JP2002103600A - Ink jet head and ink jet recording apparatus - Google Patents

Abstract

An object of the present invention is to reduce the protrusion of a joining medium when joining a printed circuit board such as an FPC to an inkjet head, to increase the joining strength in a space-saving manner, and to provide a small-sized inkjet head and inkjet. It is intended to realize a recording device. The present invention provides a nozzle substrate on which a nozzle for discharging ink is formed, a liquid chamber communicating with the nozzle, and an energy generating means for increasing the pressure in the liquid chamber to discharge the ink from the nozzle. An electrode substrate formed with
An ink jet head having a printed circuit board for energizing the energy generating means, wherein the printed circuit board and the electrode board are pressure-bonded to each other by an electric connection member, and is arranged on the printed board in a connection area between the printed board and the electrode board. A support member (7) for holding a gap between the printed board and the electrode board during crimping connection between the plurality of electrodes (17).
1) is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an ink jet head and an ink jet recording apparatus, and more particularly to an ink jet recording apparatus using an ink jet head.

[0002]

2. Description of the Related Art The non-impact recording method has attracted attention for office use and the like because noise generation during recording is small enough to be ignored. Among them, the so-called inkjet recording method, which is capable of high-speed recording and can perform recording on plain paper without requiring a special fixing process, is an extremely powerful method, and various methods have been conventionally proposed or already commercialized. Has been in practical use. In such an ink jet recording method, recording is performed by flying small droplets of a recording liquid, so-called ink, and attaching the recording liquid to a recording medium. Depending on the control method for controlling the direction, it is roughly classified into several types. Above all, in recent years, there is a technique described in Japanese Patent Application Laid-Open No. 4-52214 as a method capable of achieving high density and high integration using a silicon substrate, and a method described in Japanese Patent Application Laid-Open No. 3-293141 as a method of manufacturing the same. This is an electrostatic method in which a voltage is applied between the substrate and the electrode of the diaphragm, and the diaphragm is bent by electrostatic force to discharge ink. As a method for forming a head, a silicon substrate is etched with a liquid chamber by etching. This method is used to form a plate, and is attracting attention as a method capable of high density and high integration using a silicon substrate.

[0003] Although not limited to such an electrostatic system, a head using a silicon wafer can be mass-produced with a high yield because a high-precision fine processing can be performed by application of a semiconductor process, and a low-cost small-sized head can be manufactured. It can be said that it is excellent in realizing. On the other hand, such an ink-jet head is usually connected to a printed circuit board such as an FPC and driven by energization. However, with the downsizing of the head, the bonding area of such a printed circuit board also becomes small, Ensuring bonding strength has become an important issue. In particular, in a head having a thin structure, solder,
Protrusion of a current-carrying medium such as a conductive adhesive also poses a problem. To solve the former problem, JP-A-10-0
As disclosed in Japanese Patent No. 44441 (hereinafter referred to as Conventional Example 1), there has been proposed a method of reinforcing the periphery of a joint portion of a printed circuit board with an adhesive or a sealant. Further, in order to solve the latter problem, Japanese Patent Laid-Open No. 9-46031 (hereinafter referred to as Conventional Example 2) proposes providing a slit in a conductor for the purpose of improving the solder joint strength of each conductor of a printed circuit board. ).

[0004]

However, the method as in the prior art 1 can only reinforce the surroundings, and needs to secure an area only for the adhesive and the sealant, thereby realizing a small head. Not preferred above. Conventional example 2
Thus, when an anisotropic conductive paste or an anisotropic conductive film on which a bonding medium is arranged other than the conductive wire portion of the printed circuit board is used, a sufficient effect cannot be obtained.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and reduces the protrusion of a bonding medium when bonding a printed circuit board such as an FPC to an ink jet head, and increases the bonding strength while saving space. An object is to realize a small-sized inkjet head and an inkjet recording apparatus.

