JP2006319201A5 - - Google Patents

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Publication number
JP2006319201A5
JP2006319201A5 JP2005141555A JP2005141555A JP2006319201A5 JP 2006319201 A5 JP2006319201 A5 JP 2006319201A5 JP 2005141555 A JP2005141555 A JP 2005141555A JP 2005141555 A JP2005141555 A JP 2005141555A JP 2006319201 A5 JP2006319201 A5 JP 2006319201A5
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JP
Japan
Prior art keywords
substrate
processing chamber
cooling gas
gas supply
substrates
Prior art date
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Application number
JP2005141555A
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English (en)
Japanese (ja)
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JP4498210B2 (ja
JP2006319201A (ja
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Priority to JP2005141555A priority Critical patent/JP4498210B2/ja
Priority claimed from JP2005141555A external-priority patent/JP4498210B2/ja
Publication of JP2006319201A publication Critical patent/JP2006319201A/ja
Publication of JP2006319201A5 publication Critical patent/JP2006319201A5/ja
Application granted granted Critical
Publication of JP4498210B2 publication Critical patent/JP4498210B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005141555A 2005-05-13 2005-05-13 基板処理装置およびｉｃの製造方法 Expired - Fee Related JP4498210B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005141555A JP4498210B2 (ja) 2005-05-13 2005-05-13 基板処理装置およびｉｃの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005141555A JP4498210B2 (ja) 2005-05-13 2005-05-13 基板処理装置およびｉｃの製造方法

Publications (3)

Publication Number Publication Date
JP2006319201A JP2006319201A (ja) 2006-11-24
JP2006319201A5 true JP2006319201A5 (cg-RX-API-DMAC10.html) 2008-05-29
JP4498210B2 JP4498210B2 (ja) 2010-07-07

Family

ID=37539589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005141555A Expired - Fee Related JP4498210B2 (ja) 2005-05-13 2005-05-13 基板処理装置およびｉｃの製造方法

Country Status (1)

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JP (1) JP4498210B2 (cg-RX-API-DMAC10.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8148271B2 (en) * 2005-08-05 2012-04-03 Hitachi Kokusai Electric Inc. Substrate processing apparatus, coolant gas supply nozzle and semiconductor device manufacturing method
JP5612266B2 (ja) * 2009-02-10 2014-10-22 光洋サーモシステム株式会社 冷却装置
JP6695975B2 (ja) * 2016-07-05 2020-05-20 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、ガスノズルおよび半導体装置の製造方法
JP7055075B2 (ja) * 2018-07-20 2022-04-15 東京エレクトロン株式会社 熱処理装置及び熱処理方法
CN113451183B (zh) * 2020-06-03 2023-03-31 重庆康佳光电技术研究院有限公司 一种晶圆盒
CN114833048B (zh) * 2021-02-02 2024-05-28 芝浦机械电子装置株式会社 加热处理装置
KR20230007024A (ko) 2021-07-05 2023-01-12 삼성전자주식회사 반도체 처리 장치 및 이를 이용한 반도체 처리 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61241916A (ja) * 1985-04-18 1986-10-28 Deisuko Saiyaa Japan:Kk 半導体熱処理装置
JPH0322523A (ja) * 1989-06-20 1991-01-30 Fujitsu Ltd 気相成長装置
JP3435111B2 (ja) * 1999-12-15 2003-08-11 株式会社半導体先端テクノロジーズ 半導体ウェハ熱処理装置

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