JP2006324407A - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP2006324407A
JP2006324407A JP2005145452A JP2005145452A JP2006324407A JP 2006324407 A JP2006324407 A JP 2006324407A JP 2005145452 A JP2005145452 A JP 2005145452A JP 2005145452 A JP2005145452 A JP 2005145452A JP 2006324407 A JP2006324407 A JP 2006324407A
Authority
JP
Japan
Prior art keywords
light
emitting device
phosphor
light emitting
yellow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005145452A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006324407A5 (enExample
Inventor
Takayoshi Yajima
孝義 矢嶋
Takashi Nonokawa
貴志 野々川
Makoto Ishida
真 石田
Akio Namiki
明生 並木
Takemasa Yasukawa
武正 安川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2005145452A priority Critical patent/JP2006324407A/ja
Publication of JP2006324407A publication Critical patent/JP2006324407A/ja
Publication of JP2006324407A5 publication Critical patent/JP2006324407A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2005145452A 2005-05-18 2005-05-18 発光装置 Withdrawn JP2006324407A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005145452A JP2006324407A (ja) 2005-05-18 2005-05-18 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005145452A JP2006324407A (ja) 2005-05-18 2005-05-18 発光装置

Publications (2)

Publication Number Publication Date
JP2006324407A true JP2006324407A (ja) 2006-11-30
JP2006324407A5 JP2006324407A5 (enExample) 2007-12-06

Family

ID=37543871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005145452A Withdrawn JP2006324407A (ja) 2005-05-18 2005-05-18 発光装置

Country Status (1)

Country Link
JP (1) JP2006324407A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009079094A (ja) * 2007-09-25 2009-04-16 Toshiba Corp 蛍光体およびそれを用いたｌｅｄランプ
JP2009198544A (ja) * 2008-02-19 2009-09-03 Toyoda Gosei Co Ltd 光デバイス及びその製造方法
JP2012528473A (ja) * 2009-05-26 2012-11-12 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 発光ダイオードの製造方法
US8487330B2 (en) 2007-12-07 2013-07-16 Kabushiki Kaisha Toshiba Phosphor and LED light-emitting device using the same
CN104835901A (zh) * 2015-04-09 2015-08-12 苏州晶品新材料股份有限公司 基于二次光学设计的超薄柔性双面发光led光源
US9772441B2 (en) 2013-02-27 2017-09-26 Saturn Licensing Llc Illumination device and display unit
KR101798232B1 (ko) * 2010-07-07 2017-11-15 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법, 발광 소자 패키지 및 발광 시스템
KR20180016529A (ko) 2015-06-12 2018-02-14 가부시끼가이샤 도시바 형광체 및 그 제조 방법, 그리고 led 램프

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009079094A (ja) * 2007-09-25 2009-04-16 Toshiba Corp 蛍光体およびそれを用いたｌｅｄランプ
US9660149B2 (en) 2007-12-07 2017-05-23 Kabushiki Kaisha Toshiba Phosphor and LED light emitting device using the same
US9169436B2 (en) 2007-12-07 2015-10-27 Kabushiki Kaisha Toshiba Phosphor and LED light emitting device using the same
US8487330B2 (en) 2007-12-07 2013-07-16 Kabushiki Kaisha Toshiba Phosphor and LED light-emitting device using the same
JP2009198544A (ja) * 2008-02-19 2009-09-03 Toyoda Gosei Co Ltd 光デバイス及びその製造方法
US9806237B2 (en) 2009-05-26 2017-10-31 Osram Opto Semiconductors Gmbh Method for producing a light-emitting diode
JP2012528473A (ja) * 2009-05-26 2012-11-12 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 発光ダイオードの製造方法
KR101798232B1 (ko) * 2010-07-07 2017-11-15 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법, 발광 소자 패키지 및 발광 시스템
US9772441B2 (en) 2013-02-27 2017-09-26 Saturn Licensing Llc Illumination device and display unit
US10073215B2 (en) 2013-02-27 2018-09-11 Saturn Licensing Llc Illumination device and display unit
USRE49939E1 (en) 2013-02-27 2024-04-23 Saturn Licensing Llc Illumination device and display unit
CN104835901A (zh) * 2015-04-09 2015-08-12 苏州晶品新材料股份有限公司 基于二次光学设计的超薄柔性双面发光led光源
CN104835901B (zh) * 2015-04-09 2018-04-10 苏州晶品新材料股份有限公司 基于二次光学设计的超薄柔性双面发光led光源
KR20180016529A (ko) 2015-06-12 2018-02-14 가부시끼가이샤 도시바 형광체 및 그 제조 방법, 그리고 led 램프
US11005010B2 (en) 2015-06-12 2021-05-11 Kabushiki Kaisha Toshiba Phosphor and method of manufacturing same, and LED lamp

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