[0006]

SUMMARY OF THE INVENTION In order to solve the above problems, a nozzle substrate having a nozzle for discharging ink, a liquid chamber communicating with the nozzle, and a pressure in the liquid chamber are increased. The present invention relates to the present invention, comprising: an electrode substrate on which energy generating means for discharging ink from a nozzle is formed; and a printed circuit board for energizing the energy generating means, wherein the printed circuit board and the electrode substrate are crimp-connected by an electric connection member. According to the ink jet head, a support member for holding a gap between the printed board and the electrode board at the time of press-fit connection is provided between a plurality of electrodes arranged on the printed board in a connection area between the printed board and the electrode board. There are features. Therefore, when the printed board and the electrode board are crimped and connected by the electric connection member, the protrusion to the periphery of the electric connection member can be reduced and the bonding strength can be increased.

Further, since the thickness of the electrodes arranged on the printed circuit board is formed to be larger than the thickness of the support member, the protrusion to the periphery of the electric connection member can be reduced, the joining strength can be increased, and the joining quality can be improved. Can be stabilized.

Further, since the support member is formed by being divided into a plurality of parts, it is possible to reduce the protrusion to the periphery of the electric connection member and increase the bonding strength.

[0009] Further, by forming the surface of the support member with irregularities, it is possible to reduce the protrusion to the periphery of the electric connection member and increase the bonding strength.

Another feature of the ink jet head according to the present invention is that a concave portion such as a hole or a groove is provided on the electrode substrate between electrodes in a connection region between the printed substrate and the electrode substrate. Therefore, the protrusion of the electric connection member to the periphery can be reduced, and the bonding strength can be increased.

Further, an ink jet recording apparatus according to the present invention includes the above ink jet head.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention is directed to a nozzle substrate having a nozzle for discharging ink, a liquid chamber communicating with the nozzle, and discharging the ink from the nozzle by increasing the pressure in the liquid chamber. An ink jet head having an electrode substrate on which the energy generating means is formed, and a printed circuit board for energizing the energy generating means, wherein the printed circuit board and the electrode substrate are pressure-bonded to each other by an electric connection member. A support member is provided between the plurality of electrodes arranged on the printed circuit board in the connection area for holding a gap between the printed circuit board and the electrode board during crimp connection.

[0013]

FIG. 1 is a schematic sectional view showing the structure of an ink jet recording apparatus according to the present invention. As shown in FIG. 1, the ink jet recording apparatus 101 includes four ink cartridges 102 each containing ink of each color of cyan C, magenta M, yellow Y, and black BK, and a plurality of nozzles. Ink supply 4
Inkjet heads 103, a carriage 104 on which the ink cartridges 102 and the inkjet heads 103 are mounted, and a paper feed tray 105 for storing recording paper.
a transport roller 108 for transporting the recording paper from the a, 105b or the manual feed table 106 to the printing unit 107; and a discharge roller 110 for discharging the printed recording paper to a discharge tray 109. When printing the image data sent from the host device on the recording paper, the carriage 104 scans the carriage roller 111 while scanning the carriage roller 1.
In 08, ink is ejected from the nozzles of the inkjet head 103 onto the recording paper sent to the printing unit 107 in accordance with image data to record characters and images.

