JP2006331714A5 - - Google Patents

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Publication number
JP2006331714A5
JP2006331714A5 JP2005150536A JP2005150536A JP2006331714A5 JP 2006331714 A5 JP2006331714 A5 JP 2006331714A5 JP 2005150536 A JP2005150536 A JP 2005150536A JP 2005150536 A JP2005150536 A JP 2005150536A JP 2006331714 A5 JP2006331714 A5 JP 2006331714A5
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JP
Japan
Prior art keywords
fine particles
metals
depositing
protrusions
zinc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005150536A
Other languages
Japanese (ja)
Other versions
JP2006331714A (en
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Publication date
Application filed filed Critical
Priority to JP2005150536A priority Critical patent/JP2006331714A/en
Priority claimed from JP2005150536A external-priority patent/JP2006331714A/en
Publication of JP2006331714A publication Critical patent/JP2006331714A/en
Publication of JP2006331714A5 publication Critical patent/JP2006331714A5/ja
Pending legal-status Critical Current

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Claims (1)

基材微粒子の表面にニッケル層を形成する際にアルミニウム及び/又は亜鉛を、メッキ液中に金属等の微粒子として分散、又は、金属や金属水酸化物等として析出させることにより突起が形成されていることを特徴とする請求項1、2又は3記載の導電性微粒子。When forming a nickel layer on the surface of the substrate fine particles, protrusions are formed by dispersing aluminum and / or zinc as fine particles such as metals in the plating solution or by depositing them as metals or metal hydroxides. 4. The conductive fine particles according to claim 1, 2, or 3.
JP2005150536A 2005-05-24 2005-05-24 Conductive fine particle and anisotropic conductive material Pending JP2006331714A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005150536A JP2006331714A (en) 2005-05-24 2005-05-24 Conductive fine particle and anisotropic conductive material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005150536A JP2006331714A (en) 2005-05-24 2005-05-24 Conductive fine particle and anisotropic conductive material

Publications (2)

Publication Number Publication Date
JP2006331714A JP2006331714A (en) 2006-12-07
JP2006331714A5 true JP2006331714A5 (en) 2008-03-06

Family

ID=37553203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005150536A Pending JP2006331714A (en) 2005-05-24 2005-05-24 Conductive fine particle and anisotropic conductive material

Country Status (1)

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JP (1) JP2006331714A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007058159A1 (en) * 2005-11-18 2007-05-24 Hitachi Chemical Company, Ltd. Adhesive composition, circuit connecting material, connecting structure and circuit member connecting method
KR101271814B1 (en) * 2009-07-02 2013-06-07 히타치가세이가부시끼가이샤 Conductive particle
JP5358328B2 (en) * 2009-07-16 2013-12-04 デクセリアルズ株式会社 Conductive particles, anisotropic conductive film, joined body, and connection method
KR102103710B1 (en) * 2012-11-08 2020-04-23 엠. 테크닉 가부시키가이샤 Fine metal particles provided with projections
JP6450154B2 (en) * 2013-11-12 2019-01-09 積水化学工業株式会社 Conductive particles, conductive materials, and connection structures

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3210096B2 (en) * 1992-10-14 2001-09-17 日本化学工業株式会社 Nickel alloy plated powder and method for producing the same
JPH1173818A (en) * 1997-08-28 1999-03-16 Ricoh Co Ltd Conductive particle, anisotropic conductive adhesive and liquid crystal display device
JP2003253465A (en) * 2002-03-01 2003-09-10 Sekisui Chem Co Ltd Conductive fine particle and conductive connecting structure
JP4387175B2 (en) * 2003-07-07 2009-12-16 積水化学工業株式会社 Coated conductive particles, anisotropic conductive material, and conductive connection structure

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