic etching, a well-known calculation formula in Si anisotropic etching Wm = Wo + √2T ( T: thickness of Si wafer)
Thus, the width Wm of the opening pattern 9006 can be calculated, and the resist pattern and the opening pattern of the photomask can be designed based on this Wm.

  After forming a functional element, an ink supply port, and an opening on the Si wafer, it is cut and separated using a cutting blade 10001 as shown in FIG. 8 to form an HB chip 201 having a notch 4009.

  As shown in the exploded perspective view of FIG. 2, the chip plate unit 2 includes an HB chip 201, a chip plate 202, an electric wiring tape 203, and a macula 204. The chip tank unit 3 includes a chip tank 301, It is composed of a flow path plate 302, a joint rubber 303, a filter 304, and a seal rubber 305.

  FIG. 4 is a partially exploded perspective view for explaining the configuration of the HB chip 201. The HB chip 201 has, for example, an ink supply port 4002 formed of a long groove-like through-hole as an ink channel on a Si substrate 4001 having a thickness of 0.5 to 1 mm and a crystal orientation of the <100> plane of the four corner notches 4009 The electrothermal transducers 4003 are arranged in a staggered pattern on both sides of the ink supply port 4002 between the electrothermal transducer 4003 and the electrothermal transducer 4003. The electric wiring such as Al for supplying electric power is formed by a film forming technique. Furthermore, electrode portions 4004 for supplying power to the electric wiring are arranged on both outer sides of the electrothermal transducer 4003, and bumps such as Au are formed on the electrode portion 4004. On the Si substrate 4001, an ink channel wall 4006 and an ejection port 4007 for forming an ink channel 4005 corresponding to the electrothermal conversion element 4003 are formed of a resin material by a photolithography technique, and an ejection port group 4008 is formed. Accordingly, since the discharge port 4007 is provided to face the electrothermal conversion element 4003, the ink supplied from the ink supply port 4002 passes through the ink flow path 4005 and is generated by bubbles generated by the electrothermal conversion element 4003. Discharged.

Next, the chip plate 202 is formed by compressing and baking alumina (Al ₂ O ₃ ) powder, and has a thickness of 0.5 to 10 mm. Note that the material of the chip plate 202 is not limited to alumina, and has a linear expansion coefficient equivalent to that of the material of the HB chip 201 and is equivalent to or equivalent to the thermal conductivity of the material of the HB chip 201. It may be made of a material having the above thermal conductivity. The material of the chip plate 202 may be any of aluminum nitride (AlN), silicon nitride (Si ₃ N ₄ ), and silicon carbide (SiC), for example.

Pillow 204, e.g., a plate-shaped member having a thickness of 0.5 to 10 mm, and is formed by molding of alumina _(Al 2 _{O 3)} material. The material of the macula is not limited to alumina, and may be made of a metal material such as ceramic, Al, or SUS having the same or similar linear expansion coefficient as the material of the chip plate 202. Then, the shape is such that the opening 208 is larger than the external dimension in which three HB chips 201 bonded and fixed to the chip plate 202 are arranged. Further, the thickness of the mask is the same as the thickness of the HB chip 201 so that the HB chip 201 and the electric wiring tape 203 (described later) can be electrically connected in a plane.

  In joining the chip plate 202 and the macula 204, the first adhesive is transferred to the entire surface of one side of the macula 204, and the opening of the macula 204 with respect to the reference position 6007 in the X direction and the reference position 6008 in the Y direction of the chip plate 202 is transferred. Positioning and bonding are performed so that the position of the portion 208 becomes constant. The first adhesive used for bonding is preferably ink-resistant and has a relatively low hardness after curing. The thickness of the adhesive layer is desirably 50 μm or less.

  Moreover, you may use the thing of the shape which shape | molded the chip plate and the macula integrally.

  Next, the HB chip 201 is bonded and fixed to the joined body of the chip plate 202 and the macula 204.

  The ink supply ports 4002 of the HB chip 201 correspond to the ink supply ports 205 of the chip plate 202, respectively, and the three HB chips 201 are bonded and fixed to the chip plate 202 with high positional accuracy. The second adhesive used for bonding is desirably a low viscosity, has a relatively high hardness after curing, and has ink resistance. The second adhesive is, for example, a thermosetting adhesive mainly composed of an epoxy resin, and the thickness of the adhesive layer is desirably 20 μm or less.