Next, the ink jet recording apparatus 10 shown in FIG.
2 is an external view of an ink jet head according to another invention, FIG. 3 is a view taken in the direction of arrow A in FIG. 2, and is a sectional view taken along line BB ′ in FIG. As shown in FIG. 4, the liquid chamber substrate 11, the diaphragm substrate 12,
An electrode substrate 13, a flexible printed wiring board (hereinafter abbreviated as FPC) 14, which is a printed circuit board, two rows of staggered nozzles 15 arranged in a plurality of rows, a base 16 of FPC 14, an electrode lead 17 of FPC 14, a resist of FPC 14. Vibrating plate 2 also serving as layer 18, individual electrode 19, and common electrode
0, including a conductive adhesive 22 such as solder, an anisotropic conductive film or an anisotropic conductive paste, for electrically connecting the liquid chamber 21, the electrode lead 17 of the FPC 14 and the individual electrode 19 of the electrode substrate 13. It is composed of The common liquid chamber 23 is a liquid chamber that communicates with each liquid chamber 21 and supplies ink. The gap 24 is a gap between the individual electrode 19 and the diaphragm 20. The fluid resistance 25 is formed between the liquid chamber 21 and the common liquid chamber 23 and when the liquid chamber substrate 11 and the diaphragm substrate 12 are close to each other. The electrode substrate 13 is made of a conductor or a semiconductor, and has a conductive substrate 26.
And an insulating layer 27 formed thereon. Further, the ink supply port 28 is connected to the common liquid chamber 23
Are supply ports for supplying ink from an ink tank (not shown). Further, since the liquid chamber 21 and the nozzles 15 are provided in two rows in a staggered arrangement and the nozzle pitch is doubled, the liquid chamber 21 and the nozzles 15 can be formed as a common ink supply port 28 for supplying ink to both, so that the head area is effectively reduced. Available.
Note that, for the sake of simplicity, ink supply means to the ink supply port and the like are omitted.

The liquid chamber substrate 11 is formed with a groove by a known method such as machining such as dicing or electroforming such as etching, and is joined to the diaphragm substrate 12 so that the nozzle 15 and the liquid chamber 21 are shared. A liquid chamber 23 can be formed. As a material of the liquid chamber substrate 11,
Metals such as stainless steel, semiconductors such as Si, and insulating materials such as glass are used. In addition, as a joining method, a dry film may be used. A nozzle substrate (not shown) is bonded on the liquid chamber substrate 11 with an adhesive. The ejection surface of the nozzle surface is subjected to a water-repellent treatment by a known method (eg, plating or coating with a water-repellent agent) in order to ensure water repellency with the ink.

Further, the diaphragm substrate 12 is formed by etching a metal such as stainless steel or a semiconductor such as Si,
This is preferable because a fine pattern can be formed with a desired thickness with high precision by a method such as electroforming, and the diaphragm substrate itself can be used as a common electrode.
When an insulating material such as glass is used, a common electrode can be formed by depositing a metal such as Al, Cu, Cr, Ni, or Au on the surface by vapor deposition or sputtering. The diaphragm substrate 12 has a concave portion in which the diaphragm 20 is formed on the bottom surface by a known method such as mechanical processing such as partial polishing or electroforming such as etching. Further, a part of the diaphragm board 12 extends to the individual electrode 19 side and serves as a common electrode pad for connecting to a printed board.

The electrode substrate 13 is formed by etching a metal such as stainless steel or a semiconductor such as Si.
Forming a gap 24 of a desired height, further to the gap 24, an insulating material such as resin or SiO ₂ insulating layer 2
7 is formed. On top of that, Ni, A
1, electrode material such as Ti / Pt, Cu, etc.
An individual electrode can be formed only in the gap by forming a film to a desired thickness by a film forming technique such as VD or vapor deposition, and then forming and etching a photoresist. Therefore, the structure of the electrode substrate 13 is made of a conductor or a semiconductor and has a conductive substrate 26.
Then, a concave portion corresponding to the gap 24 with the diaphragm 20 is formed on the insulating layer 27 formed thereon, and the individual electrode 19 formed of a conductive material is formed on the bottom surface thereof. ing. In addition, on the surface of the electrode substrate 13, by pulling out and fixing a part of the common electrode to a region other than the individual electrode forming portion, the individual electrode and the common electrode can be formed in substantially the same plane. This facilitates connection with a printed circuit board (printed circuit board for driving the head) described later. Note that the diaphragm substrate 12 and the electrode substrate 13 are bonded by bonding, anodic bonding, direct bonding, or the like according to the type of the material. Further, on the individual electrode 19, an insulating layer made of SiO ₂ or a resist material may be formed except for a connection portion with a printed board for the purpose of further preventing the electrode from being damaged by short circuit or discharge. .

On the other hand, the FPC 1 connected to the individual electrode 19
4 is a plate-like printed circuit board made of glass epoxy resin or phenol resin, polyimide resin, PET resin, or the like.
A film-shaped printed circuit board (FPC) made of resin or the like is used. On the FPC 14, an electrode lead 17 for applying a voltage to the individual electrode 19 is formed. FP
As a method of electrically connecting the electrode lead 17 on C14 to the individual electrode 19 and the electrode pad of the common electrode, for example,
There is a method of thermocompression bonding with solder, a method of thermocompression bonding with an anisotropic conductive adhesive, a method of pressing electrodes between electrodes, a wire bonding method, etc., but the wire bonding method requires a wire height, and furthermore In order to prevent the mechanical damage of the wires and the connection between the wires, it is necessary to seal the wire portion with a resin or the like, which is disadvantageous in that the sealed portion becomes high, which is not preferable. The method of thermocompression bonding with solder, the method of thermocompression bonding with an anisotropic conductive adhesive, and the method of pressing between electrodes can be performed easily and at low cost because multiple electrodes can be connected at once. This is an excellent method in that the connection height is low. Further, among these methods, in the method of thermocompression bonding with solder or an anisotropic conductive film, the substrates are bonded to each other after the pressure bonding, so that the electrical connection and the mechanical connection between the electrode substrate and the printed board are simultaneously performed. Therefore, this is an excellent connection method in that it is not necessary to separately reinforce the connection portion so as not to be disconnected in a head assembling process or a printing operation. In particular, an anisotropic conductive film is superior to solder in selectivity of an electrode material, and can be used as a material for joining a printed board to various inkjet heads.

Such a connection method of thermocompression bonding with solder or an anisotropic conductive film is performed in steps as shown in FIG. In this example, an FPC is used as a driving printed board, and an anisotropic conductive film is used to connect the FPC to an electrode board. The anisotropic conductive film (anisotropic conductive film) 22 is a material in which conductive particles called fillers are dispersed in a thermoplastic or thermosetting resin, and is heated by being sandwiched between electrodes.
By applying pressure, the anisotropic conductive film 22 is crushed, and the filler comes into contact with both electrodes, so that conduction between the electrodes can be obtained. As shown in FIG. 5A, first, an FP such as an FPC is used.
The electrode portion of C14 is aligned with the anisotropic conductive film 22 so as to be located on the end face of the FPC, and then temporarily press-bonded to the FP.
The anisotropic conductive film 22 is adhered to the FPC 14 such as C.
Thereafter, as shown in FIG. 5B, the anisotropic conductive film 22 is formed.
Remove the protective film of the electrode pad part of the electrode substrate,
The electrode leads of the FPC are aligned with each other, and as shown in FIG. 5C, the heated pressure bonding head 51 is pressed against the electrode area to perform thermocompression bonding. At this time, since all the joints need to be under uniform conditions, a pressure bonding head that has as little temperature unevenness as possible and that has no temperature fluctuation due to contact with the head or the like is used. Further, since it is important that the pressure is applied uniformly, the pressure bonding surface of the pressure bonding head is finished with good flatness. However, if the electrode pattern pitch becomes smaller and the electrode width becomes narrower, it is difficult to secure the bonding reliability only by the flatness of the pressure bonding head. Therefore, silicone rubber, Teflon (registered trademark) sheet, etc. The bonding is performed with the cushion material interposed therebetween to obtain bonding reliability. When bonding is performed by this method, depending on the bonding conditions, the space between the electrode leads 17 of the FPC, which is the escape region of the anisotropic conductive film 22, is crushed by the elastic deformation of the cushion material 61 as shown in FIG. As shown in FIG. 6B, the anisotropic conductive film 22 largely protrudes to the periphery.