  The electric wiring tape 203 applies an electric pulse signal for ejecting ink to the HB chip 201, and the electrode terminal 206 corresponding to the electrode portion 4004 of the HB chip 201 is positioned at the end of the wiring tape. And an external signal input terminal 207 for receiving an electric pulse signal from the printer main body or the like.

  The electrical wiring tape 203 transfers the third adhesive to the surface of the macula 204 opposite to the chip plate 208 bonding surface, and aligns and bonds the corresponding electrode terminal 206 to the electrode portion 4004 of the HB chip 201. .

  Protruding portions 6001 are provided at the four corners of the opening of the macula, and the protruding portions 6002 provided at the four corners of the opening of the electric wiring tape 203 are bonded to the protruding portions 6001.

  As the third adhesive, an adhesive having a low viscosity, a relatively high hardness after curing, and an ink resistance is desirable. The adhesive having this characteristic is, for example, a thermosetting adhesive mainly composed of an epoxy resin.

  The electrical wiring tape 203 and the HB chip 201 are electrically connected. For example, the electrode part 4004 of the HB chip 201 and the electrode terminal 206 of the electrical wiring tape are electrically joined by a thermal ultrasonic joining method. Has been.

  The electrical connection portion between the HB chip 201 and the electrical wiring tape 203 is sealed with the first sealant 6003 and the second sealant 6004 to protect the electrical connection portion from corrosion and external impact by ink. . The first sealing agent mainly seals the back surface side of the connection portion between the electrode terminal 206 of the electric wiring tape 203 and the electrode portion 4004 of the HB chip 201 and the outer peripheral portion of the HB chip 201, and the second sealing agent. The agent seals the connecting portion.

  The first sealant 6003 is applied to the recesses formed in the gap between the opening part of the macula 204 adjacent to one side surface where the electrode part of the HB chip 201 is not disposed and the HB chip 201, and is applied to the four corners of the HB chip 201. It passes between the notch 4009 provided and the protruding portion 6001 provided on the macula 204, and is wrapped around and sealed to the side surface where the electrode part 4004 of the HB chip 201 is provided.

  As shown in FIG. 6, the overhang portions 6002 provided at the four corners of the opening of the electric wiring tape are used as the application start position and application end position, and the second sealant 6004 is electrically connected to the electric wiring tape 203 of the HB chip 201. It is applied in the direction in which the joints are arranged.

  The heat radiating member 4 is formed at a low cost by pressing or drawing a metal plate having a thickness of about 0.5 to 3 mm, particularly aluminum, copper, or an alloy thereof having good thermal conductivity, and the lower surface of the chip plate unit 2. Bonded with an adhesive having excellent thermal conductivity (for example, silver pace).

  The chip tank unit 3 is for guiding ink from the ink tank 5001 to the HB chip 201, and includes a chip tank 301, a flow path plate 302, a filter 304, a seal rubber 305, and a joint rubber 303. An ink flow path is formed by ultrasonically welding a chip tank 301 and a flow path plate 302 formed by resin molding.

  FIG. 5 is a schematic diagram showing how the ink tank is mounted on the print head. A filter 304 for preventing entry of dust from the outside is joined to the joint portion engaged with the ink tank 5001 by welding, and a seal rubber 305 is provided to prevent evaporation of ink from the joint portion. It is installed. The chip tank 301 also has a part of the function of holding the removable ink tank 5001, and the first hole 5002 for engaging the first claw (not shown) of the ink tank 5001 and the ink tank 5001. A second hole 5004 for engaging the removal lever 5003 is provided.

  The joint rubber 303 positions the chip plate unit 2 in the chip tank 301 so that the ink supply port (not shown) of the chip plate unit 2 and the ink supply port 306 of the chip tank unit communicate with each other so that ink does not leak. Fixing with screws 5 completes the joining.

  A third adhesive (not shown) is applied to one side surface of the chip plate 202, bent along the side surface, pressed, and heat-bonded. As the third adhesive, a thermosetting adhesive mainly composed of an epoxy resin having good ink resistance is used. The adhesive thickness after bonding is preferably 10 to 100 μm.