Therefore, according to the first embodiment of the present invention,
As shown in FIGS. 7A and 7B, a dummy electrode lead 71 to which a drive signal to the ink jet head is not applied is provided between each of the electrode leads 17 and the electrode substrate 13 and the F are connected to each other.
The gap between the base 16 of the PC is maintained. Accordingly, by providing the dummy electrode leads 71 in this manner, the deformation of the FPC due to the cushion material 61 can be prevented, and as shown in FIG. 7B, the protrusion of the FPC to the periphery of the anisotropic conductive film 22 is reduced. be able to. Further, since the contact area with the anisotropic conductive film 22 increases, the adhesive strength increases. Further, as a method of increasing the adhesive strength by increasing the contact area with the anisotropic conductive film 22, as a second embodiment, a dummy electrode lead 71 is divided in the longitudinal direction as shown in FIG. Is also effective. As a third embodiment, as shown in FIG. 9, it is also effective to make the surface of the dummy electrode lead 71 uneven. In order to obtain a shape as shown in FIG. 9, a mask pattern having a narrow opening may be formed in the dummy electrode lead portion and etched. Since the etching efficiency of this narrow opening is significantly lower than that of the wide opening, a saw-shaped pattern as shown in FIG. 9 can be formed. In this case, the dummy electrode leads 71
Can be made slightly lower than the height of the main electrode lead 17 to which the drive signal to the inkjet head is applied. By doing so, the load from the pressure bonding head 51 of the FPC is more likely to be applied to the main electrode lead 17, so that the bonding reliability is improved. In addition, the fourth
As shown in FIG. 10, a recess such as a hole 81 or a groove 82 is formed between the individual electrodes 19 on the surface of the electrode substrate 13 as shown in FIG. Strength can be increased. As a method,
For example, as described above, when Si or glass is used for the electrode substrate 13, after performing masking having an opening for forming a desired concave portion in the concave portion forming region, precision processing is performed by sandblasting or dry etching. be able to.

Although the description has been made by taking the electrostatic type ink jet as an example, the present invention is also effective for reducing the size of an ink jet head of another printing type such as a piezoelectric type or a bubble jet (registered trademark) type.