  The electric wiring tape 203 of the chip plate unit 2 is positioned on one side surface of the chip tank unit 3 by terminal positioning pins and terminal positioning holes (two locations) and fixed by crimping the terminal coupling pins provided in the chip tank unit 3. Thus, the print head 1 is completed.

Structure diagram of HB chip shown in embodiment 1 of the present invention Exploded structure diagram of ink jet print head in the present invention The perspective view of the ink jet type print head in the present invention Arrangement schematic diagram of HB chip on Si wafer in the present invention 1 is a perspective view of an ink jet print head and an ink tank according to the present invention. Schematic diagram of the chip plate unit shown in Example 1 of the present invention Schematic diagram showing the manufacturing process of the HB chip in the present invention Schematic diagram of separation process by dicing method in conventional inkjet printhead manufacturing method

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Print head 2 Chip plate unit 3 Chip tank unit 4 Heat radiating member 5 Screw 201 HB chip 202 Chip plate 203 Electrical wiring tape 204 Macula 205 (Chip plate) Ink supply port 206 Electrode terminal 207 External signal input terminal 208 (Macra) Opening 210 X-direction positioning hole with chip tank 301 Chip tank 302 Flow path plate 303 Joint rubber 304 Filter 305 Seal rubber 306 Ink supply port 401 (for heat dissipation member) Opening 4001 (for heat dissipation member) Si substrate 4002 (for HB chip) ) Ink supply port 4003 Electrothermal conversion element 4004 Electrode unit 4005 Ink channel 4006 Ink channel wall 4007 Ejection port 4008 Ejection port group 4009 Notch 5001 Ink tank 002 (first) for engaging the first claw of the ink tank 5003 removal lever 5004 (second) hole for engaging the removal lever 6001 Protruding portions 6002 (provided at the four corners of the macula opening) Overhang portions (provided at the four corners of the wiring tape opening) 6003 First sealant 6004 Second sealant 6005 Application region of second sealant 6007 Reference position in the X direction of the chip plate 6008 Y of the chip plate Direction reference position 8001 Si wafer 8002 Opening 9001 Si wafer 9002 Protective film 9003 Ink channel / discharge port forming part 9004 (on the back) protective film (etching-resistant mask layer)
9005 Photoresist 9006 Opening pattern for forming a notch 9007 Ink supply port pattern 9008 Resist pattern 10001 Cutting blade

Claims (3)

Opposite to the ejection port group, an ejection port group for ejecting ink, an ejection energy generation element for ejecting ink from the ejection port, an electric pulse signal for driving the ejection energy generation element, and an electrode unit for receiving power supply A recording element substrate having an ink supply port on its surface;
A support member to which the recording element substrate is attached, and a liquid supply path that communicates ink with the liquid chamber of the recording element substrate;
An opening for incorporating the recording element substrate; a flexible wiring substrate for applying an electric pulse signal and electric power for ejecting ink to the recording element substrate;
A support plate that has an opening for the recording element substrate to contact the support member, is disposed between the support member and the wiring substrate, and holds and fixes the wiring substrate;
A first sealant for sealing the periphery of the recording element substrate disposed in the opening of the support plate;
In an ink jet print head provided with a second sealant that seals the electrical connection portion between the recording element substrate and the wiring substrate,
An ink jet print head comprising: a notch structure that decreases in size from an ink supply port side to an ink discharge port side and a member that receives a second sealant at four corners of the recording element substrate.   2. The ink jet print head according to claim 1, wherein a member that receives the second sealant is integrally provided as a protruding portion at an opening of the support plate. The recording element substrate is formed on a Si wafer having a crystal orientation of <100> plane, after forming the ejection port, the ejection energy generating element, and the electrode portion for a plurality of recording element substrates.
An ink supply port is formed by Si anisotropic etching from the side opposite to the surface on which the ink discharge port is formed,
At the same time, openings are formed at the four corners of the recording element substrate by Si anisotropic etching,
Then, the recording element substrate is separated and divided to form the notch structures at the four corners of the recording element substrate.