(Specific Example 1) A specific example 1 will be described below with reference to FIG. The electrode substrate 13 is made of borosilicate glass having a thickness of 1 mm, and the diaphragm substrate 12 has a thickness of 2 mm.
A 00 [μm] silicon substrate was used. Diaphragm board 12
Is formed in advance on one surface of the silicon substrate by forming a boron layer corresponding to the thickness of the vibration plate 20 and using the boron layer as an etching stop layer to thereby form the vibration plate 2 by wet etching.
0 was formed. The electrode substrate 13 is formed by patterning a Ni electrode by sputtering in a groove formed by wet etching, and forming an S electrode as an electrode protection film on the electrode.
An iO ₂ layer was formed by a sputtering method. Next, the electrode positions of these substrates and the position of the diaphragm 20 are accurately positioned,
Both are joined by anodic bonding, and the diaphragm 2 is set at 150 dpi.
Thus, an electrostatic actuator having a gap of about 0.7 [μm] where 0 was arranged was formed. Further, the upper surface of the diaphragm 20 was polished by about 100 [μm] in order to reduce the height of the liquid chamber 21 and increase the discharge efficiency. The FPC 14 as a printed circuit board was joined to the electrostatic actuator having such a configuration with an anisotropic conductive film 22. As FPC14, thickness 1
A 18 [μm] -thick Cu patterned on a 2.5 [μm] polyimide film base material via a 20 [μm] -thick adhesive was used. Electrode pattern width is 4
0 [μm]. Further, as the anisotropic conductive film 22,
A thermosetting type having a thickness of 18 [μm] was used. After this anisotropic conductive film 22 was temporarily bonded to the end of the FPC 14, it was positioned with the electrode pad of the electrode substrate 13 and then completely bonded. The final pressure bonding was performed via a silicone rubber having a thickness of about 200 [μm] as a cushion material so that the applied pressure was uniform over the entire joint. When the capacitance of the electrostatic actuator was measured after the joining of the FPCs 14, good capacitance values were exhibited for all the channels, and it was confirmed that there was no connection failure of the FPCs 14. Next, a nozzle plate covering the contact portion of the FPC 14 was bonded to the diaphragm substrate 12 with an adhesive, filled with ink, and evaluated for ink ejection. As a result, good ejection could not be performed. When the head was disassembled and analyzed, it was found that the ink leaked between the diaphragm substrate 12 and the nozzle plate and wet the electrode pad portion. Furthermore, pursuing the cause of the leak, FPC
The height of the anisotropic conductive film 22 protruding from the end is 100
[μm] or more, so that it was found that the nozzle plate was one-sided and could not be joined well. Further pursuing the cause of the anisotropic conductive film 22 protruding,
As shown in FIG. 6A, the FPC 14 was depressed between the electrode leads 17, and it was found that the protrusion at that portion was particularly large. Therefore, as shown in FIG. 7, a dummy electrode lead 71 having a width of about 30 [μm] is provided only in the vicinity of a bonding region between the conventional electrode lead 17 and the electrode substrate 13, and a head is prototyped in the same process. As a result of evaluation, good injection characteristics could be obtained. Also, as a part of the joint quality evaluation, the joint strength was measured and the effect of the change of the FPC 14 was examined.
[KPa], but after the change was about 78.4 [kPa]
It was confirmed that the strength was also increased. Further, as a comparative experiment, as shown in FIG. 8, when the electrode lead 17 was divided in the longitudinal direction and the dummy pattern was divided into dices, it was confirmed that the strength was slightly improved.

(Specific Example 2) An electrostatic actuator having the same configuration as that described in Specific Example 1 was used, and F shown in FIGS. 6 and 7 was used.
The PC 14 was completely pressure-bonded without using the silicone rubber as the cushion material 61. As a result, in both samples, the protruding portion of the anisotropic conductive film 22 has a height of 100 μm.
m] or less, which was good, but as a result of checking the capacitance of the electrostatic actuator, it was found that there was a connection failure every few bits. Therefore, as shown in FIG. 9, the main electrode lead 17 that contributes to driving is about 3 [μm] more.
When bonding was performed under the same conditions using the FPC 14 having a dummy electrode lead 71 which was low and had a surface with irregularities of about 2 [μm] in height, good bonding could be performed without generating a defective bonding channel. Was. The protruding height of the anisotropic conductive film 22 was not more than 100 [μm], and the bonding strength was about 88.2 [kPa].

(Specific Example 3) A particle size of 8 [μm] was used before joining the FPC 14 using an electrostatic actuator having the same configuration as that of Specific Example 1.
Sand blast using abrasive grains of size about 25
A large number of holes 81 of [μm] and a depth of about 8 [μm] were provided around the individual electrode 19 as shown in FIG. When the FPC 14 shown in FIG. 6 is fully pressure-bonded to this actuator via the cushion material 61, the protruding height of the anisotropic conductive film 22 is 100 [μ].
m] The joining was performed under the following conditions. Also, the bonding strength is about 8
3.3 [kPa], and a favorable bonding state could be obtained.

The present invention is not limited to the above embodiment, and needless to say, various modifications and substitutions can be made within the scope of the claims.

[0026]

As described above, the nozzle substrate on which the nozzle for discharging ink is formed, the liquid chamber communicating with the nozzle, and the pressure inside the liquid chamber are increased to discharge the ink from the nozzle. According to the inkjet head according to the present invention, the inkjet head according to the present invention has an electrode substrate on which the energy generating means is formed, and a printed circuit board for energizing the energy generating means, and the printed circuit board and the electrode substrate are pressure-connected by an electric connection member. Between a plurality of electrodes arranged on the printed board in the connection area between the board and the electrode board,
It is characterized in that a support member for holding a gap between the printed board and the electrode board at the time of crimp connection is provided. Therefore, when the printed board and the electrode board are crimped and connected by the electric connection member, the protrusion to the periphery of the electric connection member can be reduced and the bonding strength can be increased.

Further, since the thickness of the electrodes arranged on the printed circuit board is formed to be larger than the thickness of the support member, the protrusion to the periphery of the electrical connection member can be reduced, the bonding strength can be increased, and the bonding quality can be improved. Can be stabilized.

Further, since the support member is formed by being divided into a plurality of parts, the protrusion to the periphery of the electric connection member can be reduced, and the joining strength can be increased.

Further, by forming the surface of the support member with irregularities, it is possible to reduce the protrusion to the periphery of the electric connection member and increase the bonding strength.

Further, an ink jet head according to another invention is characterized in that a concave portion such as a hole or a groove is provided on an electrode substrate between electrodes in a connection region between a printed substrate and an electrode substrate. Therefore, the protrusion of the electric connection member to the periphery can be reduced, and the bonding strength can be increased.

An ink jet recording apparatus according to the present invention includes the above ink jet head.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing a configuration of an ink jet recording apparatus of the present invention.

FIG. 2 is an external view of an inkjet head according to another invention.

FIG. 3 is a view as viewed from an arrow A in FIG. 2;

FIG. 4 is a sectional view taken along line B-B ′ of FIG. 2;

FIG. 5 is a process chart when a printed circuit board is crimped to an individual electrode.

FIG. 6 is a view showing a state of protrusion of an anisotropic conductive film at the time of conventional crimp connection.

FIG. 7 is a diagram showing a state of protrusion of an anisotropic conductive film at the time of crimp connection according to the first embodiment of the present invention.

FIG. 8 is a plan view of an FPC of an inkjet head according to a second embodiment of the present invention.

FIG. 9 is a sectional view of an FPC of an inkjet head according to a third embodiment of the present invention.

FIG. 10 is a plan view of an electrode substrate of an inkjet head according to a fourth embodiment of the present invention.

[Explanation of symbols]

51; Crimping head, 61; Cushion material, 71; Electrode lead, 81; Hole, 82;

Claims (6)

[Claims] A nozzle substrate on which a nozzle for discharging ink is formed, a liquid chamber communicating with the nozzle, and an energy generating means for increasing the pressure in the liquid chamber to discharge ink from the nozzle. An ink jet head having a formed electrode substrate and a printed circuit board for energizing the energy generating means, and press-connecting the printed circuit board and the electrode substrate by an electric connection member, wherein the printed circuit board and the electrode substrate Between a plurality of electrodes arranged on the printed circuit board in the connection area,
An ink jet head, comprising: a support member for holding a gap between the printed board and the electrode board during crimp connection. 2. The ink jet head according to claim 1, wherein the thickness of the electrode disposed on the printed board is greater than the thickness of the support member. 3. The ink jet head according to claim 1, wherein the support member is formed by being divided into a plurality. 4. The ink jet head according to claim 1, wherein the surface of the support member is formed with irregularities. 5. A nozzle substrate in which a nozzle for discharging ink is formed, a liquid chamber communicating with the nozzle, and an energy generating means for increasing the pressure in the liquid chamber to discharge ink from the nozzle. An ink jet head having a formed electrode substrate and a printed circuit board for energizing the energy generating means, and press-connecting the printed circuit board and the electrode substrate by an electric connection member, wherein the printed circuit board and the electrode substrate An ink jet head, wherein a concave portion such as a hole or a groove is provided on the electrode substrate between electrodes in a connection region. 6. An ink jet recording apparatus comprising the ink jet head according to claim 1.